PCB auxiliary over-pulling tool

By designing a hollow rectangular PCB auxiliary over-stretching tool with a support structure, the problem of ink pressure loss in the hole rings during the developing and over-stretching process of large-size thick boards was solved, achieving stable support and efficient production, which is suitable for high-end PCB manufacturing.

CN224249921UActive Publication Date: 2026-05-15GUANGZHOU TERMBRAY ELECTRONICS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGZHOU TERMBRAY ELECTRONICS TECH CO LTD
Filing Date
2025-05-08
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

In the PCB solder mask process, especially during the development and stretching process of large-size thick boards, the ink around the holes is easily crushed by the rollers or pressure rollers, leading to scratches and oil splashing problems, which affect production yield and equipment stability.

Method used

Design a hollow rectangular PCB auxiliary over-pulling tool with corner support and side support to ensure a safe gap between the PCB upper surface and the developing equipment. Guided by a sloping area, it is equipped with a router slot and drainage grid to facilitate operation, improve support stability and prevent ink damage.

Benefits of technology

It effectively prevents ink pressure damage around the holes, avoids scratches and chemical residues on the board surface, improves production yield, and reduces equipment failure rate, making it suitable for high-end PCB manufacturing.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of PCB (printed circuit board) manufacturing, and particularly discloses a PCB auxiliary over-pulling tool, which is characterized in that a hollow rectangular plate frame with a supporting structure is used for accommodating a PCB during developing over-pulling, so that a safety gap of more than 1.5 mm is kept between the upper surface of the PCB and a line roller / pressing roller, hole ring printing ink is effectively prevented from being pressed and damaged, and a plate surface is prevented from being scratched and flinged; progressive over-pulling guiding is achieved in a step area or an inclined face area on the periphery of the plate frame, and blocking is avoided. Man-machine operation is optimized through the inner gong vacancies and the drainage grids, the taking and placing efficiency is improved, and liquid medicine residues are reduced; the accurate tolerance design ensures stable nesting of the PCB, and the gridding supporting layout is matched, so that the supporting stability of the heavy board is remarkably improved. The tool systematically solves the problem that printing ink is damaged and scratched due to over-pulling of PCB development, so that the production yield is improved, the equipment failure rate is reduced, and the tool is particularly suitable for a high-end PCB manufacturing scene.
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Description

Technical Field

[0001] This utility model relates to the field of PCB manufacturing, and more specifically, to a PCB auxiliary pull-out tool. Background Technology

[0002] The PCB solder mask process involves the following steps: In the solder mask ink coating stage, ink is applied to the PCB surface (including the via rings) via screen printing or spraying, forming a protective layer (green / blue solder mask, etc.) for insulation and solder resistance; In the exposure and development stage, the areas requiring ink retention are cured by exposure, while unexposed ink (such as inside holes or pads) is dissolved and removed in the developer, creating open areas; In the development and over-extraction stage, uncured ink is rinsed off using high-pressure spray or mechanical rollers (roller / press rollers). During this process, ink may remain on the edges of the via rings. The ink needs to cover the via rings with a copper layer, but if the copper thickness is too high (e.g., 4 mil), the copper layer at the via ring location will thicken after electroplating, forming a "volcano"-like protrusion, resulting in uneven ink coverage, increased brittleness after curing, and susceptibility to crushing by external mechanical forces.

[0003] With the continuous development of the PCB industry, the demand for PCB boards is becoming increasingly diversified, and PCB manufacturing is constantly extending towards higher layer counts and larger sizes. For large-scale specialized equipment such as servers, the built-in PCB boards required to match the equipment's operation typically need to be large and thick, with dimensions of 24×36 inches or more, a thickness of 6 mm or more, and more than 30 laminated layers. In the PCB solder mask manufacturing process, these large and thick boards are heavy (approximately 20 kg) and have a copper thickness, especially around vias, reaching approximately 4 mil. The ink covering the via rings is easily crushed by the rollers or pressure rollers during development, leading to scratches and ink spillage. Utility Model Content

[0004] The present invention aims to overcome at least one of the shortcomings of the prior art and provide a PCB auxiliary over-pulling tool to solve the problem of smearing and oil splattering of green solder mask rings during PCB green solder mask development over-pulling.

[0005] The technical solution adopted by this utility model is to provide a PCB auxiliary stretching tool, which is a hollow rectangular frame with a size larger than the PCB. The inner circumference of the frame is provided with corner supports and side supports. The height difference between the upper surface of the corner supports and side supports and the upper surface of the frame is greater than the thickness of the PCB. When this frame is used in the developing and stretching step, it conforms to the shape of the PCB and is thick enough to accommodate the PCB, allowing its upper surface to be suspended and not in contact with the rollers / pressure rollers. This avoids crushing the cured but fragile ink around the holes on the PCB surface, preventing scratches and ink spillage.

[0006] Furthermore, the thickness of the board frame is 3-5 mm greater than the thickness of the PCB, and the thickness of the corner supports and side supports is 1.5-2.5 mm. The bottom surfaces of the corner supports and side supports are flush with the bottom surface of the board frame. Since the PCBs built into large specialized equipment such as servers are over 6 mm thick, it is necessary to limit the thickness of the board frame used to accommodate the PCB and to provide the corner supports and side supports, thereby achieving the goal of leaving a gap of at least 1.5 mm between the rolling / pressing rollers passing through the upper surface of the PCB and the upper surface of the board frame. In addition, limiting the thickness of the corner supports and side supports helps to improve their mechanical strength and provide stable support for heavier PCBs.

[0007] Furthermore, the length of the right-angled side of the corner support is 1 to 2 inches, and the width of the side support is 0.5 to 1 inch.

[0008] Furthermore, the number of edge support positions on each side of the plate frame is 2 to 4, the length is 2 to 4 inches, and the spacing between adjacent edge support positions is 2 to 3 inches.

[0009] Furthermore, the width of the frame is 4 to 7 inches. The frame width should not be too low to ensure sufficient mechanical strength and prevent breakage during use.

[0010] Furthermore, the outer side of the short perimeter of the plate frame is provided with a stepped or inclined area with increasing thickness, the width of which is 3 to 4 inches. The thickness of the stepped or inclined area at its thinnest point is 30% to 50% of the plate frame thickness. The stepped or inclined area will lift the rollers / pressure rollers in stages during over-stretching to prevent the plate frame from being too thick, which could cause jamming or plate jamming during over-stretching.

[0011] Furthermore, the inner perimeter of the board frame is provided with slots on all four sides, with a length of 3-6 inches and a width of 1-2 inches. These slots are for finger gripping, facilitating the handling of the board by personnel.

[0012] Furthermore, the long side of the frame is provided with a drainage grid, which is 1 to 2 inches long and 0.1 to 0.5 inches wide. This is used to allow water to drain from the surface of the board during overstretching, reducing chemical residue on the board surface or moisture residue on the board surface during drying.

[0013] Furthermore, the drainage grids are arranged in a series of parallel groups to enhance drainage capacity.

[0014] Furthermore, the inner length and width of the board frame are both 0.1 to 0.2 inches larger than the PCB, making it easier for the PCB to be nested into the board frame.

[0015] During use, place the PCB in the center of the board frame, with the corner and side supports lifting the edges. The PCB should be suspended 1.5–2.5 mm above and below the edges. Then, place the board frame and PCB together into the developing tray, with the side with the stepped or sloping section facing forward. During the tray movement, the rollers / pressure rollers are lifted along the stepped or sloping section, ensuring smooth passage. The PCB remains suspended and does not contact the rollers / pressure rollers, effectively preventing the cured ink on the PCB surface from being crushed. Additionally, the developing solution flows out through the drain grid of the board frame without residue. After the tray movement, grip and remove the PCB from the side slot.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] This utility model provides a PCB auxiliary over-pulling tool that uses a hollow rectangular frame with a support structure to accommodate the PCB during development and over-pulling. This ensures a safety gap of at least 1.5mm between the PCB's upper surface and the rollers / pressure rollers, effectively preventing ink damage to the vias and avoiding surface scratches and oil splashes. The stepped or sloping area around the frame provides progressive over-pulling guidance, preventing jamming. The inner router slots and drainage grid optimize human-machine operation, improving loading and unloading efficiency and reducing chemical residue. Precise tolerance design ensures stable PCB nesting, and the grid-based support layout significantly improves the stability of heavy-duty board support. This tool systematically solves the problem of ink damage and scratches during PCB development and over-pulling, improving production yield and reducing equipment failure rates, making it particularly suitable for high-end PCB manufacturing scenarios. Attached Figure Description

[0018] Figure 1 This is a top view of the PCB auxiliary pull-through tool of Embodiment 1 of this utility model.

[0019] Figure 2 for Figure 1 The longitudinal section of the corner support and the short side of the plate frame, as indicated by area A in the lower right corner.

[0020] Labeling explanation: PCB 1, board frame 2, corner support 21, edge support 22, bevel area 23, router space 24, drainage grid 25, pressure roller 3. Detailed Implementation

[0021] The accompanying drawings are for illustrative purposes only and should not be construed as limiting the scope of this invention. To better illustrate the following embodiments, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0022] Example 1

[0023] like Figure 1As shown, this embodiment provides a PCB auxiliary overlay tool, which is a hollow rectangular frame 2 larger than the PCB 1. The inner perimeter of the frame 2 is provided with corner support positions 21 and side support positions 22. The height difference between the upper surface of the corner support positions 21 and side support positions 22 and the upper surface of the frame 2 is greater than the thickness of the PCB 1. The frame 2 is used in the developing and overlay step. Its shape fits the PCB 1 and its thickness is large enough to accommodate the PCB 1, so that its upper surface is suspended and does not contact the pressure roller 3. This avoids crushing the cured but fragile hole ring ink on the surface of the PCB 1, preventing scratches and ink splashes.

[0024] This embodiment uses a PCB 1 built into large specialized equipment such as servers as an example. Its common size is 24×36 inches, and the board thickness is 6mm. The board frame 2 has a width of 5 inches and a thickness of 9mm. The inner perimeter of the board frame 2 is provided with corner support positions 21 and side support positions 22, each with a thickness of 1.5mm. The bottom surfaces of both the corner support positions 21 and the side support positions 22 are flush with the bottom surface of the board frame 2. Figure 2 As shown, after the PCB 1 is placed in the board frame 2, the corner support 21 and the side support 22 leave a 1.5mm gap between the pressure roller 3 passing through the upper surface of the PCB 1 and the upper surface of the board frame 2, preventing the cured ink from being crushed and thrown away. In addition, limiting the thickness of the corner support 21 and the side support 22 helps to improve their mechanical strength and provide stable support for the heavier PCB.

[0025] The right-angled side of the corner support 21 is 2 inches long, and the width of the side support 22 is 1 inch.

[0026] The length of the side support 22 is 2 inches, and there are 4 of them on each long side and 2 on each short side of the plate frame 2.

[0027] The outer side of the short outer edge of the frame 2 is provided with a sloped area 23 with increasing thickness and a width of 3 inches. The thickness of the sloped area 23 at its thinnest point is 4.5 mm, which is half the thickness of the frame 2. The sloped area 23 lifts the pressure roller 3 when overstretched, preventing the frame 2 from getting stuck or jammed during overstretching due to its excessive thickness.

[0028] The inner four sides of the board frame 2 are provided with slots 24, which are 3 inches or 4 inches long and 1 inch wide. The slots 24 are for finger gripping, making it convenient for personnel to pick up and put down the board.

[0029] The long side of the frame 2 is provided with drainage grids 25, each 2 inches long and 0.2 inches wide, arranged in a group of parallel grids. These grids are used to drain water from the board surface during overstretching, reducing chemical residue on the board surface or moisture residue on the board surface during drying.

[0030] The inner length and width of the board frame 2 are both 0.1 inches greater than the PCB 1, making it easier for the PCB 1 to be nested into the board frame 2.

[0031] In use, place the PCB in the middle of the board frame 2, with the corner support 21 and side support 22 supporting the edges of the board. At this time, the PCB is suspended 1.5mm above and below the edges. Then, place the board frame 2 along with the PCB into the developing tray, with the end with the sloping area 23 on the shorter side facing forward. During the developing process, the pressure roller 3 is lifted along the sloping area 23, and the board passes through smoothly without jamming. At the same time, the PCB is suspended and will not contact the pressure roller 3, effectively preventing the cured ink on the PCB surface from being crushed. In addition, the developing solution flows out through the drain grid 25 of the board frame 2 without any residue. After the developing process, grasp and remove the PCB from the side slot 24.

[0032] The PCB auxiliary over-pulling tool provided in this embodiment uses a hollow rectangular frame with a support structure to accommodate the PCB during development and over-pulling, maintaining a safe gap of more than 1.5mm between the upper surface of the PCB and the rollers / pressure rollers. This effectively prevents ink pressure damage to the vias and avoids scratches and oil splashes on the board surface. The beveled area around the frame provides progressive over-pulling guidance, preventing jamming. The inner router slots and drainage grids optimize human-machine operation, improve loading and unloading efficiency, and reduce chemical residue. Precise tolerance design ensures stable PCB nesting, and the grid-based support layout significantly improves the stability of heavy-duty board support. This tool systematically solves the problem of ink pressure damage and scratches during PCB development and over-pulling, improving production yield and reducing equipment failure rate, and is especially suitable for high-end PCB manufacturing scenarios.

[0033] Example 2

[0034] The difference between this embodiment and Embodiment 1 is that the thickness of the plate frame is 11mm, the thickness of the corner support and the edge support is 2.5mm, and the width of the plate frame is 7 inches.

[0035] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the technical solution of this utility model, and are not intended to limit the specific implementation of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the claims of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A PCB auxiliary pull-through tool, characterized in that, The board frame is a hollow rectangle with a size larger than the PCB. The inner circumference of the board frame is provided with corner support positions and side support positions. The height difference between the upper surface of the corner support positions and the side support positions and the upper surface of the board frame is greater than the thickness of the PCB.

2. The PCB auxiliary pull-through tool according to claim 1, characterized in that, The thickness of the board frame is 3-5 mm greater than the thickness of the PCB. The thickness of the corner support and the side support is 1.5-2.5 mm. The bottom surfaces of the corner support and the side support are flush with the bottom surface of the board frame.

3. The PCB auxiliary pull-through tool according to claim 1, characterized in that, The length of the right-angled side of the corner support is 1 to 2 inches, and the width of the side support is 0.5 to 1 inch.

4. The PCB auxiliary pull-through tool according to claim 1, characterized in that, The number of edge supports on each side of the frame is 2 to 4, with a length of 2 to 4 inches and a spacing of 2 to 8 inches.

5. The PCB auxiliary pull-through tool according to any one of claims 1 to 4, characterized in that, The width of the frame is 4 to 7 inches.

6. The PCB auxiliary pull-through tool according to any one of claims 1 to 4, characterized in that, The outer side of the short outer edge of the plate frame is provided with a stepped area or inclined area with increasing thickness, and the width is 3 to 4 inches.

7. The PCB auxiliary pull-through tool according to any one of claims 1 to 4, characterized in that, The inner perimeter of the frame has slots on all four sides, with a length of 3 to 6 inches and a width of 1 to 2 inches.

8. The PCB auxiliary pull-through tool according to any one of claims 1 to 4, characterized in that, The long side of the frame is provided with a drainage grid, which is 1 to 2 inches long and 0.1 to 0.5 inches wide.

9. The PCB auxiliary pull-through tool according to claim 8, characterized in that, The drainage grids are arranged in a parallel group of multiple grids.

10. The PCB auxiliary pull-through tool according to any one of claims 1 to 4, characterized in that, The inner length and width of the board frame are both greater than the PCB by 0.1 to 0.2 inches.