Power distribution cabinet ventilation device convenient for heat dissipation
By using temperature and humidity sensors and thermostats in conjunction with the automatic control of fans and semiconductor coolers, the problem of heat accumulation in the power distribution cabinet is solved, achieving efficient heat dissipation and temperature management, and ensuring the performance and lifespan of electrical components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YANGZHOU DONGAN ELECTRIC CO LTD
- Filing Date
- 2025-06-06
- Publication Date
- 2026-05-19
AI Technical Summary
Existing distribution cabinets cannot automatically control ventilation and heat dissipation based on temperature and humidity, resulting in heat accumulation that affects the performance and lifespan of electrical components.
Temperature and humidity sensors are used to monitor the environment inside the cabinet, which is then automatically adjusted by a temperature controller. Airflow is achieved using lower and upper axial fans, combined with aluminum extruded heat sinks and semiconductor coolers, to realize automatic adjustment and rapid cooling.
It improves heat dissipation efficiency, ensures that electrical components operate within a safe temperature range, and extends component life.
Smart Images
Figure CN224264539U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power distribution cabinet technology, specifically to a power distribution cabinet ventilation device that facilitates heat dissipation. Background Technology
[0002] Distribution cabinets play a vital role in power systems, especially in power distribution and fault protection. The core function of a distribution cabinet is to rationally distribute electrical energy, ensuring a stable power supply to all load components. At the same time, it can react quickly and provide power-off protection when abnormal conditions such as short circuits, overloads, or leakage occur in the circuit, ensuring the safe operation of the system. In general, a distribution cabinet is a cabinet that integrates numerous electrical components and is specifically designed for power distribution and protection.
[0003] The distribution cabinet integrates a large number of electrical components, such as circuit breakers, contactors, and transformers. These components generate a lot of heat during operation. If the heat accumulates inside the cabinet and cannot be dissipated, it will directly lead to an increase in the temperature inside the cabinet, which will affect the performance and lifespan of the electrical components. Existing distribution cabinets generally rely on normally open ventilation holes for ventilation and heat dissipation. In this case, it is not possible to automatically control the temperature and humidity inside the distribution cabinet. Utility Model Content
[0004] This invention provides a ventilation device for power distribution cabinets that facilitates heat dissipation, thereby solving the problems in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a heat dissipation-friendly power distribution cabinet ventilation device, comprising a cabinet body, a cabinet door hinged to the front of the cabinet body, a thermostat mounted on the upper part of the cabinet door, and a semiconductor cooler mounted on the lower part of the cabinet door, a ventilation chamber at the bottom of the cabinet body, ventilation holes on the outer walls of the ventilation chamber, a lower perforated plate mounted on the top of the ventilation chamber, a lower axial flow fan mounted on the holes of the lower perforated plate, a guide shroud mounted on the lower axial flow fan, a back plate mounted on the inner rear wall of the cabinet body, an aluminum extruded heat sink mounted on the back plate, a temperature and humidity sensor mounted on the inner wall of the cabinet body, an exhaust chamber at the top of the cabinet body, heat dissipation holes on the outer walls of the exhaust chamber, an upper perforated plate mounted on the bottom of the exhaust chamber, and an upper axial flow fan mounted on the holes of the upper perforated plate, wherein the semiconductor cooler, the lower axial flow fan, the temperature and humidity sensor, and the upper axial flow fan are electrically connected to the thermostat via wires.
[0006] Furthermore, a flat lock is installed on the cabinet door, and the flat lock is used to lock and connect the cabinet body.
[0007] Furthermore, the thermoelectric cooler includes a housing, an aluminum extruded heat sink, a cooling fan, a thermoelectric cooling chip, and an exhaust fan. The housing has a partition, the aluminum extruded heat sink is embedded in the partition, the cooling fan is installed on the heat dissipation surface of the aluminum extruded heat sink, the thermoelectric cooling chip is installed on the heat transfer surface of the aluminum extruded heat sink, and the exhaust fan is installed on the cold end of the thermoelectric cooling chip.
[0008] Furthermore, a heat dissipation port is provided on the rear side of the housing, and the cooling fan is located corresponding to the position of the heat dissipation port.
[0009] Furthermore, an air outlet is provided on the front side of the housing, and the exhaust fan is located corresponding to the air outlet.
[0010] Furthermore, the outlet of the air guide shroud is located below the aluminum extruded heat sink, and the aluminum extruded heat sink is evenly distributed with fixing holes.
[0011] Compared with the prior art, this utility model provides a ventilation device for power distribution cabinets that facilitates heat dissipation, and has the following beneficial effects:
[0012] This heat dissipation-friendly distribution cabinet ventilation device mounts electrical components on aluminum extruded heat sinks. Temperature and humidity sensors monitor changes in ambient temperature inside the cabinet in real time, and in conjunction with a temperature controller, automatically adjusts the ambient temperature parameters. Lower and upper axial flow fans allow outside air to flow from bottom to top through the cabinet. With the help of the air guide shroud and aluminum extruded heat sinks, heat from the electrical components is transferred to the heat sinks, and heat is transferred through convection between the heat sinks and the air, which helps improve heat dissipation efficiency. When the temperature inside the cabinet exceeds the set threshold, a semiconductor cooler is activated to blow out cold air for rapid cooling, keeping the temperature inside the cabinet within a safe range. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the structure of this utility model;
[0014] Figure 2 This is a side view of the present invention;
[0015] Figure 3 This is a cross-sectional view of the semiconductor cooler of this utility model.
[0016] In the diagram: 1. Cabinet body; 2. Cabinet door; 3. Thermostat; 4. Semiconductor cooler; 401. Outer shell; 402. Aluminum extruded heat sink; 403. Cooling fan; 404. Semiconductor cooling chip; 405. Exhaust fan; 406. Partition; 407. Heat dissipation port; 408. Air outlet; 5. Ventilation chamber; 6. Ventilation hole; 7. Lower perforated plate; 8. Lower axial flow fan; 9. Air guide cover; 10. Back panel; 11. Aluminum extruded heat sink; 12. Temperature and humidity sensor; 13. Exhaust chamber; 14. Heat dissipation hole; 15. Upper perforated plate; 16. Upper axial flow fan; 17. Flat lock; 18. Fixing hole. Detailed Implementation
[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0018] Please see Figures 1-3 This utility model discloses a ventilation device for a power distribution cabinet that facilitates heat dissipation. It includes a cabinet body 1, a cabinet door 2 hinged to the front of the cabinet body 1, a thermostat 3 mounted on the upper part of the cabinet door 2, and a semiconductor cooler 4 mounted on the lower part of the cabinet door 2. A ventilation chamber 5 is located at the bottom of the cabinet body 1, with ventilation holes 6 on its outer walls. A lower perforated plate 7 is mounted on the top of the ventilation chamber 5, with a lower axial flow fan 8 installed in the holes of the lower perforated plate 7. A guide shroud 9 is mounted on the lower axial flow fan 8. A back plate 10 is mounted on the rear inner wall of the cabinet body 1, with aluminum extruded heat sinks 11 mounted on the back plate 10. A temperature and humidity sensor 12 is mounted on the inner wall of the cabinet body 1. An exhaust chamber 13 is located at the top of the cabinet body 1, with heat dissipation holes 14 on its outer walls. An upper... An upper axial fan 16 is installed in the holes of the upper perforated plate 15. Electrical components are mounted on aluminum extruded heat sinks 11. A temperature and humidity sensor 12 is used to monitor the changes in ambient temperature inside the cabinet in real time. In conjunction with the temperature controller 3, it can automatically adjust the ambient temperature parameters. The lower axial fan 8 and the upper axial fan 16 are used to make the outside air flow from bottom to top through the cabinet. Under the action of the air guide shroud 9 and the aluminum extruded heat sink 11, the heat on the electrical components is conducted to the heat sink, and the heat is transferred through the convection between the heat sink and the air, which helps to improve the heat dissipation efficiency. When the temperature inside the cabinet exceeds the set threshold, the semiconductor cooler 4 is activated to blow out cold air for rapid cooling, so that the temperature inside the cabinet is kept within a safe range. The semiconductor cooler 4, the lower axial fan 8, the temperature and humidity sensor 12 and the upper axial fan 16 are electrically connected to the temperature controller 3 through wires.
[0019] Specifically, a flat lock 17 is installed on the cabinet door 2, and the flat lock 17 is used to lock and connect the cabinet body 1.
[0020] In this implementation plan, the flat lock 17 is a lock in which the lock cylinder and the latch are on the same plane. It is an important lock used to protect the safety of the electrical cabinet. It has anti-pry, anti-smashing, and anti-rust properties, and can effectively ensure the safe operation of the equipment in the electrical cabinet.
[0021] Specifically, the thermoelectric cooler 4 includes a housing 401, an aluminum extruded heat sink 402, a cooling fan 403, a thermoelectric cooling chip 404, and an exhaust fan 405. The housing 401 is provided with a partition 406. The aluminum extruded heat sink 402 is embedded in the partition 406. The cooling fan 403 is installed on the heat dissipation surface of the aluminum extruded heat sink 402. The thermoelectric cooling chip 404 is installed on the heat transfer surface of the aluminum extruded heat sink 402. The exhaust fan 405 is installed on the cold end of the thermoelectric cooling chip 404.
[0022] In this implementation plan, such as Figure 3 As shown, when the thermoelectric cooler 404 is powered on, its cold end generates cold air, which is blown into the cabinet by the exhaust fan 405. Its hot end generates heat, which is blown out by the cooling fan 403. When installing the thermoelectric cooler 4, it is necessary to ensure that its cold end is inside the cabinet and its hot end is outside the cabinet.
[0023] Specifically, the rear side of the housing 401 is provided with a heat dissipation port 407, and the cooling fan 403 is located at the position of the heat dissipation port 407.
[0024] In this embodiment, when the cooling fan 403 is running, the heat generated by the hot end of the semiconductor cooling chip 404 can be discharged to the outside through the heat dissipation port 407.
[0025] Specifically, the front side of the housing 401 is provided with an air outlet 408, and the exhaust fan 405 is located at the position of the air outlet 408.
[0026] In this embodiment, when the exhaust fan 405 is running, the cooling energy generated by the cold end of the semiconductor cooling chip 404 can be blown into the cabinet from the air outlet 408.
[0027] Specifically, the outlet of the air guide shroud 9 is located below the aluminum extruded heat sink 11, and the aluminum extruded heat sink 11 is evenly distributed with fixing holes 18.
[0028] In this implementation plan, such as Figure 2 As shown, the heat from the electrical components is transferred to the heat sink by the air guide shroud 9 and the aluminum extruded heat sink 11, and the heat is transferred through the convection between the heat sink and the air, which helps to improve the heat dissipation efficiency.
[0029] During use, electrical components are mounted on aluminum extruded heat sinks 11 with screws. Temperature and humidity sensor 12 (model WSK-CLD) is used to monitor changes in ambient temperature inside the cabinet in real time. In conjunction with temperature controller 3 (model CG209C), it can automatically adjust the ambient temperature parameters. Lower axial flow fan 8 and upper axial flow fan 16 are used to make outside air flow through the cabinet from bottom to top. Under the action of air guide shroud 9 and aluminum extruded heat sink 11, the heat on the electrical components is conducted to the heat sink, and heat is transferred through the convection between the heat sink and the air, which helps to improve heat dissipation efficiency. When the temperature inside the cabinet exceeds the set threshold, the semiconductor cooler 4 is activated to blow out cold air for rapid cooling, so that the temperature inside the cabinet is kept within a safe range.
[0030] In summary, this heat dissipation-friendly distribution cabinet ventilation device has electrical components mounted on aluminum extruded heat sinks 11. Temperature and humidity sensors 12 are used to monitor changes in ambient temperature inside the cabinet in real time. In conjunction with the temperature controller 3, the ambient temperature parameters can be automatically adjusted. The lower axial flow fan 8 and the upper axial flow fan 16 are used to allow outside air to flow from bottom to top through the cabinet. Under the action of the air guide shroud 9 and the aluminum extruded heat sinks 11, the heat on the electrical components is conducted to the heat sinks, and the heat is transferred through the convection between the heat sinks and the air, which helps to improve the heat dissipation efficiency. When the temperature inside the cabinet exceeds the set threshold, the semiconductor cooler 4 is activated to blow out cold air for rapid cooling, so that the temperature inside the cabinet is kept within a safe range.
[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A heat dissipation ventilation device for a power distribution cabinet, comprising a cabinet (1), characterized in that: The cabinet (1) has a door (2) hinged to the front. A thermostat (3) is installed on the upper part of the door (2), and a semiconductor cooler (4) is installed on the lower part of the door (2). The bottom of the cabinet (1) has a ventilation chamber (5), and the outer walls of the ventilation chamber (5) have ventilation holes (6). A lower perforated plate (7) is installed on the top of the ventilation chamber (5), and a lower axial flow fan (8) is installed in the holes of the lower perforated plate (7). A guide is installed on the lower axial flow fan (8). The cabinet (1) has a back panel (10) installed on the inner rear wall, and an aluminum extruded heat sink (11) is installed on the back panel (10). A temperature and humidity sensor (12) is installed on the inner wall of the cabinet (1). The top of the cabinet (1) is provided with an exhaust chamber (13), and the outer walls of the exhaust chamber (13) are provided with heat dissipation holes (14). The bottom of the exhaust chamber (13) is provided with an upper perforated plate (15), and an upper axial flow fan (16) is installed in the holes of the upper perforated plate (15).
2. The heat dissipation ventilation device for a distribution cabinet according to claim 1, characterized in that: A flat lock (17) is installed on the cabinet door (2), and the flat lock (17) is locked to the cabinet body (1).
3. The heat dissipation ventilation device for a distribution cabinet according to claim 1, characterized in that: The semiconductor cooler (4) includes a housing (401), an aluminum extruded heat sink (402), a cooling fan (403), a semiconductor cooling chip (404), and an exhaust fan (405). The housing (401) is provided with a partition (406). The aluminum extruded heat sink (402) is embedded in the partition (406). The cooling fan (403) is installed on the heat dissipation surface of the aluminum extruded heat sink (402). The semiconductor cooling chip (404) is installed on the heat transfer surface of the aluminum extruded heat sink (402). The exhaust fan (405) is installed on the cold end of the semiconductor cooling chip (404).
4. A heat dissipation-facilitating ventilation device for a power distribution cabinet according to claim 3, characterized in that: The rear side of the housing (401) is provided with a heat exhaust port (407), and the cooling fan (403) is located corresponding to the heat exhaust port (407).
5. A heat dissipation-facilitating ventilation device for a power distribution cabinet according to claim 3, characterized in that: The front side of the housing (401) is provided with an air outlet (408), and the exhaust fan (405) is located at the air outlet (408).
6. A heat dissipation ventilation device for a distribution cabinet according to claim 1, characterized in that: The outlet of the air guide shroud (9) is located below the aluminum extruded heat sink (11), and the aluminum extruded heat sink (11) is evenly distributed with fixing holes (18).
7. A heat dissipation ventilation device for a distribution cabinet according to claim 1, characterized in that: The semiconductor cooler (4), the lower axial fan (8), the temperature and humidity sensor (12), and the upper axial fan (16) are electrically connected to the temperature controller (3) via wires.