Chip test seat capable of simultaneously absorbing and testing
By using a chip test socket that allows for simultaneous adsorption and testing, the chip can be adsorbed and tested simultaneously during the testing process. This solves the problems of low efficiency and inaccurate positioning in existing technologies, and improves the accuracy and efficiency of testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 中探探针(福建)有限公司
- Filing Date
- 2025-04-17
- Publication Date
- 2026-05-19
AI Technical Summary
In the current chip testing process, the sampling and testing are carried out in separate steps, which leads to low testing efficiency and inaccurate positioning, potentially affecting the accuracy of the test results.
A chip test holder for simultaneous adsorption and testing was designed. By combining a floating plate and test probes, the chip can be adsorbed and tested simultaneously. A negative pressure generating device is used to adsorb the chip onto the sealing ring, and the movement of the floating plate causes the probe to contact the chip for testing.
It enables simultaneous chip sampling and testing, ensuring single-step positioning, improving testing accuracy and efficiency, avoiding errors caused by multiple positioning steps, and reducing testing costs.
Smart Images
Figure CN224263243U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip testing, and in particular to a chip testing socket for simultaneous absorption and testing. Background Technology
[0002] To ensure chip quality, chips are typically tested before leaving the factory to distinguish between qualified and defective products. This requires the use of a chip test socket. The chip test socket contains test probes and is placed between the chip and the circuit board. The test probes connect the chip and the circuit board, and the chip's qualification is determined by transmitting a certain current and frequency. In existing technology, after the chip is picked up by a chuck, its performance is tested by pressing down with the chip test socket. Because chip picking and testing are performed in steps, the testing process is complex, requiring multiple positioning steps, resulting in low testing efficiency. Inaccurate positioning can lead to inaccurate test results. Additionally, air leakage from the chuck can prevent it from holding the chip, also affecting the accuracy of the test results.
[0003] Therefore, there is an urgent need for a chip test socket that can simultaneously absorb and test chips to overcome the above-mentioned defects. Utility Model Content
[0004] The purpose of this invention is to provide a chip test socket that allows for simultaneous absorption and testing.
[0005] To achieve the above objectives, the chip test holder of this utility model includes a needle holder, a test probe, a floating plate, a cover plate, and a first sealing ring. The test probe is installed in the needle holder, and the floating plate is installed in the needle holder in a way that allows it to move up and down. A suction through hole runs through the center of the needle holder and the floating plate. A needle receiving part protrudes upward from the top of the floating plate, and the needle tip of the test probe passes through the needle receiving part. The cover plate is installed on the top of the needle holder and surrounds the needle receiving part, forming a placement opening for the chip to be placed in. The first sealing ring is fitted into the needle receiving part and extends upward beyond the needle receiving part. The suction through hole is connected to a negative pressure generating device, which causes the chip to be adsorbed by the first sealing ring. After the floating plate is pushed downward, the needle tip of the test probe is exposed and comes into contact with the chip that is being held in place.
[0006] Preferably, the needle holder includes an upper needle plate and a lower needle plate, with the lower needle plate fixed to the upper needle plate, and the needle tail end of the test probe fixed to the upper needle plate and the lower needle plate.
[0007] Preferably, the bottom of the upper needle plate is provided with a fixing groove, and the lower needle plate is installed in the fixing groove.
[0008] Preferably, a spring is provided between the floating plate and the needle holder, and the floating plate is mounted on the needle holder in a way that allows it to move up and down with the help of the spring.
[0009] Preferably, the top of the upper needle plate is provided with a movable groove, the floating plate is provided in the movable groove, the upper needle plate is provided with a receiving through hole, and a spring is installed in the receiving through hole and provided between the lower needle plate and the floating plate.
[0010] Preferably, the bottom of the floating plate is provided with a receiving groove, which is positioned opposite to the receiving through hole, and the spring is inserted into the receiving groove.
[0011] Preferably, the top of the floating plate also protrudes upward by at least one pressing protrusion, which is located on the outer side of the needle receiving portion.
[0012] Preferably, the cover plate forms a positioning protrusion on each of the four sides of the placement opening.
[0013] Preferably, the chip test holder for simultaneous absorption and testing of this utility model further includes a second sealing ring disposed between the cover plate and the floating plate, and the top of the floating plate is also provided with a mounting groove surrounding multiple pressing protrusions, and the second sealing ring is installed in the mounting groove.
[0014] Preferably, the chip test socket for simultaneous absorption and testing of this utility model further includes a circuit board and a third sealing ring. The circuit board is fixed to the bottom of the upper needle plate and is connected to the test probe. The bottom of the upper needle plate is provided with an assembly groove surrounding the fixing groove. The third sealing ring is installed in the assembly groove and is located between the upper needle plate and the circuit board.
[0015] Compared with existing technologies, the chip test socket of this invention, which allows for simultaneous suction and testing, includes a pin holder, a test probe, a floating plate, a cover plate, and a first sealing ring. The test probe is mounted on the pin holder. The floating plate is mounted on the pin holder in a vertically movable manner. A suction through-hole extends through the center of the pin holder and the floating plate. A needle-receiving portion protrudes upward from the top of the floating plate, and the tip of the test probe passes through the needle-receiving portion. The cover plate is mounted on the top of the pin holder and surrounds the needle-receiving portion, forming a placement opening for chip insertion. The first sealing ring is fitted onto the needle-receiving portion and extends upward beyond it. The suction through-hole connects to a negative pressure generating device, causing the chip to adhere to the first sealing ring. The floating plate is pushed downwards, exposing the tip of the test probe and bringing it into contact with the adhered chip, thus connecting the chip to the circuit board for testing. This novel chip test holder, capable of simultaneously suctioning and testing the chip, achieves simultaneous suction and testing. Furthermore, it uses a single positioning process throughout, avoiding multiple repositioning steps and ensuring accurate test results and high efficiency. Attached Figure Description
[0016] Figure 1 This is a perspective view of the chip test socket of this utility model when the chip is not inserted into the placement port.
[0017] Figure 2 This is a three-dimensional view of the chip tester of this utility model, which uses simultaneous absorption and testing, when the chip is inserted into the placement port.
[0018] Figure 3 This is an exploded perspective view of the chip test socket for simultaneous absorption and testing according to this utility model.
[0019] Figure 4 This is a three-dimensional view of the chip test socket of this utility model after the circuit board is hidden and separated from the lower needle plate and the third sealing ring.
[0020] Figure 5 This is a three-dimensional view of the chip test socket of this utility model, after the circuit board and the third sealing ring are hidden and separated from the floating plate.
[0021] Figure 6 This is a top view of the chip test version of this utility model, which is designed for simultaneous absorption and testing.
[0022] Figure 7 This utility model relates to a chip test board with simultaneous absorption and testing. Figure 6 A cross-sectional view after cutting along line segment AA.
[0023] Figure 8 yes Figure 7 The diagram shows a cross-sectional view of the chip test board with simultaneous absorption and testing after the floating plate is pressed down. Detailed Implementation
[0024] To explain the technical content and structural features of this utility model in detail, the following description is provided in conjunction with the embodiments and accompanying drawings.
[0025] like Figures 1 to 8 As shown, this utility model provides a chip test socket 100 for simultaneous absorption and testing. The chip test socket 100, also known as a socket, is used to test chips to sort out qualified and defective products.
[0026] The chip test holder 100 of this utility model can simultaneously attract and test the chip, thereby achieving the function of simultaneous attraction and testing. Moreover, the entire process is positioned in one step, avoiding multiple repeated positioning and the problem of inaccurate test results caused by inaccurate positioning. This ensures the accuracy and efficiency of test results and also helps to reduce chip testing costs.
[0027] The chip test socket 100 of this utility model, which allows for simultaneous absorption and testing, includes a needle holder 10, a test probe 20, a floating plate 30, a cover plate 40, and a first sealing ring 50. The test probe 20 is mounted on the needle holder 10. The floating plate 30 is mounted on the needle holder 10 in a vertically movable manner. A suction through-hole 60 passes through the center of the needle holder 10 and the floating plate 30. A needle receiving portion 31 protrudes upward from the top of the floating plate 30, and the needle tip of the test probe 20 passes through the needle receiving portion 31. The cover plate 40 is mounted on the top of the needle holder 10 and surrounds the needle receiving portion 31, forming a placement opening 41 for chip insertion. The first sealing ring 50 is fitted onto the needle receiving portion 31 and extends upward beyond it. The suction through-hole 60 is connected to a negative pressure generating device (not shown) so that the chip is adsorbed by the first sealing ring 50. The floating plate 30 is pushed downward so that the tip of the test probe 20 is exposed and comes into contact with the chip that is being held in place, thereby achieving the connection between the chip and the circuit board, and the chip can be tested.
[0028] In this invention, after the chip 01 is placed into the placement port 41, the suction through hole 60 is connected to the negative pressure generating device, causing the chip 01 to be adsorbed onto the first sealing ring 50, thus positioning the chip 01 and achieving the suction of the chip 01. The state at this time is as follows: Figure 7 As shown. After the floating plate 30 is pushed downwards, it moves downwards, exposing the tip of the test probe 20 and bringing it into contact with the attracted chip 01. The state at this time is as follows. Figure 8 As shown, chip 01 can then be tested.
[0029] like Figure 1 , Figure 3 and Figure 4 As shown, preferably, the needle receiving portion 31 is generally square in shape, and correspondingly, the first sealing ring 50 is generally square in shape. However, the needle receiving portion 31 can be set to other shapes as needed, such as circular or trapezoidal structures.
[0030] It is worth noting that the tip of the test probe 20 contacts the chip through solder balls on the chip, thereby achieving an electrical connection between the test probe 20 and the chip.
[0031] like Figures 1 to 8 As shown, the needle holder 10 includes an upper needle plate 11 and a lower needle plate 12. The lower needle plate 12 is fixed to the upper needle plate 11, and the needle tail end of the test probe 20 is fixed to the upper needle plate 11 and the lower needle plate 12. The bottom of the upper needle plate 11 is provided with a fixing groove 111, and the lower needle plate 12 is installed in the fixing groove 111. Mounting feet extend outward from the four corners of the upper needle plate 11, which facilitates fixing to the circuit board 90 and also helps to reduce the weight of the upper needle plate 11.
[0032] like Figure 3 , Figure 4 and Figure 5 As shown, a spring 70 is provided between the floating plate 30 and the needle holder 10, allowing the floating plate 30 to be mounted on the needle holder 10 in a vertically movable manner. The spring 70 enables the floating plate 30 to move vertically. A movable groove 112 is provided at the top of the upper needle holder 11, and the floating plate 30 is disposed in the movable groove 112. The upper needle holder 11 also has a receiving through hole 113, in which the spring 70 is installed and positioned between the lower needle holder 12 and the floating plate 30. The receiving through hole 113 enhances the stability of the spring 70's installation. Furthermore, a receiving groove 32 is provided at the bottom of the floating plate 30, directly opposite the receiving through hole 113, and the spring 70 also passes through the receiving groove 32. The insertion of the spring 70 into the receiving groove 32 further enhances the stability of the spring 70's installation and effectively, reliably, and stably presses against the floating plate 30.
[0033] like Figure 1 , Figure 2 and Figure 3 As shown, to facilitate pushing the floating plate 30, at least one pressing protrusion 33 protrudes upward from the top of the floating plate 30. The pressing protrusion 33 is located on the outer periphery of the needle receiving portion 31. During testing, the structure on the testing machine pushes the pressing protrusion 33, causing the floating plate 30 to move downward, thereby exposing the needle tip of the test probe 20. It is worth noting that when the pressing protrusion 33 is not pushed, the needle tip of the test probe 20 is located inside the needle receiving portion 31 and is not exposed; after the needle tip of the test probe 20 is exposed, it is located outside the needle receiving portion 31. Preferably, four pressing protrusions 33 are provided on the top of the floating plate 30, and the four pressing protrusions 33 are located on the outer periphery of the corners of the needle receiving portion 31.
[0034] like Figure 1 , Figure 2 , Figure 3 , Figure 6 , Figure 7 and Figure 8 As shown, the cover plate 40 forms a positioning protrusion 42 on each of the four sides of the placement opening 41. Each positioning protrusion 42 limits the chip and prevents the chip from shifting. Preferably, the positioning protrusions 42 are chamfered to facilitate chip placement.
[0035] like Figures 3 to 8 As shown, the chip test socket 100 of this utility model, which allows for simultaneous absorption and testing, also includes a second sealing ring 80 disposed between the cover plate 40 and the floating plate 30. The top of the floating plate 30 is also provided with a mounting groove 34 surrounding a plurality of pressing protrusions 33, and the second sealing ring 80 is installed in the mounting groove 34. The second sealing ring 80 provides a seal between the cover plate 40 and the floating plate 30.
[0036] like Figure 3 , Figure 5 , Figure 7 and Figure 8 As shown, the chip test socket 100 of this utility model, which allows for simultaneous absorption and testing, also includes a circuit board 90 and a third sealing ring 91. The circuit board 90 is fixed to the bottom of the upper mounting plate 11 and is electrically connected to the test probe 20. The bottom of the upper mounting plate 11 has an assembly groove 114 surrounding the fixing groove 111, and the third sealing ring 91 is installed in the assembly groove 114 and positioned between the upper mounting plate 11 and the circuit board 90. When the tip of the test probe 20 contacts the chip, the circuit board 90 is electrically connected to the chip 01, and the chip 01 is judged to be qualified by transmitting a certain current and frequency. The third sealing ring 91 ensures good airtightness between the upper mounting plate 11 and the circuit board 90.
[0037] Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 7 and Figure 8 In the diagram, the direction indicated by arrow Z is from top to bottom.
[0038] The above-disclosed examples are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the claims of the present utility model shall fall within the scope of the present utility model.
Claims
1. A chip test socket for simultaneous absorption and testing, characterized in that: The device includes a needle holder, a test probe, a floating plate, a cover plate, and a first sealing ring. The test probe is mounted on the needle holder, and the floating plate is mounted on the needle holder in a way that allows it to move up and down. A suction through-hole runs through the center of the needle holder and the floating plate. A needle receiving portion protrudes upward from the top of the floating plate, and the needle tip of the test probe passes through the needle receiving portion. The cover plate is mounted on the top of the needle holder and surrounds the needle receiving portion, forming a placement opening for inserting a chip. The first sealing ring is fitted onto the needle receiving portion and extends upward beyond it. The suction through-hole is connected to a negative pressure generating device, causing the chip to be adsorbed onto the first sealing ring. When the floating plate is pushed downward, the needle tip of the test probe is exposed and comes into contact with the adsorbed chip.
2. The chip test socket for simultaneous absorption and testing according to claim 1, characterized in that, The needle holder includes an upper needle plate and a lower needle plate, the lower needle plate being fixed to the upper needle plate, and the needle tail end of the test probe being fixed to the upper needle plate and the lower needle plate.
3. The chip test socket for simultaneous absorption and testing according to claim 2, characterized in that, The bottom of the upper needle plate is provided with a fixing groove, and the lower needle plate is installed in the fixing groove.
4. The chip test socket for simultaneous absorption and testing according to claim 1, characterized in that, A spring is provided between the floating plate and the needle holder, and the floating plate is mounted on the needle holder in a way that allows it to move up and down with the help of the spring.
5. The chip test socket for simultaneous absorption and testing according to claim 2, characterized in that, The top of the upper needle plate has a movable groove, the floating plate is disposed in the movable groove, the upper needle plate has a receiving through hole, and a spring is installed in the receiving through hole and disposed between the lower needle plate and the floating plate.
6. The chip test socket for simultaneous absorption and testing according to claim 5, characterized in that, The bottom of the floating plate is provided with a receiving groove, which is directly opposite to the receiving through hole, and the spring is also inserted into the receiving groove.
7. The chip test socket for simultaneous absorption and testing according to claim 1, characterized in that, The top of the floating plate also protrudes upward by at least one pressing protrusion, which is located on the outer side of the needle receiving portion.
8. The chip test socket for simultaneous absorption and testing according to claim 1, characterized in that, The cover plate forms a positioning protrusion on each of the four sides of the placement opening.
9. The chip test socket for simultaneous absorption and testing according to claim 7, characterized in that, It also includes a second sealing ring disposed between the cover plate and the floating plate, and the top of the floating plate is provided with an installation groove surrounding the plurality of pressing protrusions, and the second sealing ring is installed in the installation groove.
10. The chip test socket for simultaneous absorption and testing according to claim 3, characterized in that, It also includes a circuit board and a third sealing ring. The circuit board is fixed to the bottom of the upper needle plate and is connected to the test probe. The bottom of the upper needle plate has an assembly groove surrounding the fixing groove. The third sealing ring is installed in the assembly groove and is located between the upper needle plate and the circuit board.