Solid target electroplating equipment
By simplifying the design of fixing the anode electrode and cathode target in the electroplating equipment, the problems of complex structure and cumbersome use of existing electroplating equipment are solved, which realizes the convenience and cost reduction of target preparation, while reducing radioactive waste.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HTA CO LTD
- Filing Date
- 2025-05-26
- Publication Date
- 2026-05-19
AI Technical Summary
Existing electroplating equipment is complex in structure and cumbersome to use, resulting in inconvenient and costly target preparation processes, as well as difficulties in the disposal of radioactive waste.
A solid target electroplating device was designed, comprising: a main body, an anode electrode sheet and a cathode target sheet, which are fixed at the opening of the electroplating station by a pressure plate to ensure that the electrode sheet does not interfere with the stirrer, and are kept sealed by a stepped surface and a sealing element. A mechanical stirrer and a high-frequency pulse rectifier are used to ensure the uniformity of the electroplating solution and the stability of the electric field.
A simplified electroplating equipment structure was achieved, which improved the convenience and stability of target preparation, reduced costs, and decreased the generation of radioactive waste.
Smart Images
Figure CN224258830U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of positron emission computed tomography (PET) technology, and more particularly to a solid target electroplating apparatus. Background Technology
[0002] Radionuclides produced by bombarding specific targets with accelerators are a major source of radionuclides used in radiopharmaceuticals. In recent years, various... 68 Ga-labeled radiopharmaceuticals are used for tumor diagnosis, and are particularly suitable for PET scans. Currently, 68 Ga mainly utilizes 68 Ge- 68 Ga is prepared using a Ga generator. Traditional cyclotron accelerators (such as Cyclone accelerators) are also used. ® 30) The use of a long strip metal target (10mm × 96mm) presents a problem of wasted beam energy because the beam is distributed in a date-shaped pattern, concentrating only on the middle of the long strip target, resulting in low utilization at both ends of the target. Such relatively low irradiation efficiency leads to higher difficulty and cost in subsequent processing, and also results in a larger amount of radioactive waste.
[0003] In existing technologies, it is necessary to ensure that the target material to be electroplated is securely fixed in the electroplating equipment, and to ensure that the electroplating solution remains uniform throughout the entire electroplating process. These considerations pose challenges to the structural configuration of the electroplating equipment, such as the electrical connection between the anode and cathode, the stirring device for the electroplating solution, and the feasibility of multiple electroplating stations. These considerations result in a relatively complex structure for the electroplating equipment, and cumbersome installation / removal procedures for the target material and corresponding electrode sheets, as illustrated in Chinese invention patent application CN116575097A. Therefore, it is necessary to optimize the electroplating equipment and process to improve the stability and safety of the target material preparation process. Summary of the Invention
[0004] This application provides a solid target electroplating device to overcome the shortcomings of existing electroplating equipment, which has a complex structure and is cumbersome to use. It realizes an electroplating device with a relatively simple structure, thereby making the target preparation process more convenient.
[0005] This application provides a solid target electroplating apparatus, comprising:
[0006] The main body has an electroplating solution tank extending along its own height inside.
[0007] Anode electrode and cathode target; and
[0008] Several pressure plates;
[0009] The electroplating bath is equipped with an electroplating station, which is formed to penetrate the main body in a horizontal direction perpendicular to the height of the main body and to communicate with the electroplating bath. The electroplating station has a first opening and a second opening on the outer surface of the main body. The anode electrode sheet is fixed to and the first opening is sealed by means of a corresponding pressure plate, and the cathode target sheet is fixed to and the second opening is sealed by means of a corresponding pressure plate.
[0010] According to the solid target electroplating equipment provided in this application, the number of electroplating stations is one or more, and the multiple electroplating stations are arranged along the height direction.
[0011] According to the solid target electroplating equipment provided in this application, the area ratio of the opposite end faces of the cathode target to the anode electrode is in the range of 1:1 to 1:2.
[0012] According to the solid target electroplating equipment provided in this application, the peripheries of the first opening and the second opening are formed in a stepped shape, and the stepped surface formed therefrom serves as a stop portion of the anode electrode sheet or the cathode target sheet.
[0013] According to the solid target electroplating equipment provided in this application, there are also a number of sealing elements, and the corresponding sealing elements are arranged between the first opening and the anode electrode sheet, or between the second opening and the cathode target sheet.
[0014] According to the solid target electroplating equipment provided in this application, the anode electrode sheet and the cathode target sheet may have the same or different shapes.
[0015] According to the solid target electroplating equipment provided in this application, the anode electrode sheet and the cathode target sheet are formed in the shape of a disc, a strip, or a polygonal sheet.
[0016] According to the solid target electroplating equipment provided in this application, the anode electrode sheet is selected from one of the following materials: Pt, Ti, or graphite.
[0017] According to the solid target electroplating equipment provided in this application, a mechanical stirrer is also included, which is placed in the electroplating bath.
[0018] According to the solid target electroplating equipment provided in this application, a high-frequency pulse rectifier is also included, which is electrically connected to the anode electrode and the cathode target respectively.
[0019] The solid target electroplating equipment provided in this application, by fixing the anode electrode and the cathode target to be electroplated at two openings (i.e., the first opening and the second opening) of the electroplating station respectively, ensures that the anode electrode / cathode target and its associated wires do not need to be arranged in the electroplating bath. On the one hand, these electrical components will not interfere with the agitator or rotating mechanism in the electroplating bath; on the other hand, the steps of installing / removing the anode electrode / cathode target during a single electroplating process or maintenance are simpler and more convenient than those in the prior art. Furthermore, the solid target electroplating equipment provided in this application, through the cooperation of the pressure plate and the stepped surface, always fixes the cathode target in a position facing the electroplating bath, and under the action of the electric field, ensures that this surface continuously receives the impact of Ga and Ni ions in the electroplating solution, where a reduction reaction occurs to obtain a high-purity Ga-Ni alloy or Zn. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a perspective view of the solid target electroplating equipment provided in this application.
[0022] Figure 2 This is an exploded view of the solid target electroplating equipment provided in this application.
[0023] Figure 3 This is a cross-sectional view along the height direction of the solid target electroplating equipment provided in this application.
[0024] Figure label:
[0025] 1. Main body; 11. Electroplating bath; 12. Electroplating station; 13. First opening; 14. Second opening; 2. Pressure plate; 21. Bolt; 3. Anode electrode plate; 4. Cathode target plate; 5. Sealing component. Detailed Implementation
[0026] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but should not be used to limit the scope of this application.
[0027] In the description of the embodiments of this application, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0028] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections, wherein a fixed connection can include an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.
[0029] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0030] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0031] The following is combined Figures 1 to 3 This application describes the solid target electroplating apparatus.
[0032] like Figure 1-2 The figures shown are perspective and exploded view of the solid target electroplating apparatus provided in this application, respectively. The solid target electroplating apparatus includes a main body 1, a pressure plate 2, an anode electrode 3, and a cathode target 4. An electroplating bath 11 extending along its height direction is provided inside the main body 1. The electroplating bath 11 can be formed as a cylinder or other suitable shape. It should be noted that the electroplating bath 11 extends downward from the top surface of the main body 1 but does not penetrate the main body 1. An electroplating station 12 is provided in the electroplating bath 11, specifically, it penetrates the main body 1 horizontally, thereby forming the electroplating station 12, wherein the horizontal direction is perpendicular to the height direction of the main body 1. The electroplating station 12 communicates with the electroplating bath 11 in its middle section, allowing the electroplating solution to flow into the electroplating station 12. Simultaneously, since the electroplating station 12 penetrates the main body 1 horizontally, a first opening 13 and a second opening 14 are formed on the outer surface of the main body 1. An anode electrode 3 is positioned at the first opening 13, while a cathode target 4 is positioned at the second opening 14, thus the anode electrode 3 and the cathode target 4 are positioned opposite each other at both ends of the electroplating station 12. On the side where the first opening 13 is located, a pressure plate 2 presses the anode electrode 3 tightly onto the first opening 13, thereby closing the first opening 13; similarly, on the side where the second opening 14 is located, the pressure plate 2 presses the cathode target 4 tightly onto the second opening 14, thereby closing the second opening 14.
[0033] To fix the pressure plate 2, the anode electrode 3, and the cathode target 4 to the main body 1, a plurality of screw holes are formed around the first opening 13 and the second opening 14 on the outer surface of the main body 1. In this embodiment, four screw holes are formed around the first opening 13 and the second opening 14 respectively. The pressure plate 2 is provided with through holes corresponding to the screw holes. In this embodiment, each pressure plate 2 is provided with four through holes. The pressure plate 2 is fixed to the main body 1 by means of bolts 21, and keeps the anode electrode 3 / cathode target 4 pressed against the first opening 13 / second opening 14.
[0034] Preferably, the solid target electroplating equipment can have more than one electroplating station 12, in particular, multiple electroplating stations 12 are arranged along the height direction on the electroplating bath 11. More preferably, the multiple electroplating stations 12 are arranged at equal intervals. The advantage of this configuration is that each electroplating station 12 can process one cathode target 4, which means that the electroplating process of multiple cathode target 4 can be completed simultaneously in a single electroplating process. It is conceivable that each electroplating station 12 can accommodate a combination of anode electrode 3 and cathode target 4, and the anode electrode 3 and cathode target 4 are fixed by their respective pressure plates 2. That is, in a single solid target electroplating equipment, the number of electroplating stations 12, the number of combinations of anode electrode 3 and cathode target 4, and the number of pairs of pressure plates 2 are consistent.
[0035] To further ensure that the anode electrode 3 / cathode target 4 is fixed at the first opening 13 / second opening 14, such as Figure 3 As shown, the peripheries of the first opening 13 and the second opening 14 are formed in a stepped shape. These stepped surfaces act as stops for the anode electrode 3 and the cathode target 4, respectively, to prevent the anode electrode 3 and the cathode target 4 from being pressed by the pressure plate 2 to near the middle section of the electroplating station 12, or even into the electroplating bath 11. Preferably, a sealing element 5, such as a gasket, can be provided between the stepped surface of the first opening 13 and the anode electrode 3, and between the stepped surface of the second opening 14 and the cathode target 4. With this configuration, when the electroplating bath 11 is filled with electroplating solution, the sealing element 5 seals the gaps between the stepped surfaces of the first opening 13 / second opening 14 and the anode electrode 3 / cathode target 4, ensuring that the solid target electroplating equipment is in a liquid-sealed state.
[0036] Back Figure 2 In this embodiment, the cathode target 4 and anode electrode 3 to be electroplated are disc-shaped, and the electroplating station 12 is also cylindrical, thereby forming an electric field that substantially covers the opposing end faces of the anode electrode 3 and cathode target 4. The disc-shaped target, used in the Cyclotron 30 cyclotron accelerator, can match the beam shape, meaning the beam covers it more uniformly. This configuration has the advantages of improving irradiation efficiency and reducing energy waste, fully utilizing the target material to reduce subsequent processing costs, and effectively reducing the amount of radioactive and chemical waste. Of course, depending on actual needs, the solid target electroplating equipment of this application can still be used to prepare target sheets of other shapes, such as strips, polygonal sheets, or any other shape, requiring control of the area ratio of the opposing end faces of the cathode target 4 to the anode electrode 3 within 1:1 to 1:2. Preferably, regardless of the shape of the cathode target 4 and anode electrode 3 to be electroplated, the maximum dimension of the cross-section of the electroplating station 12 (e.g., cross-sectional length, cross-sectional width, cross-sectional diameter, etc.) is always smaller than the diameter of the electroplating bath, so that the electroplating solution can flow into the electroplating station 12.
[0037] The material constituting the anode electrode 3 can be selected from one of the following: Pt, Ti, graphite, or other suitable materials. Graphite anodes have excellent high-temperature resistance, electrical and thermal conductivity, acid and alkali corrosion resistance, high stability, and are suitable for machining; Ti anodes have a stable crystal structure and are not easily dissolved during electrolysis, thus ensuring macroscopic dimensional stability; Pt anodes have low energy consumption and can operate in highly corrosive environments. Target manufacturers can select suitable materials to constitute the anode electrode 3 based on the target material to be prepared, the composition of the electroplating solution, and other practical conditions.
[0038] To ensure that the electroplating solution maintains a uniform concentration throughout the electroplating process, the solid target electroplating equipment may also include a mechanical stirrer (not shown in the figure), which is placed in the electroplating solution tank 11. The mechanical stirrer is electrically connected to an external power source; therefore, when the external power source is turned on to electroplat the cathode target 4, the mechanical stirrer is simultaneously activated, continuously stirring the electroplating solution to maintain its uniform concentration throughout.
[0039] Furthermore, the solid target electroplating equipment may also include a high-frequency pulse rectifier (not shown in the figure), which is electrically connected to the anode electrode 3 and the cathode target 4 respectively. The electrical energy supplied by the external power source is modulated by the high-frequency pulse rectifier before being supplied to the anode electrode 3 and the cathode target 4, thus ensuring the formation of a stable and strong electric field between the anode electrode 3 and the cathode target 4, thereby guaranteeing the quality of the prepared target.
[0040] Therefore, the operator can use the solid target electroplating equipment as described above to complete the electroplating process of the solid target, which includes the following steps:
[0041] Fix the anode electrode 3 to and seal the first opening 13, and fix the cathode target 4 to and seal the second opening 14;
[0042] The electroplating solution is poured into the electroplating solution tank 11, and a mechanical stirrer is placed in the electroplating solution tank 11.
[0043] Turn on the external power supply to power the mechanical stirrer, anode electrode 3 and cathode target 4 until a solid target is prepared.
[0044] In one embodiment, the solid target to be prepared is a Ga-Ni alloy target, and the corresponding first electroplating solution can be prepared according to the following steps:
[0045] Weigh gallium chloride (GaCl3) in a glove box, pour it into a hydrochloric acid solution with a concentration of 0.05 mol / L to 0.15 mol / L to dissolve it, and prepare a gallium chloride solution with a concentration of 0.5 mol / L to 2.5 mol / L.
[0046] Weigh out nickel chloride hexahydrate (NiCl2·6H2O) and pour it into the gallium chloride solution above to completely dissolve the nickel chloride hexahydrate, thereby obtaining the first electroplating solution, namely gallium chloride-nickel chloride solution. It should be noted that the ratio of gallium ions to nickel ions in the first electroplating solution should be in the range of 1:1 to 5:1.
[0047] In another embodiment, the solid target to be prepared is a Zn target, and the corresponding second electroplating solution is prepared according to the following steps:
[0048] Weigh out anhydrous zinc chloride (ZnCl2), pour in a certain amount of pure water to dissolve it, and obtain a zinc chloride solution;
[0049] Use a pipette / grading cylinder to transfer hydrochloric acid with a concentration of 0.1 mol / L to 11.7 mol / L until the zinc chloride solution is adjusted to a pH of 1 and a concentration of 20 g / L to 240 g / L, thereby preparing the second electroplating solution.
[0050] In addition, before fixing the cathode target 4 to and sealing the second opening 14, the following operations can be performed on the cathode target 4:
[0051] (For example, using scouring powder) clean the surface of the cathode target 4 until a uniform water film is formed on the surface of the cathode target 4.
[0052] In the preparation of the Ga-Ni alloy target, after placing the anode electrode 3, cathode target 4, and mechanical stirrer in their positions and pouring in sufficient first electroplating solution, an external power supply is activated to power the mechanical stirrer, anode electrode 3, and cathode target 4. The stirring speed of the mechanical stirrer can be set within the range of 100 rpm to 1000 rpm. Using a high-frequency pulse rectifier, the electrical energy supplied by the external power source is converted to direct current, with a current intensity of 10~50 mA / cm². 2 Within the specified range. Preferably, an external heating device can be used to maintain the temperature of the first electroplating solution within the range of 50°C to 90°C. Under the above conditions, electroplating the cathode target 4 for 1 to 24 hours can prepare the desired high-purity Ga-Ni alloy target.
[0053] In the Zn target preparation process, after placing the anode electrode 3, cathode target 4, and mechanical stirrer in their positions and pouring in sufficient second electroplating solution, an external power supply is activated to power the mechanical stirrer, anode electrode 3, and cathode target 4. The stirring speed of the mechanical stirrer can be set within the range of 100 rpm to 1000 rpm. Using a high-frequency pulse rectifier, the electrical energy supplied by the external power source is converted to direct current, with a current intensity of 8–24 mA / cm². 2 Within the specified range. Under the above conditions, electroplating the cathode target 4 for 0.5 to 12 hours can prepare the desired high-purity Zn target.
[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.
Claims
1. A solid target electroplating apparatus, characterized in that, include: The main body has an electroplating solution tank extending along its own height inside. Anode electrode and cathode target; and Several pressure plates; The electroplating bath is provided with an electroplating station, which is formed to penetrate the main body in a horizontal direction perpendicular to the height of the main body and to communicate with the electroplating bath. The electroplating station has a first opening and a second opening on the outer surface of the main body. The anode electrode is fixed to and seals the first opening by means of a corresponding pressure plate, and the cathode target is fixed to and seals the second opening by means of a corresponding pressure plate.
2. The solid target electroplating equipment according to claim 1, characterized in that, The number of electroplating stations is one or more, and the multiple electroplating stations are arranged along the height direction.
3. The solid target electroplating equipment according to claim 1, characterized in that, The area ratio of the opposite end faces of the cathode target to the anode electrode is in the range of 1:1 to 1:
2.
4. The solid target electroplating equipment according to claim 1, characterized in that, The peripheries of the first opening and the second opening are formed in a stepped shape, and the stepped surface formed therefrom serves as a stop portion of the anode electrode sheet or the cathode target sheet.
5. The solid target electroplating equipment according to claim 4, characterized in that, It also includes several sealing elements, which are respectively arranged between the first opening and the anode electrode plate, or between the second opening and the cathode target plate.
6. The solid target electroplating equipment according to claim 1, characterized in that, The anode electrode sheet may have the same or different shape as the cathode target sheet.
7. The solid target electroplating equipment according to claim 6, characterized in that, The anode electrode and the cathode target are formed in the shape of a disc, a strip, or a polygonal sheet.
8. The solid target electroplating equipment according to claim 1, characterized in that, The anode electrode sheet is one of the following materials: Pt, Ti, or graphite.
9. The solid target electroplating equipment according to claim 1, characterized in that, It also includes a mechanical stirrer, which is placed in the electroplating bath.
10. The solid target electroplating equipment according to claim 1, characterized in that, It also includes a high-frequency pulse rectifier, which is electrically connected to the anode electrode and the cathode target, respectively.