Power synthesis module and radio frequency power supply system

Abstract

The utility model discloses a power synthesis module and a radio frequency power supply system. The power synthesis module comprises n transmission units and (n-1) resistor units; the transmission unit comprises a first conductive unit, a first capacitor unit, a second conductive unit, a third conductive unit, an inductor unit, a fourth conductive unit, a fifth conductive unit, a second capacitor unit and a sixth conductive unit; the first end of the first capacitor unit is connected with the first conductive unit without a welding spot, and the second end of the first capacitor unit is connected with the sixth conductive unit without a welding spot and is grounded; the first conductive unit and the second conductive unit are connected without welding spots; the first end of the inductor unit is connected with the second conductive unit without a welding spot, and the second end of the inductor unit is connected with the third conductive unit without a welding spot; and the third conductive unit and the fourth conductive unit are connected without welding spots. The utility model provides a power synthesis module and a radio frequency power supply system, which can reduce the manufacturing cost of the power synthesis module and output high power.

Description

Technical Field

[0001] This utility model relates to the field of radio frequency technology, and in particular to a power combining module and a radio frequency power supply system. Background Technology

[0002] Power combining technology has wide applications in the radio frequency (RF) field, and its importance is particularly prominent in high-power transmitters. RF power ranging from several kilowatts to tens of kilowatts is obtained through power combining technology, which is one of the key technologies for high-power transmitters.

[0003] The function of the power combining module is to combine the output power of multiple power amplifiers into a single, larger power output to meet the requirements of high-power transmission.

[0004] However, the inability of current power combining modules to output high power limits their further development. Utility Model Content

[0005] This invention provides a power combining module and an RF power supply system, which can reduce the manufacturing cost of the power combining module and also output high power.

[0006] According to one aspect of the present invention, a power combining module is provided, the power combining module comprising: n transmission units and n-1 resistor units, wherein n is greater than or equal to 2 and n is an integer;

[0007] The transmission unit includes a first conductive unit, a first capacitor unit, a second conductive unit, a third conductive unit, an inductor unit, a fourth conductive unit, a fifth conductive unit, a second capacitor unit, and a sixth conductive unit;

[0008] The first terminal of the first capacitor unit is connected to the first conductive unit without a solder joint; the second terminal of the first capacitor unit is connected to the sixth conductive unit without a solder joint and grounded; the first conductive unit is connected to the second conductive unit without a solder joint; the first terminal of the inductor unit is connected to the second conductive unit without a solder joint; the second terminal of the inductor unit is connected to the third conductive unit without a solder joint; the third conductive unit is connected to the fourth conductive unit without a solder joint; the first terminal of the second capacitor unit is connected to the fourth conductive unit without a solder joint and grounded; the second terminal of the second capacitor unit is connected to the fifth conductive unit without a solder joint.

[0009] A resistor unit is included between two adjacent transmission units. The first end of the resistor unit is connected to the fourth conductive unit in the preceding transmission unit, and the second end of the resistor unit is connected to the fourth conductive unit in the following transmission unit.

[0010] The second conductive units in two adjacent transmission units are connected without solder joints.

[0011] Optionally, the power combining module provided in this embodiment further includes a heat-dissipating insulating substrate; each of the transmission units is fixed on the same side of the heat-dissipating insulating substrate.

[0012] Optionally, the power combining module provided in this embodiment also includes an insulating fixing structure;

[0013] The inductor unit includes an air-core inductor;

[0014] The insulating fixing structure passes through the inner core of the hollow inductor and is fixed to one side of the heat dissipation insulating substrate.

[0015] The thickness of the first conductive unit ranges from 3mm to 5mm;

[0016] The thickness of the second conductive unit ranges from 3mm to 5mm;

[0017] The thickness of the third conductive unit ranges from 3mm to 5mm;

[0018] The thickness of the fourth conductive unit ranges from 3mm to 5mm;

[0019] The thickness of the fifth conductive unit ranges from 3mm to 5mm;

[0020] The thickness of the sixth conductive unit ranges from 3mm to 5mm.

[0021] Optionally, the power combining module provided in this embodiment also includes a PCB circuit board;

[0022] The resistor unit is fixed to one side of the PCB circuit board;

[0023] The heat-dissipating insulating substrate partially surrounds the PCB circuit board.

[0024] Optionally, the resistor unit includes at least two microstrip resistors connected in series;

[0025] The microstrip resistor includes a stacked metal flange base and resistor layer subunits;

[0026] The resistive layer subunit includes a ceramic substrate, a microstrip resistive layer, and a ceramic cover plate stacked sequentially; wherein the ceramic substrate is located between the metal flange base and the microstrip resistive layer; the metal flange base includes at least two through holes.

[0027] Optionally, the power combining module provided in this embodiment also includes multiple heat dissipation units;

[0028] The heat dissipation unit is located on the side of the heat dissipation insulating substrate away from the transmission unit.

[0029] Optionally, the power combining module provided in this embodiment also includes multiple fixed conductive structures;

[0030] The first end of the first capacitor unit is connected to the first conductive unit through the fixed conductive structure; the second end of the first capacitor unit is connected to the sixth conductive unit through the fixed conductive structure and grounded; the first conductive unit and the second conductive unit are connected through the fixed conductive structure; the first end of the inductor unit is connected to the second conductive unit through the fixed conductive structure; the second end of the inductor unit is connected to the third conductive unit through the fixed conductive structure; the third conductive unit and the fourth conductive unit are connected through the fixed conductive structure; the first end of the second capacitor unit is connected to the fourth conductive unit through the fixed conductive structure and grounded; the second end of the second capacitor unit is connected to the fifth conductive unit through the fixed conductive structure.

[0031] Optionally, the second conductive units in each of the transmission units are integrally connected.

[0032] According to another aspect of the present invention, an radio frequency power supply system is provided, which includes a radio frequency power supply module and the power combining module provided in any embodiment of the present invention.

[0033] This invention provides a power combining module comprising multiple transmission units. The first capacitor unit, inductor unit, and second capacitor unit within these transmission units are connected without soldering via first conductive units, second conductive units, third conductive units, fourth conductive units, fifth conductive units, and sixth conductive units. This eliminates the need for wire connections and soldering, and also avoids the need for electrical connections via a PCB board, thus reducing the cost of the power combining module. Furthermore, the solderless connection method improves the power combining module's ability to withstand high currents, enabling the power combining module provided by this invention to achieve high-power combining. In summary, the power combining module provided by this invention can reduce manufacturing costs and output high power.

[0034] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 This is a top view structural diagram of a power combining module according to an embodiment of the present utility model;

[0037] Figure 2 This is a three-dimensional structural schematic diagram of a power combining module according to an embodiment of the present utility model;

[0038] Figure 3 This is a circuit diagram of a power combining module according to an embodiment of the present utility model;

[0039] Figure 4 This is a schematic diagram of a radio frequency power supply system provided according to an embodiment of the present utility model. Detailed Implementation

[0040] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0041] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0042] Figure 1 This is a top view schematic diagram of a power combining module according to an embodiment of the present invention. Figure 2This is a three-dimensional structural diagram of a power combining module according to an embodiment of the present utility model. Figure 3 This is a circuit diagram of a power combining module according to an embodiment of the present invention, with reference to... Figures 1-3 The power combining module provided in this embodiment includes: n transmission units 110 and n-1 resistor units 120, where n is greater than or equal to 2 and is an integer; the transmission unit 110 includes a first conductive unit 111, a first capacitor unit 112, a second conductive unit 113, a third conductive unit 114, an inductor unit 115, a fourth conductive unit 116, a fifth conductive unit 117, a second capacitor unit 118, and a sixth conductive unit 119; the first end of the first capacitor unit 112 is connected to the first conductive unit 111 without solder joints, and the second end of the first capacitor unit 112 is connected to the sixth conductive unit 119 without solder joints and grounded; the first conductive unit 111 is connected to the second conductive unit 113 without solder joints; the first end of the inductor unit 115 ... The second conductive unit 113 is connected without solder joints; the second end of the inductor unit 115 is connected without solder joints to the third conductive unit 114; the third conductive unit 114 is connected without solder joints to the fourth conductive unit 116; the first end of the second capacitor unit 118 is connected without solder joints to the fourth conductive unit 116; the second end of the second capacitor unit 118 is connected without solder joints to the fifth conductive unit 117 and grounded; a resistor unit 120 is included between two adjacent transmission units 110; the first end of the resistor unit 120 is connected to the fourth conductive unit 116 in the previous transmission unit 110; the second end of the resistor unit 120 is connected to the fourth conductive unit 116 in the next transmission unit 110; the second conductive units 113 in two adjacent transmission units 110 are connected without solder joints.

[0043] Specifically, in this embodiment, solderless connection refers to achieving electrical connection between two or more components through mechanical connection or other non-welding methods, thereby avoiding the use of solder. Solderless connection in this embodiment typically employs crimping technology, solderless terminals, or other mechanical connection methods.

[0044] The first conductive unit 111, the second conductive unit 113, the third conductive unit 114, the fourth conductive unit 116, the fifth conductive unit 117, and the sixth conductive unit 119 can all be copper plates.

[0045] In this embodiment, the transmission unit 110 can be a π-type circuit. The first capacitor unit 112 may include a first capacitor C1, the second capacitor unit 118 may include a second capacitor C2, and the inductor unit 115 may include an air-core inductor L1. The resistor unit 120 may include two microstrip resistors R1 connected in series.

[0046] The power combining module provided in this embodiment includes an output terminal and an input terminal equal in number to the transmission units 110. The input terminals of the power combining module correspond one-to-one with the fourth conductive units 116. The output terminals of the power combining module are all electrically connected to the second conductive units 113 in each transmission unit 110, and the input terminals of the power combining module are electrically connected to their corresponding fourth conductive units 116.

[0047] The power combining module provided in this embodiment exhibits good filtering performance, with excellent frequency, insertion loss, and isolation parameters. For example, simulation results show that the power combining module provides dB(S(1,1)) = -29.376 at 13.56MHz, dB(S(2,1)) = -3.015 at 13.56MHz, and dB(S(3,3)) = -41.181 at 13.56MHz. This embodiment uses a solderless connection method to form the power combining module, resulting in good filtering performance and excellent frequency, insertion loss, and isolation parameters. The actual finished product closely matches the simulated values.

[0048] In this embodiment, the power combining module connects the first capacitor unit 112, the second capacitor unit 118, and the inductor unit 115 through the first conductive unit 111, the second conductive unit 113, the third conductive unit 114, the fourth conductive unit 116, the fifth conductive unit 117, and the sixth conductive unit 119, instead of through wires and metal film layers. This allows the power combining module to withstand larger currents and power. Furthermore, compared to the fabrication of metal film layers, the conductive units provided in this embodiment are less expensive, reducing the manufacturing cost of the power combining module.

[0049] It should be noted that, Figures 1-3 The power combining module is illustrated by way of example only and includes two transmission units 110, but is not intended to limit the present invention. The power combining module provided in this embodiment may also include three, four, or five transmission units 110. Figure 1 and Figure 2 The internal components of the transmission unit 110 are shown only as an example, and their specific solderless connection method is not shown.

[0050] This embodiment provides a power combining module, which includes multiple transmission units. The first capacitor unit, inductor unit, and second capacitor unit within the transmission units are connected without soldering via first, second, third, fourth, fifth, and sixth conductive units, instead of through wires or soldering. This eliminates the need for electrical connections via a PCB board, reducing the cost of the power combining module. Furthermore, the solderless connection method improves the power combining module's ability to withstand high currents, enabling it to achieve high-power combining. In summary, the power combining module provided in this embodiment reduces manufacturing costs and can output high power.

[0051] Optional, continue to refer to Figure 1 and Figure 2 The power combining module provided in this embodiment also includes a heat-dissipating insulating substrate 130; each transmission unit 110 is fixed on the same side of the heat-dissipating insulating substrate 130.

[0052] Specifically, the heat-dissipating insulating substrate 130 can be made of ceramic. During operation, the power combining module generates a large amount of heat. If this heat is not dissipated in time, it may cause the power combining module to stop working, and in severe cases, it may cause a fire. In this embodiment, a heat-dissipating insulating substrate 130 is provided on one side of each transmission unit 110, and each transmission unit 110 is fixed on the heat-dissipating insulating substrate 130, which can ensure the heat dissipation effect of the power combining module. Furthermore, using the heat-dissipating insulating substrate 130 for heat dissipation is low-cost and silent, which can further reduce the manufacturing cost of the power combining module provided in this embodiment and further improve the quality of the power combining module.

[0053] Optional, continue to refer to Figures 1-3 The power combining module provided in this embodiment also includes an insulating fixing structure 140; the inductor unit 115 includes an air-core inductor L1; the insulating fixing structure 140 passes through the inner core of the air-core inductor L1 and is fixed to one side of the heat dissipation insulating substrate 130.

[0054] Specifically, after the insulating fixing structure 140 is fixed on the heat dissipation insulating substrate 130, the air core inductor L1 can be better fixed on the heat dissipation insulating substrate 130, avoiding relative displacement between the air core inductor L1 and the heat dissipation insulating substrate 130 during the use or transportation of the power combining module, thereby further extending the service life of the power combining module.

[0055] It should be noted that the number of insulating fixing structures 140 is equal to the number of air-core inductors L1 in the power combining module. Each air-core inductor L1 corresponds to one insulating fixing structure 140.

[0056] Optionally, the thickness of the first conductive unit is 3mm to 5mm; the thickness of the second conductive unit is 3mm to 5mm; the thickness of the third conductive unit is 3mm to 5mm; the thickness of the fourth conductive unit is 3mm to 5mm; the thickness of the fifth conductive unit is 3mm to 5mm; and the thickness of the sixth conductive unit is 3mm to 5mm. This configuration allows the first, second, third, fourth, fifth, and sixth conductive units to withstand a larger current, thereby ensuring that the power combining module provided in this embodiment can output a larger power without the need to form a conductive film layer through metal deposition, which greatly reduces the manufacturing cost of the power combining module.

[0057] Specifically, the thickness of the first conductive unit can be 3mm, 3.5mm, 3.8mm, 4mm or 5mm, etc.; the thickness of the second conductive unit can be 3mm, 3.5mm, 3.8mm, 4mm or 5mm, etc.; the thickness of the third conductive unit can be 3mm, 3.5mm, 3.8mm, 4mm or 5mm, etc.; the thickness of the fourth conductive unit can be 3mm, 3.5mm, 3.8mm, 4mm or 5mm, etc.; the thickness of the fifth conductive unit can be 3mm, 3.5mm, 3.8mm, 4mm or 5mm, etc.; and the thickness of the sixth conductive unit can be 3mm, 3.5mm, 3.8mm, 4mm or 5mm, etc.

[0058] Optional, continue to refer to Figures 1-3 The power combining module provided in this embodiment also includes a PCB circuit board 150; a resistor unit 120 is fixed on one side of the PCB circuit board 150; and a heat dissipation insulating substrate 130 partially surrounds the PCB circuit board 150.

[0059] Specifically, the resistor unit 120 and the transmission unit 110 are located on the same side of the heat-dissipating insulating substrate 130. The heat-dissipating insulating substrate 130 partially surrounds the PCB circuit board 150, allowing for better connection and fixation between the heat-dissipating insulating substrate and the PCB circuit board. The power combining module includes a PCB circuit board, facilitating electrical connection between the power combining module and other devices.

[0060] Optional, continue to refer to Figure 1 and Figure 2 The resistor unit includes at least two microstrip resistors R1 connected in series; the microstrip resistor R1 includes a stacked metal flange base 210 and a resistor layer subunit, the resistor layer subunit including a ceramic substrate, a microstrip resistor layer and a ceramic cover plate stacked in sequence; wherein, the ceramic substrate is located between the metal flange base 210 and the microstrip resistor layer; the metal flange base 210 includes at least two through holes 211.

[0061] Specifically, at least two through holes 211 are provided in the metal flange base 210, and the microstrip resistor R1 can be fixed to the PCB circuit board 150 by screws passing through the through holes 211.

[0062] The microstrip resistor R1 generates a lot of heat during operation, and the metal flange base 210 can quickly dissipate heat.

[0063] Optionally, the power combining module provided in this embodiment further includes multiple heat dissipation units; the heat dissipation units are located on the side of the heat dissipation insulating substrate away from the transmission unit.

[0064] Specifically, the heat dissipation unit can be a fan. By incorporating a heat dissipation unit into the power combining module, the malfunction of the power combining module due to high temperatures can be further prevented. Therefore, the power combining module provided in this embodiment has a long service life.

[0065] Optionally, the power combining module provided in this embodiment further includes multiple fixed conductive structures; the first end of the first capacitor unit is connected to the first conductive unit through a fixed conductive structure, the second end of the first capacitor unit is connected to the sixth conductive unit through a fixed conductive structure and grounded; the first conductive unit is connected to the second conductive unit through a fixed conductive structure; the first end of the inductor unit is connected to the second conductive unit through a fixed conductive structure, the second end of the inductor unit is connected to the third conductive unit through a fixed conductive structure; the third conductive unit is connected to the fourth conductive unit through a fixed conductive structure; the first end of the second capacitor unit is connected to the fourth conductive unit through a fixed conductive structure and grounded, and the second end of the second capacitor unit is connected to the fifth conductive unit through a fixed conductive structure.

[0066] Specifically, the fixed conductive structure can be a screw. In this embodiment, the connection between the components in the transmission unit is mechanical, which is convenient for installation and disassembly, reducing the manufacturing cost of the power combining module.

[0067] Optional, continue to refer to Figure 1 and Figure 2 The second conductive units 113 in each transmission unit are connected as a whole. This arrangement reduces the area occupied by each second conductive unit 113 in the power combining module, thereby reducing the volume of the power combining module.

[0068] Figure 4 This is a schematic diagram of a radio frequency power supply system according to an embodiment of the present utility model, with reference to... Figure 4 The radio frequency power supply system provided in this embodiment includes a radio frequency power supply module 200 and a power combining module 100 provided in any embodiment of this utility model.

[0069] The radio frequency power supply system provided in this embodiment includes the power combining module 200 provided in any embodiment of this utility model. Therefore, the radio frequency power supply system provided in this embodiment has the beneficial effects of the power combining module 100 provided in any embodiment of this utility model, which will not be described in detail here.

[0070] It should be understood that the various forms of the process shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this utility model can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this utility model can be achieved, and this is not limited herein.

[0071] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A power combining module, characterized in that, include: There are n transmission units and n-1 resistor units, where n is greater than or equal to 2 and is an integer; The transmission unit includes a first conductive unit, a first capacitor unit, a second conductive unit, a third conductive unit, an inductor unit, a fourth conductive unit, a fifth conductive unit, a second capacitor unit, and a sixth conductive unit; The first terminal of the first capacitor unit is connected to the first conductive unit without a solder joint; the second terminal of the first capacitor unit is connected to the sixth conductive unit without a solder joint and grounded; the first conductive unit is connected to the second conductive unit without a solder joint; the first terminal of the inductor unit is connected to the second conductive unit without a solder joint; the second terminal of the inductor unit is connected to the third conductive unit without a solder joint; the third conductive unit is connected to the fourth conductive unit without a solder joint; the first terminal of the second capacitor unit is connected to the fourth conductive unit without a solder joint and grounded; the second terminal of the second capacitor unit is connected to the fifth conductive unit without a solder joint. A resistor unit is included between two adjacent transmission units. The first end of the resistor unit is connected to the fourth conductive unit in the preceding transmission unit, and the second end of the resistor unit is connected to the fourth conductive unit in the following transmission unit. The second conductive units in two adjacent transmission units are connected without solder joints.

2. The power combining module according to claim 1, characterized in that, It also includes a heat-dissipating insulating substrate; each of the transmission units is fixed on the same side of the heat-dissipating insulating substrate.

3. The power combining module according to claim 2, characterized in that, It also includes an insulating fixing structure; The inductor unit includes an air-core inductor; The insulating fixing structure passes through the inner core of the hollow inductor and is fixed to one side of the heat dissipation insulating substrate.

4. The power combining module according to claim 1, characterized in that, The thickness of the first conductive unit ranges from 3mm to 5mm; The thickness of the second conductive unit ranges from 3mm to 5mm; The thickness of the third conductive unit ranges from 3mm to 5mm; The thickness of the fourth conductive unit ranges from 3mm to 5mm; The thickness of the fifth conductive unit ranges from 3mm to 5mm; The thickness of the sixth conductive unit ranges from 3mm to 5mm.

5. The power combining module according to claim 2, characterized in that, It also includes PCB circuit boards; The resistor unit is fixed to one side of the PCB circuit board; The heat-dissipating insulating substrate partially surrounds the PCB circuit board.

6. The power combining module according to claim 5, characterized in that, The resistor unit includes at least two microstrip resistors connected in series; The microstrip resistor includes a stacked metal flange base and resistor layer subunits; The resistive layer subunit includes a ceramic substrate, a microstrip resistive layer, and a ceramic cover plate stacked sequentially; wherein the ceramic substrate is located between the metal flange base and the microstrip resistive layer; the metal flange base includes at least two through holes.

7. The power combining module according to claim 2, characterized in that, It also includes multiple heat dissipation units; The heat dissipation unit is located on the side of the heat dissipation insulating substrate away from the transmission unit.

8. The power combining module according to claim 1, characterized in that, It also includes multiple fixed conductive structures; The first end of the first capacitor unit is connected to the first conductive unit through the fixed conductive structure; the second end of the first capacitor unit is connected to the sixth conductive unit through the fixed conductive structure and grounded; the first conductive unit and the second conductive unit are connected through the fixed conductive structure; the first end of the inductor unit is connected to the second conductive unit through the fixed conductive structure; the second end of the inductor unit is connected to the third conductive unit through the fixed conductive structure; the third conductive unit and the fourth conductive unit are connected through the fixed conductive structure; the first end of the second capacitor unit is connected to the fourth conductive unit through the fixed conductive structure and grounded; the second end of the second capacitor unit is connected to the fifth conductive unit through the fixed conductive structure.

9. The power combining module according to claim 1, characterized in that, The second conductive units in each of the transmission units are integrally connected.

10. A radio frequency power supply system, characterized in that, It includes an RF power supply module and a power combining module as described in any one of claims 1-9.

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