Protective filter circuit for Type-C interface

Abstract

The utility model provides a protection filter circuit used for a Type-C interface, comprising a plurality of ESD protection diodes, a plurality of common mode inductors and a plurality of grounding capacitors, the ESD protection diodes, the common mode inductors and the grounding capacitors are arranged close to a Type-C interface CN1, the Type-C interface CN1 is electrically connected with one end of the ESD protection diodes and one end of the common mode inductors, and the other end of the common mode inductors is electrically connected with the Type-C interface CN1. The other ends of the common-mode inductors are connected with one ends of the grounding capacitors and a main control chip U1 of the intelligent electronic equipment, the other ends of the grounding capacitors are grounded, and the plurality of common-mode inductors and the plurality of grounding capacitors form a plurality of LC filters which are connected in parallel. The high-frequency noise suppression circuit has the beneficial effects that the plurality of common-mode inductors and the plurality of grounding capacitors can remarkably suppress high-frequency noise between the main control chip U1 and the Type-C interface CN1 of the intelligent electronic equipment, and the high-frequency noise suppression circuit is simple in structure, low in cost and small in size.

Description

Technical Field

[0001] This utility model relates to the field of computer circuit technology, and specifically to a protection filter circuit for a Type-C interface. Background Technology

[0002] Type-C is a type of USB interface, officially called USB Type-C interface, and is a new form of USB interface. Its socket end measures approximately 8.3mm × 2.5mm, featuring a slim design. It supports reversible insertion and can withstand 10,000 repeated insertions and removals. Like other interfaces, it supports USB standard functions such as charging, data transfer, and display output.

[0003] Electromagnetic compatibility (EMC) refers to the ability of a device to function normally in an electromagnetic environment without causing unacceptable electromagnetic interference to other devices. EMC testing is a comprehensive evaluation of an electronic product's electromagnetic interference (EMI) and electromagnetic immunity (EMS), and is an important indicator of product quality. EMC testing is conducted in professional testing facilities and with specialized equipment to ensure the accuracy and reliability of the test results. Since the Type-C interface is used in a wide variety of electronic devices, its EMC performance is also crucial.

[0004] Currently, existing Type-C interfaces often suffer from issues such as excessive conducted emissions.

[0005] 1. At the 0.9MHz frequency point, the conducted emissions of the Type-C interface exceed the standard (typical value ≥55dBμV) due to common-mode noise coupling of VBUS (power bus) and various data lines, which exceeds the limit of GB / T9254.1-2021 Class B (quasi-peak value ≥55dBμV, average value ≤46dBμV).

[0006] 2. Traditional single-stage filter circuits have insufficient low-frequency suppression capabilities. On the VBUS (Power Bus) of the Type-C interface, signal interference is significant, mainly because VBUS is responsible for transmitting communication signals between power and fast charging protocols (such as PD protocol). When power and communication signals are mixed on the same bus, high-frequency noise, transient voltage changes, or electromagnetic interference (EMI) may affect the VBUS signal, leading to problems such as fast charging protocol handshake failure, power instability, or abnormal device restarts.

[0007] 3. The excessive spacing between traditional filtering components and the Type-C interface leads to increased impedance in the high-frequency noise return path and exacerbates near-field coupling effects;

[0008] 4. The traditional location of the filter grounding capacitor is not reasonable enough, and it fails to form an effective low-impedance noise discharge path. Utility Model Content

[0009] To address the problems in the prior art, this utility model provides a protection filtering circuit for the Type-C interface. By setting multiple ESD protection diodes, multiple common-mode inductors, and multiple grounding capacitors between the main control chip U1 of the smart electronic device and the Type-C interface CN1, the multiple common-mode inductors and multiple grounding capacitors can significantly suppress high-frequency noise between the main control chip U1 of the smart electronic device and the Type-C interface CN1. The circuit is simple in structure, low in cost, and small in size, solving the problem that the existing Type-C interface often has excessive conducted emissions, resulting in electromagnetic compatibility performance that fails to meet people's needs.

[0010] This utility model provides a protection filtering circuit for a Type-C interface, which is disposed between the main control chip U1 of a smart electronic device and the Type-C interface CN1. It includes multiple ESD protection diodes, multiple common-mode inductors, and multiple grounding capacitors. The ESD protection diodes, common-mode inductors, and grounding capacitors are all located close to the Type-C interface CN1. The Type-C interface CN1 is electrically connected to one end of the ESD protection diodes and one end of the common-mode inductors. The other end of the common-mode inductors is connected to one end of the grounding capacitor and the main control chip U1 of the smart electronic device. The other end of the grounding capacitor is grounded. The multiple common-mode inductors and multiple grounding capacitors form multiple parallel LC filters, which can suppress high-frequency noise between the main control chip U1 of the smart electronic device and the Type-C interface CN1.

[0011] In a further improvement to this invention, the grounding capacitors are all located between the Type-C interface CN1 and the common-mode inductor, and are positioned close to the Type-C interface CN1.

[0012] In a further improvement to this invention, the grounding capacitor is a ceramic capacitor with a capacitance of 0.1μF or a ceramic capacitor with a capacitance of 0.01μF.

[0013] This utility model is further improved in that each of the multiple common-mode inductors has 4 pins, and the multiple common-mode inductors are named common-mode inductor L1, common-mode inductor L2, common-mode inductor L3, common-mode inductor L4, common-mode inductor L5 and common-mode inductor L6. The multiple grounding capacitors are named grounding capacitor C1, grounding capacitor C2, grounding capacitor C3, grounding capacitor C4, grounding capacitor C5, grounding capacitor C6, grounding capacitor C7, grounding capacitor C8, grounding capacitor C9, grounding capacitor C10 and grounding capacitor C11. The Type-C interface CN1 has 24 pins, and pin A02 of the Type-C interface CN1 is connected to pin 3 of the common-mode inductor L1. Pin 3 is connected to pin 2 of the common-mode inductor L1. Pin 1 of the common-mode inductor L1 is connected to one end of the grounding capacitor C2 and the main control chip U1 of the intelligent electronic device. Pin 4 of the common-mode inductor L1 is connected to one end of the grounding capacitor C1 and the main control chip U1 of the intelligent electronic device. Pin A06 of the Type-C interface CN1 is connected to pin 3 of the common-mode inductor L2. Pin A07 of the Type-C interface CN1 is connected to pin 2 of the common-mode inductor L2. Pin 1 of the common-mode inductor L2 is connected to one end of the grounding capacitor C4 and the main control chip U1 of the intelligent electronic device. Pin 4 of the common-mode inductor L2 is connected to one end of the grounding capacitor C3. The main control chip U1 of the intelligent electronic device is connected. Pin A10 of the Type-C interface CN1 is connected to pin 3 of the common-mode inductor L3. Pin A11 of the Type-C interface CN1 is connected to pin 2 of the common-mode inductor L3. Pin 1 of the common-mode inductor L3 is connected to one end of the grounding capacitor C6 and the main control chip U1 of the intelligent electronic device. Pin 4 of the common-mode inductor L3 is connected to one end of the grounding capacitor C5 and the main control chip U1 of the intelligent electronic device. Pin B03 of the Type-C interface CN1 is connected to pin 1 of the common-mode inductor L4. Pin B02 of the Type-C interface CN1 is connected to pin 4 of the common-mode inductor L4. The common-mode inductor L4 is connected to one end of the grounding capacitor C9 and the main control chip U1 of the intelligent electronic device. The third pin of the common-mode inductor L4 is connected to one end of the grounding capacitor C10 and the main control chip U1 of the intelligent electronic device. The B11 pin of the Type-C interface CN1 is connected to the first pin of the common-mode inductor L5. The B10 pin of the Type-C interface CN1 is connected to the fourth pin of the common-mode inductor L5. The second pin of the common-mode inductor L5 is connected to one end of the grounding capacitor C7 and the main control chip U1 of the intelligent electronic device. The third pin of the common-mode inductor L5 is connected to one end of the grounding capacitor C8 and the main control chip U1 of the intelligent electronic device.Pins A09 and B04 of the Type-C interface CN1 are connected to pin 4 of the common-mode inductor L6. Pin 3 of the common-mode inductor L6 is connected to one end of the grounding capacitor C11 and the main control chip U1 of the intelligent electronic device. The other ends of the grounding capacitors C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, and C11 are grounded.

[0014] This utility model is further improved in that the plurality of ESD protection diodes are designated as ESD protection diode D1 and ESD protection diode D2. Both ESD protection diodes D1 and D2 have 10 pins. Pin 1 of ESD protection diode D1 is connected to pin 10 of ESD protection diode D1, pin B11 of the Type-C interface CN1, and pin 1 of the common-mode inductor L5. Pin 2 of ESD protection diode D1 is connected to pin 9 of ESD protection diode D1, pin B10 of the Type-C interface CN1, and pin 4 of the common-mode inductor L5. Pin 4 of ESD protection diode D1 is connected to pin 7 of ESD protection diode D1, pin A02 of the Type-C interface CN1, and pin 3 of the common-mode inductor L1. Pin 5 of ESD protection diode D1 is connected to... Pin 6 of the ESD protection diode D2 is connected to pin A03 of the Type-C interface CN1 and pin 2 of the common-mode inductor L1. Pin 1 of the ESD protection diode D2 is connected to pin 10 of the ESD protection diode D2, pin B02 of the Type-C interface CN1 and pin 4 of the common-mode inductor L4. Pin 2 of the ESD protection diode D2 is connected to pin 9 of the ESD protection diode D2, pin B03 of the Type-C interface CN1 and pin 1 of the common-mode inductor L4. Pin 4 of the ESD protection diode D2 is connected to pin 7 of the ESD protection diode D2, pin A11 of the Type-C interface CN1 and pin 2 of the common-mode inductor L3. Pin 5 of the ESD protection diode D2 is connected to pin 6 of the ESD protection diode D2, pin A10 of the Type-C interface CN1 and pin 3 of the common-mode inductor L3.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows: It provides a protection filtering circuit for the Type-C interface. By setting multiple ESD protection diodes, multiple common-mode inductors, and multiple grounding capacitors between the main control chip U1 of the smart electronic device and the Type-C interface CN1, the multiple common-mode inductors and multiple grounding capacitors can significantly suppress high-frequency noise between the main control chip U1 of the smart electronic device and the Type-C interface CN1, meeting the CE test requirements in the GBT 9254.1-2021 standard. Moreover, while suppressing differential and common-mode interference, it does not affect the fast charging protocol handshake. The common-mode inductors have little impact on differential-mode signals, and the grounding capacitors have little impact on low-frequency signals. Furthermore, it does not affect the power supply voltage, making it suitable for applications that require stable power supply voltage. It has a simple structure, low cost, and small size, making it suitable for the compact layout of modern electronic devices. It solves the problem that existing Type-C interfaces often have excessive conducted emissions, resulting in electromagnetic compatibility performance that fails to meet user needs. Attached Figure Description

[0016] To more clearly illustrate the solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a circuit diagram of a protection filter circuit for a Type-C interface according to the present invention. Detailed Implementation

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used herein in the specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and accompanying drawings of this invention are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or accompanying drawings of this invention are used to distinguish different objects, not to describe a particular order.

[0019] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the present invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0020] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0021] like Figure 1 As shown, this utility model provides a protection filter circuit for a Type-C interface, which is set between the main control chip U1 of the intelligent electronic device and the Type-C interface CN1. It includes multiple ESD protection diodes, multiple common-mode inductors, and multiple grounding capacitors. The ESD protection diodes, common-mode inductors, and grounding capacitors are all set close to the Type-C interface CN1. The Type-C interface CN1 is electrically connected to one end of the ESD protection diodes and one end of the common-mode inductors. The other end of the common-mode inductors is connected to one end of the grounding capacitors and the main control chip U1 of the intelligent electronic device. The other end of the grounding capacitors is grounded. The grounding capacitors are all set between the Type-C interface CN1 and the common-mode inductors, and are set close to the Type-C interface CN1. The grounding capacitors are 0.1μF ceramic capacitors or 0.01μF ceramic capacitors. In this embodiment, multiple common-mode inductors and multiple grounding capacitors form multiple parallel LC filters. These multiple common-mode inductors and multiple grounding capacitors can suppress high-frequency noise between the main control chip U1 of the smart electronic device and the Type-C interface CN1, meeting the CE test requirements in the GBT 9254.1-2021 standard. Moreover, while suppressing differential and common-mode interference, it does not affect the fast charging protocol handshake. The common-mode inductors have little impact on differential-mode signals, and the grounding capacitors have little impact on low-frequency signals. Furthermore, they do not affect the power supply voltage, making them suitable for applications that require stable power supply voltage. The structure is simple, the cost is low, and the size is small, making it suitable for the compact layout of modern electronic devices.

[0022] like Figure 1As shown, multiple common-mode inductors each have four pins. These common-mode inductors are designated L1, L2, L3, L4, L5, and L6. Multiple grounding capacitors are designated C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, and C11. The Type-C interface CN1 has 24 pins. Pin A02 of the Type-C interface CN1 is connected to pin 3 of the common-mode inductor L1, and pin A03 of the Type-C interface CN1 is connected to pin 2 of the common-mode inductor L1. Pin 1 of common-mode inductor L1 is connected to one end of grounding capacitor C2 and the main control chip U1 of the intelligent electronic device. Pin 4 of common-mode inductor L1 is connected to one end of grounding capacitor C1 and the main control chip U1 of the intelligent electronic device. Pin A06 of Type-C interface CN1 is connected to pin 3 of common-mode inductor L2. Pin A07 of Type-C interface CN1 is connected to pin 2 of common-mode inductor L2. Pin 1 of common-mode inductor L2 is connected to one end of grounding capacitor C4 and the main control chip U1 of the intelligent electronic device. Pin 4 of common-mode inductor L2 is connected to one end of grounding capacitor C3 and the main control chip U1 of the intelligent electronic device. Pin A10 of Type-C interface CN1 is connected to common-mode inductor L2. Pin 3 of common-mode inductor L3 is connected to the grounding capacitor C6. Pin A11 of Type-C interface CN1 is connected to pin 2 of common-mode inductor L3. Pin 1 of common-mode inductor L3 is connected to one end of grounding capacitor C6 and the main control chip U1 of the intelligent electronic device. Pin 4 of common-mode inductor L3 is connected to one end of grounding capacitor C5 and the main control chip U1 of the intelligent electronic device. Pin B03 of Type-C interface CN1 is connected to pin 1 of common-mode inductor L4. Pin B02 of Type-C interface CN1 is connected to pin 4 of common-mode inductor L4. Pin 2 of common-mode inductor L4 is connected to one end of grounding capacitor C9 and the main control chip U1 of the intelligent electronic device. Pin 3 of common-mode inductor L4 is connected to grounding capacitor C6. One end of the type-C interface CN1 is connected to the main control chip U1 of the intelligent electronic device. Pin B11 of the type-C interface CN1 is connected to pin 1 of the common-mode inductor L5. Pin B10 of the type-C interface CN1 is connected to pin 4 of the common-mode inductor L5. Pin 2 of the common-mode inductor L5 is connected to one end of the grounding capacitor C7 and the main control chip U1 of the intelligent electronic device. Pin 3 of the common-mode inductor L5 is connected to one end of the grounding capacitor C8 and the main control chip U1 of the intelligent electronic device. Pins A09 and B04 of the type-C interface CN1 are connected to pin 4 of the common-mode inductor L6. Pin 3 of the common-mode inductor L6 is connected to one end of the grounding capacitor C11 and the main control chip U1 of the intelligent electronic device.The other ends of grounding capacitors C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, and C11 are grounded. Multiple ESD protection diodes are designated as ESD protection diodes D1 and D2. Both D1 and D2 have 10 pins. Pin 1 of D1 is connected to pin 10, pin B11 of Type-C interface CN1, and pin 1 of common-mode inductor L5. Pin 2 of D1 is connected to pin 9, pin B10 of Type-C interface CN1, and pin 4 of common-mode inductor L5. Pin 4 of D1 is connected to pin 7 and pin 8. Pin A02 of the e-C interface CN1 is connected to pin 3 of the common-mode inductor L1. Pin 5 of the ESD protection diode D1 is connected to pin 6 of the ESD protection diode D1, pin A03 of the Type-C interface CN1, and pin 2 of the common-mode inductor L1. Pin 1 of the ESD protection diode D2 is connected to pin 10 of the ESD protection diode D2, pin B02 of the Type-C interface CN1, and pin 4 of the common-mode inductor L4. Pin 2 of the ESD protection diode D2 is connected to pin 9 of the ESD protection diode D2, pin B03 of the Type-C interface CN1, and pin 1 of the common-mode inductor L4. Pin 4 of the ESD protection diode D2 is connected to pin 7 of the ESD protection diode D2, pin A11 of the Type-C interface CN1, and pin 2 of the common-mode inductor L3. Pin 5 of the ESD protection diode D2 is connected to pin 6 of the ESD protection diode D2, pin A10 of the Type-C interface CN1, and pin 3 of the common-mode inductor L3. In this embodiment, the present invention aims to provide a protective filtering circuit for a Type-C interface. Adding a filtering circuit to the Type-C interface CN1 suppresses differential-mode and common-mode interference while ensuring normal handshake of the PD (Power Delivery) fast charging protocol. This is a problem requiring comprehensive consideration of circuit design and electromagnetic compatibility (EMC). It solves the problem of conducted emissions exceeding limits due to common-mode noise coupling caused by interference signals emitted by the Type-C interface of the device under test through power lines, signal lines, and interconnects. This ensures that other devices operating on the public power grid are protected from interference.

[0023] When external electrostatic discharge or other interference signals enter the device through the Type-C interface CN1, the ESD protection diodes D1 and D2 have a specific clamping voltage. When the input voltage exceeds this value, the diodes will quickly conduct, clamping the excessive voltage within a safe range. The signal processed by the ESD protection diode group enters the common mode inductor.

[0024] Filtering process: 1. When common-mode noise passes through common-mode inductors L1, L2, L3, L4, L5, and L6, the magnetic fields of the inductors are superimposed due to the same current direction in the two conductors, resulting in a large impedance on the inductors and thus attenuating the noise; 2. Grounding capacitors C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, and C11 provide a low-impedance path for the common-mode noise, guiding it to the ground wire and further suppressing the noise.

[0025] The filtering circuit processes signals on the power bus:

[0026] 1. Direct Current Voltage (DC):

[0027] Parallel LC filters have a relatively small impact on DC voltage because the impedance of the inductor to DC voltage is close to zero.

[0028] Capacitors have a relatively small impact on DC voltage because they are essentially disconnected under DC conditions.

[0029] 2. Alternating Current (AC) Noise:

[0030] Inductors have high impedance to high-frequency noise and can effectively suppress high-frequency differential-mode interference.

[0031] Capacitors have low impedance to high-frequency noise and can bypass high-frequency common-mode noise to ground.

[0032] 3. PD protocol signals:

[0033] The filtering circuit needs to maintain transparency to the PD protocol signal, that is, it should not cause significant attenuation or phase shift of the voltage modulation signal.

[0034] Through the above design and implementation methods, a filter circuit can be added to the power bus to effectively suppress differential-mode and common-mode interference, while ensuring the normal handshake of fast charging protocols such as PD.

[0035] As can be seen from the above, this utility model provides a protection filtering circuit for a Type-C interface. By setting multiple ESD protection diodes, multiple common-mode inductors, and multiple grounding capacitors between the main control chip U1 of the smart electronic device and the Type-C interface CN1, the multiple common-mode inductors and multiple grounding capacitors can significantly suppress high-frequency noise between the main control chip U1 of the smart electronic device and the Type-C interface CN1, meeting the CE test requirements in the GBT 9254.1-2021 standard. Moreover, while suppressing differential and common-mode interference, it does not affect the fast charging protocol handshake. The common-mode inductors have little impact on differential-mode signals, and the grounding capacitors have little impact on low-frequency signals, and do not affect the power supply voltage. It is suitable for applications that require stable power supply voltage. The structure is simple, the cost is low, and the size is small, which is suitable for the compact layout of modern electronic devices. It solves the problem that existing Type-C interfaces often have excessive conducted emissions, resulting in electromagnetic compatibility performance that is difficult to meet people's needs.

[0036] The specific embodiments described above are preferred embodiments of this utility model, and are not intended to limit the specific scope of this utility model. The scope of this utility model includes but is not limited to the specific embodiments described above. All equivalent changes made in accordance with this utility model are within the protection scope of this utility model.

Claims

1. A protection filter circuit for a Type-C interface, disposed between the main control chip U1 and the Type-C interface CN1 of a smart electronic device, characterized in that: The device includes multiple ESD protection diodes, multiple common-mode inductors, and multiple grounding capacitors. The ESD protection diodes, common-mode inductors, and grounding capacitors are all positioned close to the Type-C interface CN1. The Type-C interface CN1 is electrically connected to one end of each ESD protection diode and one end of each common-mode inductor. The other end of each common-mode inductor is connected to one end of each grounding capacitor and the main control chip U1 of the intelligent electronic device. The other end of each grounding capacitor is grounded. The multiple common-mode inductors and multiple grounding capacitors form multiple parallel LC filters, which can suppress high-frequency noise between the main control chip U1 of the intelligent electronic device and the Type-C interface CN1.

2. The protection filtering circuit for a Type-C interface according to claim 1, characterized in that: The grounding capacitors are all located between the Type-C interface CN1 and the common-mode inductor, and are positioned close to the Type-C interface CN1.

3. The protection filtering circuit for a Type-C interface according to claim 2, characterized in that: The grounding capacitor is a ceramic capacitor with a capacitance of 0.1μF or a ceramic capacitor with a capacitance of 0.01μF.

4. The protection filtering circuit for a Type-C interface according to claim 3, characterized in that: Each of the aforementioned common-mode inductors has four pins. The common-mode inductors are designated as L1, L2, L3, L4, L5, and L6. The aforementioned grounding capacitors are designated as C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, and C11. The Type-C interface CN1 has 24 pins. Pin A02 of the Type-C interface CN1 is connected to pin 3 of the common-mode inductor L1, and pin A03 of the Type-C interface CN1 is connected to the common-mode inductor L1. Pin 2 of common-mode inductor L1 is connected to the grounding capacitor C2, pin 1 of common-mode inductor L1 is connected to one end of the grounding capacitor C2 and the main control chip U1 of the intelligent electronic device, pin 4 of common-mode inductor L1 is connected to one end of the grounding capacitor C1 and the main control chip U1 of the intelligent electronic device, pin A06 of Type-C interface CN1 is connected to pin 3 of common-mode inductor L2, pin A07 of Type-C interface CN1 is connected to pin 2 of common-mode inductor L2, pin 1 of common-mode inductor L2 is connected to one end of the grounding capacitor C4 and the main control chip U1 of the intelligent electronic device, and pin 4 of common-mode inductor L2 is connected to one end of the grounding capacitor C3 and the main control chip U1 of the intelligent electronic device. The main control chip U1 is connected to the Type-C interface CN1. Pin A10 of the Type-C interface CN1 is connected to pin 3 of the common-mode inductor L3. Pin A11 of the Type-C interface CN1 is connected to pin 2 of the common-mode inductor L3. Pin 1 of the common-mode inductor L3 is connected to one end of the grounding capacitor C6 and the main control chip U1 of the intelligent electronic device. Pin 4 of the common-mode inductor L3 is connected to one end of the grounding capacitor C5 and the main control chip U1 of the intelligent electronic device. Pin B03 of the Type-C interface CN1 is connected to pin 1 of the common-mode inductor L4. Pin B02 of the Type-C interface CN1 is connected to pin 4 of the common-mode inductor L4. Pin 2 of the common-mode inductor L4 is connected to one end of the grounding capacitor C9 and the main control chip U1 of the intelligent electronic device. Pin 3 of the common-mode inductor L4 is connected to one end of the grounding capacitor C10 and the main control chip U1 of the intelligent electronic device. Pin B11 of the Type-C interface CN1 is connected to pin 1 of the common-mode inductor L5. Pin B10 of the Type-C interface CN1 is connected to pin 4 of the common-mode inductor L5. Pin 2 of the common-mode inductor L5 is connected to one end of the grounding capacitor C7 and the main control chip U1 of the intelligent electronic device. Pin 3 of the common-mode inductor L5 is connected to one end of the grounding capacitor C8 and the main control chip U1 of the intelligent electronic device.Pins A09 and B04 of the Type-C interface CN1 are connected to pin 4 of the common-mode inductor L6. Pin 3 of the common-mode inductor L6 is connected to one end of the grounding capacitor C11 and the main control chip U1 of the intelligent electronic device. The other ends of the grounding capacitors C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, and C11 are grounded.

5. The protection filtering circuit for a Type-C interface according to claim 4, characterized in that: The plurality of ESD protection diodes are designated as ESD protection diode D1 and ESD protection diode D2. Both ESD protection diodes D1 and D2 have 10 pins. Pin 1 of ESD protection diode D1 is connected to pin 10 of ESD protection diode D1, pin B11 of the Type-C interface CN1, and pin 1 of the common-mode inductor L5. Pin 2 of ESD protection diode D1 is connected to pin 9 of ESD protection diode D1, pin B10 of the Type-C interface CN1, and pin 4 of the common-mode inductor L5. Pin 4 of ESD protection diode D1 is connected to pin 7 of ESD protection diode D1, pin A02 of the Type-C interface CN1, and pin 3 of the common-mode inductor L1. Pin 5 of ESD protection diode D1 is connected to pin 6 of ESD protection diode D1, and pin 7 of ESD protection diode D1, pin A02 of the Type-C interface CN1, and pin 3 of the common-mode inductor L1. Pin 5 of ESD protection diode D1 is connected to pin 6 of ESD protection diode D1, and pin 7 of ESD protection diode D1, pin A02 of the Type-C interface CN1, and pin 3 of the common-mode inductor L1. The A03 pin of the Type-C interface CN1 and the 2nd pin of the common-mode inductor L1 are connected. The 1st pin of the ESD protection diode D2 is connected to the 10th pin of the ESD protection diode D2, the B02 pin of the Type-C interface CN1, and the 4th pin of the common-mode inductor L4. The 2nd pin of the ESD protection diode D2 is connected to the 9th pin of the ESD protection diode D2, the B03 pin of the Type-C interface CN1, and the 1st pin of the common-mode inductor L4. The 4th pin of the ESD protection diode D2 is connected to the 7th pin of the ESD protection diode D2, the A11 pin of the Type-C interface CN1, and the 2nd pin of the common-mode inductor L3. The 5th pin of the ESD protection diode D2 is connected to the 6th pin of the ESD protection diode D2, the A10 pin of the Type-C interface CN1, and the 3rd pin of the common-mode inductor L3.

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