Three-dimensional adjusting bracket for superconducting quantum interference device

Abstract

The utility model discloses a three-dimensional adjusting bracket for a superconducting quantum interference device, which is used for adjusting the superconducting quantum interference device and is characterized in that a support frame is arranged on two sides of a quantum chip packaging box; the first adjusting piece can move in the XY horizontal direction relative to the upper end of the supporting frame, and the supporting frame and the first adjusting piece are fixed through the penetrating groove. The second adjusting piece is nested in the first adjusting piece, and the nesting face of the second adjusting piece is a vertical face. The second adjusting piece can move up and down in the Z direction relative to the first adjusting piece, and the second adjusting piece and the first adjusting piece are fixed through the penetrating groove and the threaded hole. The sleeve is rotatably arranged at the bottom of the second adjusting piece. According to the utility model, centimeter-level XYZ three-axis displacement adjustment and omni-directional rotation around the Z axis are realized, and the XYZ-axis positioning precision reaches a hundred-micron level by matching the precise adjusting screw with scale marks and a gradienter tool.

Description

Technical Field

[0001] This utility model relates to the field of superconducting quantum technology, specifically to a three-dimensional adjustment frame for a superconducting quantum interference device. Background Technology

[0002] Superconducting quantum interference devices (SQUIDs) are among the most sensitive devices for detecting extremely weak magnetic fields. Based on the Josephson effect and superconducting coherence, they can capture extremely minute changes in the magnetic field on the surface of a chip. In the field of quantum computing, SQUIDs can be used to detect signals on the surface of superconducting quantum chips. Detecting the magnetic field on the chip surface using SQUIDs helps analyze the current signals and bit crosstalk within the quantum chip, thereby enabling non-destructive diagnostics and aiding in the improvement of quantum chip design and manufacturing. Superconducting quantum chips typically operate at an extremely low temperature of 10 mK, at which point SQUIDs perform optimally and can detect extremely weak magnetic fields on the order of fT. Since the spacing between circuits on the quantum chip surface is only on the order of hundreds of micrometers, precisely adjusting the position of the SQUID is crucial, thus requiring a precision adjustment mechanism to achieve this goal.

[0003] Existing adjustment frame technologies mainly include piezoelectric and mechanical types. Piezoelectric adjustment frames deform piezoelectric materials by applying a voltage signal, offering high precision, small size, and stable operation in extreme environments. However, their displacement range is limited, and achieving three-dimensional displacement requires multiple devices, increasing costs and making it difficult to meet the application requirements of SQUID in quantum chip detection. Mechanical adjustment frames are not optimized for quantum measurement environments, exhibiting problems such as poor stability, poor thermal conductivity, and magnetic interference. Therefore, there is an urgent need for an adjustment frame suitable for extremely low-temperature environments to better meet the detection requirements of SQUID. Utility Model Content

[0004] The purpose of this invention is to provide a three-dimensional adjustment frame for a superconducting quantum interference device in order to solve the above problems.

[0005] To achieve the above objectives, this utility model specifically adopts the following technical solution:

[0006] Design a three-dimensional adjustment frame for a superconducting quantum interference device (SQI), used for adjusting the SQI, including:

[0007] A support frame is disposed on both sides of the quantum chip packaging box;

[0008] The first adjusting member has a flat lower surface with a first through slot, and the upper surface of the support frame has a flat upper surface with a second through slot. The first through slot and the second through slot are perpendicularly arranged to each other. The first adjusting member can move horizontally in the XY direction relative to the upper end of the support frame, and the support frame and the first adjusting member are fixed through the through slot.

[0009] A second adjusting member is nested within a first adjusting member. The nesting surface of the second adjusting member is vertical and has a third through slot. The direction of the third through slot is perpendicular to the directions of the first and second through slots. The nested surface of the first adjusting member is vertical and has a connecting hole. The second adjusting member can move up and down in the Z direction relative to the first adjusting member, and the second adjusting member and the first adjusting member are fixed together by the through slot and the connecting hole.

[0010] A sleeve, which is rotatably disposed at the bottom of the second adjusting member.

[0011] As a further description of the above technical solution, the first through groove is parallel to the short side direction of the first adjusting member, and the second through groove is perpendicular to the first through groove; or

[0012] The first through groove is parallel to the long side of the first adjusting member, and the second through groove is perpendicular to the first through groove.

[0013] As a further description of the above technical solution, at least one first through groove is provided at each of the two ends of the first adjusting member. The shape of the first through groove is straight, arc-shaped or other curved. The extension direction of the first through groove is along the short side direction, the long side direction or the direction forming a certain angle with the short side or the long side of the first adjusting member.

[0014] As a further description of the above technical solution, the support frame is provided with at least one second through groove. The shape of the second through groove is straight, arc-shaped, or other curved. The extension direction of the second through groove forms an angle of 40° to 90° with the extension direction of the first through groove, so that the first through groove and the second through groove form a through-hole during the relative displacement of the first adjusting member and the support frame.

[0015] As a further description of the above technical solution, the second adjusting member includes a base plate, a longitudinal plate is connected to one side of the base plate, the longitudinal plate has a plurality of the third through slots, and the longitudinal plate is fixedly connected to the side of the first adjusting member by a fixing member.

[0016] As a further description of the above technical solution, the base plate has a plurality of rotating grooves distributed along the circumference, and the upper surface of the sleeve has connecting holes distributed along the circumference. The fixing member passes through the rotating grooves and connects with the connecting holes.

[0017] As a further description of the above technical solution, the edge of the first adjusting member is provided with a protrusion, the protrusion is provided with a pressing member, and the pressing member abuts against the edge of the longitudinal plate.

[0018] As a further description of the above technical solution, the superconducting quantum interference device is fixed to the bottom of the sleeve by a connector, and in the initial state, the superconducting quantum interference device is located directly above the quantum chip in the quantum chip packaging box.

[0019] As a further description of the above technical solution, the connector includes a connecting block disposed at the bottom of the sleeve, the connecting block being connected to the bottom of the sleeve by screws, and the superconducting quantum interference device being fixed to the connecting block by screws.

[0020] As a further description of the above technical solution, the support frame, the first adjusting member, the second adjusting member, the sleeve, the quantum chip packaging box, the fixing member, and the connecting member are all made of oxygen-free copper.

[0021] The beneficial effects of this utility model are as follows:

[0022] 1. The three-dimensional adjustment frame provided by this utility model adopts a structural design combining screws and slides, which can realize centimeter-level XYZ three-axis displacement adjustment and omnidirectional rotation adjustment around the Z-axis. Through the compensation positioning method and the vision-assisted alignment method, a positioning accuracy of hundreds of micrometers in the XY direction can be achieved; at the same time, the adjustment screws are cleverly used to finely adjust the Z-direction position, and with the help of scale markings and a level, the adjustment frame can also achieve a positioning accuracy of hundreds of micrometers in the Z-direction.

[0023] 2. This invention provides a three-dimensional adjustment frame that ensures stability, efficient heat transfer, and low signal interference through the synergistic effect of materials and structure, making it suitable for room temperature and extremely low temperature quantum measurement environments. The manufacturing material is oxygen-free copper, which has a low coefficient of thermal expansion, high thermal conductivity, and low relative magnetic permeability. This results in minimal deformation during temperature changes, enabling efficient conduction of cold energy to the SQUID's operating temperature and reducing magnetic interference to the SQUID.

[0024] After cooling, all components of the adjustment frame shrink proportionally, and the screws fixation reduces relative positional errors between components. The symmetrical design (symmetrical in the X and Y directions, with the quantum chip and SQUID at the center and screws distributed on the symmetrical sides) further cancels out errors in the central area after cooling, improving positioning accuracy. The large contact area between components and the screw compression stress further enhance heat transfer efficiency. The system uses only five parts to achieve its function, resulting in a simple structure and further reducing interference with the SQUID signal.

[0025] To more clearly illustrate the structural features and functions of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0026] Figure 1 This is a perspective view of the three-dimensional adjustment frame provided by this utility model.

[0027] Figure 2 This is a front view of the three-dimensional adjustment frame provided by this utility model.

[0028] Figure 3 This is a partial schematic diagram of the three-dimensional adjustment frame provided by this utility model.

[0029] Figure 4 This is a partial schematic diagram of the three-dimensional adjustment frame provided by this utility model.

[0030] Figure 5 This is a schematic diagram of the sleeve in the three-dimensional adjustment frame provided by this utility model cooperating with the superconducting quantum interference device.

[0031] Figure 6 This is a perspective view of the support frame and the quantum chip packaging box in the three-dimensional adjustment frame provided by this utility model.

[0032] Figure 7 This is a perspective view of the cooperation between the support frame and the first adjusting component in the three-dimensional adjusting frame provided by this utility model.

[0033] Figure 8 This is a perspective view of the second adjusting member and the first adjusting member cooperating in the three-dimensional adjusting frame provided by this utility model.

[0034] Figure 9 This is a perspective view of the second adjusting component and the sleeve in the three-dimensional adjusting frame provided by this utility model.

[0035] Reference numerals: 1. Support frame; 101. Second through slot; 2. Quantum chip packaging box; 3. First adjusting component; 301. First through slot; 302. Protrusion; 303. Extrusion component; 304. Protrusion; 5. Fixing component; 6. Second adjusting component; 601. Base plate; 6011. Rotating slot; 602. Longitudinal plate; 603. Third through slot; 604. Scale; 7. Sleeve; 701. Connecting hole; 8. Rotating screw; 9. Superconducting quantum interference device; 10. Connecting component; 1001. Connecting block. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0037] like Figures 1-5 As shown, in one embodiment, a three-dimensional adjustment frame for a superconducting quantum interference device (SQUID) is provided for adjusting the SQUID, comprising:

[0038] Support frame 1 is fixed to both sides of quantum chip packaging box 2. In some embodiments, support frame 1 is a gantry frame. Two sets of gantry frames are provided and fixed to both sides of quantum chip packaging box 2 by bolts. The gantry frame serves as the supporting foundation for the entire three-dimensional adjustment frame.

[0039] like Figure 1 As shown, the first adjusting member 3 is disposed at the upper end of the support frame 1. The first adjusting member 3 has a first through groove 301, and the upper end of the support frame 1 has a second through groove 101. The first through groove 301 and the second through groove 101 are arranged perpendicularly to each other. The lower surface of the first adjusting member 3 is a plane, and similarly, the upper surface of the support frame 1 is also a plane. The first adjusting member 3 can move horizontally in the XY direction relative to the upper end of the support frame. After moving to the designated position, the support frame 1 and the first adjusting member 3 are fixed by the first through groove 301, the second through groove 101 and the fixing member 5.

[0040] In some embodiments, the first adjusting member 3 is a horizontal plate, which is placed horizontally above the support frame 1. Specifically, both ends of the horizontal plate are connected to the top of the two sets of support frames 1 respectively. The fixing member 5 used to fix the first adjusting member 3 and the support frame 1 is a combination structure of screws and nuts.

[0041] like Figure 8-9As shown, the second adjusting member 6 is tightly nested within the first adjusting member 3, and can move up and down relative to the first adjusting member 3 in the Z direction. It can be fixed at a designated position by screws. The nesting surface of the second adjusting member 6 is a vertical surface with a third through groove 603. The nested surface of the first adjusting member 3 is also a vertical surface with a threaded hole. The second adjusting member 6 moves along the length of the third through groove 603. In some embodiments, the second adjusting member 6 is a U-shaped member with the same spacing between its inner walls as the horizontal plate, and can be nested on both sides of the horizontal plate. There are three through holes in the middle area of ​​the horizontal plate, and three coaxial fine-threaded holes at the bottom of the U-shaped member. The adjusting screw is passed through the through holes and coaxial threaded holes on the horizontal plate until the screw head contacts the horizontal plate. The adjusting screw is rotated while maintaining the contact between the screw head and the horizontal plate, causing the third through groove to slide up and down relative to the screw on the side of the horizontal plate. The movement range of the U-shaped member in the Z direction is -3mm to 2cm, with the origin being the center point of the upper surface of the quantum chip. When in use, first screw the screw into the third through groove 603, but do not tighten it completely, so that the second adjusting part 6 can move up and down. After adjusting the second adjusting part 6 to the designated position, the screw passes through the third through groove 603 and is screwed into the threaded hole on the side of the horizontal plate to fix the U-shaped part to the horizontal plate.

[0042] like Figure 4 , Figure 6 as well as Figure 9 As shown, sleeve 7 is rotatably mounted at the bottom of the second adjusting member 6. The superconducting quantum interference device 9 is fixed to the bottom of sleeve 7. By rotating sleeve 7, the angle of the superconducting quantum interference device 9 can be adjusted. It should be noted that sleeve 7 is rotatable before being fixed. After being rotated to the designated position, sleeve 7 can be fixed by the fixing member so that sleeve 7 will not rotate during use.

[0043] This solution enables linear displacement adjustment along the X, Y, and Z axes and omnidirectional rotation adjustment around the Z-axis, while achieving positioning accuracy within the hundreds of micrometers in the X, Y, and Z directions in the Z direction. Specifically, for precise positioning in the X and Y directions, in some implementations, it can be achieved through a "visual-assisted alignment method" and a "compensation positioning method," achieving positioning accuracy within the hundreds of micrometers. Specifically: First, adjust the adjustment frame to its initial state. Rotate the adjustment screw to move the U-shaped component downwards until the lower long edge of the sensor of the superconducting quantum interference device 9 is about to contact the chip, ensuring the U-shaped component is horizontal. Since there is a gap in the X direction between the Z-axis groove of the U-shaped component and the screw within the groove, a slight error may occur. A "compensation positioning method" can be used, where the set screw on the rotating plate presses against one edge of the U-shaped component, and the other edge of the U-shaped component contacts and presses against the protrusion to eliminate this gap error.

[0044] Check if the U-shaped component is level; if so, make minor adjustments. Then, tighten the screws on the U-shaped component to secure it. Using a "visual-assisted alignment method," with the aid of an optical magnifying tool, observe the sensor and chip circuitry, and adjust the position of the horizontal plate until the lower edge of the sensor is aligned with the measured circuit. Carefully tighten the screws and nuts on the horizontal plate to complete the X and Y direction fixation. Then, slightly loosen the set screws and U-shaped component screws, and rotate the adjusting screw to adjust the Z direction position of the U-shaped component until the scale 604 reaches the desired value. Repeat the "compensation positioning method" steps to compensate for gap errors. Tighten the screw in the Z-direction groove to complete the displacement locking.

[0045] The first adjusting member 3 has at least one first through slot 301 at each end, which can be straight or curved, and extends along the short side, the long side, or at a certain angle to both. The support frame 1 has a corresponding second through slot 101, and the extension direction of the second through slot 101 is perpendicular or at a large acute angle to the extension direction of the first through slot 301, ensuring that a through-hole is formed during relative displacement. For example, in some embodiments, the first adjusting member 3 has two X-direction first through slots 301 at each end, and the support frame 1 has a corresponding Y-direction second through slot 101; or the first through slot 301 is Y-direction, and the second through slot 101 is X-direction. The through slots are perpendicular to each other in the XY plane, forming a cross hole, which facilitates the connection and fixation of the first adjusting member 3 and the support frame 1 by the fixing member 5, realizing displacement adjustment and fixation in the X and Y directions. The adjustment range of the adjusting frame in the XY direction is X±2cm, Y±2cm, and the origin is the center point of the upper surface of the quantum chip.

[0046] Optionally, the surface of the second adjusting member 6 is provided with a scale 604, the measuring range of which is -3mm to 2cm, and the scale 604 is a mm-level scale. Within the entire measuring range, the second adjusting member 6 performs adjustment in 23 step units, each step unit being 1mm. This adjustment can be performed manually. During manual adjustment, the scale 604 is aligned with the reference point of the second adjusting member 6 to achieve scale adjustment at corresponding positions of 0mm, 1mm, 2mm, and 3mm, i.e., a step unit of 1mm. In this application, the line width of each scale 604 is 0.1-0.2mm. During manual adjustment, aligning the reference line with the scale line achieves a positioning accuracy at the hundred-micron level.

[0047] Optionally, multiple rotating screws 8 are provided through the surface of the first adjusting member 3. These screws 8 extend downwards and penetrate the second adjusting member 6, and are threadedly connected to threaded holes on the second adjusting member 6. Rotation of the screws 8 within these threaded holes allows for displacement of the second adjusting member 6 in the Z-axis. The engagement of the screws 8 with the threaded holes effectively prevents the second adjusting member 6 from sagging due to its own weight, ensuring the progress of Z-axis adjustment. Furthermore, three rotating screws 8 are provided with corresponding threaded holes. The degrees of freedom of the second adjusting member 6 are adjusted using these three screws 8, and then a level is used to ensure the second adjusting member 6 is level, thereby guaranteeing the accuracy of the reference and reducing errors.

[0048] Optionally, the second adjusting member 6 includes a base plate 601, with a longitudinal plate 602 connected to one side of the base plate 601. The longitudinal plate 602 has multiple third through slots 603, for example, two third through slots 603. The longitudinal plate 602 is fixedly connected to the side of the first adjusting member 3 by a fixing member 5. In some embodiments, two longitudinal plates 602 are provided, and the two longitudinal plates 602 are integrally formed with the base plate 601 to form a U-shaped member. The U-shaped member has a symmetrical structure, which can effectively improve the stability of the second adjusting member 6 during movement and fixation.

[0049] Optionally, such as Figure 3 As shown, the base plate 601 has multiple circumferentially distributed rotating grooves 6011 at its center, and the sleeve 7 has circumferentially distributed connecting holes 701 on its upper surface. The fastener 5 passes through the rotating grooves 6011 and connects to the connecting holes 701, which are also threaded holes. When the centers of the contact surfaces of the base plate 601 and the sleeve 7 are aligned, the screw can pass through the rotating grooves 6011 and be screwed into the threaded holes regardless of how the sleeve 7 is rotated, thus achieving angle adjustment.

[0050] Optionally, such as Figure 5 As shown, the superconducting quantum interference device 9 is fixed to the connector 10 by screws, and the connector 10 is fixed to the sleeve 7 by screws. The connector 10 includes a connecting block 1001 disposed at the bottom of the sleeve 7. The connecting block 1001 is connected to the bottom of the sleeve 7 by screws. The superconducting quantum interference device 9 is fixed to the connecting block 1001 by screws. The superconducting quantum interference device 9 is arranged vertically.

[0051] Optionally, such as Figure 1As shown, the edge of the first adjusting member 3 is provided with a protrusion 302, and the protrusion 302 is provided with a pressing member 303. The pressing member 303 abuts against the edge of the longitudinal plate 602. In use, after the bottom of the superconducting quantum interference device 9 contacts the bottom of the quantum chip slot or a certain fixed point, the Z-axis scale 604 is calibrated. After the Z-axis scale 604 is aligned, the pressing member 303 is twisted to press the second adjusting member 6 (U-shaped member), thereby eliminating the gap error in the X-axis. In some embodiments, the pressing member 303 can be a set screw. A protrusion is provided at the other end of the pressing member 303 relative to the second adjusting member 6. The protrusion is fixed on the horizontal plate. Preferably, the protrusion is a cylindrical protrusion. The pressing member 303 on the rotating horizontal plate presses the edge of the second adjusting member 6, and the other edge of the second adjusting member 6 contacts and presses against the cylindrical protrusion to eliminate the gap error.

[0052] Optionally, the support frame 1, the first adjusting component 3, the second adjusting component 6, the sleeve 7, the quantum chip packaging box 2, the fixing component 5, and the connector 10 are all made of oxygen-free copper. Except for the aforementioned components, the three-dimensional adjusting frame support frame 1, the first adjusting component 3, the second adjusting component 6, the sleeve 7, the quantum chip packaging box 2, the fixing component 5, and the connector 10 in this application are all made of oxygen-free copper. Oxygen-free copper has a low coefficient of thermal expansion, which can reduce deformation errors caused by temperature changes. Simultaneously, oxygen-free copper has excellent thermal conductivity, meeting the requirement that the superconducting quantum interference device 9 operates at a temperature below 4K. Furthermore, oxygen-free copper has extremely low relative permeability, generating almost no induced magnetic field, which can reduce signal interference from the three-dimensional adjusting frame itself to sensitive devices like the superconducting quantum interference device 9.

[0053] Furthermore, to improve the thermal conductivity of the three-dimensional adjustment frame, the larger contact area between parts and the screw compression stress effectively enhance thermal conductivity. Since all parts use the same material, oxygen-free copper, each part can shrink proportionally at low temperatures. The synchronous shortening of the screws and the fixed components ensures that the initial preload remains essentially unchanged. The overall structure after cooling and shrinkage is still a scaled-down version of the original, initially reducing the positional error between the SQUID and the chip. The adjustment frame adopts a symmetrical structural design, and the deformation of the symmetrical central region is canceled out at low temperatures. Since both the SQUID and the quantum chip are located in the central region, this design further reduces the positional error between the SQUID and the chip.

[0054] refer to Figure 6 - Figure 9 , Figure 6 This demonstrates the mating relationship between the support frame 1 and the quantum chip packaging box 2. The support frame 1 has four through holes at its bottom, and the packaging box has two slots on each side. When the through holes and slots are aligned... Figure 6 When the center position is aligned parallel, the gantry and chip box are fastened with screws and nuts.

[0055] Figure 7The diagram illustrates the mating relationship between the support frame 1 and the first adjusting member 3. The first adjusting member 3 has a Y-axis displacement groove on each side. The top of the support frame 1 has two X-axis displacement grooves perpendicular to the Y-axis displacement grooves. Screws pass through the holes formed by the intersection of the Y-axis and X-axis displacement grooves, engaging with nuts to secure the support frame 1 and the first adjusting member 3.

[0056] Figure 8 The diagram illustrates the mating relationship between the second adjusting member 6 and the first adjusting member 3. The inner wall spacing of the second adjusting member 6 is the same as that of the first adjusting member 3, allowing it to be nested within the first adjusting member 3 on both sides. Each side of the second adjusting member 6 has two Z-axis displacement grooves. The first adjusting member 3 has threaded holes on both sides corresponding to the Z-axis displacement grooves, allowing the second adjusting member 6 to be fixed to the first adjusting member 3 by screwing in screws.

[0057] Figure 9 The fit between the second adjusting component 6 and the sleeve 7 is demonstrated. The upper surface of the sleeve 7 is fitted to the lower surface of the second adjusting component 6. The bottom of the second adjusting component 6 has three identical rotary displacement grooves, which are equidistantly distributed with the geometric center of the lower rectangular surface of the second adjusting component 6 as the origin. The sleeve 7 has six threaded holes, which are equidistantly distributed with the geometric center of the upper circular surface of the sleeve 7 as the origin. Screwing in screws can secure the sleeve 7 and the second adjusting component 6.

[0058] For precise positioning in the Z-axis, calibration is necessary due to potential errors introduced during machining and assembly. Calibration methods include:

[0059] First, adjust the adjustment frame to its initial state: install all parts in the positions shown in the diagram, and adjust the sleeve angle 7 so that the long side of the sensor is approximately parallel to the measured circuit. Except for the screws securing the horizontal plate and the U-shaped component, which are not yet fully tightened, all other parts are securely fastened. Adjust the horizontal plate to shift the sensor to the non-chip area within the chip slot. Rotate the adjusting screw to move the U-shaped component downwards until the bottom of the sensor contacts the bottom of the chip slot. Fine-tune the U-shaped component's orientation until it is completely horizontal and read the scale value at this point. If scale 604 displays 0, then the device itself has no error in scale 604 in the Z direction. If scale 604 is not 0, then in subsequent positioning operations, this scale value of 0 will be used as the reference.

[0060] All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0061] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A three-dimensional adjustment frame for a superconducting quantum interference device (QFID), used for adjusting the QFID, characterized in that, include: A support frame is disposed on both sides of the quantum chip packaging box; The first adjusting member has a flat lower surface with a first through slot, and the upper surface of the support frame has a flat upper surface with a second through slot. The first through slot and the second through slot are perpendicularly arranged to each other. The first adjusting member can move horizontally in the XY direction relative to the upper end of the support frame, and the support frame and the first adjusting member are fixed through the through slot. A second adjusting member is nested within a first adjusting member. The nesting surface of the second adjusting member is vertical and has a third through slot. The direction of the third through slot is perpendicular to the directions of the first and second through slots. The nested surface of the first adjusting member is vertical and has a connecting hole. The second adjusting member can move up and down in the Z direction relative to the first adjusting member, and the second adjusting member and the first adjusting member are fixed together by the through slot and the connecting hole. A sleeve, which is rotatably disposed at the bottom of the second adjusting member.

2. The three-dimensional adjustment frame for the superconducting quantum interference device according to claim 1, characterized in that, The first through groove is parallel to the short side of the first adjusting member, and the second through groove is perpendicular to the first through groove; or The first through groove is parallel to the long side of the first adjusting member, and the second through groove is perpendicular to the first through groove.

3. The three-dimensional adjustment frame for the superconducting quantum interference device according to claim 1, characterized in that, The first adjusting member has at least one first through groove at each end. The shape of the first through groove is straight or arc-shaped. The extension direction of the first through groove is along the short side, the long side, or a direction that forms a certain angle with the short side or the long side of the first adjusting member.

4. The three-dimensional adjustment frame for the superconducting quantum interference device according to claim 1, characterized in that, The support frame is provided with at least one second through groove. The second through groove is straight or curved. The extension direction of the second through groove forms an angle of 40° to 90° with the extension direction of the first through groove, so that the first through groove and the second through groove form a through-hole during the relative displacement of the first adjusting member and the support frame.

5. The three-dimensional adjustment frame for the superconducting quantum interference device according to claim 1, characterized in that, The second adjusting member includes a base plate, one side of which is connected to a longitudinal plate. The longitudinal plate has multiple third through slots and is fixedly connected to the side of the first adjusting member by a fixing member.

6. The three-dimensional adjustment frame for the superconducting quantum interference device according to claim 5, characterized in that, The base plate has multiple rotating grooves distributed circumferentially, and the upper surface of the sleeve has connecting holes distributed circumferentially. The fastener passes through the rotating grooves and connects with the connecting holes.

7. The three-dimensional adjustment frame for the superconducting quantum interference device according to claim 5, characterized in that, The first adjusting member has a protrusion on its edge, and the protrusion has a pressing member that abuts against the edge of the longitudinal plate.

8. The three-dimensional adjustment frame for the superconducting quantum interference device according to claim 1, characterized in that, The superconducting quantum interference device is fixed to the bottom of the sleeve by a connector, and in the initial state, the superconducting quantum interference device is located directly above the quantum chip in the quantum chip packaging box.

9. The three-dimensional adjustment frame for the superconducting quantum interference device according to claim 8, characterized in that, The connector includes a connecting block disposed at the bottom of the sleeve, the connecting block being connected to the bottom of the sleeve by screws, and the superconducting quantum interference device being fixed to the connecting block by screws.

10. The three-dimensional adjustment frame for the superconducting quantum interference device according to claim 7, characterized in that, The support frame, the first adjusting component, the second adjusting component, the sleeve, the quantum chip packaging box, the fixing component, and the connecting component are all made of oxygen-free copper.

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