TO packaging, surface mounting and welding integrated device

Abstract

The utility model discloses a TO packaging paster welding integrated device, which relates to the technical field of discrete semiconductor devices and comprises a lower die and an upper die. Wherein the lower die and the upper die are detachably connected; a plurality of frame embedding grooves, a first positioning pin and a second positioning pin are arranged on the upper surface of the lower die, the frame embedding grooves are arranged in parallel at intervals, the frame embedding grooves are matched with the lead frame, and the first positioning pin and the second positioning pin are located on the two sides of the frame embedding grooves; a plurality of through holes which are uniformly arranged are formed in positions, corresponding to the frame embedding grooves, of the upper mold, and the plurality of through holes correspond to chips of the lead frame in position; a first positioning hole and a second positioning hole are formed in the upper die and correspond to the first positioning pin and the second positioning pin of the lower die in position respectively. According to the TO packaging, surface-mounting and welding integrated device provided by the utility model, simultaneous surface-mounting of a plurality of chips is realized, and the surface-mounting efficiency is higher.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor discrete device technology, specifically relating to an integrated TO package surface mount and bonding device. Background Technology

[0002] Currently, TO series discrete devices are mounted using traditional die-mounting machines. TO packages come in various types (such as TO-220, TO-247, TO-252, etc.). Switching between package types using traditional die-mounting machines is slow, requiring frequent changes to the mounting rails and tooling fixtures, resulting in long debugging cycles, high time and labor costs, and poor compatibility with irregularly shaped lead frames. Traditional die-mounting machines often employ mechanical positioning or simple vision alignment systems, whose mounting accuracy is insufficient for the demands of miniaturized chips. Power devices have stringent requirements for solder joint voids; after traditional die-mounting, the solder layer voids (individual voids <5%, overall voids <10%) are insufficient to meet the heat dissipation requirements of miniaturized chips. Utility Model Content

[0003] To address the aforementioned problems in the existing technology, this utility model provides an integrated TO package surface mount welding device. The technical problem to be solved by this utility model is achieved through the following technical solution:

[0004] This utility model provides an integrated TO packaging surface mount welding device, comprising: a lower mold and an upper mold; wherein, the lower mold and the upper mold are detachably connected;

[0005] The upper surface of the lower mold is provided with multiple frame embedding grooves, a first positioning pin and a second positioning pin, wherein the multiple frame embedding grooves are arranged in parallel and spaced apart, the frame embedding grooves are adapted to the lead frame, and the first positioning pin and the second positioning pin are located on both sides of the frame embedding groove.

[0006] The upper mold has a plurality of through holes evenly arranged at positions corresponding to the embedded grooves of the frame, and the plurality of through holes correspond to the chip positions of the lead frame.

[0007] The upper mold is provided with a first positioning hole and a second positioning hole, the first positioning hole and the second positioning hole corresponding to the positions of the first positioning pin and the second positioning pin of the lower mold, respectively.

[0008] In one embodiment of the present invention, when the lead frame is placed in the frame embedding groove, the upper surface of the lead frame pins is flush with the upper surface of the lower mold.

[0009] In one embodiment of this utility model, the frame is embedded in the groove and has a first protrusion and a second protrusion, the first protrusion and the second protrusion corresponding to the positions of the first recessed notch and the second recessed notch on both sides of the lead frame, respectively.

[0010] In one embodiment of this utility model, the outer frame size of the lower mold is the same as the outer frame size of the upper mold.

[0011] In one embodiment of this utility model, a boss is provided on the lower surface of the upper mold at a position corresponding to the embedded groove of the frame, and the through hole penetrates the boss.

[0012] In one embodiment of this utility model, both the lower mold and the upper mold are graphite clamps.

[0013] In one embodiment of this utility model, the thickness of the lower mold is 8-10mm.

[0014] In one embodiment of this utility model, the thickness of the upper mold is 4-6 mm.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] This utility model's TO package chip bonding and mounting integrated device enables the simultaneous mounting of multiple chips, resulting in higher mounting efficiency. Compared to mechanical positioning or simple vision alignment systems, the mounting accuracy of this utility model's TO package chip bonding and mounting integrated device can meet the requirements of miniaturized chips.

[0017] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0018] Figure 1 This is an outline drawing of a TO-220FB-3L packaged lead frame provided in an embodiment of this utility model;

[0019] Figure 2 This is a perspective view of a lower mold provided in an embodiment of the present utility model;

[0020] Figure 3 This is a top view of a lower mold provided in an embodiment of the present utility model;

[0021] Figure 4 This is a perspective view of an upper mold provided in an embodiment of the present utility model;

[0022] Figure 5 This is a top view of an upper mold provided in an embodiment of the present utility model;

[0023] Figure 6This is a left view of an upper mold provided in an embodiment of this utility model.

[0024] Icons: 1-First recessed notch; 2-Second recessed notch; 3-First positioning pin; 4-Second positioning pin; 5-Frame embedded groove; 6-First protrusion; 7-Second protrusion; 8-First positioning hole; 9-Second positioning hole; 10-Through hole; 11-Boss. Detailed Implementation

[0025] To further illustrate the technical means and effects adopted by this utility model to achieve its intended purpose, the following detailed description of a TO package patch welding integrated device based on this utility model is provided in conjunction with the accompanying drawings and specific embodiments.

[0026] The foregoing and other technical contents, features, and effects of this utility model will be clearly presented in the following detailed description of the specific embodiments with reference to the accompanying drawings. Through the description of the specific embodiments, a more in-depth and specific understanding can be gained of the technical means and effects adopted by this utility model to achieve the intended purpose. However, the accompanying drawings are only provided for reference and illustration and are not intended to limit the technical solution of this utility model.

[0027] Please refer to the above. Figures 1-6 This utility model provides an integrated TO packaging surface mount welding device, which includes a lower mold and an upper mold; wherein the lower mold and the upper mold are detachably connected.

[0028] Specifically, such as Figure 2 As shown, the upper surface of the lower mold is provided with multiple frame embedding grooves 5, a first positioning pin 3, and a second positioning pin 4. The multiple frame embedding grooves 5 are arranged in parallel and spaced apart, and the frame embedding grooves 5 are adapted to the lead wire frame. The first positioning pin 3 and the second positioning pin 4 are located on both sides of the frame embedding grooves 5. In this embodiment, the upper surface of the lower mold is provided with 5 frame embedding grooves 5. It is understood that, depending on the actual production situation, 4, 6, or 7 frame embedding grooves 5 can also be provided on the upper surface of the lower mold; the specific number is not limited here.

[0029] In this embodiment, the lower mold is dug to a depth according to the structural dimensions of the lead frame, and the lead frame is bent into a stepped shape to form a frame embedding groove 5, so as to ensure that the entire lead frame can be fully embedded in the frame embedding groove 5. When the lead frame is placed in the frame embedding groove 5, the upper surface of the lead frame pins is flush with the upper surface of the lower mold.

[0030] Taking TO-220FB-3L as an example, the outline of the TO-220FB-3L package lead frame is as follows: Figure 1As shown, the lead frame has recessed notches on both the left and right sides (first recessed notch 1 and second recessed notch 2). Figure 3 As shown, the frame is embedded in the groove 5 and has a first protrusion 6 and a second protrusion 7. The first protrusion 6 and the second protrusion 7 correspond to the positions of the first recessed notch 1 and the second recessed notch 2 on both sides of the lead frame, respectively.

[0031] In this embodiment, the two recessed notches of the lead frame are used as frame positioning points for mold insertion. The corresponding frame is embedded in the first protrusion 6 and the second protrusion 7 within the groove 5, and is manufactured exactly according to the dimensions of the lead frame drawing. Figure 2 As shown, one lower die can accommodate 5 TO-220FB lead frames arranged in sequence.

[0032] like Figure 4 and Figure 5 As shown, the upper mold has a plurality of through holes 10 evenly arranged at the position corresponding to the frame embedding groove 5, and the plurality of through holes 10 correspond to the chip position of the lead frame; the upper mold has a first positioning hole 8 and a second positioning hole 9, and the first positioning hole 8 and the second positioning hole 9 correspond to the positions of the first positioning pin 3 and the second positioning pin 4 of the lower mold, respectively.

[0033] In this embodiment, the outer frame dimensions of the lower mold and the upper mold are the same. Optionally, the outer frame dimensions of the lower and upper molds can be 270*210mm, the thickness of the lower mold can be 8-10mm, and the thickness of the upper mold can be 4-6mm. For example, the thickness of the lower mold is 10mm, and the thickness of the upper mold is 5mm.

[0034] In this embodiment, after the lead frame is inserted into the mold through the frame positioning point, the lower mold and the upper mold achieve precise mold closing through the first positioning pin 3, the second positioning pin 4, the first positioning hole 8, and the second positioning hole 9.

[0035] like Figure 6 As shown, in this embodiment, a boss 11 is provided on the lower surface of the upper mold at the position corresponding to the frame embedding groove 5, and a through hole 10 passes through the boss 11. After the lower mold and the upper mold are closed, the lead frame can be fixed and pressed by the boss 11.

[0036] Understandably, for the upper mold, through-holes 10 corresponding to the chip positions can be set in the corresponding lead frame area of ​​the upper mold for different products and chip positions, for placement machines to solder the chips and mount them. The size and position of the through-holes 10 correspond to the BOM drawings of different product models, allowing for the creation of dedicated upper molds for different product models. For lead frames with the same package shape, the lower mold can be directly universal.

[0037] In this embodiment, both the lower and upper molds are graphite fixtures, which can be directly placed into a vacuum formic acid furnace for chip soldering after the mounting process is completed.

[0038] In the TO package chip mounting and soldering integrated device of this embodiment, during chip mounting, the empty lead frame is embedded into the frame embedding groove 5 of the lower mold according to the frame positioning point, and then covers the upper mold, so that the lead frame is completely fixed in the mold. The chip mounter is used to edit the automation program according to the type and position information of the solder pads and chips on the product BOM drawing, and the solder pads and chips are mounted one after another through the reserved through holes 10 of the upper mold. The precise hole position can ensure that the solder pads and chips will not be displaced due to shaking during transportation and transfer, so as to avoid problems such as chip flipping and void abnormalities. After all solder pads and chips are mounted, the whole mold is sent to the vacuum formic acid furnace for final soldering.

[0039] This embodiment of the TO package surface mount and soldering integrated device enables the simultaneous mounting of multiple chips, resulting in higher mounting efficiency. Compared to mechanical positioning or simple vision alignment systems, the mounting accuracy of this TO package surface mount and soldering integrated device meets the requirements of miniaturized chips. Furthermore, when changing to different products, only the molds corresponding to the different products need to be replaced, without requiring a series of modifications to the mounting equipment, ensuring equipment stability and reducing equipment maintenance costs.

[0040] Furthermore, after all the solder pads and chips are mounted using the TO package surface mount and soldering integrated device of this embodiment, when the entire mold is sent to the vacuum formic acid furnace for final soldering, a vacuum reflow soldering method can be used, specifically including: evacuating quickly to a chamber pressure of 5~10 mbar; filling the chamber with N2; evacuating quickly to a chamber pressure of 1~5 mbar; heating to 150℃~170℃ and holding for 10~30 s; filling the chamber with formic acid at a flow rate of 15 Sl / min to a chamber pressure of 400~600 mbar; filling the chamber with N2 to a chamber pressure of 950 mbar; evacuating quickly to a chamber pressure of 5~10 mbar; heating to 200℃~220℃ and holding for 10~30 s; filling the chamber with formic acid at a flow rate of 15 Sl / min to a chamber pressure of 400~600 mbar and holding for 60~90 s; evacuating quickly to a chamber pressure of 2~5 mbar. mbar; Evacuate, softly pump to 1 mbar pressure in the cavity; Heat, set the heating temperature to the solder melting point +30℃~50℃, hold for 60~120 s; Cool down to 25℃~40℃.

[0041] This utility model's integrated TO packaging surface mount and soldering device breaks through the technical boundaries of traditional chip mounting machines and general-purpose surface mount machines, providing an efficient and low-cost solution for high-reliability TO packaging. Using this integrated TO packaging surface mount and soldering device, power devices that achieve both surface mount and formic acid soldering have solder layer voids (individual voids <1%, overall voids <1.5%), meeting the heat dissipation requirements of miniaturized chips.

[0042] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations are intended to cover non-exclusive inclusion, such that an article or device comprising a list of elements includes not only those elements but also other elements not expressly listed. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or device comprising said element. Terms such as "connected" or "linked" are not limited to physical or mechanical connections but can include electrical connections, whether direct or indirect. The orientations or positional relationships indicated by terms such as "upper," "lower," "left," and "right" are based on the orientations or positional relationships shown in the accompanying drawings and are used only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention.

[0043] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0044] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the protection scope of the present invention.

Claims

1. A TO package surface mount soldering integrated device, characterized in that, include: A lower mold and an upper mold; wherein the lower mold and the upper mold are detachably connected; The upper surface of the lower mold is provided with multiple frame embedding grooves (5), a first positioning pin (3) and a second positioning pin (4), wherein the multiple frame embedding grooves (5) are arranged in parallel and spaced apart, the frame embedding grooves (5) are adapted to the lead frame, and the first positioning pin (3) and the second positioning pin (4) are located on both sides of the frame embedding grooves (5). The upper mold has a plurality of through holes (10) evenly arranged at the position corresponding to the frame embedding groove (5), and the plurality of through holes (10) correspond to the chip position of the lead frame; The upper mold is provided with a first positioning hole (8) and a second positioning hole (9), and the first positioning hole (8) and the second positioning hole (9) correspond to the positions of the first positioning pin (3) and the second positioning pin (4) of the lower mold, respectively.

2. The TO package surface mount welding integrated device according to claim 1, characterized in that, When the lead frame is placed in the frame embedding groove (5), the upper surface of the lead frame pins is flush with the upper surface of the lower mold.

3. The TO package surface mount welding integrated device according to claim 1, characterized in that, The frame is embedded in the groove (5) and is provided with a first protrusion (6) and a second protrusion (7). The first protrusion (6) and the second protrusion (7) correspond to the positions of the first recessed notch (1) and the second recessed notch (2) on both sides of the lead frame, respectively.

4. The TO package surface mount welding integrated device according to claim 1, characterized in that, The outer frame dimensions of the lower mold are the same as those of the upper mold.

5. The TO package surface mount welding integrated device according to claim 1, characterized in that, A boss (11) is provided on the lower surface of the upper mold at the position corresponding to the frame embedding groove (5), and the through hole (10) passes through the boss (11).

6. The TO package surface mount welding integrated device according to claim 1, characterized in that, Both the lower mold and the upper mold are graphite clamps.

7. The TO package surface mount welding integrated device according to claim 1, characterized in that, The thickness of the lower mold is 8-10mm.

8. The TO package surface mount welding integrated device according to claim 1, characterized in that, The thickness of the upper mold is 4-6mm.

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