Heat dissipation structure of interface test box

Abstract

The utility model discloses a heat radiation structure of an interface test box, the interface test box comprises a housing and an upper cover, a test board is fixed in the housing, a heating device is loaded on the test board, the heat radiation structure comprises a heat conduction member, the heat conduction member is connected with the surface of the heating device and is in contact connection with the upper cover, and the heat conduction member is provided with a heat conduction hole. And the heat conduction piece and the upper cover simultaneously dissipate heat of the heating device. The heat-conducting piece is an n-shaped heat-conducting piece, the middle of the heat-conducting piece is connected with the surface of the heating device, and the two ends of the heat-conducting piece are connected with the upper cover through screw holes and screws respectively. The heat conduction piece is used for connecting the heating device and the metal upper cover, a heat dissipation path from the heat conduction piece to the upper cover is formed, the heat dissipation area is increased, the heat dissipation efficiency is improved, the high-frequency interface test box is suitable, the temperature rise of a core device can be remarkably reduced, the test stability is improved, and the service life of equipment is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of interface testing, and in particular to a heat dissipation structure for an interface testing box. Background Technology

[0002] In the field of electronic test equipment, high-frequency interface test boxes, such as those for Type-C, HDMI, and Thunderbolt interfaces, typically contain high-power-density heat-generating components (such as processors, FPGAs, and power ICs), which generate significant heat during prolonged operation. Most test boxes rely solely on natural convection within the casing or simple heat sinks, which are insufficient for effectively dissipating internal heat, leading to excessively high device temperatures and impacting test accuracy and equipment lifespan. Some solutions employ heat sinks or fans, but these require considerations of dust and interference protection, limiting their design options. Utility Model Content

[0003] The purpose of this invention is to provide a heat dissipation structure for an interface test box, suitable for high-frequency interface test boxes. It adopts a simple structure with low cost, significantly reduces the temperature rise of core components, and improves test stability and equipment lifespan.

[0004] The technical solution of this utility model is:

[0005] The interface test box includes a heat dissipation structure, comprising a shell and a top cover. A test board is fixed inside the shell, and a heat-generating device is mounted on the test board. The heat dissipation structure includes a heat-conducting component, which is in contact with the surface of the heat-generating device and connected to the top cover. The heat-conducting component and the top cover dissipate heat from the heat-generating device simultaneously.

[0006] Preferably, the heat-conducting component is a Z-shaped heat-conducting sheet, with the middle part of the heat-conducting sheet in contact with the surface of the heating device, and the two ends of the heat-conducting sheet connected to the upper cover through screw holes and screws, respectively.

[0007] Preferably, the heat-conducting element is a square-shaped or square-shaped heat-conducting sheet.

[0008] Preferably, thermally conductive silicone is used to fill the space between the thermally conductive element and the heating element.

[0009] Preferably, the top cover is made of metal.

[0010] Preferably, the test plate is connected to the bottom of the housing by a support column, leaving a gap between the test plate and the bottom of the housing.

[0011] The advantages of this utility model are:

[0012] This invention utilizes a heat-conducting component to connect the heat-generating device to the metal cover, forming a heat dissipation path from the heat-conducting component to the cover. This increases the heat dissipation area and improves heat dissipation efficiency. It is suitable for high-frequency interface test boxes and can significantly reduce the temperature rise of core components, improve test stability, and extend equipment life. Attached Figure Description

[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0014] Figure 1 An exploded view of the heat dissipation structure of the interface test box of this utility model;

[0015] Figure 2 This is a schematic diagram of the structure of a Z-shaped heatsink;

[0016] Figure 3 This is a schematic diagram of the upper cover structure;

[0017] Figure 4 This is a schematic diagram of the shell structure. Detailed Implementation

[0018] like Figure 1 As shown, the interface test box heat dissipation structure of this utility model includes a shell 1 and a top cover 2. A test plate 3 is fixed inside the shell 2, and a heat-generating device is mounted on the test plate. The heat dissipation structure includes a heat-conducting component 4, which is in contact with the surface of the heat-generating device and is connected to the top cover 2. The heat-conducting component 4 and the top cover 2 dissipate heat from the heat-generating device simultaneously.

[0019] like Figure 2 As shown, the heat-conducting component 4 is a Z-shaped heat-conducting sheet. The middle part of the heat-conducting sheet 4 is in contact with the surface of the heating device, and the contact surface is filled with thermally conductive silicone to eliminate contact gaps and improve heat conduction efficiency. Screw holes 41 are provided at both ends of the heat-conducting sheet 4, which are connected to the upper cover 2 via screws and bolts.

[0020] like Figure 3 As shown, the upper cover 2 has screw holes 21 corresponding to the screw holes 41 at both ends of the heat-conducting plate 4. The upper cover 2 is made of metal such as aluminum alloy, forming a heat dissipation path from the heat-conducting component 4 to the upper cover 2, increasing the heat dissipation area and improving heat dissipation efficiency.

[0021] The heat-conducting component 4 can also be a heat-conducting sheet in other forms such as a square or a square shape.

[0022] like Figure 4 As shown, the bottom of the housing 1 is provided with a support column 11, and the test plate 3 is connected to the bottom of the housing 1 through the support column 11, so that there is a gap between the test plate 3 and the bottom of the housing 1, increasing the bottom heat dissipation space.

[0023] This invention utilizes a heat-conducting component to connect the heat-generating device to the metal cover, forming a heat dissipation path from the heat-conducting component to the cover. This increases the heat dissipation area and improves heat dissipation efficiency. It is suitable for high-frequency interface test boxes and can significantly reduce the temperature rise of core components, improve test stability, and extend equipment life.

[0024] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All modifications made in accordance with the spirit and essence of the main technical solution of this utility model should be included within the scope of protection of this utility model.

Claims

1. A heat dissipation structure for an interface test box, the interface test box comprising a housing and a top cover, wherein a test board is fixed inside the housing, and a heat-generating device is mounted on the test board, characterized in that, The heat dissipation structure includes a heat-conducting component, which is in contact with the surface of the heat-generating device and connected to the upper cover, so that the heat-conducting component and the upper cover dissipate heat from the heat-generating device simultaneously.

2. The heat dissipation structure of the interface test box according to claim 1, characterized in that, The heat-conducting component adopts a Z-shaped heat-conducting sheet, with the middle part of the heat-conducting sheet in contact with the surface of the heating device, and the two ends of the heat-conducting sheet connected to the top cover through screw holes and screws, respectively.

3. The heat dissipation structure of the interface test box according to claim 2, characterized in that, The heat-conducting component is a square-shaped or square-shaped heat-conducting sheet.

4. The heat dissipation structure of the interface test box according to claim 2 or 3, characterized in that, Thermally conductive silicone is used to fill the space between the thermally conductive component and the heat-generating device.

5. The heat dissipation structure of the interface test box according to claim 1, characterized in that, The top cover is made of metal.

6. The heat dissipation structure of the interface test box according to claim 1, characterized in that, The test plate is connected to the bottom of the housing by a support column, leaving a gap between the test plate and the bottom of the housing.

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