Packaging substrate warping leveling device with strong heating effect

Abstract

The utility model discloses a packaging substrate warped leveling device with a strong heating effect. The packaging substrate warped leveling device comprises a base, an upper frame, a heating platform, a heat conduction assembly and a flattening assembly, a plurality of first hot air holes are formed in the heating platform, the heat conduction assembly comprises two traction pieces and a first heat conduction piece, the two traction pieces are arranged on the base and located on the left side and the right side of the heating platform respectively, the first heat conduction piece is attached to the upper surface of the heating platform, and the two ends of the first heat conduction piece are connected with the two traction pieces respectively; and the first heat-conducting sheet is made of a flexible heat-conducting material. According to the utility model, the leveling device with the flexible heat conduction assembly is designed, and a hot air heating mode is matched, so that the warped and deformed packaging substrate can be heated more uniformly and efficiently in the leveling process, and the leveling effect is greatly improved; the utility model has the advantages of strong practicability and strong popularization significance.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, and in particular to a device for warping and leveling packaging substrates with strong heating effect. Background Technology

[0002] A packaging substrate, or simply substrate, is a type of substrate used to further encapsulate multiple primary packaged IC components to create greater density and capacity. It provides electrical connections, protection, support, heat dissipation, and assembly for chips, enabling multi-pin configurations, reduced package size, improved electrical performance and heat dissipation, ultra-high density, or multi-chip modularization.

[0003] During the manufacturing process, packaging substrates are prone to warping and curling due to stress or heat, leading to decreased processing accuracy or even substrate scrap. Therefore, it is necessary to flatten and level the warped packaging substrates during processing. Existing packaging substrate leveling equipment typically places the warped packaging substrate on a heated platform for heating, and then a flattening mechanism flattens the substrate. However, conventional heating platforms are usually fixed structures. When the warped packaging substrate is placed on the platform, it often cannot fit well with the heating platform, resulting in uneven or insufficient heating of the substrate, ultimately affecting the leveling effect. Utility Model Content

[0004] Therefore, it is necessary to provide a packaging substrate warping and leveling device with strong heating effect to address the shortcomings of the existing technology.

[0005] A high-efficiency heating device for leveling and warping packaging substrates includes a base, an upper frame, a heating platform, a heat-conducting component, and a flattening component. The upper frame, heating platform, and heat-conducting component are all mounted on the base, with the heating platform located below the upper frame and the heat-conducting component located between the upper frame and the heating platform. The flattening component is mounted on the upper frame and located above the heat-conducting component. The heating platform has several first hot air holes. The heat-conducting component includes two sets of traction members and a first heat-conducting sheet. The two sets of traction members are mounted on the base and located on the left and right sides of the heating platform, respectively. The first heat-conducting sheet is attached to the upper surface of the heating platform, and its two ends are connected to the two traction members, respectively. The first heat-conducting sheet is made of a flexible thermally conductive material.

[0006] Furthermore, the traction component includes a sliding seat, a fixed seat, a reset slide rod, a reset spring, and a first traction frame. The base is provided with a slide rail groove. The sliding seat is engaged in the slide rail groove and can slide left and right. The fixed seat is fixedly mounted on the base and located outside the sliding seat. The reset slide rod is horizontally inserted through the fixed seat, and its inner end is connected to one side of the sliding seat. The reset spring is sleeved on the outer end of the reset slide rod. The first traction frame is mounted on the sliding seat, and the end of the first heat-conducting plate is connected to the first traction frame.

[0007] Furthermore, the flattening assembly includes a lifting cylinder and a pressing plate. The lifting cylinder is mounted on the upper frame, and the pressing plate is mounted at the lower end of the lifting cylinder and can be moved up and down by the lifting cylinder.

[0008] Furthermore, the heat-conducting assembly also includes a second heat-conducting sheet, the traction component also includes a second traction frame, and the bottom of the pressure plate is provided with a plurality of second hot air holes. The second heat-conducting sheet is disposed between the first heat-conducting sheet and the pressure plate, and its two ends are respectively connected to the second traction frame. The second heat-conducting sheet is made of a flexible heat-conducting material.

[0009] Furthermore, the second traction frame includes two sets of lifting rods and a traction rod. Both sets of lifting rods are mounted on a sliding seat. The two ends of the traction rod are respectively connected to the upper ends of the two sets of lifting rods and can be moved up and down by the lifting rods. The end of the second heat-conducting plate is connected to the traction rod.

[0010] Furthermore, the flattening assembly also includes several auxiliary lifting rods, all of which are vertically inserted into the upper frame and their lower ends are connected to the flattening plate.

[0011] In summary, the beneficial effects of this utility model's packaging substrate warping and leveling device with strong heating effect are as follows: by designing a leveling device with flexible heat-conducting components and using hot air heating, the warped packaging substrate can be heated more evenly and efficiently during the leveling process, greatly improving the leveling effect; this utility model is highly practical and has strong promotional significance. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of a packaging substrate warping and leveling device with strong heating effect according to the present invention.

[0013] Figure 2 for Figure 1 A schematic diagram of the decomposed structure;

[0014] Figure 3 for Figure 2 Schematic diagram of the exploded structure of the heat-conducting component;

[0015] Figure 4 for Figure 2 Exploded view of the medium-pressure flat component. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of the utility model.

[0017] like Figures 1 to 4 As shown, this utility model provides a packaging substrate warping and leveling device 100 with strong heating effect, which includes a base 10, an upper frame 20, a heating platform 30, a heat-conducting component 40, and a flattening component 50. The upper frame 20, heating platform 30, and heat-conducting component 40 are all mounted on the base 10, with the heating platform 30 located below the upper frame 20, the heat-conducting component 40 located between the upper frame 20 and the heating platform 30, and the flattening component 50 mounted on the upper frame 20 and located above the heat-conducting component 40. It is understood that this utility model also includes several hot air supply, pumping structures, and intelligent electrical control structures, etc., which are all conventional technologies in the field and will not be described in detail here.

[0018] The heating platform 30 is provided with a plurality of first hot air holes 31. The heat-conducting component 40 includes two sets of traction members 41 and a first heat-conducting plate 42. The two sets of traction members 41 are mounted on the base 10 and are respectively located on the left and right sides of the heating platform 30. The first heat-conducting plate 42 is attached to the upper surface of the heating platform 30, and its two ends are respectively connected to the two traction members 41. The first heat-conducting plate 42 is made of a flexible heat-conducting material.

[0019] When heating and flattening a warped packaging substrate, it is simply placed on the heating platform 30 and supported by the first heat-conducting sheet 42. During heating, high-temperature hot air is blown upwards from the first hot air hole 31 of the heating platform 30. The hot air not only makes the flexible first heat-conducting sheet 42 fit tightly against the surface of the packaging substrate, but also the heat emitted by it is evenly conducted to the packaging substrate by the first heat-conducting sheet 42. This heating method is more uniform and efficient than conventional flat-plate heating structures, thus significantly improving the flattening effect.

[0020] The traction component 41 includes a sliding seat 411, a fixed seat 412, a reset slide rod 413, a reset spring 414, and a first traction frame 415. The base 10 is provided with a slide rail groove 11. The sliding seat 411 is snapped onto the slide rail groove 11 and can slide left and right. The fixed seat 412 is fixedly mounted on the base 10 and located outside the sliding seat 411. The reset slide rod 413 is horizontally inserted through the fixed seat 412 and its inner end is connected to one side of the sliding seat 411. The reset spring 414 is sleeved on the outer end of the reset slide rod 413. The first traction frame 415 is mounted on the sliding seat 411, and the end of the first heat-conducting plate 42 is connected to the first traction frame 415.

[0021] The design incorporates elastically sliding traction components 41. When the heating platform 30 blows air to heat the substrate, and the first heat-conducting sheet 42 conforms to the curvature of the packaging substrate, the traction components 41 on both sides will slide inwards to ensure smoother contact between the first heat-conducting sheet 42 and the surface of the packaging substrate. When the flattening assembly 50 flattens the packaging substrate, the traction components 41 on both sides can slowly and elastically return to their original position, thus taut and flattening the first heat-conducting sheet 42 and preventing wrinkles from affecting the flattening effect of the packaging substrate.

[0022] The flattening assembly 50 includes a lifting cylinder 51 and a pressing plate 52. The lifting cylinder 51 is mounted on the upper frame 20, and the pressing plate 52 is mounted at the lower end of the lifting cylinder 51 and can be moved up and down by the lifting cylinder 51. The flattening assembly 50 also includes several auxiliary lifting rods 53, all of which are vertically inserted into the upper frame 20 and their lower ends are connected to the pressing plate 52. The flattening assembly 50 with auxiliary lifting rods 53 makes the process of the lifting cylinder 51 moving the pressing plate 52 up and down more horizontally and stably.

[0023] The heat-conducting component 40 further includes a second heat-conducting sheet 43, the traction component 41 further includes a second traction frame 416, and the bottom of the pressure plate 52 is provided with several second hot air holes (not shown). The second heat-conducting sheet 43 is disposed between the first heat-conducting sheet 42 and the pressure plate 52, and its two ends are respectively connected to the second traction frame 416. The second heat-conducting sheet 43 is made of a flexible heat-conducting material. The addition of the second heat-conducting sheet 43 to the heat-conducting component 40 allows it and the first heat-conducting sheet 42 to respectively adhere to and cover the upper and lower surfaces of the encapsulation substrate. Combined with the dual hot air holes, the upper and lower surfaces of the encapsulation substrate can be heated simultaneously, further improving the heating efficiency and uniformity of the encapsulation substrate during the leveling process.

[0024] The second traction frame 416 includes two sets of lifting rods 416a and a traction rod 416b. Both sets of lifting rods 416a are mounted on the sliding seat 411. The two ends of the traction rod 416b are connected to the upper ends of the two sets of lifting rods 416a and can be moved up and down by the lifting rods 416a. The end of the second heat-conducting sheet 43 is connected to the traction rod 416b. The height-adjustable second traction frame 416 can flexibly adjust the height of the second heat-conducting sheet 43, thereby enabling it to be used to flatten and level packaging substrates of different thicknesses. It can also dynamically adjust the height of the second heat-conducting sheet 43 according to the downward pressure of the flattening assembly 50.

[0025] In summary, the beneficial effects of the present invention, a packaging substrate warping and leveling device 100 with strong heating effect, are as follows: by designing a leveling device with a flexible heat-conducting component 40 and using hot air heating, the warped packaging substrate can be heated more evenly and efficiently during the leveling process, greatly improving the leveling effect; the present invention is highly practical and has strong promotional significance.

[0026] The embodiments described above illustrate only one implementation of the utility model, and while the description is relatively specific and detailed, it should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the inventive concept, and these all fall within the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be determined by the appended claims.

Claims

1. A device for warping and leveling a packaging substrate with strong heating effect, characterized in that: The device includes a base, an upper frame, a heating platform, a heat-conducting component, and a flattening component. The upper frame, heating platform, and heat-conducting component are all mounted on the base, with the heating platform located below the upper frame and the heat-conducting component located between the upper frame and the heating platform. The flattening component is mounted on the upper frame and located above the heat-conducting component. The heating platform has several first hot air holes. The heat-conducting component includes two sets of traction members and a first heat-conducting sheet. The two sets of traction members are mounted on the base and located on the left and right sides of the heating platform, respectively. The first heat-conducting sheet is attached to the upper surface of the heating platform, and its two ends are connected to the two traction members, respectively. The first heat-conducting sheet is made of a flexible heat-conducting material.

2. The packaging substrate warping and leveling device with strong heating effect as described in claim 1, characterized in that: The traction component includes a sliding seat, a fixed seat, a reset slide rod, a reset spring, and a first traction frame. The base is provided with a slide rail groove. The sliding seat is engaged in the slide rail groove and can slide left and right. The fixed seat is fixedly mounted on the base and located outside the sliding seat. The reset slide rod is horizontally inserted through the fixed seat and its inner end is connected to one side of the sliding seat. The reset spring is sleeved on the outer end of the reset slide rod. The first traction frame is mounted on the sliding seat, and the end of the first heat-conducting sheet is connected to the first traction frame.

3. The packaging substrate warping and leveling device with strong heating effect as described in claim 2, characterized in that: The flattening assembly includes a lifting cylinder and a pressing plate. The lifting cylinder is mounted on the upper frame, and the pressing plate is mounted at the lower end of the lifting cylinder and can be moved up and down by the lifting cylinder.

4. The packaging substrate warping and leveling device with strong heating effect as described in claim 3, characterized in that: The heat-conducting component further includes a second heat-conducting sheet, the traction component further includes a second traction frame, and the bottom of the pressure plate is provided with a plurality of second hot air holes; the second heat-conducting sheet is disposed between the first heat-conducting sheet and the pressure plate, and its two ends are respectively connected to the second traction frame; the material of the second heat-conducting sheet is a flexible heat-conducting material.

5. The packaging substrate warping and leveling device with strong heating effect as described in claim 4, characterized in that: The second traction frame includes two sets of lifting rods and a traction rod. Both sets of lifting rods are mounted on a sliding seat. The two ends of the traction rod are respectively connected to the upper ends of the two sets of lifting rods and can be moved up and down by the lifting rods. The end of the second heat-conducting sheet is connected to the traction rod.

6. The packaging substrate warping and leveling device with strong heating effect as described in claim 2, characterized in that: The flattening assembly also includes several auxiliary lifting rods, all of which are vertically installed on the upper frame and their lower ends are connected to the flattening plate.

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