Multilayer phase change radiator
By designing a multi-layer phase change heat sink, the problem of low material utilization in integrated heat sinks is solved, achieving efficient heat dissipation and cost savings, and ensuring the stable operation of heat-generating devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI HOTTOP ELECTRONIC TECH CO LTD
- Filing Date
- 2025-04-23
- Publication Date
- 2026-05-15
AI Technical Summary
The monolithic design of existing phase change heat sinks results in low material utilization and increases unnecessary manufacturing costs.
The phase change heat sink with a multi-layer structure includes a base plate, a cover plate and a condenser. The base plate has a heat dissipation cavity filled with a condensing medium, which is connected to the condenser through a connecting hole. The condensing medium undergoes a phase change in the heat dissipation cavity and releases heat in the condenser, forming a circulating heat dissipation process.
It achieves targeted heat dissipation, improves heat dissipation efficiency, reduces manufacturing costs, and optimizes the flow path through the raised structure, ensuring sealing and stability.
Smart Images
Figure CN224250038U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of heat sinks, and in particular to a multi-layer phase change heat sink. Background Technology
[0002] Phase change thermal management technology, with its highly efficient heat transfer capabilities, has been widely applied in the thermal management of electronic devices and mechanical systems. This technology achieves rapid heat dissipation through the liquid-gas phase change cycle of the refrigerant, effectively addressing the thermal management challenges of modern high-power-density electronic components and has become an effective solution for heat dissipation problems involving high heat flux densities.
[0003] However, current phase change heat sink designs generally adopt an integrated heat dissipation structure. This integrated heat dissipation structure not only covers the key heat-generating components, but also wraps the non-heat-generating components, resulting in low material utilization and increased unnecessary manufacturing costs. Utility Model Content
[0004] In order to achieve more targeted heat dissipation of heat-generating components and save costs, this application provides a multi-layer phase change heat sink.
[0005] The multi-layer phase change heat sink provided in this application adopts the following technical solution:
[0006] A multilayer phase change heat sink includes a substrate, a cover plate, and a condenser. One side of the substrate is positioned close to or abuts against a heat-generating device. One or more heat dissipation cavities are provided on the substrate, with the heat dissipation cavities positioned close to the heat-generating device and filled with a phase-change condensing medium. The cover plate covers and is connected to the side of the substrate with the heat dissipation cavities, and the condenser is connected to the cover plate. A condensation channel is formed inside the condenser, and a connecting hole is formed on the cover plate corresponding to the heat dissipation cavities, through which the heat dissipation cavities communicate with the condensation channel.
[0007] By adopting the above technical solution, the condensing medium filled in the heat dissipation cavity changes from liquid to gas after absorbing the heat generated by the heat-generating device. The gaseous condensing medium enters the condenser through the condensation channel, releases heat in the condenser, and then re-condenses into liquid, thereby forming a circulating heat dissipation process, which effectively improves heat dissipation efficiency and ensures the stable operation of the heat-generating device. Furthermore, by setting one or more heat dissipation chambers for the corresponding heat dissipation device, more targeted heat dissipation can be achieved, reducing manufacturing costs.
[0008] Preferably, the heat dissipation cavity is provided with a plurality of first protrusions and a plurality of second protrusions. The first protrusions are located at the bottom of the heat dissipation cavity near the ground, and the plurality of first protrusions are located at the top of the second protrusions. A first flow channel is formed between adjacent first protrusions and between the first protrusions and the sidewall of the heat dissipation cavity, and a second flow channel is formed between adjacent second protrusions and between the second protrusions and the sidewall of the heat dissipation cavity.
[0009] By adopting the above technical solution, the stepped layout of the first and second protrusions allows the liquid condensing medium to flow preferentially through the first flow channel at the bottom, while the gaseous medium rises through the second flow channel at the top, thus achieving automatic gas-liquid separation.
[0010] Preferably, a plurality of the first protrusions are uniformly arranged along the length direction of the substrate, and the length direction of the first protrusions is perpendicular to the length direction of the substrate.
[0011] By adopting the above technical solution, the first protrusions are uniformly arranged perpendicular to the length direction of the substrate to form micro-fluid flow channels with equal spacing, avoiding local flow dead zones and ensuring that the liquid medium uniformly absorbs the heat of the heating device.
[0012] Preferably, the plurality of the second protrusions are arranged in a matrix.
[0013] By adopting the above technical solution, the matrix distribution of the second protrusion forms a grid-like airflow channel, which expands the diffusion area of the gaseous medium. At the same time, the slit effect between the protrusions accelerates the gas convergence towards the connecting hole.
[0014] Preferably, each column of second protrusions along the length of the substrate is respectively arranged in a one-to-one correspondence with a plurality of first protrusions, and each column of second protrusions is coaxially arranged with the corresponding first protrusion.
[0015] By adopting the above technical solution, the coaxial design of the second protrusion and the first protrusion ensures that the gaseous medium always has a vertical guiding structure during the upward process, reducing flow resistance.
[0016] Preferably, the substrate, the first protrusion, and the second protrusion are fixedly connected to the cover plate by non-contact welding.
[0017] By adopting the above technical solution, the substrate, the first protrusion, and the second protrusion are fixedly connected to the cover plate by non-contact welding, which can reduce damage to the workpiece, ensure a sealed connection between the substrate and the cover plate, and minimize the leakage of condensate, thereby improving the overall reliability and stability of the radiator.
[0018] Preferably, the top of the first flow channel is connected to the condensation channel through the connecting hole.
[0019] By adopting the above technical solution, it is ensured that the condensing medium, which is transformed into liquid by the condenser, can flow fully into the first flow channel.
[0020] Preferably, the condenser includes multiple condenser tubes and multiple heat dissipation fins, the condensation channel is disposed inside the condenser tubes, the side of the condensation channel near the cover plate is connected to the connecting hole and communicates with the heat dissipation cavity, and the heat dissipation fins are disposed between adjacent heat dissipation fins.
[0021] By adopting the above technical solution and setting up condenser tubes, the gaseous condensing medium can complete the heat release and phase change process in the condenser; in addition, the setting of heat dissipation fins increases the heat dissipation area and further enhances the overall heat dissipation performance.
[0022] In summary, this application includes at least one of the following beneficial technical effects:
[0023] 1. By setting multiple heat dissipation cavities on the substrate, heat dissipation of heat-generating devices can be targeted, which can effectively reduce manufacturing costs compared to the traditional overall heat dissipation method;
[0024] 2. By connecting the first flow channel, the second flow channel, and the condensation channel, the phase change circulation of the condensation medium can be realized, achieving efficient heat transfer and improving the heat dissipation effect. Attached Figure Description
[0025] Figure 1 This is a structural schematic diagram of an embodiment of this application;
[0026] Figure 2 This is a schematic diagram of the substrate structure in an embodiment of this application;
[0027] Figure 3 This is a schematic diagram of the cover plate and condenser in the embodiments of this application.
[0028] Reference numerals: 1. Substrate; 11. Heat dissipation cavity; 12. First protrusion; 13. Second protrusion; 14. First flow channel; 15. Second flow channel; 16. Mounting part; 2. Cover plate; 21. Connecting hole; 3. Condenser; 31. Condensing tube; 311. Condensing channel; 32. Heat dissipation fins. Detailed Implementation
[0029] The following is in conjunction with the appendix Figure 1-3 This application will be described in further detail.
[0030] This application discloses a multilayer phase change heat sink.
[0031] Reference Figure 1 , Figure 2 and Figure 3A multilayer phase change heat sink includes a substrate 1, a cover plate 2, and a condenser 3. One side of the substrate 1 is positioned close to or against a heat-generating device. One or more heat dissipation cavities 11 are formed on the side of the substrate 1 opposite to the heat-generating device, and the heat dissipation cavities 11 are positioned corresponding to the heat-generating device. The cover plate 2 covers and is fixed to the side of the substrate 1 away from the heat-generating device. The condenser 3 is connected to the cover plate 2, and a condensation channel 311 is formed inside the condenser 3. A connecting hole 21 is formed on the cover plate 2, and the heat dissipation cavities 11 and the condensation channel 311 are connected through the connecting hole 21. The heat dissipation cavities 11 are filled with a condensing medium. After absorbing heat, the condensing medium changes from a liquid state to a gaseous state and enters the condenser 3 through the condensation channel 311. The gaseous condensing medium releases heat in the condenser 3 and condenses from a gaseous state to a liquid state. Then, the liquid condensing medium re-enters the heat dissipation cavities 11, thereby achieving efficient heat exchange and transfer and significantly improving heat dissipation efficiency. By setting multiple heat dissipation cavities 11, targeted heat dissipation of the heat-generating device can be achieved, saving manufacturing costs.
[0032] The substrate 1 is generally rectangular, and the heat dissipation cavity 11 is located on the side of the substrate 1 near the cover plate 2. In this embodiment, two heat dissipation cavities 11 are provided as an example. In other embodiments, the number of heat dissipation cavities 11 can be increased or decreased as needed. The two heat dissipation cavities 11 are arranged sequentially along the shorter dimension of the substrate 1. Both heat dissipation cavities 11 are cuboid in shape, and the length direction of the heat dissipation cavity 11 is parallel to the length direction of the substrate 1.
[0033] The heat dissipation cavity 11 is provided with a plurality of first protrusions 12 and a plurality of second protrusions 13, with the first protrusions 12 all located at the bottom of the heat dissipation cavity 11 near the ground, and the second protrusions 13 all located at the top. The first protrusions 12 are generally rectangular strips, and the length direction of the first protrusions 12 is perpendicular to the length direction of the substrate 1. The plurality of first protrusions 12 are evenly arranged along the length direction of the substrate 1, thereby ensuring heat dissipation. A first flow channel 14 is formed between adjacent first protrusions 12, and between the first protrusions 12 and the sidewall of the heat dissipation cavity 11. The first flow channel 14 is mainly used for the flow of liquid condensation medium, ensuring that the condensation medium can fully absorb heat and convert into gas.
[0034] The second protrusion 13 is generally rectangular in shape, and multiple second protrusions 13 are distributed in a matrix. Each column of second protrusions 13 along the length of the substrate 1 corresponds one-to-one with a first protrusion 12, and each column of second protrusions 13 is located along the length of the corresponding first protrusion 12. A second flow channel 15 is formed between adjacent second protrusions 13 and between the second protrusion 13 and the wall of the heat dissipation cavity 11. The second flow channel 15 is mainly used for the flow of gaseous condensing medium. The flow channel is composed of a first flow channel 14 and a second flow channel 15, ensuring that the gaseous condensing medium can enter the condenser 3 smoothly for cooling.
[0035] Preferably, the heat dissipation cavity 11 also has a reserved mounting part 16. In this embodiment, the mounting part 16 is set as a circular protrusion to facilitate subsequent bolt installation and other operations.
[0036] The cover plate 2 is rectangular in shape and covers the side of the substrate 1 away from the heat-generating device. The first protrusion 12, the second protrusion 13, and the substrate 1 are all welded to the cover plate 2 using non-contact welding methods such as laser welding, electron beam welding, and induction welding. Non-contact welding not only reduces damage to the workpiece but also ensures the seal between the substrate 1 and the cover plate 2, preventing leakage of the condensing medium. The connecting hole 21 is rectangular in shape, and its length is parallel to the short dimension of the cover plate 2. The connecting hole 21 is located at the gap between adjacent rows of second protrusions 13, and its bottom is connected to the top of the first flow channel 14, ensuring that the liquid condensing medium can enter the heat dissipation cavity 11; at the same time, the inflow of liquid condensing medium through multiple channels can improve the heat dissipation effect on the heat-generating device.
[0037] The condenser 3 includes multiple condenser tubes 31 and multiple heat dissipation fins 32, with condensation channels 311 disposed within the condenser tubes 31. The condenser tubes 31 are generally rectangular tubular, with their length direction perpendicular to the surface of the cover plate 2, and the ends of the condenser tubes 31 along their length direction are fixedly mounted on the cover plate 2. The end of the condensation channel 311 near the cover plate is set as an open surface, and the condensation channel 311 connects to the connecting hole 21 and communicates with the heat dissipation cavity 11. The condenser tubes 31 can be made of copper or aluminum alloy, possessing good thermal conductivity. The heat dissipation fins 32 are disposed between adjacent condenser tubes 31 to increase the heat dissipation area and improve heat dissipation efficiency.
[0038] The implementation principle of a multi-layer phase change heat sink according to an embodiment of this application is as follows: Multi-layer phase change cyclic heat dissipation is achieved through the combined design of a substrate 1, a cover plate 2, and a condenser 3. Inside the heat dissipation cavity 11 on the substrate 1, a first flow channel 14 and a second flow channel 15 are formed by a first protrusion 12 and a second protrusion 13, respectively used for the flow of liquid and gaseous condensing media. After absorbing heat, the condensing media changes from a liquid to a gaseous state, enters the condenser 3 through the condensing channel 311, releases heat within the condenser 3, and then condenses from a gaseous state back to a liquid state, thereby achieving efficient heat transfer and dissipation. This multi-layer phase change cyclic heat dissipation method not only improves heat dissipation efficiency but also ensures structural compactness.
[0039] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A multi-layer phase change heat sink, characterized in that: The device includes a substrate (1), a cover plate (2), and a condenser (3). One side of the substrate (1) is used to approach or abut against a heat-generating device. One or more heat dissipation cavities (11) are provided on the substrate (1). The heat dissipation cavities (11) are located close to the heat-generating device and are filled with a phase-change condensing medium. The cover plate (2) covers and is connected to the side of the substrate (1) where the heat dissipation cavity (11) is located. The condenser (3) is connected to the cover plate (2). A condensation channel (311) is provided in the condenser (3). A connecting hole (21) is provided on the cover plate (2) corresponding to the heat dissipation cavity (11). The heat dissipation cavity (11) is connected to the condensation channel (311) through the connecting hole (21).
2. The multi-layer phase change heat sink according to claim 1, characterized in that: The heat dissipation cavity (11) is provided with a plurality of first protrusions (12) and a plurality of second protrusions (13). The first protrusions (12) are located at the bottom of the heat dissipation cavity (11) near the ground, and the plurality of first protrusions (12) are located at the top of the second protrusions (13). A first flow channel (14) is formed between adjacent first protrusions (12) and between the first protrusions (12) and the side wall of the heat dissipation cavity (11). A second flow channel (15) is formed between adjacent second protrusions (13) and between the second protrusions (13) and the side wall of the heat dissipation cavity (11).
3. A multi-layer phase change heat sink according to claim 2, characterized in that: Multiple first protrusions (12) are uniformly arranged along the length direction of the substrate (1), and the length direction of the first protrusions (12) is perpendicular to the length direction of the substrate (1).
4. A multi-layer phase change heat sink according to claim 2, characterized in that: The multiple second protrusions (13) are distributed in a matrix.
5. A multi-layer phase change heat sink according to claim 4, characterized in that: Each column of second protrusions (13) along the length of the substrate (1) is respectively arranged in a one-to-one correspondence with a plurality of first protrusions (12), and each column of second protrusions (13) is coaxially arranged with the corresponding first protrusion (12).
6. A multi-layer phase change heat sink according to claim 2, characterized in that: The substrate (1), the first protrusion (12), and the second protrusion (13) are fixedly connected to the cover plate (2) by non-contact welding.
7. A multi-layer phase change heat sink according to claim 2, characterized in that: The top of the first flow channel (14) is connected to the condensation channel (311) through the connecting hole (21).
8. A multi-layer phase change heat sink according to claim 1, characterized in that: The condenser (3) includes multiple condenser tubes (31) and multiple heat dissipation fins (32). The condensation channel (311) is disposed inside the condenser tubes (31). The side of the condensation channel (311) near the cover plate (2) is connected to the connecting hole (21) and communicates with the heat dissipation cavity (11). The heat dissipation fins (32) are disposed between adjacent heat dissipation fins.