Three-phase semiconductor solid-state circuit breaker

Abstract

The utility model relates to the technical field of circuit breakers, in particular to a three-phase semiconductor solid-state circuit breaker, which is characterized in that a circuit breaker body is positioned in a shell, a heat dissipation box and mounting cavities on two sides are arranged in the shell, the heat dissipation box and the mounting cavities on the two sides are arranged in an inverted T shape, the heat dissipation box comprises a box body and heat dissipation fins positioned in the box body, and the heat dissipation fins are arranged in the box body. The radiating fins are located on the upper half portion of the box body, the lower half portion of the box body is a hollow channel, radiating holes are formed in the four vertical side faces of the lower half portion of the box body, radiating openings are formed in the faces, corresponding to the front side and the rear side of the box body, of the shell, the two ends of each radiating fin are in a triangular tip shape, and the radiating box is made of an aluminum alloy plate. The box body is slidably inserted between the mounting cavities on the two sides, and a three-phase IGBT module and a gate driving plate are respectively arranged in the mounting cavities on the two sides; and heat conduction holes are formed in the inner cavity walls of the mounting cavities on the two sides, so that the heat dissipation efficiency is improved, and the phenomenon that heat dissipation is not smooth due to non-circulation of the bottom heat dissipation channel is avoided.

Description

Technical Field

[0001] This utility model relates to the field of circuit breakers, and in particular to a three-phase semiconductor solid-state circuit breaker. Background Technology

[0002] Solid-state circuit breakers (SCBs) primarily rely on modern electronic technology to control the operating speed and accuracy of circuit breakers through contactless switching. SCBs integrate various high-end technologies, including microelectronics, modern communication, and sensor technology. Research on SCBs helps improve the stability of my country's transmission lines and the overall level of digital management of the power grid, and is also a major direction for the intelligent and modern development of circuit breakers. Circuit breakers generate a large amount of heat during operation; if this heat is not dissipated in time, malfunctions or even accidents can easily occur.

[0003] Currently, the heat dissipation methods for solid-state circuit breakers mostly involve using heat sinks to dissipate heat through radiation, or installing heat sinks on the main heat-generating components and then radiating the heat inside the solid-state circuit breaker into the air through the outer wall of the solid-state circuit breaker. However, since circuit breakers are usually installed in circuit boxes with other circuit components on both sides, the heat conduction effect of the outer wall of the solid-state circuit breaker is isolated, resulting in limited heat dissipation efficiency. Utility Model Content

[0004] The purpose of this application is to provide a three-phase semiconductor solid-state circuit breaker, which aims to solve the problems in the prior art.

[0005] This application provides a three-phase semiconductor solid-state circuit breaker, including a circuit breaker body located inside a housing. The housing contains a heat sink and two mounting cavities on either side. The heat sink and the mounting cavities are arranged in a U-shape. The heat sink includes a housing body and heat sinks located within the housing body. The heat sinks are located in the upper half of the housing body, and the lower half of the housing body is a hollow channel. Heat dissipation holes are provided on the four vertical sides of the lower half of the housing body. Heat dissipation openings are provided on the front and rear surfaces of the housing and the housing body. The heat sinks have triangular pointed ends. The heat sink is made of aluminum alloy plate. The housing body is slidably inserted between the two mounting cavities. A three-phase IGBT module and a gate driver board are respectively located in each of the two mounting cavities. Thermal conductive holes are provided on the internal walls of the two mounting cavities, and these thermal conductive holes correspond to the positions of the heat dissipation holes on the left and right sides of the housing body.

[0006] Furthermore, the outer casing has an opening on its convex top, and the tip of the heat sink is located at the opening.

[0007] Furthermore, a positioning bolt is provided on the protruding edge of the outer shell. The positioning bolt is rotatably mounted on the outer shell, and the end of the positioning bolt passes through the outer shell and connects to the internal heat dissipation box.

[0008] Furthermore, the heat-generating components in the three-phase IGBT module and the gate driver board are all mounted close to the walls of the mounting cavity on both sides of the heat sink box.

[0009] Furthermore, the bottom tip of the heat sink is located in the hollow channel, and the bottom tip occupies at most 1 / 3 of the total height of the hollow channel.

[0010] The beneficial effects of this utility model are: by using the heat dissipation box and the internal heat dissipation fins together, the hollow channel can first dissipate heat through the air circulation channel formed by the heat dissipation holes on the front and rear sides. If the channels on both sides are occupied by other circuit components, heat dissipation can also be carried out from the top through the heat dissipation fins, thereby improving the heat dissipation efficiency and avoiding the phenomenon of poor heat dissipation caused by the bottom heat dissipation channel not circulating. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0012] Figure 2 This is a schematic diagram of the split structure with a heat sink and mounting cavities on both sides.

[0013] Figure 3 This is a front structural diagram of the present utility model.

[0014] Figure 4 This is a schematic diagram of the internal structure of the heat sink.

[0015] In the picture:

[0016] 1. Outer shell; 11. Opening; 113. Positioning bolt; 13. Heat dissipation vent; 2. Mounting cavity; 21. Heat conduction hole; 3. Heat dissipation box; 31. Hollow channel; 312. Front and rear heat dissipation holes; 313. Left and right heat dissipation holes; 32. Heat sink; 321. Triangular tip. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] like Figures 1 to 4The diagram illustrates a three-phase semiconductor solid-state circuit breaker. The circuit breaker body is located within a housing 1, which is generally convex in shape with an opening at its top. The housing 1 contains a heat sink 3 and two side mounting cavities 2. The heat sink 3 and the side mounting cavities 2 are convex in shape. The heat sink 3 includes a housing body and heat sink fins 32 located within the housing body. The heat sink fins 32 are located in the upper half of the housing body, while the lower half of the housing body is a hollow channel 31. Heat dissipation holes are provided on all four vertical sides of the lower half of the housing body (front, back, left, and right). The front and back heat dissipation holes 312 are connected to heat dissipation vents 13 on the housing 1, and the left and right heat dissipation holes 313 are connected to heat conduction holes 21 on the mounting cavities 3. The outer shell 1 and the corresponding front and rear sides of the box body are provided with heat dissipation vents 13. The heat sink 32 has triangular pointed ends 321 at both ends. The heat dissipation box 3 is made of aluminum alloy plate. The heat sink 32 and the box body are both made of aluminum alloy heat dissipation substrate, which has good heat conduction function. The box body is slidably inserted between the two mounting cavities 2. The two mounting cavities 2 are respectively provided with a three-phase IGBT module and a gate driver board, which are both common circuit breaker structures. The inner cavity walls of the two mounting cavities 2 are provided with heat conduction holes 21. The heat conduction holes 21 correspond to the heat dissipation holes 312 on the left and right sides of the box body. The heat generated by the heat-generating components in the mounting cavity 2 is diffused into the hollow channel 31 of the heat dissipation box 3 through the heat conduction holes 21 and the heat dissipation holes 312.

[0019] An opening 11 is provided on the convex top of the outer casing 1. The tip of the heat sink 32 is located at the opening 11. The airflow at the top of the outer casing 1 forms a flow channel through the heat sink 32 and the hollow channel 31 inside, thereby dissipating heat from the inside of the circuit breaker.

[0020] The outer shell 1 has a positioning bolt 113 on its protruding edge. The positioning bolt 113 is rotatably mounted on the outer shell 1, and the end of the positioning bolt 113 passes through the outer shell 1 and connects with the internal heat sink 3. Since the heat sink 3 is slidably inserted into the outer shell 1, it can be taken out of the outer shell 1 for cleaning and then reinstalled. By rotating the positioning bolt 113, the heat sink 3 can be completely locked in the outer shell 1 for fixation.

[0021] The heat-generating components in the three-phase IGBT module and the gate driver board are all closely attached to the walls of the mounting cavity 2 on both sides of the heat sink box 3, and are positioned as close as possible to the heat sink box 3 so that heat can be conducted to the hollow channel 31 as soon as possible for heat dissipation, reducing the heat conduction path and improving heat dissipation efficiency.

[0022] The bottom tip of the heat sink 32 is located in the hollow channel 31, and the bottom tip occupies at most 1 / 3 of the total height of the hollow channel 31. The hollow channel 31 can first dissipate heat through the air flow channel formed by the heat dissipation holes 312 on the front and rear sides. If the channels on both sides are occupied by other circuit components, heat can also be dissipated from the top through the heat sink 31, thereby improving the heat dissipation efficiency.

[0023] The above embodiments are not intended to limit the present invention. Unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. The present invention is not limited to the examples above. Changes, modifications, additions, or substitutions made by those skilled in the art within the scope of the technical solution of the present invention are also within the protection scope of the present invention. Furthermore, the technical features involved in the different embodiments of the present application described above can be combined with each other as long as they do not conflict with each other.

[0024] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A three-phase semiconductor solid-state circuit breaker, comprising a circuit breaker body, characterized in that, The circuit breaker body is located inside the housing, which contains a heat sink and two mounting cavities on both sides. The heat sink and the mounting cavities are arranged in a U-shape. The heat sink includes a box body and heat sinks located inside the box body. The heat sinks are located in the upper half of the box body, and the lower half of the box body is a hollow channel. Each of the four vertical sides of the lower half of the box body has a heat dissipation hole. The outer shell and the front and rear sides of the box body have heat dissipation openings. The heat sinks have triangular pointed ends. The heat sink is made of aluminum alloy plate. The box body is slidably inserted between the two mounting cavities. The two mounting cavities on both sides respectively house a three-phase IGBT module and a gate driver board. The internal cavity walls of the two mounting cavities on both sides have heat conduction holes, which correspond to the positions of the heat dissipation holes on the left and right sides of the box body.

2. The three-phase semiconductor solid-state circuit breaker according to claim 1, characterized in that, The outer casing has an opening on its convex top, and the tip of the heat sink is located at the opening.

3. The three-phase semiconductor solid-state circuit breaker according to claim 2, characterized in that, The outer casing has a locating bolt on its raised edge. The locating bolt is rotatably mounted on the outer casing, and the end of the locating bolt passes through the outer casing and connects to the internal heat sink box.

4. The three-phase semiconductor solid-state circuit breaker according to claim 1, characterized in that, The heat-generating components in the three-phase IGBT module and the gate driver board are all mounted close to the walls of the mounting cavity on both sides of the heat sink box.

5. The three-phase semiconductor solid-state circuit breaker according to claim 1, characterized in that, The bottom tip of the heat sink is located in the hollow channel, and the bottom tip occupies at most 1 / 3 of the total height of the hollow channel.

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