Detection mechanism
By setting infrared and visible light sources outside the inspection station and using a light path steering module to transmit the image to the camera module, the external and internal inspection of semiconductor chips can be completed in one station, solving the problem of inspection agencies occupying multiple stations and improving inspection efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NANTONG HUAXIN INTELLIGENT EQUIPMENT CO LTD
- Filing Date
- 2025-05-07
- Publication Date
- 2026-05-19
AI Technical Summary
Existing semiconductor chip testing facilities require two workstations, one for visible light detection and one for infrared light detection, resulting in a large number of workstations being occupied and low testing efficiency.
Infrared and visible light sources are set up outside the inspection station, and the infrared and visible light images are transmitted to the camera module through the optical path steering module, so that the external and internal inspections can be performed at one station at the same time.
This avoids testing agencies occupying multiple workstations and improves testing efficiency.
Smart Images
Figure CN224263096U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of testing technology, and in particular to a testing organization. Background Technology
[0002] Semiconductor chip inspection requires both external and internal inspection of the chip. External inspection of the chip requires visible light, while internal defect inspection requires infrared light.
[0003] Existing testing facilities require two stations: a visible light testing station for external chip inspection and an infrared light testing station for internal chip defect inspection. During operation, after the visible light testing station completes the external chip inspection, the chip is then transferred to the infrared light testing station for internal defect inspection. This dual-station design results in the testing facility occupying too many stations and also leads to low testing efficiency. Utility Model Content
[0004] The main purpose of this invention is to propose a testing mechanism that addresses the problem of existing testing mechanisms occupying too many workstations.
[0005] To achieve the above objectives, the detection mechanism proposed in this utility model is applied to semiconductor chip detection. The semiconductor chip is made of a material that can be penetrated by an infrared light source. The detection structure includes:
[0006] The testing station is used to place semiconductor chips.
[0007] An infrared light source and a visible light source are provided outside the detection station. The infrared light source can emit infrared light towards the detection station to illuminate the first peripheral side of the semiconductor chip placed at the detection station. The visible light source can emit visible light towards the detection station to illuminate the second peripheral side of the semiconductor chip placed at the detection station.
[0008] The light path steering module is located outside the detection station and is positioned opposite to the infrared light source relative to the detection station. The light path steering module can transmit the visible light imaging and infrared light imaging of the semiconductor chip to the camera module.
[0009] In one embodiment, the optical path steering module, the visible light source, and the infrared light source are configured as two sets;
[0010] The semiconductor chip has two first peripheral sides and two second peripheral sides, the two first peripheral sides intersect, and the two second peripheral sides intersect.
[0011] In one embodiment, the camera module is positioned above the optical path steering module.
[0012] In one embodiment, the optical path steering module includes a beam-splitting lens or a beam-splitting prism;
[0013] The visible light source is located on the side of the optical path steering module that is away from the detection station.
[0014] In one embodiment, the beam-splitting surfaces of the beam-splitting lens or beam-splitting prism are set at 45 degrees.
[0015] In one embodiment, the beam-splitting lens or beam-splitting prism uses a 50:50 ratio beam-splitting film.
[0016] In one embodiment, the optical path steering module includes a reflective prism or a reflective mirror;
[0017] The visible light source is located between the camera module and the optical path steering module.
[0018] In one embodiment, the reflective surface of the reflective prism or the reflective lens is set at a 45-degree angle.
[0019] In one embodiment, the visible light source is configured as an LED light source.
[0020] In one embodiment, the camera module includes dual sensors, one of which receives visible light imaging and the other receives infrared light imaging.
[0021] The technical solution of this utility model adopts a visible light source, an infrared light source, and a light path steering module set on the outside of the inspection station. The infrared light source can illuminate the first periphery of the semiconductor chip, and the visible light source can illuminate the second periphery of the semiconductor chip. Then, the infrared light imaging and visible light shaping are transmitted to the camera module through the light path steering module. In this way, the external and internal inspection of the semiconductor chip can be realized with a single inspection station, which can avoid the inspection mechanism occupying a lot of stations, and thus solve the technical problems existing in the prior art. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0023] Figure 1 A schematic diagram of the structure of an embodiment of the testing mechanism provided by this utility model;
[0024] Figure 2 for Figure 1 A structural diagram of a testing agency from another perspective;
[0025] Figure 3 A schematic diagram of another embodiment of the testing mechanism provided by this utility model;
[0026] Figure 4 A schematic diagram of another embodiment of the testing mechanism provided by this utility model;
[0027] Figure 5 A schematic diagram of another embodiment of the testing mechanism provided by this utility model.
[0028] Explanation of icon numbers:
[0029] 100. Inspection station;
[0030] 200. Infrared light source; 210. Infrared light;
[0031] 300. Visible light source; 310. Visible light;
[0032] 400. Optical path steering module; 410. Beam splitter prism; 420. Reflecting prism;
[0033] 500, Semiconductor chip; 510, First cycle side; 520, Second cycle side;
[0034] 600. Camera module.
[0035] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.
[0037] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.
[0038] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0039] Semiconductor chip inspection requires both external and internal inspection of the chip. External inspection of the chip requires visible light, while internal defect inspection requires infrared light.
[0040] Existing testing facilities require two workstations: one visible light detection workstation to inspect the exterior of the chip, and one infrared light detection workstation to detect internal defects in the chip. This dual-workstation design results in the testing facility occupying too many workstations.
[0041] This invention proposes a testing mechanism for semiconductor chip testing. The semiconductor chip is made of a material permeable by infrared light sources. It should be noted that materials permeable by infrared light sources include, but are not limited to, silicon and gallium arsenide. Furthermore, this application takes a semiconductor with four peripheral surfaces as an example. When testing a semiconductor chip, it is necessary to test all four peripheral surfaces of the rectangular chip.
[0042] Please see Figure 1 , Figure 2 , Figure 3 In one embodiment of the present invention, the testing mechanism includes a testing station 100, wherein the testing station 100 is used for placing the semiconductor chip 500. It should be noted that the semiconductor chip 500 can be placed at the testing station 100 by means of a robotic arm or a turret or other structure.
[0043] Furthermore, the testing mechanism also includes an infrared light source 200 and a visible light source 300 located outside the testing station 100. After the semiconductor chip 500 is placed in the testing station 100, the infrared light source 200 can emit infrared light 210 towards the testing station 100 to irradiate the first peripheral side 510 of the semiconductor chip 500 placed in the testing station 100. The visible light source 300 can emit visible light 310 towards the testing station 100 to irradiate the second peripheral side 520 of the semiconductor chip 500 placed in the testing station 100.
[0044] It should be noted that, in some embodiments, the first peripheral side 510 and the second peripheral side 520 of the semiconductor chip 500 may be parallel or intersecting. When the first peripheral side 510 and the second peripheral side 520 intersect, the included angle between them may be 90 degrees or other angles. Further, in some embodiments, reference... Figure 4 When the first peripheral side 510 and the second peripheral side 520 are parallel, both the visible light source 300 and the infrared light source 200 are configured as one. During detection, the semiconductor chip 500 needs to rotate four times. At this time, the visible light source 300 can illuminate the four peripheral sides of the rectangular semiconductor chip 500. When the first peripheral side 510 and the second peripheral side 520 intersect, both the visible light source 300 and the infrared light source 200 are configured as one or two. When two are configured, refer to... Figure 1 When the semiconductor chip 500 is being tested, it needs to be rotated twice. During the first rotation, two visible light sources 300 can illuminate the two peripheral sides of the rectangular structure chip. After the semiconductor chip 500 has rotated twice, the two visible light sources 300 can illuminate all four peripheral sides of the semiconductor chip 500.
[0045] Furthermore, in some embodiments, the infrared light source 200 can directly illuminate the first peripheral side 510 of the semiconductor chip 500 placed at the inspection station 100. Alternatively, it can indirectly illuminate the first peripheral side 510 of the semiconductor chip 500 placed at the inspection station 100 through a structure such as a reflector. Specifically, the infrared light source 200 emits infrared light 210 towards the structure such as a reflector, and the infrared light 210 is reflected and redirected by the structure, so that the infrared light 210 illuminates the first peripheral side 510 of the semiconductor chip 500. Similarly, the visible light source 300 can directly illuminate the second peripheral side 520 of the semiconductor chip 500 placed at the inspection station 100, or it can indirectly illuminate the second peripheral side 520 of the semiconductor chip 500 placed at the inspection station 100 through a structure such as a reflector. The user can choose the placement positions of the visible light source 300 and the infrared light source 200 according to the size of the inspection station 100, whether direct or indirect illumination is used.
[0046] It should be further explained that the purpose of using infrared light source 200 in this embodiment is because the emitted infrared light 210 can penetrate semiconductor chip 500. Of course, in some embodiments, other light sources can also be used to emit light that can penetrate semiconductor chip 500, such as X-ray source.
[0047] Furthermore, the detection mechanism also includes a light path steering module 400 and a camera module 600. The light path steering module is located outside the detection station 100 and is positioned opposite to the infrared light source 200 relative to the detection station 100. The light path steering module 400 can transmit the visible light image and infrared light image of the semiconductor chip 500 to the camera module 600. It should be noted that, since the infrared light source 200 and the light path steering module 400 are positioned opposite to the detection station 100, the infrared light 210 emitted by the infrared light source 200 can act on the light path steering module 400 after penetrating the semiconductor chip 500 placed in the detection station 100, and then the light path steering module 400 can transmit the infrared light image to the camera module 600. For the visible light source 300, the visible light 310 emitted by the visible light source 300 acts on the second peripheral side 520 of the semiconductor chip 500, and then acts on the light path steering module 400 from the second peripheral side 520, and then is transmitted to the camera module 600 from the light path steering module 400. The visible light 310 can be reflected once by the light path steering module 400 before acting on the second peripheral side 520 of the semiconductor chip 500. Alternatively, it can pass through the light path steering module 400 before acting on the second peripheral side 520 of the semiconductor chip 500.
[0048] It should be noted that this embodiment employs a visible light source 300, an infrared light source 200, and a light path steering module 400 arranged outside the detection station 100. The infrared light source 200 can illuminate the first peripheral side 510 of the semiconductor chip 500, and the visible light source 300 can illuminate the second peripheral side 520 of the semiconductor chip 500. Then, the infrared light imaging and visible light 310 shaping are transmitted to the camera module 600 through the light path steering module 400. In this way, the external and internal detection of the semiconductor chip 500 can be realized with a single detection station 100, which can avoid the detection mechanism occupying too many stations and thus solve the technical problems existing in the prior art.
[0049] In one embodiment, reference Figure 1The optical path steering module 400, the visible light source 300, and the infrared light source 200 are configured in two groups. The semiconductor chip 500 has two first peripheral sides 510 and two second peripheral sides 520. The two first peripheral sides 510 intersect, and the two second peripheral sides 520 intersect. It should be noted that at this time, one optical path steering module 400, visible light source 300, and infrared light source 200 are configured as one group, and the other optical path steering module 400, visible light source 300, and infrared light source 200 are configured as another group. In use, the two infrared light sources 200 can illuminate the two first peripheral sides 510 of the semiconductor chip 500, and the two visible light sources 300 can cover the two second peripheral sides 520 of the semiconductor chip 500. Further, this embodiment is described using a semiconductor chip 500 with four peripheral sides. The two first peripheral sides 510 and the two second peripheral sides 520 can form the four peripheral sides of the semiconductor chip 500. However, this design is not limited to this. In some embodiments, when the semiconductor chip 500 has six peripheral surfaces, the optical path steering module 400, the visible light source 300, and the infrared light source 200 are configured as three groups.
[0050] In one embodiment, reference Figure 3 The camera module 600 is located above the optical path steering module 400. When the detection mechanism is used on the detection equipment, the camera module 600 is located above the optical path steering module 400, which can provide certain convenience for installation. However, this design is not limited to this. In some embodiments, the camera module 600 is located below the optical path steering module 400.
[0051] In one embodiment, reference Figure 2 The optical path steering module 400 includes a beam splitter. The visible light source 300 is located on the side of the optical path steering module 400 away from the detection station 100. When a beam splitter is used, the infrared light source 200 and the beam splitter are respectively located on opposite sides of the detection station 100. The infrared light 210 emitted by the infrared light source 200 penetrates the semiconductor chip 500 placed in the detection station 100 and then acts on the beam splitter. The beam splitter then reflects the infrared image (internal image information of the semiconductor chip 500) to the camera module 600. The visible light source 300 is located on the side of the beam splitter away from the detection station 100. In this case, part of the visible light 310 emitted by the visible light source 300 can penetrate the beam splitter and act on the second peripheral side 520 of the semiconductor chip 500. The beam splitter can then reflect the visible light image (image information of the second peripheral side 520) to the camera module 600. However, this design is not limited to this. In some embodiments, the user can use a beam splitter prism 410.
[0052] In one embodiment, reference Figure 2The beam-splitting surface of the beam-splitting lens or beam-splitting prism 410 is set at 45 degrees. Furthermore, the 45-degree beam-splitting surface can reflect the incident light at a 90-degree right angle, while the transmitted light maintains its original direction or is deflected at a small angle, thus ensuring imaging quality.
[0053] In one embodiment, the beam-splitting lens or beam-splitting prism 410 uses a 50:50 ratio beam-splitting film. Using a 50:50 ratio beam-splitting film can achieve equal beam splitting and ensure imaging quality.
[0054] In one embodiment, reference Figure 3 The optical path steering module 400 includes a reflecting prism 420. The visible light source 300 is disposed between the camera module 600 and the optical path steering module 400. In this embodiment, the visible light source 300 can be configured as a coaxial light source, a point light source, or a ring light source. Further, in this embodiment, the visible light 310 emitted by the visible light source 300 is reflected by the reflecting prism to the second peripheral side 520 of the semiconductor chip 500. The infrared light 210 emitted by the infrared light source 200 illuminates the semiconductor chip 500 and is then reflected by the reflecting prism 420 to the camera module 600. However, this design is not limited to this; in some embodiments, the user can also use a reflecting lens.
[0055] Furthermore, in some embodiments, when the first periphery 510 and the second periphery 520 intersect, and both the visible light source 300 and the infrared light source 200 are configured as one, the reference... Figure 5 In this configuration, two optical path steering modules 400 are used, one corresponding to the infrared light source 200 and the other corresponding to the visible light source 300. The optical path steering module 400 corresponding to the visible light source 300 includes a beam-splitting prism or beam-splitting mirror, while the optical path steering module 400 corresponding to the infrared light source 200 includes a beam-splitting prism, beam-splitting mirror, or reflecting prism or reflecting mirror. In some embodiments, refer to... Figure 4 When the first peripheral side 510 and the second peripheral side 520 are parallel, the optical path steering module 400 includes a beam splitter prism or a beam splitter lens.
[0056] In one embodiment, reference Figure 2 The reflective surface of the reflective prism 420 or the reflective lens is set at 45 degrees. The 45-degree reflective surface can cause the incident light to be reflected at a 90-degree right angle, realizing efficient folding of the optical path and ensuring imaging quality.
[0057] In one embodiment, the visible light source 300 is configured as an LED light source. Using an LED light source as the visible light source 300 can reduce the cost of the visible light source 300 and increase its service life compared to fluorescent lamps and incandescent lamps.
[0058] In one embodiment, the camera module 600 includes dual sensors, one of which receives visible light imaging and the other receives infrared light imaging. Thus, the camera module 600 is capable of receiving both visible light and infrared light imaging. Furthermore, in some embodiments, after receiving both visible light and infrared light imaging, the camera module 600 feeds them back to other devices.
[0059] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.
Claims
1. A testing institution, characterized in that, Applied to semiconductor chip inspection, wherein the semiconductor chip is made of a material permeable by infrared light, the inspection mechanism includes: The testing station is used to place semiconductor chips. An infrared light source and a visible light source are provided outside the detection station. The infrared light source can emit infrared light towards the detection station to illuminate the first peripheral side of the semiconductor chip placed at the detection station. The visible light source can emit visible light towards the detection station to illuminate the second peripheral side of the semiconductor chip placed at the detection station. The light path steering module is located outside the detection station and is positioned opposite to the infrared light source relative to the detection station. The light path steering module can transmit the visible light imaging and infrared light imaging of the semiconductor chip to the camera module.
2. The testing mechanism as described in claim 1, characterized in that, The optical path steering module, the visible light source, and the infrared light source are configured in two groups; The semiconductor chip has two first peripheral sides and two second peripheral sides, the two first peripheral sides intersect, and the two second peripheral sides intersect.
3. The testing mechanism as described in claim 1, characterized in that, The camera module is located above the optical path steering module.
4. The testing mechanism as described in claim 1, characterized in that, The optical path steering module includes a beam-splitting lens or a beam-splitting prism; The visible light source is located on the side of the optical path steering module that is away from the detection station.
5. The testing mechanism as described in claim 4, characterized in that, The beam-splitting surfaces of the beam-splitting lens or beam-splitting prism are set at 45 degrees.
6. The testing mechanism as described in claim 5, characterized in that, The beam splitter or beam splitter prism uses a 50:50 ratio beam splitting film.
7. The testing mechanism as described in claim 1, characterized in that, The optical path steering module includes a reflective prism or a reflective mirror; The visible light source is located between the camera module and the optical path steering module.
8. The testing mechanism as described in claim 7, characterized in that, The reflective surface of the reflective prism or the reflective lens is set at a 45-degree angle.
9. The testing mechanism as described in claim 1, characterized in that, The visible light source is configured as an LED light source.
10. The testing mechanism as described in claim 1, characterized in that, The camera module includes dual sensors, one of which receives visible light imaging and the other receives infrared light imaging.