Automatic silicon wafer feeding system

Abstract

The utility model relates to the technical field of silicon wafer production, in particular to an automatic silicon wafer feeding system, which comprises a silicon wafer pretreatment mechanism, a plurality of silicon wafer conveying mechanisms and a wafer inserting and feeding mechanism, the silicon wafer pretreatment mechanism comprises a supporting frame body, and the supporting frame body is provided with a clamp component used for clamping a material frame and a six-axis moving component used for controlling the clamp component to move along the X axis, the Y axis and the Z axis. The silicon wafer conveying mechanism comprises a second conveying part for continuously conveying silicon wafers; the second conveying part comprises a supporting frame, the supporting frame is provided with a first bottom conveying module used for supporting and conveying the silicon wafers, and the supporting frame is further provided with a second bottom conveying module in seamless butt joint with the tail end of the first bottom conveying module. Under the cooperation of all the mechanisms, full-automatic degumming, carrying, conveying and wafer inserting and feeding machining steps are achieved, the machining efficiency is improved, silicon wafers can be protected, and the machining quality of the silicon wafers is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer production technology, and in particular to an automatic silicon wafer feeding system. Background Technology

[0002] In the field of silicon wafer manufacturing technology, wafer loading is a critical process, and its efficiency and stability directly affect the quality and capacity of subsequent processing. In existing technologies, silicon wafers are typically loaded using a wafer rack, where the wafer holder and wafer are bonded together with adhesive, requiring multiple steps including debonding, handling, conveying, and wafer insertion. However, traditional wafer loading systems suffer from significant technical bottlenecks, making it difficult to meet the demands of efficient and automated production.

[0003] One major issue is the insufficient automation in wafer insertion and loading: In existing systems, the process from debonding to inserting silicon wafers into the basket often requires multiple devices to operate independently, with poor coordination between each step. For example, after debonding, the silicon wafers need additional equipment to be transferred to the conveying mechanism. During the insertion process, the positioning of the basket, the separation and insertion of silicon wafers one by one, rely on mechanical or manual assistance, making it difficult to achieve full-process automated control. In addition, during the conveying process, silicon wafers are prone to jamming or damage due to inaccurate connections between mechanisms, further affecting the automation process.

[0004] Secondly, the conveying and feeding process requires machine shutdown for replenishment, resulting in low efficiency: Traditional conveying mechanisms typically use single-module conveying. After one batch of silicon wafers is conveyed, the machine must be stopped before loading the next batch, causing production interruptions. For example, silicon wafers must be completely conveyed to the next stage before they can be reloaded, during which time the equipment is idle. Especially in multi-batch continuous production, frequent shutdowns severely reduce capacity.

[0005] Therefore, an automatic silicon wafer feeding system is provided to solve the above-mentioned technical problems. Utility Model Content

[0006] The purpose of this utility model is to provide an automatic silicon wafer feeding system to address the shortcomings of existing technologies, thereby solving the technical problems that existing silicon wafer feeding systems cannot perform fully automatic wafer insertion and feeding processes, and that the system needs to be stopped to replenish materials during the silicon wafer conveying and feeding process.

[0007] To achieve the above objectives, the technical solution of this utility model is as follows:

[0008] An automatic silicon wafer feeding system includes a silicon wafer pretreatment mechanism, a silicon wafer conveying mechanism, and an insertion feeding mechanism that are connected sequentially. Several silicon wafer conveying mechanisms are arranged side by side.

[0009] The silicon wafer preprocessing mechanism includes a support frame, which is equipped with a clamping component for gripping the material frame and a six-axis movable component for controlling the movement of the clamping component along the X-axis, Y-axis and Z-axis.

[0010] The silicon wafer conveying mechanism includes a second conveying section for continuously conveying silicon wafers; the second conveying section includes a support frame, the support frame is provided with a first bottom conveying module for supporting and conveying silicon wafers, and is also provided with a second bottom conveying module that is seamlessly connected to the end of the first bottom conveying module.

[0011] It also includes a second support plate, which is provided with a first movable frame and a second movable frame that can move closer to or further away from each other. The first movable frame is equipped with a first clamping and conveying module, and the second movable frame is equipped with a second clamping and conveying module for combining with the first clamping and conveying module to clamp and convey the silicon wafer placed on the first bottom conveying module.

[0012] It also includes a support beam, which is provided with a first fixed frame and a second fixed frame. The first fixed frame is equipped with a third clamping and conveying module, and the second fixed frame is equipped with a fourth clamping and conveying module for cooperating with the third clamping and conveying module to clamp and convey the silicon wafers conveyed to the second bottom conveying module.

[0013] The wafer loading mechanism includes a climbing conveyor module, a basket flipping mechanism, and a basket clamping and handling module; several climbing conveyor modules are arranged side by side, and the beginning of each climbing conveyor module is connected to the end of a different second bottom conveyor module. The end of each climbing conveyor module is connected to a receiving module for collecting silicon wafers and inserting them into the basket.

[0014] The beneficial effects of this utility model are as follows: In use, the six-axis movable parts control the clamping parts to move along the X-axis, Y-axis and Z-axis. The clamping parts are used to clamp the material frame, realize the transportation of the material frame, and transport the material frame to the designated position for degumming and other treatments.

[0015] After the adhesive removal is completed, the clamping frame, in conjunction with the six-axis movable component, transports a batch of silicon wafers to between the first clamping conveyor module and the second clamping conveyor module. The frame is then opened and removed. At this point, the silicon wafers are placed on the first bottom conveyor module and positioned between the first and second clamping conveyor modules. First, the first and second movable frames are brought closer together, causing the first and second clamping conveyor modules to move closer together as well. Once they contact both sides of the batch of silicon wafers, they are clamped. Simultaneously, the first bottom conveyor module, the first clamping conveyor module, and the second clamping conveyor module operate to transport this batch of silicon wafers. During transport, the first and second clamping conveyor modules limit the movement of the silicon wafers, ensuring they remain upright (several wafers are stacked horizontally) and preventing collapse.

[0016] In addition, while the first bottom conveyor module transports the silicon wafers to the second bottom conveyor module, they are simultaneously clamped by the third and fourth clamping conveyor modules. These modules operate concurrently, continuing to transport the wafers in the same manner as described above. The second bottom conveyor module then transports the wafers to the beginning of the climbing conveyor module for reception. Because the second and first bottom conveyor modules are seamlessly connected (seamless transmission path), the wafers are smoothly transported to the second bottom conveyor module without jamming, shifting, or falling. Once all the wafers on the first bottom conveyor module have been transported to the second bottom conveyor module, the modules are moved away from each other, allowing the next batch of wafers to be placed on the first bottom conveyor module. This allows for replenishment during wafer transport, improving processing efficiency.

[0017] After the second bottom conveying module transports the silicon wafers one by one to the designated position, they are received by the climbing conveying module, which continues to transport the wafers. During the transport process, the wafers change from an upright position to a horizontal position. Each receiving module has a basket, which moves up and down intermittently with the basket to allow silicon wafers to be inserted one by one. Each time the basket rises, the climbing conveying module feeds in one silicon wafer. When enough silicon wafers are inserted into the basket, the basket clamping and transporting module is activated to move the basket from the receiving module to the basket flipping mechanism. Finally, the basket flipping mechanism flips the upright basket to a horizontal position for easy transport to the next mechanism.

[0018] With the cooperation of the aforementioned institutions, the silicon wafers can be fully automated in terms of debinding, handling, conveying, and insertion. This not only improves processing efficiency but also protects the silicon wafers and ensures the quality of silicon wafer processing. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0020] Figure 2 This is a schematic diagram of the silicon wafer pretreatment mechanism of this utility model.

[0021] Figure 3 This is a schematic diagram of the silicon wafer pretreatment mechanism of this utility model from another perspective.

[0022] Figure 4 This is a schematic diagram of the structure of the six-axis movable component of this utility model.

[0023] Figure 5 This is a schematic diagram of the structure of the first driving component and the third driving component of this utility model.

[0024] Figure 6 This is a structural schematic diagram of the clamp component and the material support component of this utility model.

[0025] Figure 7 This is a schematic diagram of the silicon wafer conveying mechanism of this utility model.

[0026] Figure 8 This is a schematic diagram of the structure of the second conveying part of this utility model.

[0027] Figure 9 This is a schematic diagram of the structure of the first bottom conveying module and the second bottom conveying module of this utility model.

[0028] Figure 10 This is a schematic diagram of the gripper and material frame of this utility model.

[0029] Figure 11 This is a schematic diagram of the structure of the first clamping and conveying mold of this utility model.

[0030] Figure 12 This utility model Figure 11 Enlarged view of part A in the image.

[0031] Figure 13 This is a schematic diagram of the insert feeding mechanism of this utility model.

[0032] Figure 14 This is a schematic diagram of the insert feeding mechanism of this utility model from another perspective.

[0033] Figure 15 This is a schematic diagram of the climbing conveyor module of this utility model.

[0034] Figure 16 This is a schematic diagram of the waste discharge mechanism of this utility model.

[0035] Figure 17 This is a schematic diagram of the structure of the flower basket clamping and handling module of this utility model.

[0036] Figure 18 This is a schematic diagram of the clamping mechanism of this utility model.

[0037] The reference numerals in the figures include:

[0038] 114. Material frame; 1141. Frame plate; 1142. Connecting frame; 1143. First mounting plate; 1144. First slide rail; 1145. Limiting roller; 1146. First slide rod; 1147. Second mounting plate; 1148. Positioning groove; 1149. Second slide rail; 11410. Support roller; 11411. Second slide rod; 11412. Protruding rod; 11413. Clearance groove; 115. Material transport trolley; 116. Crystal holder; 1161. Support foot; 117. Silicon wafer;

[0039] 1. Silicon wafer pretreatment mechanism; 11. Support frame; 12. Material frame conveyor line; 13. Spray tank; 131. Spray pipe; 132. Cover plate; 133. Push cylinder; 14. First degumming tank; 15. Second degumming tank; 16. Immersion tank; 17. Truss; 171. Guide rail; 172. Movable roller; 18. First drive component; 181. Right angle steering gear; 182. First rotating shaft; 183. First gear; 184. First rack; 185. First stepper motor; 19. First movable seat; 110. Second drive component; 111. First lifting seat ; 1111, Lifting plate; 112, Third drive component; 1121, Third support base; 1122, Second rotating shaft; 1123, Second gear; 1124, Second rack; 1125, Second stepper motor; 113, Clamping component; 1131, Sliding member; 1132, Gripper part; 1133, First control cylinder; 1134, Placement slot; 1135, Actuating bevel; 1136, Extension part; 118, Guide seat; 119, First support plate; 120, Buffer spring; 121, Rotary cylinder; 122, Rotating rod; 123, Support block;

[0040] 2. Silicon wafer conveying mechanism; 201. Support frame; 202. First wafer insertion slot; 203. Second wafer insertion slot; 204. First conveying section; 205. Second conveying section; 2051. Second support plate; 2052. Slide rail; 2053. First movable frame; 2054. Second movable frame; 2055. Second control cylinder; 2056. First clamping conveying module; 20561. First transmission gear; 20562. Second transmission gear; 20563. Transmission toothed belt; 20564. Anti-slip layer; 20565. Third drive motor; 20566. Connecting shaft; 2057. Second clamping conveying module; 2058. Support beam; 2059. First fixed frame; 20510. Second fixed frame; 20511. Third clamping conveying module; 20512. Fourth clamping conveying module; 20 513. Support frame; 20514. Positioning block; 20515. First bottom conveyor module; 205151. First support base; 205152. First pulley; 205153. First conveyor belt; 205154. Guide bar; 205155. First drive motor; 205156. First transmission component; 20516. Second bottom conveyor module; 205161. Second support base; 205162. Third rotating shaft; 205163. Fourth rotating shaft; 205164. Second pulley; 205165. Third pulley; 205166. Second conveyor belt; 205167. Second drive motor; 205168. Second transmission component; 20517. Fixed base; 20518. First conveyor wheel; 20519. Second conveyor wheel; 20520. Conveyor belt;

[0041] 3. Insertion feeding mechanism; 31. Support frame; 32. Climbing conveyor module; 321. Vertical conveying mechanism; 322. Climbing conveying mechanism; 323. Horizontal conveying mechanism; 324. Output module; 325. Waste discharge mechanism; 3251. Support platform; 3252. Lifting platform; 3253. Fifth rotating shaft; 3254. Cam; 3255. Fourth drive component; 3256. Rolling wheel; 3257. Drive shaft; 3258. First transmission assembly; 3259. Feeding rotary rod; 32510. Second transmission assembly Components; 32511, Feeding roller; 33, Receiving module; 34, Basket flipping mechanism; 35, Flower basket clamping and handling module; 351, Third movable frame; 352, Second movable seat; 353, Second lifting seat; 354, Clamping mechanism; 3541, Third mounting plate; 3542, Clamping cylinder; 3543, Clamping block; 3544, Sliding frame; 3545, Pressing rod; 3546, Pressing spring; 355, Fourth drive mechanism; 356, Fifth drive mechanism; 357, Sixth drive mechanism; 36, Flower basket. Detailed Implementation

[0042] The following is a detailed description of an automatic silicon wafer feeding system according to the present invention, with reference to the accompanying drawings.

[0043] like Figure 1-3 As shown, an embodiment of the automatic silicon wafer feeding system of this utility model includes a silicon wafer pretreatment mechanism 1, a silicon wafer conveying mechanism 2, and a wafer insertion feeding mechanism 3 connected in sequence; several silicon wafer conveying mechanisms 2 can be provided to improve the conveying efficiency of silicon wafers 117. After the material frame 114 containing silicon wafers 117 is transported to the silicon wafer pretreatment mechanism 1, the silicon wafers 117 in the material frame 114 are subjected to a pre-de-adhesion treatment to separate the silicon wafers 117 from the crystal holder 116 (when the silicon wafers 117 are transported, several silicon wafers 117 are adhered to the crystal holder 116 and are filled together in the material frame 114); then the de-adhesion silicon wafers 117 are transported to the silicon wafer conveying mechanism 2, and the material frame 114 is removed to transport the silicon wafers 117. After being transported to the designated loading position, the wafer loading mechanism 3 loads the silicon wafers 117 one by one into the basket 36. When the basket 36 is filled with enough silicon wafers 117, the basket 36 is transported to the designated position to be transported to the subsequent processing mechanism; through the above process, the silicon wafers 117 are de-adhesioned, transported, conveyed and loaded into the wafer loading mechanism. Each step is described in detail below.

[0044] like Figure 2-4 As shown, the silicon wafer pretreatment mechanism 1 includes a support frame 11 and several material frame conveyor lines 12 mounted on the support frame 11. The several material frame conveyor lines 12 are arranged side by side and are all used to continuously convey the material frames 114. The material frames 114 are used to load the crystal trays 116 and several silicon wafers 117 bonded to the crystal trays 116 (e.g., ...). Figure 6As shown, the silicon wafers 117 are transported and conveyed by using the material frame 114 as a carrier. A spray tank 13 for rinsing the silicon wafers 117 in the material frame 114 is provided beside the material frame conveyor line 12. The support frame 11 is equipped with a clamping component 113 for gripping the material frame 114 and a six-axis movable component for controlling the movement of the clamping component 113 along the X, Y, and Z axes. The six-axis movable component controls the movement of the clamping component 113 along the X, Y, and Z axes, thereby transporting the material frames 114 from the material frame conveyor line 12 one by one into the spray tank 13 for rinsing, washing away dust and fine debris adhering to the surface of the silicon wafers 117, facilitating subsequent processing of the silicon wafers 117.

[0045] In this embodiment, the spray tank 13 is equipped with a plurality of spray pipes 131. When the material frame 114 is transported into the spray tank 13, it is placed between the spray pipes 131, and water is sprayed from the spray pipes 131 to perform rinsing treatment. The support frame 11 is laterally movably provided with a cover plate 132 for covering the opening of the spray tank 13, and a push cylinder 133 for pushing the cover plate 132 to move. When the spray pipes 131 spray water, the push cylinder 133 pushes the cover plate 132 to move laterally to cover the opening of the spray tank 13, preventing water from splashing out and improving the cleaning effect in the process of cleaning the silicon wafer 117.

[0046] Furthermore, the support frame 11 is also equipped with an immersion tank 16, and a first debonding tank 14 and a second debonding tank 15 are arranged beside the immersion tank 16. Both the first debonding tank 14 and the second debonding tank 15 are filled with a chemical solution and equipped with an electric heating rod for heating the chemical solution. Heating the chemical solution can heat the adhesive between the silicon wafer 117 and the crystal holder 116, thereby achieving the debonding process. After debonding, the silicon wafer 117 is separated from the crystal holder 116. In addition, an ultrasonic device (existing technology) can be installed at the bottom of the first debonding tank 14 and the second debonding tank 15. While heating the adhesive, the ultrasonic device is running, and the debonding efficiency is improved by combining heating and ultrasonic waves. The immersion tank 16 contains hot water. After the silicon wafer 117 is separated from the crystal holder 116, the material frame 114 in the first debonding tank 14 and the second debonding tank 15 is transported to the immersion tank 16 through the cooperation of the six-axis moving part and the clamping part 113 for buffering. The material frame 114 loaded with silicon wafer 117 is then transported to the silicon wafer conveying mechanism 2 for continuous conveying of silicon wafer 117. During the waiting process, the silicon wafer 117 is always kept in an immersion state.

[0047] The six-axis movable component includes a truss 17 that moves along the X-axis on the support frame 11, a first movable seat 19 that moves along the Y-axis on the truss 17, and a first lifting seat 111 that moves along the Z-axis on the first movable seat 19; it also includes a first driving component 18 for driving the truss 17 to move, a second driving component 110 for driving the first movable seat 19 to move, and a third driving component 112 for driving the first lifting seat 111 to move.

[0048] In addition, a guide rail 171 arranged along the X-axis in the length direction is provided on the support frame 11, and a movable roller 172 is mounted on the truss 17, which rolls on the guide rail 171. Under the guidance of the guide rail 171, the truss 17 moves along the X-axis on the support frame 11. Furthermore, a guide rail arranged along the Y-axis is provided on the truss 17, and the first movable seat 19 is slidably disposed on the guide rail. The guide rail 171 and the guide rails disposed on the truss 17 are arranged horizontally or substantially horizontally.

[0049] like Figure 5 As shown, the first drive component 18 includes a right-angle steering gear 181 (model XCT2, T-type steering gear) mounted on the truss 17. Two output shafts of the right-angle steering gear 181 are laterally arranged, each with a coaxially arranged first rotating shaft 182. The first rotating shafts 182 on both sides are laterally arranged and their axes are perpendicular to the direction of movement of the truss 17. The right-angle steering gear 181 controls the first rotating shafts 182 on both sides to rotate simultaneously in the same direction. A pair of first racks 184, parallel in length to the direction of movement of the truss 17, are mounted on the support frame 11. The first racks 184 on both sides are close to different first rotating shafts 182. A first gear 183 is provided at the ends of the first rotating shafts 182 that are far apart from each other. The first gears 183 on both sides mesh with different first racks 184. It also includes a first stepper motor 185, the output shaft of which is connected to the vertically arranged output shaft of the right-angle steering gear 181; running the first stepper motor 185 drives the right-angle steering gear 181 to control the first rotating shafts 182 on both sides to rotate simultaneously in the same direction. Because the first rack 184 is fixedly set, in cooperation with the first gears 183 on both sides, it drives the truss 17 to move along the X-axis on the support frame 11.

[0050] Furthermore, the third driving component 112 includes a third support 1121 mounted on the first movable seat 19. A second rotating shaft 1122, arranged laterally and with its axis perpendicular to the direction of movement of the first lifting seat 111, is rotatably mounted on the third support 1121. The first lifting seat 111 is equipped with a vertically arranged second rack 1124, and the second rotating shaft 1122 is provided with a second gear 1123 meshing with the second rack 1124. The first movable seat 19 is equipped with a second stepper motor 1125 for driving the second rotating shaft 1122 to rotate. Operating the second stepper motor 1125 drives the second rotating shaft 1122 and the second gear 1123 to rotate. Because the second rack 1124 is fixedly mounted, it can drive the first lifting seat 111 to move along the Z-axis when engaged with the second gear 1123.

[0051] like Figure 6 As shown, a lifting plate 1111 is installed at the bottom of the first lifting seat 111, and a clamping component 113 is installed on the lifting plate 1111. The clamping component 113 includes a left clamping part and a right clamping part, which have the same structure and are arranged in a mirror image. The left clamping part includes a sliding member 1131 that can move towards or away from the right clamping part, and a first control cylinder 1133 for controlling the movement of the sliding member 1131. The sliding member 1131 is equipped with a gripper part 1132 for clamping the material frame 114. By operating the first control cylinder 1133, the sliding member 1131 is controlled to move towards or away from the right clamping part, so that the two sides move closer or further apart, thereby clamping and releasing the material frame 114.

[0052] In this embodiment, a pair of protruding rods 11412 are provided on the outer side walls at both ends of the material frame 114, and a pair of placement grooves 1134 for placing the protruding rods 11412 are formed in the gripper portion 1132. When the gripper portions 1132 on the left and right sides are placed on both sides of the material frame 114, the gripper portions 1132 on the left and right sides are controlled to move closer to each other, so that each protruding rod 11412 is placed in a different placement groove 1134. Then, when the gripper portions 1132 are controlled to move along the X-axis, Y-axis and Z-axis, the material frame 114 is transported.

[0053] After the debinding process, in order to remove the crystal tray 116 from the material frame 114, a pair of parallel and T-shaped support feet 1161 are formed on the side of the crystal tray 116 away from the silicon wafer 117. The lifting plate 1111 is also equipped with a number of material support components for supporting the crystal tray 116. The material support components include a first support plate 119 and a rotary cylinder 121 mounted on the first support plate 119. The output shaft of the rotary cylinder 121 is arranged downward, and a vertically arranged rotating rod 122 is mounted on its output shaft. The bottom end of the rotating rod 122 extends downward to pass through the lifting plate 1111. The bottom end of the rotating rod 122 is equipped with a support block 123 that, after rotation, cooperates with the support feet 1161 to support the crystal tray 116. When the material frame 114 is placed in the soaking tank 16, the crystal tray 116 needs to be moved out of the material frame 114. Specifically: control the lifting plate 1111 to move along the X-axis, Y-axis and Z-axis to the top of the material frame 114, and then control the lifting plate 1111 to move downward so that the support block 123 is placed between the two T-shaped support feet 1161. Then, run the rotary cylinder 121 to drive the support block 123 to rotate 90 degrees. At this time, the two ends of the support feet 1161 are respectively placed directly below the lips of the two T-shaped support feet 1161. Then control the lifting plate 1111 to move upward so that the crystal tray 116 can be moved away from the discharge frame 114.

[0054] Furthermore, the material support component also includes several guide seats 118, and a first support plate 119 is movably mounted on the guide seats 118. The guide seats 118 are equipped with buffer springs 120 for applying an upward pushing force to the first support plate 119. During the handling of the crystal tray 116, the buffer springs 120 provide pressure buffering for the first support plate 119, reducing wear on the rotary cylinder 121.

[0055] A material handling trolley 115 for loading crystal trays 116 is provided inside the support frame 11. The crystal trays 116 that are removed from the discharge frame 114 are placed on the material handling trolley 115. When the material handling trolley 115 is loaded with a sufficient number of crystal trays 116, the staff will push the material handling trolley 115 out of the support frame 11 to replace the empty material handling trolley 115.

[0056] like Figure 7As shown, the silicon wafer conveying mechanism 2 includes a support frame 201. The support frame 201 is equipped with a first wafer insertion slot 202 and a second wafer insertion slot 203, which are filled with water. The first wafer insertion slot 202 is equipped with a first conveying part 204 for continuously conveying silicon wafers 117. The second wafer insertion slot 203 is equipped with a second conveying part 205 for continuously conveying silicon wafers 117. The first conveying part 204 and the second conveying part 205 have the same structure and operate in the same way. After the initial degumming process, several material frames 114 containing a batch of silicon wafers 117 are transported and placed into the first insertion slot 202 and the second insertion slot 203, respectively. While being stably positioned, the silicon wafers 117 within each material frame 114 are supported by the first conveying section 204 and the second conveying section 205, respectively. Then, the material frames 114 are opened and removed, and the silicon wafers 117 automatically detach from the discharge frames 114, thus placing the silicon wafers 117 onto the first conveying section 204 and the second conveying section 205. After the first conveying section 204 and the second conveying section 205 are activated, this batch of silicon wafers 117 can be continuously conveyed to the designated position for insertion processing. Furthermore, during the conveying process, the silicon wafers 117 are always immersed in water to prevent them from being exposed to air for extended periods.

[0057] like Figure 8 As shown, the second conveying section 205 includes a support frame 20513 installed in the second insert slot 203. The support frame 20513 is provided with a first bottom conveying module 20515 for supporting and conveying the silicon wafer 117, and also provides a second bottom conveying module 20516 that is seamlessly connected to the end of the first bottom conveying module 20515. The second bottom conveying module 20516 can also support and convey the silicon wafer 117, and the top surface of the first bottom conveying module 20515 and the top surface of the second bottom conveying module 20516 are at the same level or based on the same level. After a batch of silicon wafers 117 is placed on the first bottom conveying module 20515, the first bottom conveying module 20515 is operated to transport the batch of silicon wafers 117 horizontally or based on a horizontal path. Because the second bottom conveying module 20516 is seamlessly connected to the first bottom conveying module 20515 (seamless connection of the transmission path), the silicon wafers 117 can be smoothly transported to the second bottom conveying module 20516 without any jamming, offset, or falling. The second bottom conveying module 20516 can then continue to transport the silicon wafers 117. After the silicon wafers 117 are transported to the second bottom conveying module 20516, the next batch of silicon wafers 117 can be placed on the first bottom conveying module 20515 to achieve continuous transport.

[0058] Furthermore, in order to achieve stable transport of silicon wafer 117, a second support plate 2051 is installed on the support frame 201 above the second insert slot 203. The second support plate 2051 is provided with a first movable frame 2053 and a second movable frame 2054 that can move closer or further apart from each other. A first clamping conveying module 2056 is installed on the first movable frame 2053, and a second clamping conveying module 2057 is installed on the second movable frame 2054 for cooperating with the first clamping conveying module 2056 to clamp and transport the silicon wafer 117 placed on the first bottom conveying module 20515. The silicon wafer 117 placed on the first bottom conveying module 20515 is placed between the first clamping conveying module 2056 and the second clamping conveying module 2057. Before the first bottom conveying module 20515 operates, the first movable frame 2053 and the second movable frame 2054 are controlled to move closer to each other, thereby causing the first clamping conveying module 2056 and the second clamping conveying module 2057 to move closer to each other as well. After moving until they contact both sides of this batch of silicon wafers 117, the silicon wafers 117 are clamped. Then, the first bottom conveying module 20515, the first clamping conveying module 2056 and the second clamping conveying module 2057 operate simultaneously to convey this batch of silicon wafers 117. During the conveying process, the first clamping conveying module 2056 and the second clamping conveying module 2057 limit the silicon wafers 117, so that the silicon wafers 117 always maintain their original vertical state (the state when placed in the material frame 114, several vertical silicon wafers 117 are stacked horizontally) to prevent collapse. In addition, the spacing between the silicon wafers 117 is also kept consistent to ensure that the effect of feeding out one wafer at a time can be achieved, which is convenient for subsequent loading and inserting processing. The second clamping and conveying module 2057 is equipped with a water jet mechanism (not shown in the drawing) at its end. The water jet sprays water jets to separate the first one of the horizontally stacked silicon wafers by rinsing.

[0059] Furthermore, a support beam 2058 is also installed on the support frame 201, which is positioned above the second insert slot 203. The support beam 2058 is provided with a first fixing frame 2059 and a second fixing frame 20510. A third clamping and conveying module 20511 is installed on the first fixing frame 2059, and a fourth clamping and conveying module 20512 is installed on the second fixing frame 20510 for cooperating with the third clamping and conveying module 20511 to clamp and convey the silicon wafer 117 conveyed to the second bottom conveying module 20516. While the first bottom conveying module 20515 conveys the silicon wafer 117 to the second bottom conveying module 20516, it is simultaneously clamped by the third clamping conveying module 20511 and the fourth clamping conveying module 20512. Furthermore, the second bottom conveying module 20516, the third clamping conveying module 20511, and the fourth clamping conveying module 20512 operate simultaneously, continuing to convey the silicon wafer 117 in the same manner as described above. The second bottom conveying module 20516 then conveys the silicon wafer 117 to the designated location. The wafer insertion process involves positioning the wafers for loading. During this process, the silicon wafers 117 are sequentially detached from the second bottom conveyor module 20516. Once all the silicon wafers 117 on the first bottom conveyor module 20515 have been transferred to the second bottom conveyor module 20516, the first clamping conveyor module 2056 and the second clamping conveyor module 2057 are moved away from each other. This allows the next batch of silicon wafers 117 to be placed on the first bottom conveyor module 20515. Material replenishment can also be performed during the wafer insertion process, improving the processing efficiency of the silicon wafers 117. Furthermore, after the first clamping conveyor module 2056 and the second clamping conveyor module 2057 move closer together to clamp the silicon wafers 117, the first clamping conveyor module 2056 seamlessly connects with the third clamping conveyor module 20511, and the second clamping conveyor module 2057 seamlessly connects with the fourth clamping conveyor module 20512.

[0060] In this embodiment, to control the movement of the first movable frame 2053 and the second movable frame 2054 on the second support plate 2051, moving them closer to or further apart, the second support plate 2051 is equipped with a transversely arranged slide rail 2052. The length direction of the slide rail 2052 is perpendicular to the conveying direction of the silicon wafer 117. Both the first movable frame 2053 and the second movable frame 2054 are slidably mounted on the slide rail 2052. The second support plate 2051 is also equipped with a pair of second control cylinders 2055, whose length direction is parallel to the length direction of the slide rail 2052 and arranged in opposite directions. The extension rod end of one second control cylinder 2055 is fixedly mounted to the first movable frame 2053, and the extension rod end of the other second control cylinder 2055 is fixedly mounted to the second movable frame 2054. When these two second control cylinders are operated simultaneously, their extension rods extend or retract in opposite directions, thereby causing the first movable frame 2053 and the second movable frame 2054 to move closer to or further apart.

[0061] The support frame 20513 is equipped with positioning blocks 20514 for positioning and supporting the material frame 114. Two positioning blocks 20514 are provided on each side of the first bottom conveying module 20515. The four positioning blocks 20514 can position and support the four corners of the material frame 114, so that the material frame 114 is stably placed in the designated position. The bottom of the material frame 114 is formed with a relief groove 11413 that can accommodate the first bottom conveying module 20515 (e.g., Figure 9 As shown, when the material frame 114 is placed on the positioning block 20514, the first bottom conveying module 20515 is placed in the relief groove 11413. At the same time, the first bottom conveying module 20515 supports the silicon wafer 117 in the material frame 114 so that the material frame 114 can be opened and taken out later.

[0062] like Figure 9 As shown, the first bottom conveying module 20515 includes a first support base 205151 fixedly mounted on a support frame 20513. A pair of first pulleys 205152, arranged along the conveying trajectory of the silicon wafer 117, are rotatably mounted on the first support base 205151. The pair of first pulleys 205152 are respectively located at both ends of the first support base 205151 and at the same height. A first conveyor belt 205153 for conveying the silicon wafer 117 is wound around the first pulleys 205152. The upper half of the first conveyor belt 205153 is positioned on top of the first support base 205151. After the silicon wafer 117 is placed on the upper half of the first conveyor belt 205153, it is supported by the first support base 205151, driving the first pulleys 205152 to rotate, and the first conveyor belt 205153 to move to convey the silicon wafer 117.

[0063] In this embodiment, guide strips 205154 are provided on both sides of the first support base 205151 to guide and limit the first conveyor belt 205153 during the operation, so as to prevent the first conveyor belt 205153 from deviating and improve the conveying effect of the bone silicon wafer 117. In order to drive the first pulley 205152 to rotate, the second support plate 2051 is equipped with a first drive motor 205155. The output shaft of the first drive motor 205155 is connected to one of the first pulleys 205152 through a first transmission component 205156. The first transmission component 205156 is the prior art and can be a structure of transmission wheel and transmission belt. Transmission wheels are provided on the output shaft of the first drive motor 205155 and on the central shaft of one of the first pulleys 205152. A transmission belt is wound on the transmission wheels. After the first drive motor 205155 is running, the first pulley 205152 is driven to rotate under the transmission action of the transmission wheels and the transmission belt.

[0064] The second bottom conveying module 20516 includes a second support base 205161 and a pair of continuous conveying components mounted on the second support base 205161. The continuous conveying components are in the same conveying direction as the first bottom conveying module 20515, and are used to continue conveying the silicon wafers 117 conveyed by the first bottom conveying module 20515. The initial ends of the pair of continuous conveying components are respectively placed on both sides of the end of the first bottom conveying module 20515. When the first bottom conveying module 20515 conveys the silicon wafers 117 to its end, the silicon wafers 117 are exactly placed at the initial ends of the pair of continuous conveying components. After continued conveying, the remaining silicon wafers 117 in this batch are completely placed on the continuous conveying components, and there are no silicon wafers 117 on the first bottom conveying module 20515, so that the next batch of silicon wafers 117 can be placed on the first bottom conveying module 20515, thus achieving continuous conveying.

[0065] Furthermore, the continuous conveying assembly includes a third rotating shaft 205162 and a fourth rotating shaft 205163 rotatably mounted on the second support 205161 and arranged along the conveying trajectory of the silicon wafer 117. The third rotating shaft 205162 is equipped with a second pulley 205164, and the fourth rotating shaft 205163 is equipped with a third pulley 205165. A second conveying belt 205166 for conveying the silicon wafer 117 is wound around the second pulley 205164 and the third pulley 205165. The upper half of the second conveying belt 205166 is positioned on top of the second support 205161. The function and operation mode of the second conveying belt 205166 are the same as those of the first conveying belt 205153. The support frame 201 is equipped with a second drive motor 205167. The output shaft of the second drive motor 205167 is connected to the fourth rotating shaft 205163 via a second transmission component 205168. The structure of the second transmission component 205168 is the same as that of the first transmission component 205156. The second drive motor 205167 runs and, under the transmission action of the second transmission component 205168, drives the second conveyor belt 205166 to move to transport the silicon wafer 117.

[0066] A fixed seat 20517 is mounted on the support frame 20513 near the third pulley 205165. Several first conveyor wheels 20518 are rotatably mounted on the fixed seat 20517. Several second conveyor wheels 20519 corresponding to the first conveyor wheels 20518 are mounted on the fourth rotating shaft 205163. A conveyor belt 20520 is wound around the first and second conveyor wheels 20518 and the second conveyor wheels 20519. The first conveyor wheels 20518 are positioned between the third pulleys 205165 on both sides. The initial end of the conveyor belt 20520 is connected to the end of the second conveyor belt 205166, and the end of the conveyor belt 20520 is connected to the feeding insert mechanism 3. When the fourth rotating shaft 205163 rotates, it drives the third pulley 205165 and the first conveyor wheels 20518 to rotate synchronously. The conveyor belt 20520 is used to support and transport the silicon wafer 117 placed between the continuous conveying component and the loading insertion mechanism 3, so as to act as a bridge.

[0067] like Figure 6 , 9 As shown in Figure -10, the specific steps for opening and removing the material frame 114 placed in the wafer slot are as follows: The material frame 114 includes a connecting frame 1142, and frame plates 1141 are installed at both the left and right ends of the connecting frame 1142. The silicon wafer 117 is placed between the left and right frame plates 1141. A pair of second mounting plates 1147 are installed on both the left and right frame plates 1141. The pair of second mounting plates 1147 on the left and the pair of second mounting plates 1147 on the right are arranged opposite each other. Each second mounting plate 1147 is formed with a second sliding groove 1149. The second sliding groove 1149 on the left and the second sliding groove 1149 on the right are arranged in a figure-eight pattern. A pair of support rollers 11410 for supporting silicon wafers 117 are provided between the left and right frame plates 1141. The two ends of each support roller 11410 are aligned with a left second mounting plate 1147 and a right second mounting plate 1147, respectively. Each support roller 11410 has a second slide rod 11411 at both ends, and each second slide rod 11411 is slidably disposed in a different second slide groove 1149. Since the second slide grooves 1149 on the left and right are arranged in a figure-eight pattern, each second slide groove 1149 is inclined. The upper end of each second slide groove 1149 has a positioning groove 1148 formed to position the second slide rod 11411.

[0068] After the silicon wafer 117 is debonded from the crystal holder 116, the silicon wafer 117 automatically falls into the material frame 114 and is supported by the support roller 11410. When the material frame 114 is placed on the positioning block 20514, the first bottom conveying module 20515 is placed in the relief groove 11413 to support the silicon wafer 117, so that the silicon wafer 117 is separated from the support roller 11410. Then, an upward pushing force is applied to the second slide rod 11411 to make it disengage from the positioning groove 1148. Under the action of the weight of the support roller 11410 itself, the second slide rod 11411 automatically moves in the second slide groove 1149 in a downward direction. When the pair of support rollers 11410 move in the downward direction, they move away from each other and deviate from directly below the silicon wafer 117, so that the material frame 114 can be taken out from bottom to top. A pressing mechanism is also installed on the lifting plate 1111 to press the silicon wafer 117 before it is removed from the material frame 114. Before the material frame 114 is removed, the pressing mechanism first presses the silicon wafer 117 that is horizontally stacked on the first bottom conveying module 20515, and then removes the material frame 114 from bottom to top. During the removal process, the silicon wafer 117 is always in a pressed state to prevent the silicon wafer 117 from collapsing before it is clamped by the first clamping conveying module 2056 and the second clamping conveying module 2057. When the two clamp the silicon wafer 117, the pressing of the silicon wafer 117 can be stopped, and the handover is completed.

[0069] Furthermore, both the left and right frame plates 1141 are equipped with a pair of first mounting plates 1143. The pair of first mounting plates 1143 on the left and the pair of first mounting plates 1143 on the right are arranged opposite each other. Each first mounting plate 1143 is formed with a first sliding groove 1144. The first sliding grooves 1144 on the left and the first sliding grooves 1144 on the right are arranged in an inverted "V" shape. A pair of limiting rollers 1145 are arranged between the left and right frame plates 1141, respectively placed on the front and rear sides of the silicon wafer 117. The limiting rollers 1145 are positioned above the support rollers 11410. The two ends of one limiting roller 1145 are aligned with one left first mounting plate 1143 and one right first mounting plate 1143, respectively. Each end of each limiting roller 1145 is provided with a first sliding rod 1146, and each first sliding rod 1146 is slidably disposed in a different first sliding groove 1144. Because both the first slide groove 1144 on the left and the first slide groove 1144 on the right are arranged in an inverted "V" shape, each of the first slide grooves 1144 is inclined. Under the weight of the limiting roller 1145, the first slide rod 1146 automatically moves in a downward direction within the first slide groove 1144, and the limiting roller 1145 also moves in a downward direction. When it moves to contact the side of the silicon wafer 117, it can limit the silicon wafer 117 to prevent it from collapsing on the support roller 11410. The limiting roller 1145 is a sponge roller. When the material frame 114 is removed, an upward force is applied to each of the first slide rods 1146, causing the first slide rods 1146 to move upward in the first slide groove 1144. The limiting roller 1145 separates from the side of the silicon wafer 117 to prevent the limiting roller 1145 from scratching or damaging the silicon wafer 117 during the removal process.

[0070] To open the material frame 114, a pair of extensions 1136 arranged in a figure-eight pattern are formed at the bottom of the gripper portion 1132. When the gripper portion 1132 moves upward with the extensions 1136, it contacts the second slide bar 11411 and disengages it from the positioning groove 1148. Each placement groove 1134 is formed with a swivel edge 1135 whose inclined direction is consistent with the extension direction of the extension 1136, so that the swivel edges 1135 on both sides are also arranged in a figure-eight pattern. During the upward movement of the gripper portion 1132, after the swivel edge 1135 contacts the corresponding first slide bar 1146, it will push the first slide bar 1146 to move obliquely upward in the first slide groove 1144. The first slide bar 1146 slides on the surface of the swivel edge 1135 and finally slides into the corresponding placement groove 1134. At this time, the limiting roller 1145 separates from the side of the silicon wafer 117.

[0071] When unlocking is required, the gripper 1132 is positioned on the side of the material frame 114. At this time, the extension 1136 is positioned below the second slide bar 11411, and the inclined side 1135 is positioned below the first slide bar 1146. Then, the gripper 1132 is moved upward, and the extension 1136 applies an upward thrust to the second slide bar 11411 to push it out of the positioning groove 1148. Under the action of the weight of the support roller 11410, the second slide bar 11411 automatically moves in a downward direction within the second slide groove 1149, causing the pair of support rollers 11410 to move away from each other until they deviate from each other. Directly below the silicon wafer 117; then continue to control the upward movement of the gripper 1132, the extension 1136 passes by the side of the extension 1136, and when the movement reaches the point where the actuating inclined edge 1135 contacts the corresponding first slide bar 1146, it will push the first slide bar 1146 to move obliquely upward in the first slide groove 1144. The first slide bar 1146 slides on the surface of the actuating inclined edge 1135 and finally slides into the corresponding placement groove 1134. At this time, the limiting roller 1145 separates from the side of the silicon wafer 117, and the gripper 1132 continues to move upward to drive the material frame 114 to move upward, thereby realizing the removal of the material frame 114.

[0072] like Figure 11-12 As shown, the first clamping conveyor module 2056, the second clamping conveyor module 2057, the third clamping conveyor module 20511, and the fourth clamping conveyor module 20512 have the same structure and the same operating mode. The first clamping conveyor module 2056 includes a first transmission gear 20561 and a second transmission gear 20562 rotatably mounted on the first movable frame 2053 and arranged along the conveying trajectory of the silicon wafer 117. The axes of rotation of the first transmission gear 20561 and the second transmission gear 20562 are arranged vertically, and a transmission toothed belt 20563 is wound around them. The outer surface of the transmission toothed belt 20563 is provided with an anti-slip layer 20564 for contacting the silicon wafer 117. When the first movable frame 2053 is moved, the anti-slip layer 20564 on the transmission belt 20563 contacts the side of the silicon wafer 117. The anti-slip layers 20564 on both sides contact the two sides of the silicon wafer 117 respectively to clamp it. Then, the first transmission gear 20561 or the second transmission gear 20562 is driven to rotate clockwise (rotation direction is...). Figure 11 Based on this, it is then combined with the first bottom conveying module 20515 to realize the conveying of silicon wafer 117.

[0073] To drive the first transmission gear 20561 or the second transmission gear 20562 to rotate, the first movable frame 2053 is also equipped with a vertically arranged third drive motor 20565. The output shaft of the third drive motor 20565 is connected to the first transmission gear 20561 (or the second transmission gear 20562) via a connecting shaft 20566. When the third drive motor 20565 is operated, the first transmission gear 20561 is driven to rotate under the transmission action of the connecting shaft 20566, and the transmission belt 20563 moves to transport the silicon wafer 117.

[0074] like Figure 13-14 As shown, the insert feeding mechanism 3 includes a support frame 31 and a climbing conveying module 32 mounted on the support frame 31, as well as a receiving module 33, a basket flipping mechanism 34 and a basket clamping and handling module 35. Several climbing conveyor modules 32 are arranged side by side, and the initial end of each climbing conveyor module 32 is connected to the end of a different second bottom conveyor module 20516. The second bottom conveyor module 20516 conveys the silicon wafers 117 one by one to the designated position and is received by the climbing conveyor module 32. The climbing conveyor module 32 continues to convey the silicon wafers 117, and during the conveying process, the silicon wafers 117 change from an upright position to a flat position. Each end of the climbing conveyor module 32 is connected to a receiving module 33 for receiving the flat silicon wafers 117. Each receiving module 33 is equipped with a basket 36. The receiving module 33 moves up and down intermittently with the basket 36 so that the silicon wafers 117 are inserted into the basket 36 one by one. Each time the basket 36 rises one step, the climbing conveyor module 32 inputs one silicon wafer 117. Once enough silicon wafers 117 are inserted into the basket 36, the basket clamping and transporting module 35 is activated to transport the basket 36 on the receiving module 33 to the basket flipping mechanism 34. Finally, the basket flipping mechanism 34 is activated to flip the vertically arranged basket 36 to a horizontally arranged position. After being arranged horizontally, it is placed at the inlet end of the basket feeding conveyor belt (not shown in the figure) to transport the basket 36 filled with silicon wafers 117 to the next mechanism.

[0075] The aforementioned receiving module 33 and the basket flipping mechanism 34 are existing structures. For details of the specific structure, please refer to a silicon wafer feeding system with patent number CN202311603705.8. An existing silicon wafer feeding system discloses a receiving device and a basket flipping mechanism, which are consistent with the specific structure and function of the aforementioned receiving module 33 and basket flipping mechanism 34, and will not be described in detail here.

[0076] like Figure 15As shown, the climbing conveyor module 32 includes a vertical conveyor mechanism 321, a climbing conveyor mechanism 322, a horizontal conveyor mechanism 323, and an output module 324 arranged sequentially along the conveying direction of the silicon wafer 117. The initial end of the vertical conveyor mechanism 321 is inserted into the first wafer insertion slot 202 (or the second wafer insertion slot 203) and connected to the end of the second bottom conveyor module 20516 to receive the silicon wafers 117 conveyed one by one. In addition, a waste discharge mechanism 325 for discharging damaged silicon wafers 117 from the conveying track is installed below the end of the horizontal conveyor mechanism 323. The vertical conveying mechanism 321 receives silicon wafers 117 from the second bottom conveying module 20516 one by one. After receiving, the vertical conveying mechanism 321 conveys the silicon wafers 117 vertically. After being conveyed to the climbing conveying mechanism 322, the upright silicon wafers 117 change to a flat position. The flat silicon wafers 117 are then conveyed sequentially to the horizontal conveying mechanism 323 and the output module 324. Finally, the output module 324 conveys the silicon wafers 117 into the insertion basket 36 for wafer insertion. During the conveying process of the silicon wafers 117 by the horizontal conveying mechanism 323, the detection mechanism above (not shown in the figure) detects whether the silicon wafers 117 are damaged. When a damaged silicon wafer is detected, it is conveyed to the end of the horizontal conveying mechanism 323 and then stopped. The waste discharge mechanism 325 then runs to discharge the damaged silicon wafers 117 from the horizontal conveying mechanism 323, preventing the damaged silicon wafers 117 from being inserted into the basket 36.

[0077] Among them, the vertical conveying mechanism 321, the climbing conveying mechanism 322, the horizontal conveying mechanism 323 and the output module 324 are all existing structures. For details of the specific structure, please refer to a silicon wafer feeding system with patent number CN202311603705.8. An existing silicon wafer feeding system discloses the above-mentioned mechanisms, which will not be described in detail here.

[0078] like Figure 16As shown, the waste discharge mechanism 325 includes a support platform 3251 and a lifting platform 3252 that slides vertically on the support platform 3251. The lifting platform 3252 is rotatably provided with several drive shafts 3257 arranged laterally with their axes parallel to the conveying direction of the transverse conveying mechanism 323. The drive shafts 3257 are connected by a first transmission assembly 3258. After one of the drive shafts 3257 is driven to rotate by a motor, the drive shafts 3257 can rotate synchronously in the same direction. The top of the lifting platform 3252 is rotatably provided with several feeding rods 3259 whose axes are parallel to the axes of the drive shafts 3257. The feeding rods 3259 are used to convey the damaged silicon wafers 117 out of the transverse conveying mechanism 323. The feeding rods 3259 and the drive shafts 3257 are connected by a second transmission assembly 32510. Each feeding rod 3259 is provided with a feeding roller 32511 for conveying the silicon wafers 117. Upon inspection of a damaged silicon wafer 117, the damaged silicon wafer 117 is conveyed to the end of the horizontal conveying mechanism 323 and stopped. Then, the lifting platform 3252 is controlled to move upward, lifting the damaged silicon wafer 117 to remove it from the end of the horizontal conveying mechanism 323. The drive shaft 3257 is then controlled to rotate. Under the transmission action of the first transmission component 3258 and the second transmission component 32510, several feeding rotating rods 3259 are driven to rotate synchronously in the same direction. The feeding rollers 32511 rotate to convey the damaged silicon wafer 117 out of the conveying track of the horizontal conveying mechanism 323 and to a designated location for collection and processing.

[0079] In order to control the lifting platform 3252 to move up and down, a fifth rotating shaft 3253 with its axis arranged laterally is rotatably provided on the support platform 3251, and a fourth driving component 3255 for driving the fifth rotating shaft 3253 to rotate. The fifth rotating shaft 3253 is equipped with a cam 3254, and the lifting platform 3252 is rotatably provided with a rolling wheel 3256 placed above the cam 3254 and in contact with its surface. The fourth driving component 3255 operates to drive the fifth rotating shaft 3253 to rotate. When the fifth rotating shaft 3253 rotates with the cam 3254, the cam 3254 cooperates with the rolling wheel 3256 to control the lifting platform 3252 to rise and fall.

[0080] like Figure 17As shown, the flower basket clamping and transporting module 35 includes a third movable frame 351 that moves along the X-axis on the support frame 31, a second movable seat 352 that moves along the Y-axis on the third movable frame 351, and a second lifting seat 353 that moves along the Z-axis on the second movable seat 352. The bottom of the second lifting seat 353 is equipped with a clamping mechanism 354 for clamping the flower basket 36. In addition, the third movable frame 351 is equipped with a fourth drive mechanism 355 for driving it to move along the X-axis on the support frame 31, the second movable seat 352 is equipped with a fifth drive mechanism 356 for driving it to move along the Y-axis on the third movable frame 351, and a sixth drive mechanism 357 for driving the second lifting seat 353 to move up and down.

[0081] The operation mode of the third movable frame 351, the second movable seat 352 and the second lifting seat 353 is the same as that of the above-mentioned six-axis movable components. With the cooperation of the third movable frame 351, the second movable seat 352 and the second lifting seat 353, the clamping mechanism 354 can be controlled to move along the X-axis, Y-axis and Z-axis to realize the transfer of the flower basket 36 on the receiving module 33 to the basket flipping mechanism 34.

[0082] like Figure 18 As shown, the clamping mechanism 354 includes a third mounting plate 3541 installed at the bottom of the second lifting seat 353. A pair of clamping cylinders 3542 with telescopic rods arranged in opposite directions are mounted on the third mounting plate 3541. The clamping cylinders 3542 are mirror-arranged, and each clamping block 3543 for clamping the top of the flower basket 36 is installed at the end of its telescopic rod. When the third mounting plate 3541 is positioned directly above the flower basket 36, the clamping blocks 3543 on both sides are positioned on either side of the top of the flower basket 36. Simultaneously, the clamping cylinders 3542 on both sides are activated, and the telescopic rods retract, clamping the flower basket 36 through the clamping blocks 3543. After clamping, the basket is then transported.

[0083] In addition, the third mounting plate 3541 is slidably provided with a sliding frame 3544. The bottom end of the sliding frame 3544 is equipped with a pressing rod 3545 for applying downward pressure to the top of the flower basket 36. A pressing spring 3546 is wound around the sliding frame 3544 and placed between the third mounting plate 3541 and the pressing rod 3545 to apply downward pressure to the pressing rod 3545. When the third mounting plate 3541 is placed directly above the flower basket 36, the pressing rod 3545 contacts the top of the flower basket 36, the pressing spring 3546 is compressed to apply downward pressure to the flower basket 36, and then the clamping block 3543 is controlled to clamp the flower basket 36, preventing the flower basket 36 from shaking during the transportation of the flower basket 36.

[0084] In summary, this utility model possesses the aforementioned excellent characteristics, enabling it to achieve unprecedented efficiency in use and thus become a highly practical product.

[0085] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. An automatic silicon wafer feeding system, characterized in that: It includes a silicon wafer pre-processing mechanism (1), a silicon wafer conveying mechanism (2), and a wafer insertion and feeding mechanism (3) that are connected in sequence. The silicon wafer conveying mechanism (2) has several units arranged side by side. The silicon wafer preprocessing mechanism (1) includes a support frame (11), the support frame (11) is provided with a clamping component (113) for clamping the material frame (114) and a six-axis movable component for controlling the clamping component (113) to move along the X-axis, Y-axis and Z-axis; The silicon wafer conveying mechanism (2) includes a second conveying section (205) for continuously conveying silicon wafers (117); the second conveying section (205) includes a support frame (20513), the support frame (20513) is provided with a first bottom conveying module (20515) for supporting and conveying silicon wafers (117), and is also provided with a second bottom conveying module (20516) that is seamlessly connected to the end of the first bottom conveying module (20515); It also includes a second support plate (2051), which is provided with a first movable frame (2053) and a second movable frame (2054) that can move closer to or further away from each other. The first movable frame (2053) is equipped with a first clamping and conveying module (2056), and the second movable frame (2054) is equipped with a second clamping and conveying module (2057) for cooperating with the first clamping and conveying module (2056) to clamp and convey the silicon wafer (117) placed on the first bottom conveying module (20515). It also includes a support beam (2058), the support beam (2058) is provided with a first fixing frame (2059) and a second fixing frame (20510), and the first fixing frame (2059) is equipped with a third clamping conveying module (20511), and the second fixing frame (20510) is equipped with a fourth clamping conveying module (20512) for cooperating with the third clamping conveying module (20511) to clamp and convey the silicon wafer (117) conveyed to the second bottom conveying module (20516); The wafer loading mechanism (3) includes a climbing conveyor module (32), a basket flipping mechanism (34), and a basket clamping and handling module (35); several climbing conveyor modules (32) are arranged side by side, and the initial end of each climbing conveyor module (32) is connected to the end of a different second bottom conveyor module (20516), and the end of each climbing conveyor module (32) is connected to a receiving module (33) for collecting silicon wafers (117) and inserting them into the basket (36).

2. The automatic silicon wafer feeding system according to claim 1, characterized in that: The six-axis movable component includes a truss (17) that moves along the X-axis on the support frame (11), a first movable seat (19) that moves along the Y-axis on the truss (17), and a first lifting seat (111) that moves along the Z-axis on the first movable seat (19).

3. The automatic silicon wafer feeding system according to claim 2, characterized in that: The bottom of the first lifting seat (111) is equipped with a lifting plate (1111), and the material clamping frame (114) is installed on the lifting plate (1111). The lifting plate (1111) is also equipped with a material support component. After the material support component is running, its execution end supports the support foot (1161) on the crystal tray (116).

4. The automatic silicon wafer feeding system according to claim 3, characterized in that: The material support component includes a first support plate (119) and a rotary cylinder (121) mounted on the first support plate (119). The output shaft of the rotary cylinder (121) is arranged downward, and a vertically arranged rotating rod (122) is mounted on its output shaft. The bottom end of the rotating rod (122) extends downward to pass through the lifting plate (1111). The bottom end of the rotating rod (122) is equipped with a support block (123) that supports the support foot (1161) after rotation. It also includes a plurality of guide seats (118). The first support plate (119) is movably mounted on the guide seats (118). The guide seats (118) are provided with buffer springs (120) for applying an upward pushing force to the first support plate (119).

5. The automatic silicon wafer feeding system according to claim 1, characterized in that: The first clamping and conveying module (2056) includes a first transmission gear (20561) and a second transmission gear (20562) rotatably mounted on a first movable frame (2053) and arranged along the conveying trajectory of the silicon wafer (117). The axes of rotation of the first transmission gear (20561) and the second transmission gear (20562) are arranged vertically, and a transmission toothed belt (20563) is wound around both of them. The outer surface of the transmission toothed belt (20563) is provided with an anti-slip layer (20564) for contacting the silicon wafer (117).

6. The automatic silicon wafer feeding system according to claim 1, characterized in that: The clamping component (113) includes a left clamping part and a right clamping part; the left clamping part includes a slider (1131) that can move toward or away from the right clamping part, and a first control cylinder (1133) for controlling the movement of the slider (1131), the slider (1131) being equipped with a gripper part (1132) for clamping the material frame (114).

7. The automatic silicon wafer feeding system according to claim 6, characterized in that: A pair of protruding rods (11412) are provided on the outer side walls at both ends of the material frame (114), and a pair of placement grooves (1134) for placing the protruding rods (11412) are formed on the gripper part (1132).

8. The automatic silicon wafer feeding system according to claim 7, characterized in that: The material frame (114) includes a connecting frame (1142), and frame plates (1141) are installed at the left and right ends of the connecting frame (1142). The silicon wafer (117) is placed between the left and right frame plates (1141). A pair of second mounting plates (1147) are installed on both the left and right frame plates (1141). The pair of second mounting plates (1147) on the left side and the pair of second mounting plates (1147) on the right side are arranged opposite to each other. 47) Both are formed with a second slide groove (1149). The second slide groove (1149) on the left and the second slide groove (1149) on the right are arranged in a figure-eight pattern. A pair of support rollers (11410) for supporting silicon wafers (117) are provided between the frame plates (1141) on the left and right sides. Each support roller (11410) has a second slide rod (11411) at both ends. Each second slide rod (11411) is slidably arranged in a different second slide groove (1149).

9. The automatic silicon wafer feeding system according to claim 8, characterized in that: Both the left frame plate (1141) and the right frame plate (1141) are equipped with a pair of first mounting plates (1143). The pair of first mounting plates (1143) on the left and the pair of first mounting plates (1143) on the right are arranged opposite to each other. Each first mounting plate (1143) is formed with a first sliding groove (1144). The first sliding groove (1144) on the left and the first sliding groove (1144) on the right are arranged in an inverted "V" shape. A pair of limiting rollers (1145) are arranged between the left and right frame plates (1141) and placed on the front and rear sides of the silicon wafer (117). The limiting rollers (1145) are placed above the support rollers (11410). Each limiting roller (1145) has a first sliding rod (1146) at both ends. Each first sliding rod (1146) is slidably arranged in a different first sliding groove (1144).

10. The automatic silicon wafer feeding system according to claim 9, characterized in that: The bottom of the gripper (1132) is formed with a pair of extensions (1136) arranged in a figure-eight pattern. The extensions (1136) move upward to push the second slide rod (11411) out of the positioning groove (1148). Each placement groove (1134) is formed with a paving bevel (1135) whose inclined direction is consistent with the extension direction of the extension (1136). The paving bevel (1135) is used to push the first slide rod (1146) to move obliquely upward in the first slide groove (1144).

Images