Hot melting connection structure of fin heat dissipation module

Abstract

The utility model provides a hot melting connection structure of a fin heat dissipation module, a tin melting hole for a tin bar to extend into is arranged above a through hole of a conventional fin module, the tin melting hole is isolated from the through hole, the tin bar is arranged among heat dissipation fins in a penetrating manner, and the tin bar can naturally flow down from a gap between two heat dissipation fins after being melted, so that the heat dissipation effect of the fin heat dissipation module is improved. The connecting position of the heat pipe and the penetrating hole is covered, the outer side face of the heat pipe is wrapped, and the 100% heat absorption face of the heat pipe is guaranteed. Compared with a mode of dispensing the radiating fins one by one in the prior art, the hot melting structure provided by the utility model only needs one worker to process, can improve the working efficiency by 500%, and has the advantages of high forming speed, attractive appearance and high radiating effect.

Description

Technical Field

[0001] This utility model relates to a finned heat dissipation module, and more particularly to a heat-fusion connection structure for a finned heat dissipation module. Background Technology

[0002] A finned heatsink module is a common heat dissipation device for electronic components, consisting of multiple heat dissipation fins arranged side-by-side on the surface of a heat source. Heat pipes connect the fins to the heat source, and the surface of the fins has perforations for inserting the heat pipes. The heat pipes are fused to the walls of the perforations using solder paste. In existing technology, the solder paste is applied by dispensing. A dispensing groove extends from the upper surface of each perforation, and a needle dipped in solder paste is inserted through the groove to apply the paste to each connection point between the perforation and the heat pipe. This method is time-consuming and labor-intensive, and due to variations in the dispensing skills of different operators, the dispensing effect on each heatsink fin is not ideal. Utility Model Content

[0003] To solve the above technical problems, this utility model provides a hot-melt connection structure for a fin heat dissipation module, including a fin module composed of multiple heat dissipation fins. Each heat dissipation fin is provided with multiple sets of perforations along its arrangement direction, and a heat pipe is provided in each set of perforations. The heat pipe passes through the perforations between the heat dissipation fins.

[0004] Each heat sink fin has a solder fusion hole above its perforation. The solder fusion hole is isolated from the perforation and a solder rod is connected inside the solder fusion hole. The solder rod passes through each solder fusion hole in sequence, and the heat pipe is thermally connected to each heat sink fin through the solder rod.

[0005] Furthermore, the lateral dimension of the solder fusion hole is not greater than the radial dimension of the through hole.

[0006] Furthermore, the lateral dimension of the solder fusion hole does not exceed half of the radial dimension of the through hole.

[0007] Furthermore, the cross-sectional shape of the solder fusion hole is square, polygonal, circular, or irregular.

[0008] Furthermore, the solder rod extends uniformly along its length.

[0009] Furthermore, it also includes a base located at the bottom of the fin module, the base having folded edges on both sides of the fin module in the stacking direction, and the fin module being installed between the two sets of folded edges.

[0010] This invention provides a hot-melt connection structure for a finned heat dissipation module. A soldering hole is provided above the perforation of a conventional finned module for inserting a solder rod. The soldering hole is isolated from the perforation. The solder rod is inserted between each heat dissipation fin. After melting, the solder rod flows naturally down from the gap between two heat dissipation fins, covering the connection position between the heat pipe and the perforation, thus wrapping the outer surface of the heat pipe and ensuring 100% heat absorption surface. Compared to the existing method of applying adhesive to each heat dissipation fin individually, the hot-melt structure provided by this invention is suitable for finned heat dissipation modules with perforations. It requires only one worker, improving work efficiency by 500%, and has the advantages of fast molding speed, aesthetic appearance, and high heat dissipation effect. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the thermal fusion connection between a finned heat dissipation module and a solder rod according to this utility model;

[0012] Figure 2 This is a schematic diagram of the finned heat dissipation module;

[0013] Figure 3 This is a side view of the finned heat dissipation module and the solder rod.

[0014] 1. Heat sink fins; 2. Heat pipes; 3. Perforations; 4. Solder melting holes; 5. Base; 6. Folded edge; 7. Solder rod. Detailed Implementation

[0015] like Figures 1 to 3 The diagram illustrates a thermofusion connection structure for a finned heat dissipation module. It includes a finned module composed of multiple heat dissipation fins 1 arranged in a specific pattern. Each heat dissipation fin 1 has multiple sets of perforations 3 along its arrangement direction. A heat pipe 2 is disposed within each set of perforations 3. The heat pipe 2 passes through the perforations 3 and is positioned between the heat dissipation fins 1, providing support for each fin. The connection between the heat pipe 2 and the heat dissipation fins 1 is prior art. The heat pipe 2 is filled with a heat dissipation medium, and the surface of the heat pipe 2 is bonded to the inner surface of the perforation 3. During operation, the heat dissipation medium exchanges heat with each heat dissipation fin 1.

[0016] In conventional techniques, the bonding between the heat pipe 2 and the perforation 3 is achieved by applying solder paste using a long needle. The needle tip extends to the top of the perforation 3, and solder paste is applied sequentially to the connection points between each heat sink fin 1 and the heat pipe 2. Unlike existing technologies, this invention provides a solder fusion hole 4 above the perforation 3 of each heat sink fin 1. The solder fusion hole 4 is isolated from the perforation 3, and its lateral dimension is smaller than the radial dimension of the perforation 3. A solder rod 7 is connected inside the solder fusion hole 4, and the solder rod 7 passes through each solder fusion hole 4 sequentially. Under high temperature conditions, the solder rod 7 transforms into a flowing liquid and flows downwards under gravity; gaps exist between adjacent heat sink fins 1, providing space for the liquid solder to flow.

[0017] This invention replaces the liquid solder adhesive in conventional technology with a solder rod 7, which stabilizes the position of the solder rod 7 during hot melting and eliminates the need for repositioning. When assembling the heat dissipation module, first fix the position of each heat dissipation fin 1, then insert the heat pipe 2 and solder rod 7 into the through hole 3 and the solder melting hole 4 respectively. The solder melting hole 4 is located above the through hole 3 and is isolated from it, without obstructing the through hole 3. After the solder rod 7 melts, it flows along the wall of the heat pipe 2 into the through hole 3, covering the connection between the heat pipe 2 and the through hole 3, and wrapping the outer surface of the heat pipe 2. The wall of the heat pipe 2 can fully contact the fins for thermal conduction, ensuring 100% heat absorption surface area. Compared with existing technologies, this improves the heat transfer efficiency of the heat pipe 2 and fins by 16%.

[0018] Furthermore, the cross-sectional shape of the molten solder hole 4 is not limited to a regular circular hole; it can also be square, polygonal, or irregular in shape, as long as it matches the cross-sectional shape of the solder rod 7. The solder rod 7 can be inserted into the molten solder hole 4, and its position can be fixed during melting, so that the molten liquid solder can drip stably from above the heat pipe 2.

[0019] Furthermore, the lateral dimension of the solder fusion hole 4 shall not exceed half the radial dimension of the through hole 3, so as to make full use of the utilization rate of the solder rod 7. After the solder rod 7 melts, it can completely cover the surface of the heat pipe 2, reducing the loss of the solder rod 7.

[0020] This invention is applicable to various finned heat dissipation modules with perforations 3. The solder rod 7 can pass through the solder melting holes 4 of each heat dissipation fin 1 in one go, increasing the temperature and quickly melting the solder rod 7 at various positions. The solder rod 7 is further configured to extend uniformly along its length, ensuring uniform contact between the solder rod 7 and each heat dissipation fin 1, guaranteeing that the degree of melting of each solder rod 7 in each solder melting hole 4 is as uniform as possible, and giving the finned heat dissipation module an ideal appearance.

[0021] Furthermore, it also includes a base 5, which is located at the bottom of the fin module. The base 5 has flanges 6 on both sides of the fin module in the stacking direction, and the fin module is installed between the two sets of flanges 6. The base 5 can restrict the position of the fin module on both sides, assembling the entire fin module into a whole.

[0022] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A heat-fusion connection structure for a finned heat dissipation module, comprising a finned module composed of multiple heat dissipation fins (1) arranged together, each heat dissipation fin (1) having multiple sets of perforations (3) along its arrangement direction, each set of perforations (3) containing a heat pipe (2), the heat pipe (2) passing through the perforations (3) between the heat dissipation fins (1); characterized in that: Each heat sink fin (1) has a solder fusion hole (4) above the perforation (3). The solder fusion hole (4) is isolated from the perforation (3). A solder rod (7) is connected inside the solder fusion hole (4). The solder rod (7) passes through each solder fusion hole (4) in sequence. The heat pipe (2) and each heat sink fin (1) are thermally connected by the solder rod (7).

2. The hot-melt connection structure of the fin heat dissipation module as described in claim 1, characterized in that: The lateral dimension of the solder fusion hole (4) is not greater than the radial dimension of the through hole (3).

3. The hot-melt connection structure of the fin heat dissipation module as described in claim 2, characterized in that: The lateral dimension of the solder fusion hole (4) shall not exceed half the radial dimension of the through hole (3).

4. The hot-melt connection structure of the fin heat dissipation module as described in claim 1, characterized in that: The cross-sectional shape of the solder fusion hole (4) is square, polygonal, circular or irregular.

5. The hot-melt connection structure of a finned heat dissipation module as described in claim 1, characterized in that: The tin rod (7) extends uniformly along its length.

6. The hot-melt connection structure of a finned heat dissipation module as described in claim 1, characterized in that: It also includes a base (5) located at the bottom of the fin module. The base (5) has folded edges (6) on both sides of the stacking direction of the fin module. The fin module is installed between the two sets of folded edges (6).

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