Display substrate cleaning system and supporting assembly

Abstract

The embodiment of the utility model provides a display substrate cleaning system and a supporting assembly. The display substrate cleaning system comprises a supporting assembly, a transferring assembly and a cleaning assembly, the supporting assembly comprises a base table and a static electricity removing mechanism, the static electricity removing mechanism comprises a conductive pad, a connecting wire and a grounding part which are connected with one another, the conductive pad is arranged on the base table, the grounding part is arranged at the grounding position, and the connecting wire is connected to the conductive pad and the grounding part; the surface charges of the bearing area can be conducted to the grounding part to be grounded through the connecting line, the transfer assembly can transfer the display substrate, the cleaning assembly cleans the display substrate in the bearing area, and due to the fact that the surface charges of the bearing area can be conducted to the grounding part to be grounded through the connecting line, the potential difference between the display panel and the bearing area is reduced. Therefore, the electrostatic discharge intensity between the display panel and the bearing area is reduced, the risk that devices in the display substrate are damaged by static electricity is reduced, and the preparation yield of the display substrate is improved.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display substrate cleaning system and support assembly. Background Technology

[0002] In traditional display panel manufacturing, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision, high development costs, and long development cycles. Fine metal maskless technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe relevant aspects of fine metal maskless technology and are provided for reference.

[0003] Display devices are prone to static electricity during the production process. When the display panel comes into contact with other operating equipment, ESD (Electro Static Discharge) often occurs, which can easily damage the internal components or circuits of the display panel and reduce the yield of the display panel. Utility Model Content

[0004] This application provides a display substrate cleaning system and support assembly, which aims to reduce the risk of electrostatic discharge damage to the display substrate and improve the manufacturing yield of the display substrate during cleaning before etching the inorganic encapsulation layer.

[0005] An embodiment of the first aspect of this application provides a display substrate cleaning system. The display substrate is used to fabricate a display device. The display substrate cleaning system includes: a support assembly, including a base and an anti-static mechanism. The anti-static mechanism includes a conductive pad, a connecting wire, and a grounding portion connected to each other. The conductive pad is disposed on one side of the base in a first direction, and the grounding portion is disposed at a grounding position. The connecting wire connects the conductive pad and the grounding portion to form a grounding loop. A bearing area is disposed on the side of the conductive pad away from the base, and the bearing area is used to bear the display substrate; a transfer assembly, which is used to transfer the display substrate to the bearing area and / or to remove the display substrate from the bearing area; and a cleaning assembly, which is used to clean the display substrate in the bearing area. The cleaning assembly includes a support mechanism and an ultrasonic cleaning mechanism. The ultrasonic cleaning mechanism is fixed to the mounting position by the support mechanism and is disposed facing the bearing area.

[0006] According to an embodiment of the first aspect of this application, the cleaning assembly further includes a spraying mechanism, which is connected to a support mechanism. The spraying mechanism includes a liquid storage section and a spray head that are interconnected. The liquid storage section is used to store a medium. The spray head and the ultrasonic cleaning mechanism are spaced apart. The spray head is positioned toward the bearing area. The spraying mechanism is used to clean the display substrate in the bearing area.

[0007] According to an embodiment of the first aspect of this application, the spray head and the ultrasonic cleaning mechanism are spaced apart along the second direction, and the spray head is rotatably arranged relative to the support mechanism around the third direction, with the first direction, the second direction and the third direction intersecting each other.

[0008] According to an embodiment of the first aspect of this application, the cleaning assembly further includes a drying mechanism, which is connected to and disposed downstream of the spraying mechanism. The opening of the drying mechanism is disposed facing the bearing area, and the drying mechanism is used to remove the medium from the surface of the display substrate.

[0009] According to an embodiment of the first aspect of this application, the cleaning assembly further includes a humidity sensor. Both the spray mechanism and the ultrasonic cleaning mechanism are electrically connected to the humidity sensor. The humidity sensor and the bearing area are spaced apart. The humidity sensor is used to obtain the actual humidity value of the surrounding environment of the bearing area. The cleaning assembly is configured such that when the actual humidity value is greater than or equal to a preset humidity value, the ultrasonic cleaning mechanism is in the open state and the spray mechanism is in the closed state; when the actual humidity value is less than the preset humidity value, the ultrasonic cleaning mechanism is in the closed state and the spray mechanism is in the open state.

[0010] According to an embodiment of the first aspect of this application, the static elimination mechanism further includes an ion fan, which is disposed upstream of the conductive pad.

[0011] According to an embodiment of the first aspect of this application, the base includes a main body and at least two support parts. The support parts are telescopically arranged relative to the main body in a first direction. The at least two support parts are spaced apart. The conductive pad includes a first conductive pad and a second conductive pad. The first conductive pad is disposed in the main body and the second conductive pad is disposed in the support parts. The static elimination mechanism includes a plurality of connecting lines. The plurality of connecting lines are respectively connected to the first conductive pad and the second conductive pad. The bearing area is disposed in each of the second conductive pads and at least a portion of the first conductive pad.

[0012] According to an embodiment of the first aspect of this application, the base includes a body and protrusions, at least two protrusions are spaced apart on one side of the body in a first direction, and a conductive pad is disposed on the side of the protrusions opposite to the body.

[0013] According to an embodiment of the first aspect of this application, a negative pressure hole is provided through the protrusion on its surface in a first direction, and the support assembly further includes a negative pressure mechanism disposed in the body and facing the negative pressure hole.

[0014] According to an embodiment of the first aspect of this application, the conductive pad further includes an edge region, which is disposed outside the bearing region, and the connecting wire is disposed in the edge region.

[0015] According to an embodiment of the first aspect of this application, the static elimination mechanism includes a plurality of connecting lines, which are spaced apart in the edge region.

[0016] According to an embodiment of the first aspect of this application, the grounding portion includes at least two grounding electrodes connected in parallel.

[0017] According to an embodiment of the first aspect of this application, the connecting line is configured to be stretchable and deformable in its length direction.

[0018] According to an embodiment of the first aspect of this application, the connecting wire and the conductive pad are detachably connected.

[0019] The second aspect of this application provides a support assembly applied to the display substrate cleaning system of the first aspect embodiment described above. The support assembly includes a base and an anti-static mechanism. The anti-static mechanism includes a conductive pad, a connecting line, and a grounding portion that are interconnected. The conductive pad is disposed on one side of the base in a first direction, and the grounding portion is disposed at a grounding position. The connecting line is connected to the conductive pad and the grounding portion to form a grounding loop. A bearing area is disposed on the side of the conductive pad away from the base, and the bearing area is used to bear the display substrate.

[0020] In the display substrate cleaning system provided in this application embodiment, the display substrate cleaning system includes a support component, a transfer component, and a cleaning component. The support component includes a base and an electrostatic discharge mechanism. The electrostatic discharge mechanism includes interconnected conductive pads, connecting lines, and a grounding portion. The conductive pads are disposed on one side of the base in a first direction, and the grounding portion is disposed at a grounding position. The connecting lines are connected to the conductive pads and the grounding portion so that the surface charge of the bearing area can be conducted to the grounding portion through the connecting lines. The transfer component can transfer the display substrate to the bearing area and / or remove the display substrate from the bearing area. Since the surface charge of the bearing area can be conducted to the grounding portion through the connecting lines, the potential difference between the display panel and the bearing area is reduced, which helps to reduce the electrostatic discharge intensity between the display panel and the bearing area, reduce the risk of electrostatic damage to the internal components of the display substrate, and help improve the manufacturing yield of the display substrate. The cleaning component includes an ultrasonic cleaning mechanism facing the bearing area. The ultrasonic cleaning mechanism is fixed to the installation position by the support component. The ultrasonic cleaning mechanism cleans the display substrate in the bearing area, improving the problem that surface impurities of the display substrate affect the etching process and cause display defects in the display panel. Attached Figure Description

[0021] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar features.

[0022] Figure 1 This is a schematic diagram of the structure of a display substrate used in a display substrate cleaning system according to an embodiment of this application.

[0023] Figure 2 This is a schematic diagram of a display substrate cleaning system in one embodiment;

[0024] Figure 3 This is a top view of the conductive pad of a display substrate cleaning system in one embodiment;

[0025] Figure 4 This is a partial structural schematic diagram of the static elimination mechanism of a display substrate cleaning system in one embodiment.

[0026] Figure 5 This is a schematic diagram of the display substrate cleaning system in another embodiment;

[0027] Figure 6 This is a schematic diagram of the display substrate cleaning system in another embodiment;

[0028] Figure 7 This is a schematic diagram of the display substrate cleaning system in another embodiment.

[0029] Explanation of reference numerals in the attached figures:

[0030] 100. Display substrate cleaning system;

[0031] 110. Support components;

[0032] 120. Transfer component;

[0033] 130. Cleaning assembly; 131. Ultrasonic cleaning mechanism; 132. Spraying mechanism; 1321. Liquid storage unit; 1322. Spray head; 133. Drying mechanism; 134. Humidity sensor; 135. Support mechanism;

[0034] 140. Base; 141. Main body; 142. Support; 143. Body; 144. Protrusion; 1441. Negative pressure hole;

[0035] 150. Static eliminator; 151. Conductive pad; 152. Connecting wire; 153. Grounding part; 154. Ionizing fan; 1511. First conductive pad; 1512. Second conductive pad; 1531. Grounding electrode;

[0036] 160. Bearing area; 161. Edge area;

[0037] 170. Light-emitting element; 171. First electrode; 172. Second electrode; 173. Light-emitting layer; 180. Pixel circuit; 190. Isolation structure;

[0038] X, first direction; Y, second direction; Z, third direction. Detailed Implementation

[0039] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0040] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0041] The directional terms appearing in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the embodiments of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0042] This application provides a display substrate cleaning system for cleaning the display substrate before etching the inorganic encapsulation layer.

[0043] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of a display substrate used in a display substrate cleaning system according to an embodiment of this application.

[0044] like Figure 1 As shown, the display substrate includes sub-pixels, each sub-pixel including a light-emitting element 170 and a pixel circuit 180. The light-emitting element 170 includes a first electrode 171, a second electrode 172, and a light-emitting layer 173, located between the first electrode 171 and the second electrode 172. The first electrode 171 is electrically connected to the pixel circuit 180. Physically, the second electrodes 172 of different light-emitting elements 170 are disconnected from each other through an isolation structure 190; electrically, the second electrodes 172 of different light-emitting elements 170 are electrically connected to each other through the isolation structure 190. The second electrode 172 overlaps with the isolation structure 190, and the portion of the isolation structure 190 overlapping with the second electrode 172 is conductive. Furthermore, the light-emitting layers 173 of different light-emitting elements 170 are also isolated from each other through the isolation structure 190. In other words, the light-emitting layers 173 of different light-emitting elements 170 are disconnected from each other, and the second electrodes 172 of different light-emitting elements 170 are disconnected from each other. The light-emitting layer 173 can be formed by vapor deposition using a non-fine metal mask technique.

[0045] Two or more sub-pixels may share a single pixel circuit 180. The driving current provided by the pixel circuit 180 flows through a first electrode 171 to multiple light-emitting elements 170 sharing the first electrode 171. It is understood that multiple sub-pixels sharing the pixel circuit 180 constitute a sub-pixel group. For example, multiple sub-pixels sharing the pixel circuit 180 may share a single first electrode 171. See also... Figure 2 , Figure 2 This is a schematic diagram of the structure of a display substrate cleaning system in one embodiment.

[0046] like Figure 2As shown, an embodiment of the first aspect of this application provides a display substrate cleaning system 100. The display substrate is used to fabricate a display device. The display substrate cleaning system 100 includes a support assembly 110, a transfer assembly 120, and a cleaning assembly 130. The support assembly 110 includes a base 140 and an anti-static mechanism 150. The anti-static mechanism 150 includes a conductive pad 151, a connecting wire 152, and a grounding portion 153 connected to each other. The conductive pad 151 is disposed on one side of the base 140 in a first direction X. The grounding portion 153 is disposed at a grounding position. The connecting wire 152 connects the conductive pad 151 and the grounding portion 153 to form a [missing information - likely a configuration or structure]. A grounding loop is formed. A bearing area 160 is provided on the side of the conductive pad 151 away from the base 140. The bearing area 160 is used to bear the display substrate. The transfer assembly 120 is used to transfer the display substrate to the bearing area 160 and / or the transfer assembly 120 is used to remove the display substrate from the bearing area 160. The cleaning assembly 130 is used to clean the display substrate in the bearing area 160. The cleaning assembly 130 includes a support mechanism 135 and an ultrasonic cleaning mechanism 131. The ultrasonic cleaning mechanism 131 is fixed to the installation position by the support mechanism 135 and is disposed facing the bearing area 160.

[0047] In the display substrate cleaning system 100 provided in this application embodiment, the display substrate cleaning system 100 includes a support assembly 110, a transfer assembly 120, and a cleaning assembly 130. The support assembly 110 includes a base 140 and an anti-static mechanism 150. The anti-static mechanism 150 includes a conductive pad 151, a connecting line 152, and a grounding portion 153 connected to each other. The conductive pad 151 is disposed on one side of the base 140 in the first direction X. The grounding portion 153 is disposed at a grounding position. The connecting line 152 connects the conductive pad 151 and the grounding portion 153 so that the surface charge of the bearing area 160 can be conducted to the grounding portion 153 through the connecting line 152. The transfer assembly 120 can transfer the display substrate to the bearing area 160 and / or can transfer the display substrate to the bearing area 160. The display substrate is removed from the carrier area 160. Since the surface charge of the carrier area 160 can be conducted to the grounding part 153 through the connecting line 152, the potential difference between the display panel and the carrier area 160 is reduced. This helps to reduce the electrostatic discharge intensity between the display panel and the carrier area 160, reduce the risk of electrostatic damage to the internal components of the display substrate, and help improve the manufacturing yield of the display substrate. The cleaning assembly 130 includes an ultrasonic cleaning mechanism 131 facing the carrier area 160. The ultrasonic cleaning mechanism 131 is fixed to the installation position by the support mechanism 135. The ultrasonic cleaning mechanism 131 cleans the display substrate in the carrier area 160, improving the problem that surface impurities of the display substrate affect the etching process and cause poor display of the display panel.

[0048] Optionally, the display substrate cleaning system 100 provided in the first aspect embodiment of this application can be used to clean the display substrate before etching the inorganic encapsulation layer.

[0049] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0050] During processing and transportation, the surface of the display substrate may be contaminated with dust and other impurities. Therefore, before etching its inorganic encapsulation layer, the surface of the display substrate needs to be cleaned to prevent impurities from forming a barrier layer during the etching process and affecting the progress of the etching process.

[0051] The display substrate cleaning system 100 includes a support component 110, a transfer component 120, and a cleaning component 130. The transfer component 120 transfers the display substrate to and from the support component 110, and the cleaning component 130 cleans the display substrate located on the support component 110.

[0052] Optionally, the transfer component 120 can be a robotic arm, conveyor belt, intelligent handling robot, etc. The transfer component 120 is used to transfer the display substrate from the previous process to the support component 110, and to transfer the display substrate from the support component 110 to the next process.

[0053] In related technologies, static charge may accumulate on the surfaces of the display panel and the support component 110. The transfer component 120 transfers the display panel, and the static charge is released when the display panel and the support area 160 come into contact. The chips and circuits in the display substrate may be damaged or destroyed by static electricity.

[0054] In this embodiment of the application, by providing an antistatic mechanism 150 on the base 140 of the support component 110, and placing the display substrate within the bearing area 160 of the antistatic mechanism 150, the electrostatic discharge intensity when the display panel and the bearing area 160 come into contact is reduced.

[0055] The base 140 is used to provide support for the display substrate and the static elimination mechanism 150. The shape, size and material of the base 140 can be designed according to the actual situation.

[0056] For example, the base 140 may be cubic or cylindrical, and the material of the base 140 may be marble.

[0057] The static eliminator 150 includes an interconnected conductive pad 151, a connecting wire 152, and a grounding part 153. The conductive pad 151 is laid flat on the end face of the base 140 in the first direction X. The conductive pad 151 is provided with a bearing area 160 for supporting the display substrate. Static charge on the surface of the bearing area 160 is conducted to the ground through the connecting wire 152 and the grounding part 153, reducing the risk of charge accumulation in the bearing area 160. The potential of the bearing area 160 is forced to be maintained at the same potential as the ground (close to zero potential), reducing the potential difference between the bearing area 160 and the display substrate, thereby reducing the electrostatic discharge intensity and reducing the risk of electrostatic damage to the components inside the display substrate.

[0058] For example, the shape and size of the carrier region 160 can be designed by the user, but should at least ensure that the display substrate can be completely accommodated within the carrier region 160.

[0059] Optionally, the conductive pad 151 and the base 140 are detachably connected to facilitate the replacement and maintenance of the conductive pad 151.

[0060] For example, the conductive pad 151 is bonded to the base 140 by a conductive adhesive.

[0061] Optionally, the conductive pad 151 includes a stacked electrostatic dissipation layer and a conductive layer. The electrostatic dissipation layer can be made of antistatic rubber or PVC (polyvinyl chloride) and other electrostatic dissipation materials, which can be used to absorb and diffuse charges. The conductive layer is disposed between the electrostatic dissipation layer and the base 140. The conductive layer can be made of carbon black, metal powder or conductive fiber, etc. The conductive layer is connected to the connecting wire 152. The electrostatic dissipation layer transfers charges to the conductive layer and then to the grounding part 153 by the connecting wire 152, thus preventing charge accumulation.

[0062] Optionally, the conductive layer includes a stacked bottom conductive layer and a mesh layer. The mesh layer is disposed between the bottom conductive layer and the electrostatic dissipation layer. The mesh layer provides a low-resistance multi-path conduction channel for electrostatic charges, avoids charge accumulation in local areas, and ensures that charges are quickly and uniformly introduced into the bottom conductive layer.

[0063] For example, the mesh layer can be a metal mesh, which has good electrical conductivity, or the mesh layer can be a carbon fiber mesh, which has good flexibility and is resistant to chemical corrosion. For example, the metal mesh can be copper mesh, aluminum mesh, stainless steel mesh, etc.

[0064] Connector 152 is used to transfer charge between conductive pad 151 and ground electrode 1531. Connector 152 can be a metal braided wire, which has both good conductivity and good bending resistance. The size and material of connector 152 can be designed by the user. For example, the metal braided wire can be copper braided wire.

[0065] The grounding part 153 is provided at the grounding position to conduct the charge of the bearing area 160 to the ground.

[0066] For example, the grounding part 153 can be a copper-plated steel pipe or a galvanized angle steel, etc., and the grounding part 153 is buried at least 0.5m underground.

[0067] Optionally, the grounding part 153 of multiple static elimination mechanisms 150 can be shared to reduce the difficulty of setting up the static elimination mechanism 150.

[0068] After the transfer assembly 120 places the display substrate in the carrier area 160, the cleaning assembly 130 cleans the display substrate. The display substrate includes an ultrasonic cleaning mechanism 131, which generates a high-speed airflow through vibration to clean the display substrate. This airflow is CDA (Clean Dry Air) airflow to enhance the cleaning effect of the ultrasonic cleaning mechanism 131.

[0069] Optionally, the cleaning assembly 130 may include a plurality of ultrasonic cleaning mechanisms 131 spaced apart to improve cleaning quality.

[0070] In some embodiments, such as Figure 2 As shown, the connecting wire 152 and the conductive pad 151 are detachably connected.

[0071] In these embodiments, the connecting wire 152 and the conductive pad 151 are detachably connected to facilitate repair and replacement of the connecting wire 152 in case of damage.

[0072] Optionally, the connection method between the connecting wire 152 and the conductive pad 151 can be snap-fit, bolt connection, or adhesive connection. For example, the conductive pad 151 is provided with a conductive port, which is electrically connected to its bottom conductive layer. The end of the connecting wire 152 is provided with a conductive terminal, which can be detachably fixed in the conductive port. The conductive pad 151 and the connecting wire 152 are detachably snap-fitted together.

[0073] Please see Figure 3 , Figure 3 This is a top view of the conductive pads in a display substrate cleaning system according to one embodiment.

[0074] In some embodiments, such as Figure 2 and Figure 3 As shown, the conductive pad also includes an edge region 161, which is located outside the bearing region 160, and the connecting line 152 is located in the edge region 161.

[0075] In these embodiments, the conductive pad 151 further includes an edge region 161 disposed outside the support region 160, and the connecting line 152 is connected to the edge region to avoid the connecting line 152 interfering with the display substrate within the support region 160.

[0076] For example, the edge region 161 is provided around the bearing region 160 to facilitate adjustment of the position of the connecting line 152 and reduce the risk that static charge will accumulate at the edge and cannot be promptly introduced to the grounding position.

[0077] In some embodiments, such as Figure 2 and Figure 3 As shown, the static elimination mechanism 150 includes a plurality of connecting lines 152, which are spaced apart in the edge region 161.

[0078] In these embodiments, the static eliminator 150 includes a plurality of connecting lines 152, which are spaced apart in the edge region 161. The charge in the carrying region 160 is conducted to the plurality of connecting lines 152 in the edge region 161. This redundancy design reduces the risk of failure of the entire static eliminator 150 due to the failure of a single connecting line 152, thus improving the reliability of the static eliminator 150. It also reduces the risk of charge concentration in some areas, which could lead to partial discharge and damage to the display substrate.

[0079] Specifically, the connecting line 152 includes an interconnected busbar and multiple sub-lines. The size of the busbar is larger than the size of the sub-lines. The multiple sub-lines are connected to the edge area 161. The busbar is connected to the grounding part 153 to reduce the difficulty of setting up the static elimination mechanism 150; or multiple independent connecting lines 152, one end of which is connected to the edge area 161 and the other end is connected to the grounding part 153.

[0080] Optionally, multiple connecting lines 152 are evenly spaced at equal intervals in the edge region 161 to reduce the risk of charge concentration in some areas, which could lead to partial discharge.

[0081] For example, the number of connecting lines 152 in the edge region 161 can be 2, 3, 5, etc.

[0082] Optionally, multiple connecting lines 152 are arranged around the bearing area 160 to reduce the risk of charge concentration in the bearing area 160.

[0083] Please see Figure 4 , Figure 4 This is a partial structural schematic diagram of the static elimination mechanism of a display substrate cleaning system in one embodiment.

[0084] In some embodiments, such as Figure 2 and Figure 4As shown, the grounding part 153 includes at least two grounding electrodes 1531, which are connected in parallel.

[0085] In these embodiments, the grounding part 153 includes at least two grounding electrodes 1531 connected in parallel. The parallel connection of the grounding electrodes 1531 helps to reduce the overall resistance of the grounding part 153, thereby improving the reliability of the static eliminator 150; and the risk of failure of the grounding part 153 can be reduced through redundant design.

[0086] Optionally, each grounding electrode 1531 may be made of the same material and have the same dimensions to reduce the difficulty of setting up the grounding part 153.

[0087] Optionally, the number of grounding electrodes 1531 can be designed independently. For example, the grounding part 153 includes 2, 3, 5, or 10 grounding electrodes 1531 connected in parallel.

[0088] In some embodiments, such as Figure 2 and Figure 4 As shown, the connecting line 152 is designed to be stretchable and deformable along its length.

[0089] In these embodiments, the connecting line 152 is designed to be stretchable and deformable along its length to facilitate adjustment of the grounding part 153 and reduce the difficulty of setting up the static elimination mechanism 150.

[0090] For example, the connecting line 152 extends along a spiral path to allow the connecting line 152 to be stretchable and deformable in its length direction.

[0091] In some embodiments, such as Figure 2 As shown, the static elimination mechanism 150 also includes an ion fan 154, which is located upstream of the conductive pad 151.

[0092] In these embodiments, the static eliminator 150 also includes an ion fan 154. By placing the ion fan 154 upstream of the conductive pad 151, the ion fan 154 first neutralizes the static charge on the surface of the display substrate before the display substrate and the support area 160 come into contact, thereby reducing the electrostatic discharge intensity during the contact process between the display substrate and the support assembly 110 and improving the problem of electrostatic damage to the display substrate.

[0093] The ion fan 154 uses a high-voltage electric field to act on needle-shaped or filamentous electrodes, triggering a corona discharge phenomenon that decomposes oxygen and nitrogen in the air into positive and negative ions. Then, the built-in fan blows out the charged ions to form a wide-coverage positive and negative charge airflow. The static charge on the surface of the object attracts opposite ions in the airflow, and static electricity is eliminated through charge neutralization.

[0094] The ion fan 154 is located upstream of the conductive pad 151. This means that when the transfer assembly 120 transfers the display substrate, the display substrate must first pass through the positive and negative charge airflow generated by the ion fan 154 to neutralize at least part of the charge on the surface of the display substrate before the display substrate is placed in the bearing area 160 of the conductive pad 151.

[0095] For example, the transfer component 120 controls the display substrate to remain in the positive and negative charge airflow generated by the ion fan 154 for a preset time before placing the display substrate in the support area 160. For example, the preset time can be designed by the user and can be 1s, 2s, 3s, etc.

[0096] Optionally, the positive and negative charged airflow generated by the ion fan 154 blows towards and covers the carrier area 160, ensuring that the display substrate first enters the positive and negative charged airflow generated by the ion fan 154 before being placed in the carrier area 160; or the opening of the ion fan 154 and the carrier area 160 are spaced apart along the first direction X, the axis of the opening of the ion fan 154 is parallel to the surface of the carrier area 160, and the ion fan 154 generates a positive and negative charged airflow on one side of the carrier area 160 in the first direction X, so that when the transfer component 120 transfers the display substrate, the display substrate first passes through the positive and negative charged airflow before being placed in the carrier area 160.

[0097] Optionally, after the transfer component 120 places the display substrate in the carrier area 160 and before the cleaning component 130 starts working, the ion fan 154 stops working to avoid the ion fan 154 interfering with the cleaning effect of the cleaning component 130.

[0098] For example, the static elimination mechanism 150 includes a grating switch, which is electrically connected to an ion fan 154. When the transfer assembly 120 transfers the display substrate to the carrying area 160, the transfer assembly 120 blocks the grating, and the ion fan 154 is turned on. When the transfer assembly 120 is reset, the transfer assembly 120 is removed from the grating area, the ion fan 154 is turned off, and the cleaning assembly 130 is started.

[0099] Optionally, the ion fan 154 and the ultrasonic cleaning mechanism 131 can simultaneously blow air onto the bearing area 160, and both the ion fan 154 and the ultrasonic cleaning mechanism 131 can generate clean airflow onto the bearing area 160.

[0100] Please see Figure 5 , Figure 5 This is a schematic diagram of the display substrate cleaning system in another embodiment.

[0101] In some embodiments, such as Figure 5As shown, the cleaning assembly 130 also includes a spray mechanism 132, which is connected to the support mechanism 135. The spray mechanism 132 includes a liquid storage section 1321 and a spray head 1322 that are interconnected. The liquid storage section 1321 is used to store the medium. The spray head 1322 and the ultrasonic cleaning mechanism 131 are spaced apart. The spray head 1322 is positioned toward the bearing area 160. The spray mechanism 132 is used to clean the display substrate in the bearing area 160.

[0102] In these embodiments, the cleaning assembly 130 further includes a spraying mechanism 132, with spray heads 1322 facing the support area 160 to spray the display substrate within the support area 160. This helps to disperse the surface charge of the display substrate, improve the problem of charge accumulation, and reduce the electrostatic discharge intensity. It can also increase the ambient humidity, reduce the accumulation rate of static charge on the surface of the display substrate, thereby reducing the electrostatic discharge intensity when the display substrate and the support area 160 come into contact, and reducing the risk of electrostatic damage to the internal components of the display substrate.

[0103] The spray mechanism 132 also includes a pressure pump, a liquid storage section 1321 for storing a medium, which can be clean water, and a pressure pump for pressurizing the medium. The medium is sprayed from the spray head 1322 onto the display substrate of the bearing area 160.

[0104] It should be noted that the location of the liquid storage unit 1321 in the figure is only an example. The liquid storage unit 1321 can also be set in other places and connected to the spray head 1322 through pipelines.

[0105] Optionally, the spray mechanism 132 can slowly increase the humidity of the surrounding environment when spraying. The humid environment helps to reduce the rate of charge accumulation on the surface of the display substrate and reduce the electrostatic discharge intensity when the display substrate and the carrier area 160 come into contact.

[0106] Optionally, the spraying mechanism 132 can form a conductive water film on the surface of the display substrate during spraying. The conductive water film helps to reduce the surface resistance of the display substrate, allowing the static charge that was originally accumulated to slowly leak along the wet surface, avoiding violent discharge caused by charge concentration; and the liquid itself is conductive, so when the droplets come into contact with charged bodies during the spraying process, they can neutralize some of the static charge through conduction, thereby reducing the total amount of charge and reducing the electrostatic discharge intensity.

[0107] For example, when the display substrate is transferred during the transfer operation and placed in the support area 160, the spraying mechanism 132 continuously sprays the medium to continuously increase the humidity of the surrounding environment and form a conductive water film on the surface of the display substrate.

[0108] Optionally, multiple spray heads 1322 are spaced apart to improve the cleaning efficiency of the spray mechanism 132.

[0109] Optionally, the spray mechanism 132 and the ultrasonic cleaning mechanism 131 will not be activated simultaneously to reduce the problem of the airflow of the ultrasonic cleaning mechanism 131 interfering with the spray range of the spray mechanism 132, which could lead to poor cleaning effect of the cleaning component 130.

[0110] Optionally, the spray head 1322 is an atomizing nozzle, which helps to improve the uniformity of the spray.

[0111] In some embodiments, such as Figure 5 As shown, the spray head 1322 and the ultrasonic cleaning mechanism 131 are spaced apart along the second direction Y. The spray head 1322 is rotatable relative to the support mechanism 135 around the third direction Z. The first direction X, the second direction Y and the third direction Z intersect each other.

[0112] In these embodiments, the spray head 1322 is rotatable relative to the support mechanism 135 in a third direction Z, so that the spray head 1322 can form a larger spray area and more conveniently spray the display substrate.

[0113] Optionally, the spray head 1322 and the support mechanism 135 are connected by a pivot extending in the third direction Z, so as to facilitate the rotation of the spray head 1322 relative to the support mechanism 135 about the third direction Z.

[0114] Optionally, the spraying mechanism 132 further includes a drive component, which is connected to the rotating shaft to drive the rotating shaft to rotate, thereby causing the spraying mechanism 132 to rotate. For example, the drive component can be a motor, a pneumatic cylinder, or a hydraulic cylinder, etc.

[0115] Optionally, both the spray head 1322 and the ultrasonic cleaning mechanism 131 are movable relative to the support mechanism 135 in the second direction Y to facilitate adjustment of their positions. When the spray head 1322 is operating, it is moved to a position directly facing the display substrate, and the ultrasonic cleaning mechanism 131 is moved to an edge position; conversely, when the ultrasonic cleaning mechanism 131 is operating, it is moved to a position directly facing the display substrate, and the spray head 1322 is moved to an edge position.

[0116] In some embodiments, such as Figure 5As shown, the cleaning assembly 130 also includes a humidity sensor 134. The spray mechanism 132 and the ultrasonic cleaning mechanism 131 are both electrically connected to the humidity sensor 134. The humidity sensor 134 and the bearing area 160 are spaced apart. The humidity sensor 134 is used to obtain the actual humidity value of the surrounding environment of the bearing area 160. The cleaning assembly 130 is configured such that when the actual humidity value is greater than or equal to a preset humidity value, the ultrasonic cleaning mechanism 131 is in the open state and the spray mechanism 132 is in the closed state; when the actual humidity value is less than the preset humidity value, the ultrasonic cleaning mechanism 131 is in the closed state and the spray mechanism 132 is in the open state.

[0117] In these embodiments, the cleaning assembly 130 also includes a humidity sensor 134, which is used to obtain the actual humidity value of the environment surrounding the bearing area 160. The cleaning assembly 130 adjusts the on / off state of the ultrasonic cleaning mechanism 131 and the spray mechanism 132 based on the actual humidity value. When the ambient humidity is low, the spray mechanism 132 is activated to increase the ambient humidity and reduce the risk of strong electrostatic discharge when the display substrate and the support assembly 110 come into contact. When the ambient humidity is high, the spray mechanism 132 is turned off and the ultrasonic cleaning mechanism 131 is activated to reduce the operating cost of the cleaning assembly 130.

[0118] Specifically, the display substrate is prone to charge accumulation in a dry environment. Therefore, when the humidity sensor 134 detects that the actual humidity value of the surrounding environment of the bearing area 160 is lower than the preset humidity value, the spray mechanism 132 is activated and the ultrasonic cleaning mechanism 131 is deactivated. At this time, only the spray mechanism 132 cleans the display substrate. As the spray mechanism 132 sprays, the humidity of the surrounding environment gradually increases. When the actual humidity value is greater than or equal to the preset humidity value, the spray mechanism 132 is deactivated and the ultrasonic cleaning mechanism 131 is activated. At this time, only the ultrasonic cleaning mechanism 131 cleans the display substrate.

[0119] The humidity sensor 134 is used to obtain the actual humidity value of the environment around the bearing area 160. This refers to the actual humidity value of the environment around the bearing area 160 obtained by the humidity sensor 134 at its installation location.

[0120] For example, the distance between the installation position of the humidity sensor 134 and the bearing area 160 can be 0.5m, 0.75m, 1m, 2m, etc.

[0121] Optionally, the specific preset humidity value can be designed according to the actual situation. For example, the preset humidity value can be 20%, 25%, 30%, etc.

[0122] Optionally, the preset humidity value includes a first preset humidity value and a second preset humidity value. The first preset humidity value is less than the second preset humidity value. When the actual humidity value is less than the first preset humidity value, the spray mechanism 132 is in the open state, and the ion fan 154 and the ultrasonic cleaning mechanism 131 are in the closed state. When the actual humidity value is greater than or equal to the first preset humidity value and less than the second preset humidity value, the ion fan 154 and the ultrasonic cleaning mechanism 131 are in the open state, and the spray mechanism 132 is in the closed state. When the actual humidity value is greater than or equal to the second preset humidity value, the ultrasonic cleaning mechanism 131 is in the open state, and the ion fan 154 and the spray mechanism 132 are in the closed state.

[0123] For example, the first preset humidity value can be 20%, and the second preset humidity value can be 30%.

[0124] In some embodiments, such as Figure 5 As shown, the cleaning assembly 130 also includes a drying mechanism 133. The drying mechanism 133 and the support mechanism 135 are connected and disposed downstream of the spraying mechanism 132. The opening of the drying mechanism 133 is disposed facing the bearing area 160. The drying mechanism 133 is used to remove the medium from the surface of the display substrate.

[0125] In these embodiments, the drying mechanism 133 is located downstream of the spraying mechanism 132, and the drying mechanism 133 is able to dry the display substrate after the spraying mechanism 132 sprays the display substrate.

[0126] Optionally, the drying mechanism 133 can be a hot air drying device, which includes a heating element and a fan. The fan blows out clean gas, which is heated by the heating element and then blown onto the bearing area 160 to dry the display panel. Through the combination of high temperature and airflow, the drying mechanism 133 has high drying efficiency. Alternatively, the drying mechanism 133 can be an infrared drying device, which uses infrared radiation to cause the liquid medium molecules to vibrate and evaporate to dry the display panel. This avoids the problem of charge concentration caused by airflow molecules rubbing against the display substrate, and helps to reduce the electrostatic discharge intensity when the display substrate is removed from the bearing area 160.

[0127] The drying mechanism 133 is located downstream of the spraying mechanism 132, meaning that the spraying mechanism 132 first sprays the display substrate, and then the spraying mechanism 132 is turned off, and the drying mechanism 133 dries the display substrate.

[0128] Specifically, the cleaning assembly 130 includes an ultrasonic cleaning mechanism 131, a spraying mechanism 132, a drying mechanism 133, and a humidity sensor 134. When the actual humidity value is greater than or equal to the preset humidity value, the ultrasonic cleaning mechanism 131 is in the open state, and the spraying mechanism 132 and the drying mechanism 133 are both in the closed state; when the actual humidity value is less than the preset humidity value, the ultrasonic cleaning mechanism 131 is in the closed state, and the spraying mechanism 132 and the drying mechanism 133 are both in the open state.

[0129] Please see Figure 6 , Figure 6 This is a schematic diagram of the display substrate cleaning system in another embodiment.

[0130] In some embodiments, such as Figure 6 As shown, the base 140 includes a body 143 and protrusions 144. At least two protrusions 144 are spaced apart on one side of the body 143 in a first direction X, and a conductive pad 151 is disposed on the side of the protrusions 144 opposite to the body 143.

[0131] In these embodiments, at least two protrusions 144 are spaced apart on one side of the body 143 in the first direction X, and a conductive pad 151 is disposed on the side of the protrusions 144 away from the body 143. By reducing the contact area between the display substrate and the carrier area 160, the overall charge transfer is limited, thereby reducing the electrostatic discharge intensity when the display substrate contacts the carrier area 160 and reducing the risk of electrostatic damage to the internal devices of the display substrate.

[0132] Optionally, each protrusion 144 has the same shape and size to reduce the machining difficulty of the base 140.

[0133] Optionally, the number of protrusions 144 can be designed by the user. For example, 2, 3, 4, 5, etc., protrusions 144 can be set at intervals.

[0134] Optionally, multiple protrusions 144 are equidistantly spaced to stably support the display substrate.

[0135] Optionally, the conductive pad 151 includes multiple sub-pads, each sub-pad being disposed on the side surface of the protrusion 144 opposite to the body 143, and each sub-pad being connected to the connecting line 152.

[0136] Optionally, the transfer component 120 can be a robotic arm, and the space between adjacent protrusions 144 can form a space to avoid the robotic arm, so as to facilitate the placement and gripping of the display substrate by the robotic arm.

[0137] Optionally, a limiting groove is formed on the side of the protrusion 144 opposite to the body 143, and at least part of the display substrate is accommodated in the limiting groove. The limiting groove is used to limit and fix the display substrate, reducing the risk of the display substrate being displaced and damaged by airflow impact during the ultrasonic cleaning mechanism 131 cleaning process.

[0138] In some embodiments, such as Figure 6 As shown, the protrusion 144 has a negative pressure hole 1441 through its surface in the first direction X. The support assembly 110 also includes a negative pressure mechanism (not shown in the figure), which is disposed in the body 143 and is positioned toward the negative pressure hole 1441.

[0139] In these embodiments, the negative pressure mechanism can apply an attractive force to the outside through the negative pressure hole 1441 to facilitate the stable fixing of the display substrate to the protrusion 144.

[0140] The main body 143 has a cavity inside to accommodate the negative pressure mechanism. The opening of the negative pressure mechanism is positioned facing the negative pressure hole 1441 to create an attractive force at the negative pressure hole 1441. In this way, when the display substrate is placed on the protrusion 144, the negative pressure mechanism can attract the display substrate onto the protrusion 144.

[0141] Optionally, multiple negative pressure holes 1441 are spaced apart on the protrusion 144 to improve the connection stability between the protrusion 144 and the display substrate.

[0142] Please see Figure 7 , Figure 7 This is a schematic diagram of the display substrate cleaning system in another embodiment.

[0143] In some embodiments, such as Figure 7 As shown, the base 140 includes a main body 141 and at least two support parts 142. The support parts 142 are telescopically arranged relative to the main body 141 in a first direction X. The at least two support parts 142 are spaced apart. The conductive pad 151 includes a first conductive pad 1511 and a second conductive pad 1512. The first conductive pad 1511 is disposed on the main body 141, and the second conductive pad 1512 is disposed on the support parts 142. The static elimination mechanism 150 includes a plurality of connecting lines 152. The plurality of connecting lines 152 are respectively connected to the first conductive pad 1511 and each of the second conductive pads 1512. The bearing area 160 is disposed on each of the second conductive pads 1512 and at least a portion of the first conductive pads 1511.

[0144] In these embodiments, the base 140 includes a main body 141 and at least two support portions 142. The support portions 142 are telescopically arranged relative to the main body 141 in a first direction X. The support portions 142 support the display substrate. The at least two support portions 142 are spaced apart to form a space to avoid the transfer assembly 120. The conductive pad 151 includes a first conductive pad 1511 and a second conductive pad 1512 respectively disposed on the main body 141 and the support portions 142. The bearing area 160 is disposed on each of the second conductive pads 1512 and at least a portion of the first conductive pads 1511. The charge of the bearing area 160 is conducted by the combination of the first thermally conductive pad and the second thermally conductive pad.

[0145] Specifically, the support portion 142 can extend out of the main body portion 141 on one side in the first direction X, and the conductive pad 151 includes a first conductive pad 1511 and a second conductive pad 1512. The first thermal conductive pad is disposed on the main body portion 141, and the second thermal conductive pad is disposed on the end face of the support portion 142 in the first direction X.

[0146] The support portion 142 is extendable relative to the main body portion 141 along the first direction X. During the process of the transfer assembly 120 placing the display substrate in the support area 160, the support portion 142 extends relative to the main body portion 141, and the transfer assembly 120 places the display substrate on the end face of the support portion 142. The transfer assembly 120 detaches from the display substrate by relying on the clearance space formed by the adjacent support portions 142. The support portion 142 retracts and resets, and the end face of the support portion 142 in the first direction X is flush with the surface of the main body portion 141 in the first direction X. The first conductive pad 1511 and the second conductive pad 1512 are flush, so that the display substrate remains stable within the support area 160.

[0147] Multiple connecting lines 152 are respectively connected to the first conductive pad 1511 and the second conductive pad 1512. The connecting line 152 includes a busbar and multiple sub-lines. Each second conductive pad 1512 is connected to at least one sub-line, and each first conductive pad 1511 is connected to at least one sub-line. Alternatively, the multiple connecting lines 152 are independent of each other, and each first conductive pad 1511 and each second thermal pad are connected to at least one connecting line 152.

[0148] Optionally, the support 142 can be driven by a motor, a hydraulic cylinder, or a pneumatic cylinder.

[0149] like Figure 2As shown, an embodiment of the second aspect of this application provides a support component 110, which is applied to the display substrate cleaning system 100 of the first aspect embodiment described above. The support component 110 includes a base 140 and an anti-static mechanism 150. The anti-static mechanism 150 includes a conductive pad 151, a connecting line 152, and a grounding portion 153 that are connected to each other. The conductive pad 151 is disposed on one side of the base 140 in a first direction X. The grounding portion 153 is disposed at a grounding position. The connecting line 152 connects the conductive pad 151 and the grounding portion 153 to form a grounding loop. A bearing area 160 is disposed on the side of the conductive pad 151 away from the base 140. The bearing area 160 is used to bear the display substrate.

[0150] Since the support component 110 provided in the second aspect embodiment of this application is applied to the display substrate cleaning system 100 of the first aspect embodiment above, the beneficial effects of the support component 110 provided in the second aspect embodiment of this application are all described in the first aspect embodiment above, and will not be repeated here.

[0151] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display substrate cleaning system, wherein the display substrate is used to manufacture a display device, characterized in that, The display substrate cleaning system includes: The support assembly includes a base and an anti-static mechanism. The anti-static mechanism includes an interconnected conductive pad, a connecting wire, and a grounding part. The conductive pad is disposed on one side of the base in a first direction. The grounding part is disposed at a grounding position. The connecting wire connects the conductive pad and the grounding part to form a grounding loop. The conductive pad has a bearing area on the side away from the base, and the bearing area is used to support the display substrate. A transfer assembly for transferring the display substrate to the carrier region, and / or for removing the display substrate from the carrier region; A cleaning assembly is provided for cleaning the display substrate within the bearing area. The cleaning assembly includes a support mechanism and an ultrasonic cleaning mechanism. The ultrasonic cleaning mechanism is fixed to the installation position by the support mechanism and is oriented towards the bearing area. 2.The display substrate cleaning system of claim 1, wherein, The cleaning assembly further includes a spray mechanism connected to the support mechanism. The spray mechanism includes a liquid storage section and a spray head that are interconnected. The liquid storage section is used to store a medium. The spray head and the ultrasonic cleaning mechanism are spaced apart. The spray head is positioned towards the bearing area. The spray mechanism is used to clean the display substrate within the bearing area. 3.The display substrate cleaning system of claim 2, wherein, The spray head and the ultrasonic cleaning mechanism are spaced apart along the second direction, and the spray head is rotatable relative to the support mechanism around a third direction. The first direction, the second direction, and the third direction intersect each other.

4. The display substrate cleaning system of claim 2, wherein, The cleaning assembly also includes a drying mechanism, which is connected to and disposed downstream of the spraying mechanism. The opening of the drying mechanism faces the bearing area, and the drying mechanism is used to remove the medium from the surface of the display substrate.

5. The display substrate cleaning system of claim 2, wherein, The cleaning assembly also includes a humidity sensor. Both the spray mechanism and the ultrasonic cleaning mechanism are electrically connected to the humidity sensor. The humidity sensor and the bearing area are spaced apart. The humidity sensor is used to obtain the actual humidity value of the surrounding environment of the bearing area. The cleaning assembly is configured such that, when the actual humidity value is greater than or equal to a preset humidity value, the ultrasonic cleaning mechanism is in the on state and the spray mechanism is in the off state; when the actual humidity value is less than the preset humidity value, the ultrasonic cleaning mechanism is in the off state and the spray mechanism is in the on state.

6. The display substrate cleaning system of claim 1, wherein, The static elimination mechanism also includes an ion fan, which is located upstream of the conductive pad.

7. The display substrate cleaning system of claim 1, wherein, The base includes a main body and at least two support parts. The support parts are telescopically arranged relative to the main body in the first direction. The at least two support parts are spaced apart. The conductive pad includes a first conductive pad and a second conductive pad. The first conductive pad is disposed on the main body, and the second conductive pad is disposed on the support parts. The static elimination mechanism includes a plurality of connecting lines. The plurality of connecting lines are respectively connected to the first conductive pad and each of the second conductive pads. The bearing area is disposed on each of the second conductive pads and at least a portion of the first conductive pad. 8.The display substrate cleaning system of claim 1, wherein, The base includes a body and protrusions, at least two of the protrusions are spaced apart on one side of the body in the first direction, and the conductive pad is disposed on the side of the protrusions opposite to the body. 9.The display substrate cleaning system of claim 8, wherein, The protrusion has a negative pressure hole through its surface in a first direction. The support assembly also includes a negative pressure mechanism, which is disposed in the body and is oriented toward the negative pressure hole.

10. The display substrate cleaning system of claim 1, wherein, The conductive pad also includes an edge region, which is located outside the bearing area, and the connecting line is located in the edge region. 11.The display substrate cleaning system of claim 10, wherein, The static elimination mechanism includes a plurality of connecting lines, which are spaced apart in the edge region. 12.The display substrate cleaning system of claim 1, wherein, The grounding part includes at least two grounding electrodes, and the at least two grounding electrodes are connected in parallel. 13.The display substrate cleaning system of claim 1, wherein The connecting line is designed to be stretchable and deformable along its length. 14.The display substrate cleaning system of claim 1, wherein The connecting wire and the conductive pad are detachably connected.

15. A support assembly applied to the display substrate cleaning system according to any one of claims 1-14, characterized in that, The support assembly includes a base and an anti-static mechanism. The anti-static mechanism includes an interconnected conductive pad, a connecting wire, and a grounding part. The conductive pad is disposed on one side of the base in a first direction. The grounding part is disposed at a grounding position. The connecting wire connects the conductive pad and the grounding part to form a grounding loop. The conductive pad has a bearing area on the side away from the base, and the bearing area is used to support the display substrate.

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