Water-cooling heat dissipation device

Abstract

A water-cooling heat dissipation device comprises a seat body, a cover body and a plurality of fins, the seat body is provided with a cavity, the cover body is connected with the seat body and covers the cavity, the cover body is provided with a first side face and a second side face which are opposite to each other, the first side face is used for being thermally coupled to a heat source, and the second side face faces the cavity. The fins are erected on the second side face of the cover body and located in the cavity, and a plurality of first capillary structures are arranged on the two opposite side surfaces of each fin.

Description

Technical Field

[0001] This utility model relates to a water-cooled heat dissipation device, and more particularly to a water-cooled heat dissipation device with a capillary structure. Background Technology

[0002] Electronic devices generate significant heat during operation. If this heat cannot be effectively dissipated, internal electronic components may overheat, leading to malfunctions or system crashes. Therefore, electronic devices typically incorporate cooling systems to ensure that components operate within preset temperature ranges. With increasing power density in electronic components, traditional air-cooling technology, due to its insufficient heat transfer efficiency, struggles to meet the demands of high power and high heat flux density. This has led to water-cooling technology, leveraging the efficient heat transfer and phase change capabilities of cooling fluids, becoming the mainstream technology for high-efficiency cooling systems in servers, graphics card modules, and other applications.

[0003] However, the trend towards lighter, thinner, shorter, and smaller electronic products limits heat dissipation space. Furthermore, existing water-cooling devices suffer from incomplete liquid-gas two-phase separation, leading to increased thermal resistance and impacting overall heat dissipation efficiency and reliability. Therefore, improving the heat dissipation efficiency of water-cooled plates has become a critical issue requiring immediate attention in this field. Utility Model Content

[0004] The technical problem to be solved by this utility model is to address the above-mentioned deficiencies of the prior art by providing a water-cooled heat dissipation device with a capillary structure, so as to effectively improve the heat dissipation efficiency of the water-cooled heat dissipation device and achieve efficient phase change deheating.

[0005] To achieve the above objectives, this utility model provides a water-cooled heat dissipation device, comprising:

[0006] A single body, containing a cavity;

[0007] A cover body, which engages with the seat body and covers the chamber, the cover body having a first side surface and a second side surface opposite to each other, the first side surface being thermally coupled to a heat source, and the second side surface facing the chamber; and

[0008] Multiple fins are erected on the second side of the cover and located within the cavity, and each of the multiple fins has multiple first capillary structures on opposite side surfaces.

[0009] In the aforementioned water-cooled heat dissipation device, the base has at least one first flow channel and at least one second flow channel.

[0010] The aforementioned water-cooled heat dissipation device further includes a flow channel plate, which is installed on the side of the base opposite to the cover.

[0011] In the aforementioned water-cooled heat dissipation device, the flow channel plate has a first flow channel connector, a second flow channel connector, a first channel and a second channel, and the first channel and the second channel are connected to the chamber through the at least one first flow channel connector and the at least one second flow channel connector.

[0012] In the aforementioned water-cooled heat dissipation device, the height of the plurality of first capillary structures is equal to the height of the plurality of fins.

[0013] In the aforementioned water-cooled heat dissipation device, the chamber of the base has a bottom surface facing the second side of the cover, and the bottom surface of the chamber has at least one recessed structure. The at least one recessed structure overlaps with at least one of the plurality of fins in a normal direction of the second side of the cover. The plurality of fins overlapping with the at least one recessed structure in the normal direction of the second side of the cover do not contact the base, while the plurality of fins not overlapping with the at least one recessed structure in the normal direction of the second side of the cover contact the base.

[0014] In the aforementioned water-cooled heat dissipation device, the chamber of the base has a chamber bottom surface facing the second side of the cover, and the height of the plurality of first capillary structures is less than the height of the plurality of fins, and each of the plurality of first capillary structures is spaced apart from the chamber bottom surface.

[0015] The aforementioned water-cooled heat dissipation device further includes a plurality of second capillary structures that cover the second side of the cover.

[0016] In the aforementioned water-cooled heat dissipation device, the plurality of first capillary structures are three-dimensional printed sintered structures or powder sintered structures, and the plurality of second capillary structures are three-dimensional printed sintered structures or powder sintered structures.

[0017] The aforementioned water-cooled heat dissipation device further includes a plurality of second capillary structures that cover the second side of the cover, and the chamber of the base has a bottom surface facing the second side of the cover, with one end of the plurality of fins away from the second side directly abutting the bottom surface of the chamber of the base.

[0018] In the aforementioned water-cooled heat dissipation device, the end of the plurality of first capillary structures away from the second side directly abuts against the bottom surface of the chamber of the base.

[0019] In the aforementioned water-cooled heat dissipation device, the plurality of first capillary structures are three-dimensional printed sintered structures or powder sintered structures, and the plurality of second capillary structures are copper mesh sintered structures.

[0020] In the aforementioned water-cooled heat dissipation device, the plurality of fins and the cover are integrally formed.

[0021] The beneficial effects of this utility model are as follows:

[0022] This utility model's water-cooled heat dissipation device enhances heat conduction efficiency by sintering capillary structures on the surface of the fins to increase the heat dissipation surface area of ​​the fins. Furthermore, the capillary force generated by the microporous structure formed by the capillary structures on the fins helps separate liquid and vapor in a two-phase flow cooling system, and adsorbs the liquid onto the surface of the fins that require heat dissipation, thereby effectively improving phase change heat dissipation efficiency.

[0023] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention. Attached Figure Description

[0024] Figure 1 This is a three-dimensional schematic diagram of the water-cooled heat dissipation device according to the first embodiment of this utility model;

[0025] Figure 2 for Figure 1 Exploded view of the water-cooled heat dissipation device;

[0026] Figure 3 for Figure 1 A cross-sectional view of the water-cooled heat dissipation device along section 3-3;

[0027] Figure 4 This is a perspective view of the water-cooled heat dissipation device according to the second embodiment of the present invention;

[0028] Figure 5 for Figure 4 Exploded view of the water-cooled heat dissipation device;

[0029] Figure 6 for Figure 4 A cross-sectional view of the water-cooled heat dissipation device along line 6-6;

[0030] Figure 7 This is a three-dimensional schematic diagram of the water-cooled heat dissipation device according to the third embodiment of this utility model;

[0031] Figure 8 for Figure 7 Exploded view of the water-cooled heat dissipation device;

[0032] Figure 9 for Figure 7 The water-cooled heat dissipation device is shown in the cross section along 9-9'.

[0033] Among them, the attached reference numerals

[0034] 100, 200, 300: Water-cooled heat dissipation device

[0035] 110, 210, 310: base

[0036] 111: Depressed structure

[0037] 112, 212, 312: Floor of the chamber

[0038] 113, 213, 313: First flow passage

[0039] 114, 214, 314: Second flow channel entrance

[0040] 120, 220, 320: Cover

[0041] 121, 221, 321: First side view

[0042] 122, 222, 322: Second side

[0043] 123, 223, 323: Fins

[0044] 124, 224, 324: First capillary structure

[0045] 130, 230, 330: Flow channel plate

[0046] 131, 231, 331: First flow channel connector

[0047] 132, 232, 332: Second flow channel connector

[0048] 133, 233, 333: First channel

[0049] 134, 234, 334: Second channel

[0050] 225, 325: Second capillary structure

[0051] 126, 226, 326: Flow channels

[0052] 115, 135, 136, 215, 235, 236, 315, 335, 336: Side

[0053] 227: Section

[0054] 2231, 2241, 2242: Endpoints

[0055] D: Distance

[0056] S1, S2, S3: Chambers Detailed Implementation

[0057] The structural and working principles of the present invention will be described in detail below with reference to the accompanying drawings:

[0058] The following detailed description of the embodiments of this utility model outlines its features and advantages. This content is sufficient for any person skilled in the art to understand the technical content of the embodiments of this utility model and to implement them accordingly. Furthermore, based on the disclosure, patent claims, and drawings in this specification, any person skilled in the art can easily understand the related objectives and advantages of this utility model. The following embodiments further illustrate the viewpoints of this utility model in detail, but are not intended to limit the scope of this utility model in any way.

[0059] Please see Figures 1 to 3 , Figure 1 This is a perspective view of the water-cooled heat dissipation device according to the first embodiment of this utility model. Figure 2 for Figure 1 An exploded view of the water-cooled heat dissipation device. Figure 3 for Figure 1 The water-cooled heat dissipation device is shown in section 3-3.

[0060] like Figure 1 , Figure 2 and Figure 3 As shown, the water-cooled heat dissipation device 100 of this embodiment is used to contain cooling fluid and can be fixed to an electronic device (not shown), for example, by means of assembly components. The cooling fluid may be a fluid that undergoes a two-phase change within the operating temperature range, such as, but not limited to, water or a refrigerant (models may be: R-407C, R-410A, or R-134a, etc.). The water-cooled heat dissipation device 100 includes a base 110, a cover 120, and a plurality of fins 123, each of which has a plurality of first capillary structures 124 on opposite side surfaces.

[0061] In this embodiment, the seat 110 may have a chamber S1 for accommodating cooling fluid (not shown) for heat exchange, and the chamber S1 may have a bottom surface 112. The seat 110 may also have at least one first flow channel 113 and at least one second flow channel 114 located on the bottom surface 112 of the chamber and penetrating the seat 110. Specifically, the sides of the seat 110 may also have two elongated first flow channel openings 113 and one circular second flow channel opening 114. This one first flow channel opening 113 may be located between the two second flow channel openings 114. At least one recessed structure 111 may be formed on the bottom surface 112 of the chamber of the seat 110. In this embodiment, the number of recessed structures is exemplified by multiple structures, but the present invention is not limited thereto. In other embodiments, the number of recessed structures may be one.

[0062] In this embodiment, the cover 120 has a first side 121 and a second side 122 facing each other. The first side 121 is used for thermal coupling to a heat source, wherein thermal coupling refers to direct thermal contact or heat transfer through another heat conductor. The second side 122 of the cover 120 faces the chamber S1. The cover 120 is engaged with the seat 110 and covers the chamber S1. The chamber bottom surface 112 of the seat 110 faces the second side 122 of the cover 120.

[0063] In this embodiment, the fins 123 may be sheet-like structures. Specifically, the fins 123 are arranged in two rows side by side. The fins 123 stand upright on the second side 122 of the cover 120 and are located within the chamber S1. The first capillary structures 124 may be sintered on the opposite side surfaces of each of the fins 123.

[0064] In this embodiment, the fins 123 and the cover 120 may be integrally formed, but this utility model is not limited thereto.

[0065] In this embodiment, these first capillary structures 124 may be, but are not limited to, three-dimensional printed sintered structures, powder (e.g., metal powders such as iron powder, stainless steel powder, bronze powder, brass powder, etc.) sintered structures, or ceramic sintered structures. These first capillary structures 124 are used to increase the heat dissipation surface area of ​​these fins 123, so as to obtain better heat dissipation efficiency in water-cooled heat dissipation devices of the same size. Furthermore, since metal powder also has capillary force, in the application of the two-phase flow water-cooled heat dissipation device 100, the capillary phenomenon can be used to separate the cooling fluid from the gas that evaporates when heated, so that the cooling fluid can be adsorbed onto these fins 123 that need heat dissipation, so as to achieve more efficient phase change deheating.

[0066] In this embodiment, the height of these first capillary structures 124 may be equal to the height of these fins 123. The height is the distance by which they protrude from the second side surface 122 in the normal direction of the second side surface 122. Specifically, these first capillary structures 124 extend from one end of these fins 123 to the other end of these fins 123. More specifically, these first capillary structures 124 are aligned with the opposite ends of these fins 123.

[0067] In this embodiment, at least one recessed structure 111 may overlap at least one of the fins 123 in the normal direction of the second side surface 122 of the cover 120, such that the fins 123 overlapping the at least one recessed structure 111 in the normal direction of the second side surface 122 of the cover 120 may not contact the bottom surface 112 of the chamber of the seat 110, while the fins 123 that may not overlap the at least one recessed structure 111 in the normal direction of the second side surface 122 of the cover 120 may contact the bottom surface 112 of the chamber of the seat 110. In this embodiment, since the height of the first capillary structures 124 may be equal to the height of the fins 123, some of the first capillary structures 124 contact the bottom surface 112 of the chamber, and some of the first capillary structures 124 do not contact the bottom surface 112 of the chamber.

[0068] In this embodiment, at least one recessed structure 111 formed on the bottom surface 112 of the chamber S1 of the seat 110 does not contact the bottom surface 112 of the chamber. Specifically, the at least one recessed structure 111 does not have these first capillary structures 124 sintered on it. The space created by the at least one recessed structure 111 can be used in two-phase flow applications to accommodate gases that evaporate upon heating, thereby achieving more efficient gas-liquid separation and phase change deheating.

[0069] The water-cooled heat dissipation device 100 of this embodiment may further include a flow channel plate 130. The flow channel plate 130 may have a first flow channel connector 131, a second flow channel connector 132, at least one first channel 133, and at least one second channel 134. The first flow channel connector 131 and the second flow channel connector 132 may be located on the side 135 of the flow channel plate 130 opposite to the chamber S1. The at least one first channel 133 and the at least one second channel 134 may be located on the other side 136 of the flow channel plate 130 facing the chamber S1. The flow channel plate 130 may be mounted on the side 115 of the base 110 opposite to the cover 120 by means of brazing or the like.

[0070] In this embodiment, at least one first channel 133 and at least one second channel 134 can be connected to the chamber S1 through at least one first flow port 113 and at least one second flow port 114 penetrating the seat body 110, and are used to allow cooling fluid to flow into or out of the chamber S1. In detail, cooling fluid can flow into at least one first channel 133 of the flow channel plate 130 through the first flow port 131. The at least one first channel 133 is connected to the chamber S1 through two first flow ports 113 on both sides of the seat body 110. After the cooling fluid flows through the at least one first channel 133, the cooling fluid then flows into the chamber S1 through the two first flow ports 113. Subsequently, the cooling fluid can exchange heat in the flow channel 126 between any two adjacent fins 123 in the chamber S1 to absorb the heat energy generated by the heat source transferred from the first side 121 of the cover 120 to the second side 122. After the heat exchange, the cooling fluid can flow out of the chamber S1 through at least one second flow channel port 114 in the center of the seat 110 connected to the chamber S1, and after flowing through at least one second channel 134, it flows out of the water cooling heat dissipation device 100 through the second flow channel connector port 132.

[0071] Please see Figures 4 to 6 , Figure 4 This is a perspective view of the water-cooled heat dissipation device according to the second embodiment of this utility model. Figure 5 for Figure 4 An exploded view of the water-cooled heat dissipation device. Figure 6 for Figure 4 The water-cooled heat dissipation device is shown in section 6-6.

[0072] like Figure 4 , Figure 5 and Figure 6 As shown, the water-cooled heat dissipation device 200 of this embodiment is similar to the water-cooled heat dissipation device 100 of the first embodiment. Specifically, the components of the water-cooled heat dissipation device 200 of this embodiment, which are similar to those of the water-cooled heat dissipation device 100 of the first embodiment, include: a base 210, a side 215 of the base 210, a chamber S2, a bottom surface 212 of the chamber, at least one first flow channel opening 213, at least one second flow channel opening 214, a cover 220, a first side 221 of the cover 220, a second side 222 of the cover 220, a plurality of fins 223, a first capillary structure 224, a flow channel 226, a flow channel plate 230, a first flow channel connector 231, a second flow channel connector 232, at least one first channel 233, at least one second channel 234, a side 235 of the flow channel plate 230, and the other side 236 of the flow channel plate 230. The connection relationships and detailed structures between the components similar to those in the first embodiment will not be repeated here. The following description will only focus on the differences between the water cooling heat dissipation device 200 in this embodiment and the water cooling heat dissipation device 100 in the first embodiment.

[0073] In this embodiment, the seat 210 may have a chamber bottom surface 212 facing the second side surface 222 of the cover 220. The difference from the first embodiment is that no recessed structure is formed on the chamber bottom surface 212 in this embodiment. Specifically, each of the fins 223 contacts the chamber bottom surface 212.

[0074] The difference from the first embodiment is that, in this embodiment, the height of the first capillary structures 224 is smaller than the height of the fins 223, such that each of the first capillary structures 224 is spaced apart from the bottom surface 212 of the chamber and does not contact each other. Specifically, one end 2241 of each of the first capillary structures 224 is flush with the end 2231 of the fin 223 that contacts the second side surface 222, and the other end 2242 of each of the first capillary structures 224 terminates at a position spaced apart from the bottom surface 212 of the chamber by a distance D. Specifically, in this embodiment, a segment 227 of each of the fins 223 that is not sintered with each of the first capillary structures 224 is defined by the distance D between each of the first capillary structures 224 and the bottom surface 212 of the chamber. The larger space created between the two sections 227 of any two adjacent fins 223 can be used in two-phase flow applications to accommodate gases that evaporate upon heating, achieving more efficient gas-liquid separation. These gases can be adsorbed onto the fins 223 that require heat dissipation, resulting in more efficient phase change deheating. Furthermore, the arrangement of sections 227 prevents capillary failure caused by the adsorption of solder during the brazing process of water-cooled heat dissipation devices, thus significantly and effectively increasing process yield.

[0075] The difference from the first embodiment is that the water-cooled heat dissipation device 200 in this embodiment may further include a plurality of second capillary structures 225, which cover the second side surface 222 of the cover 220. Specifically, these second capillary structures 225 are horizontally covered on the second side surface 222 of the cover 220 and are perpendicular to these first capillary structures 224.

[0076] In this embodiment, the first capillary structures 224 and the second capillary structures 225 may be, but are not limited to, three-dimensional printed sintered structures, powder (e.g., metal powders such as iron powder, stainless steel powder, bronze powder, brass powder, etc.) sintered structures, or ceramic sintered structures. The first capillary structures 224 are used to increase the heat dissipation surface area of ​​the fins 223, and the second capillary structures 225 are used to increase the heat dissipation surface area of ​​the water-cooled heat dissipation device 200, so as to obtain better heat dissipation performance in water-cooled heat dissipation devices of the same size.

[0077] Please see Figures 7 to 9 , Figure 7This is a perspective view of the water-cooled heat dissipation device 300 according to the third embodiment of this utility model. Figure 8 for Figure 7 An exploded view of the water-cooled heat dissipation device. Figure 9 for Figure 7 The water-cooled heat dissipation device is shown in section 9-9.

[0078] like Figure 7 , Figure 8 and Figure 9 As shown, the water-cooled heat dissipation device 300 of this embodiment is similar to the water-cooled heat dissipation device 100 of the first embodiment. Specifically, the water-cooled heat dissipation device 300 of this embodiment, similar to the water-cooled heat dissipation device 100 of the first embodiment, includes the following components: a base 310, a side 315 of the base 310, a chamber S3, a bottom surface 312 of the chamber, at least one first flow channel opening 313, at least one second flow channel opening 314, a cover 320, a first side 321 of the cover 320, a second side 322 of the cover 320, a plurality of fins 323, a first capillary structure 324, a flow channel 326, a flow channel plate 330, a first flow channel connector 331, a second flow channel connector 332, at least one first channel 333, at least one second channel 334, a side 335 of the flow channel plate 330, and the other side 336 of the flow channel plate 330. The connection relationships and detailed structures between the components similar to those in the first embodiment will not be repeated here. The following description will only focus on the differences between the water-cooled heat dissipation device 300 in this embodiment and the water-cooled heat dissipation device 100 in the first embodiment.

[0079] In this embodiment, the seat 310 may have a chamber bottom surface 312 facing the second side surface 322 of the cover 320. The difference from the first embodiment is that no recessed structure is formed on the chamber bottom surface 312 in this embodiment. Specifically, each of the fins 323 contacts the chamber bottom surface 312. One end of each of the fins 323, away from the second side surface 322 of the cover 320, directly abuts against the chamber bottom surface 312 of the seat.

[0080] The difference from the first embodiment is that, in this embodiment, the end of each of the first capillary structures 324 of these fins 323 that is away from the second side 322 of the cover 320 can directly abut against the bottom surface 312 of the chamber of the seat 310.

[0081] The difference from the first embodiment is that the water-cooled heat dissipation device 300 in this embodiment may further include a plurality of second capillary structures 325, which cover the second side surface 322 of the cover 320. Specifically, these second capillary structures 325 are horizontally covered on the second side surface 322 of the cover 320 and are perpendicular to these first capillary structures 324.

[0082] In this embodiment, the first capillary structures 324 and the second capillary structures 325 can be different sintering structures. Specifically, the first capillary structures 324 can be, but are not limited to, three-dimensional printing sintering structures, powder (e.g., metal powders such as iron powder, stainless steel powder, bronze powder, brass powder, etc.) sintering structures, or ceramic sintering structures, while the second capillary structures 325 can be copper mesh sintering structures. The copper mesh sintering structure of these second capillary structures 325 is used to further increase the heat dissipation surface area of ​​the water-cooled heat dissipation device 300 and enhance the capillary effect, so as to obtain better heat dissipation performance in a water-cooled heat dissipation device of the same size.

[0083] Of course, there may be other embodiments of this utility model. Without departing from the spirit and essence of this utility model, those skilled in the art can make various corresponding changes and modifications based on this utility model, but these corresponding changes and modifications should all fall within the protection scope of the appended claims of this utility model.

Claims

1. A water-cooled heat dissipation device, characterized in that, Include: A single body, containing a cavity; A cover body that engages with the seat body and covers the cavity, the cover body having a first side and a second side opposite to each other, the first side being thermally coupled to a heat source, and the second side facing the cavity. as well as Multiple fins are erected on the second side of the cover and located within the cavity, and each of the multiple fins has multiple first capillary structures on opposite side surfaces.

2. The water-cooled heat dissipation device as described in claim 1, characterized in that, The body has at least one first flow channel and at least one second flow channel.

3. The water-cooled heat dissipation device as described in claim 2, characterized in that, It also includes a flow channel plate, which is mounted on the side of the base opposite to the cover.

4. The water-cooled heat dissipation device as described in claim 3, characterized in that, The flow channel plate has a first flow channel connector, a second flow channel connector, a first channel and a second channel, and the first channel and the second channel are connected to the chamber through the at least one first flow channel connector and the at least one second flow channel connector.

5. The water-cooled heat dissipation device as described in claim 1, characterized in that, The height of the plurality of first capillary structures is equal to the height of the plurality of fins.

6. The water-cooled heat dissipation device as described in claim 4, characterized in that, The chamber of the seat has a bottom surface facing the second side of the cover, and the bottom surface of the chamber has at least one recessed structure. The at least one recessed structure overlaps with at least one of the plurality of fins in a normal direction of the second side of the cover. The plurality of fins overlapping with the at least one recessed structure in the normal direction of the second side of the cover do not contact the seat, while the plurality of fins not overlapping with the at least one recessed structure in the normal direction of the second side of the cover contact the seat.

7. The water-cooled heat dissipation device as described in claim 1, characterized in that, The chamber of the seat has a chamber bottom surface facing the second side of the cover, and the height of the plurality of first capillary structures is less than the height of the plurality of fins, each of the plurality of first capillary structures being spaced apart from the chamber bottom surface.

8. The water-cooled heat dissipation device as described in claim 7, characterized in that, It also includes a plurality of second capillary structures that cover the second side of the cover.

9. The water-cooled heat dissipation device as described in claim 8, characterized in that, The plurality of first capillary structures are stereolithographic sintered structures or powder sintered structures, and the plurality of second capillary structures are stereolithographic sintered structures or powder sintered structures.

10. The water-cooled heat dissipation device as described in claim 1, characterized in that, It also includes a plurality of second capillary structures that cover the second side of the cover, and the chamber of the seat has a chamber bottom surface facing the second side of the cover, with one end of the plurality of fins away from the second side surface directly abutting against the chamber bottom surface of the seat.

11. The water-cooled heat dissipation device as described in claim 10, characterized in that, The ends of the plurality of first capillary structures away from the second side directly abut against the bottom surface of the chamber of the seat.

12. The water-cooled heat dissipation device as described in claim 11, characterized in that, The plurality of first capillary structures are three-dimensional printed sintered structures or powder sintered structures, and the plurality of second capillary structures are copper mesh sintered structures.

13. The water-cooled heat dissipation device as described in claim 1, characterized in that, The multiple fins and the cover are integrally formed.

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