Automatic stripping machine

By designing an automatic chip stripping machine, the automated feeding, identification, and sorting of chips were achieved, solving the inefficiency problem caused by manual assistance in existing technologies and improving production efficiency.

CN224250124UActive Publication Date: 2026-05-15YOUGUANG INTELLIGENT SEMICON TECH (SHENZHEN) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
YOUGUANG INTELLIGENT SEMICON TECH (SHENZHEN) CO LTD
Filing Date
2025-04-27
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

In existing technologies, chip testing and sorting require manual assistance, resulting in low automation, low production efficiency, high labor intensity for workers, and unsuitability for mass production.

Method used

An automatic chip stripping machine was designed, including a blue film feeding rack, a blue film picking and placing mechanism, a blue film tensioning mechanism, a chip picking and placing mechanism, an identification device, and a chip collection rack. These components enable automated chip feeding, identification, and sorting.

Benefits of technology

It has enabled automated chip feeding, identification and sorting processes, improving work efficiency, reducing manual intervention, and making it suitable for mass production.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an automatic material stripping machine, comprising a blue film feeding rack, a blue film taking and placing mechanism, a blue film tensioning mechanism, a chip taking and placing mechanism, an identification device and a chip collecting rack, the blue film feeding rack is used for storing blue film rings, the blue film taking and placing mechanism is arranged between the blue film feeding rack and the blue film tensioning mechanism, and the chip collecting rack is used for collecting the blue film rings. A plurality of material boxes are arranged on the chip collecting frame, the recognition device is arranged above the blue film tensioning mechanism, and the chip taking and placing mechanism is used for taking and placing chips from the blue film tensioning mechanism to the material boxes. The automatic stripping machine can automatically realize feeding, identification and sorting processes of chips, and is high in working efficiency. When the device is used, the blue film rings are taken and placed on the blue film tensioning mechanism through the blue film taking and placing mechanism, then the specification or quality of chips is recognized through the recognition device, and finally the different chips are taken and placed into the corresponding material boxes through the chip taking and placing mechanism to achieve sorting.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip manufacturing technology, and in particular to an automatic stripping machine. Background Technology

[0002] Blue film rings are typically used as carriers for chips. Chips on the same wafer are arranged closely together. Although the chips themselves are small, there are many of them, and multiple chips are fixed to the blue film rings by adhesive or other means. To facilitate subsequent processing, the chips on the blue film rings are usually identified according to different specifications or qualities, and then peeled off and placed in different material boxes. This reduces the difficulty of processing and avoids problems such as incorrect chip removal due to errors.

[0003] In existing technologies, chip testing and sorting often require manual assistance. For example, workers need to place chips into a testing machine for inspection, and after inspection, workers need to remove and flip the chips or insert new chips for further inspection. After inspection, workers also need to manually sort the chips based on the results. This method has low automation, high worker workload, and low production efficiency, making it unsuitable for mass production.

[0004] Therefore, it is necessary to design an efficient automatic chip stripping machine. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide an automatic chip stripping machine that can efficiently sort chips.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: an automatic stripping machine, including a blue film loading rack, a blue film picking and placing mechanism, a blue film tensioning mechanism, a chip picking and placing mechanism, an identification device, and a chip collecting rack. The blue film loading rack is used to store blue film rings. The blue film picking and placing mechanism is located between the blue film loading rack and the blue film tensioning mechanism. The chip collecting rack is provided with multiple material boxes. The identification device is located above the blue film tensioning mechanism. The chip picking and placing mechanism is used to pick up and place chips from the blue film tensioning mechanism and place them into the material boxes.

[0007] Furthermore, the blue film tensioning mechanism includes a base, a mounting platform, a pin assembly, and an XY-axis displacement platform. The XY-axis displacement platform is drivenly connected to the base, the mounting platform is mounted on the base, and the pin assembly is located below the mounting platform.

[0008] Furthermore, the blue film tensioning mechanism also includes a first rotary drive assembly. The mounting platform is rotatable relative to the base. The first rotary drive assembly is mounted on the base and is used to drive the mounting platform to rotate.

[0009] Furthermore, the first rotary drive component is a belt drive mechanism.

[0010] Furthermore, the mounting platform is provided with a slot, and the slot is provided with a magnetic suction element.

[0011] Furthermore, the identification device is a CCD camera.

[0012] Furthermore, the blue film feeding rack includes a frame and a first lifting drive assembly that is driven to the frame, and the frame is provided with multiple material placement chambers along the vertical direction.

[0013] Furthermore, the blue film picking and placing mechanism includes a gripper, a second lifting drive assembly, and a second rotating drive assembly. The second lifting drive assembly is drivenly connected to the second rotating drive assembly, and the second rotating drive assembly is drivenly connected to the gripper.

[0014] Furthermore, the chip picking and placing mechanism includes a chip picking swing arm, a third lifting drive assembly, and a third rotation drive assembly. The third rotation drive assembly is driven to the chip picking swing arm to drive the chip picking swing arm to swing back and forth between the blue film tensioning mechanism and the chip collection rack. The third lifting drive assembly is driven to the chip picking swing arm to drive the chip picking swing arm to move closer to or away from the blue film tensioning mechanism.

[0015] Furthermore, the end of the crystal-picking arm is provided with a suction nozzle for adsorbing the wafer.

[0016] The beneficial effects of this utility model are as follows: This automatic chip stripping machine can automate the chip feeding, identification, and sorting process, resulting in high work efficiency. In use, the blue film ring is placed onto the blue film tensioning mechanism via the blue film pick-and-place mechanism. Then, the identification device identifies the chip's specifications or quality. Finally, the chip pick-and-place mechanism sorts different chips into their corresponding material boxes. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the automatic material peeling machine according to Embodiment 1 of this utility model;

[0018] Figure 2 This is a schematic diagram of the blue film loading and unloading mechanism in the automatic stripper of this utility model according to Embodiment 1;

[0019] Figure 3 This is a schematic diagram of the blue film tensioning mechanism in the automatic peeling machine according to Embodiment 1 of this utility model.

[0020] Label Explanation:

[0021] 1. Blue film loading rack; 11. Frame body; 12. First lifting drive assembly;

[0022] 2. Blue film picking and placing mechanism; 21. Gripper; 22. Second lifting drive assembly; 23. Second rotation drive assembly;

[0023] 3. Blue film tensioning mechanism; 31. Base; 32. Mounting platform; 321. Slot; 322. Magnetic suction component; 33. Ejector pin assembly; 34. XY axis displacement platform; 35. First rotary drive assembly;

[0024] 4. Chip picking and placing mechanism; 41. Chip picking swing arm; 411. Suction nozzle; 42. Third lifting drive assembly; 43. Third rotation drive assembly;

[0025] 5. Identification device;

[0026] 6. Chip collection rack; 61. Material box. Detailed Implementation

[0027] To explain in detail the technical content, objectives, and effects of this utility model, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0028] Please refer to Figures 1 to 3 An automatic stripping machine includes a blue film loading rack 1, a blue film picking and placing mechanism 2, a blue film tensioning mechanism 3, a chip picking and placing mechanism 4, an identification device 5, and a chip collecting rack 6. The blue film loading rack 1 is used to store blue film rings. The blue film picking and placing mechanism 2 is located between the blue film loading rack 1 and the blue film tensioning mechanism 3. The chip collecting rack 6 is provided with multiple material boxes 61. The identification device 5 is located above the blue film tensioning mechanism 3. The chip picking and placing mechanism 4 is used to pick up and place chips from the blue film tensioning mechanism 3 and place them into the material boxes 61.

[0029] As can be seen from the above description, the beneficial effects of this utility model are as follows: This automatic chip stripping machine can automate the chip feeding, identification, and sorting process, resulting in high working efficiency. In use, the blue film ring is picked up and placed onto the blue film tensioning mechanism 3 via the blue film picking and placing mechanism 2. Then, the identification device 5 identifies the chip's specifications or quality. Finally, the chip picking and placing mechanism 4 sorts different chips into their corresponding material boxes 61.

[0030] Furthermore, the blue film tensioning mechanism 3 includes a base 31, a mounting platform 32, a pin assembly 33, and an XY axis displacement platform 34. The XY axis displacement platform 34 is drivenly connected to the base 31, the mounting platform 32 is mounted on the base 31, and the pin assembly 33 is located below the mounting platform 32.

[0031] As described above, the XY axis displacement platform 34 can drive the mounting stage 32 and the blue film ring on the mounting stage 32 to translate, thereby aligning different chips with the ejector pin assembly 33, so that the blue film pick-up and drop mechanism 2 can pick up chips located at different positions on the blue film ring.

[0032] Furthermore, the blue film tensioning mechanism 3 also includes a first rotary drive assembly 35. The mounting platform 32 is rotatable relative to the base 31. The first rotary drive assembly 35 is mounted on the base 31 and is used to drive the mounting platform 32 to rotate.

[0033] As described above, the first rotary drive assembly 35 drives the mounting platform 32 to rotate, which can correct the position of the blue film ring, making it easier for the identification device 5 to identify and for the blue film picking and placing mechanism 2 to pick it up.

[0034] Furthermore, the first rotary drive assembly 35 is a belt drive mechanism.

[0035] As can be seen from the above description, the first rotary drive assembly 35 has a simple structure and can be modified from commercially available standard parts.

[0036] Furthermore, the mounting platform 32 is provided with a slot 321, and a magnetic suction element 322 is provided in the slot 321.

[0037] As described above, the slot 321 is used to limit the position of the blue film ring, and the magnetic attractor 322 can attract the blue film ring to prevent it from accidentally detaching.

[0038] Furthermore, the identification device 5 is a CCD camera.

[0039] Furthermore, the blue film feeding rack 1 includes a frame 11 and a first lifting drive assembly 12 drivenly connected to the frame 11, and the frame 11 is provided with a plurality of material placement cavities along the vertical direction.

[0040] As can be seen from the above description, the first lifting drive component 12 can drive the frame 11 to rise and fall so that the multiple material placement chambers are aligned with the blue film picking and placing mechanism 2 in sequence.

[0041] Furthermore, the blue film picking and placing mechanism 2 includes a gripper 21, a second lifting drive assembly 22, and a second rotating drive assembly 23. The second lifting drive assembly 22 is drivenly connected to the second rotating drive assembly 23, and the second rotating drive assembly 23 is drivenly connected to the gripper 21.

[0042] As described above, the gripper 21 is used to hold the blue film ring, and the second lifting drive assembly 22, in conjunction with the second rotating drive assembly 23, can drive the gripper 21 to move the blue film ring above the blue film tensioning mechanism 3.

[0043] Furthermore, the chip picking and placing mechanism 4 includes a chip picking swing arm 41, a third lifting drive assembly 42, and a third rotation drive assembly 43. The third rotation drive assembly 43 is driven to the chip picking swing arm 41 to drive the chip picking swing arm 41 to swing back and forth between the blue film tensioning mechanism 3 and the chip collecting rack 6. The third lifting drive assembly 42 is driven to the chip picking swing arm 41 to drive the chip picking swing arm 41 to move closer to or away from the blue film tensioning mechanism 3.

[0044] As can be seen from the above description, the chip picking and placing mechanism 41 can effectively improve the chip transportation efficiency.

[0045] Furthermore, the end of the crystal-picking arm 41 is provided with a suction nozzle 411 for adsorbing the wafer.

[0046] Please refer to Figures 1 to 3 The first embodiment of this utility model is an automatic stripping machine, including a blue film loading rack 1, a blue film picking and placing mechanism 2, a blue film tensioning mechanism 3, a chip picking and placing mechanism 4, an identification device 5, and a chip collecting rack 6. The blue film loading rack 1 is used to store blue film rings. The blue film picking and placing mechanism 2 is located between the blue film loading rack 1 and the blue film tensioning mechanism 3. The chip collecting rack 6 is provided with multiple material boxes 61. The identification device 5 is located above the blue film tensioning mechanism 3. The chip picking and placing mechanism 4 is used to pick up and place chips from the blue film tensioning mechanism 3 into the material boxes 61.

[0047] The blue film tensioning mechanism 3 includes a base 31, a mounting platform 32, a pin assembly 33, and an XY axis displacement platform 34. The XY axis displacement platform 34 is driven to connect with the base 31. The mounting platform 32 is mounted on the base 31, and the pin assembly 33 is located below the mounting platform 32.

[0048] The blue film tensioning mechanism 3 also includes a first rotary drive assembly 35. The mounting platform 32 is rotatable relative to the base 31. The first rotary drive assembly 35 is mounted on the base 31 and is used to drive the mounting platform 32 to rotate. In this embodiment, the first rotary drive assembly 35 is a belt drive mechanism. In other embodiments, the first rotary drive assembly 35 may be a gear drive mechanism.

[0049] The mounting platform 32 is provided with a slot 321, and a magnetic element 322 is provided in the slot 321. The blue film ring is fixed in the slot 321 by the magnetic element 322.

[0050] In this embodiment, the identification device 5 is a CCD camera, and the automatic stripper is also equipped with a control module for processing the identification results of the identification device 5. The identification device 5 is electrically connected to the XY axis displacement platform 34 and the first rotation drive assembly 35 through the control module.

[0051] The blue film loading rack 1 includes a frame 11 and a first lifting drive assembly 12 drivenly connected to the frame 11. The frame 11 has multiple material placement cavities along the vertical direction. In this embodiment, the first lifting drive assembly 12 is a ball screw module.

[0052] The blue film handling mechanism 2 includes a gripper 21, a second lifting drive assembly 22, and a second rotating drive assembly 23. The second lifting drive assembly 22 and the second rotating drive assembly 23 are drivenly connected, and the second rotating drive assembly 23 is drivenly connected to the gripper 21. In this embodiment, the second lifting drive assembly 22 is a cylinder, and the second rotating drive assembly 23 is a motor.

[0053] The chip picking and placing mechanism 4 includes a chip picking swing arm 41, a third lifting drive assembly 42, and a third rotation drive assembly 43. The third rotation drive assembly 43 is driven to the chip picking swing arm 41 to drive the chip picking swing arm 41 to reciprocate between the blue film tensioning mechanism 3 and the chip collecting rack 6. The third lifting drive assembly 42 is driven to the chip picking swing arm 41 to drive the chip picking swing arm 41 to move closer to or away from the blue film tensioning mechanism 3. The end of the chip picking swing arm 41 is provided with a suction nozzle 411 for adsorbing wafers. In this embodiment, the third lifting drive assembly 42 is a motor-driven crank-slider mechanism, and the third rotation drive assembly 43 is a motor.

[0054] In summary, the automatic chip stripping machine provided by this utility model can automate the chip feeding, identification, and sorting process with high efficiency. In use, the blue film ring is placed onto the blue film tensioning mechanism via the blue film pick-and-place mechanism. Then, the identification device identifies the chip's specifications or quality. Finally, the chip pick-and-place mechanism sorts different chips into their corresponding boxes.

[0055] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent modifications made based on the content of this utility model specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. An automatic material peeling machine, characterized in that: The device includes a blue film loading rack, a blue film picking and placing mechanism, a blue film tensioning mechanism, a chip picking and placing mechanism, an identification device, and a chip collecting rack. The blue film loading rack is used to store blue film rings. The blue film picking and placing mechanism is located between the blue film loading rack and the blue film tensioning mechanism. The chip collecting rack has multiple material boxes. The identification device is located above the blue film tensioning mechanism. The chip picking and placing mechanism is used to pick up and place chips from the blue film tensioning mechanism and place them into the material boxes.

2. The automatic material peeling machine according to claim 1, characterized in that: The blue film tensioning mechanism includes a base, a mounting platform, a pin assembly, and an XY-axis displacement platform. The XY-axis displacement platform is driven to be connected to the base. The mounting platform is mounted on the base, and the pin assembly is located below the mounting platform.

3. The automatic material peeling machine according to claim 2, characterized in that: The blue film tensioning mechanism further includes a first rotary drive assembly. The mounting platform is rotatable relative to the base. The first rotary drive assembly is mounted on the base and is used to drive the mounting platform to rotate.

4. The automatic material peeling machine according to claim 3, characterized in that: The first rotary drive component is a belt drive mechanism.

5. The automatic material peeling machine according to claim 2, characterized in that: The mounting platform is provided with a card slot, and the card slot is provided with a magnetic suction component.

6. The automatic material peeling machine according to claim 1, characterized in that: The identification device is a CCD camera.

7. The automatic material peeling machine according to claim 1, characterized in that: The blue film feeding rack includes a frame and a first lifting drive assembly that is driven to the frame. The frame has multiple material placement chambers along the vertical direction.

8. The automatic material peeling machine according to claim 1, characterized in that: The blue film picking and placing mechanism includes a gripper, a second lifting drive assembly, and a second rotating drive assembly. The second lifting drive assembly is driven to the second rotating drive assembly, and the second rotating drive assembly is driven to the gripper.

9. The automatic material peeling machine according to claim 1, characterized in that: The chip picking and placing mechanism includes a chip picking swing arm, a third lifting drive assembly, and a third rotation drive assembly. The third rotation drive assembly is driven to the chip picking swing arm to drive the chip picking swing arm to swing back and forth between the blue film tensioning mechanism and the chip collection rack. The third lifting drive assembly is driven to the chip picking swing arm to drive the chip picking swing arm to move closer to or away from the blue film tensioning mechanism.

10. The automatic material peeling machine according to claim 9, characterized in that: The end of the crystal-picking arm is equipped with a suction nozzle for adsorbing the wafer.