Detachable electromagnetic shielding structure and smart watch

Abstract

The utility model provides a detachable electromagnetic shielding structure and a smart watch. The detachable electromagnetic shielding structure comprises a main board on which an area to be electromagnetically shielded is arranged; the buckle is fixed on the main board and arranged around the area to be electromagnetically shielded, and a clamping groove is formed in the center area of the buckle and suitable for installing a shielding cover; the length of the shielding cover is matched with the length of the corresponding buckle, and the shielding cover is detachably installed in the clamping groove of the buckle so as to achieve electromagnetic shielding of the area to be subjected to electromagnetic shielding. While the electromagnetic shielding effect is ensured, the electromagnetic shielding device has good maintainability, structural flexibility and higher adaptability.

Description

Technical Field

[0001] This application relates to the field of smartwatch technology, and more particularly to a detachable electromagnetic shielding structure and a smartwatch. Background Technology

[0002] In modern electronic devices, motherboards integrate numerous high-speed electronic components. These components generate electromagnetic radiation during operation and are also susceptible to external electromagnetic interference. To ensure the electrical performance and electromagnetic compatibility of the devices, electromagnetic shielding design in critical areas of the motherboard has become an indispensable technical means. Especially around sensitive modules such as radio frequency communication, power management, and high-speed interfaces, failure to take effective shielding measures may lead to signal interference, functional abnormalities, or even a decline in overall system performance.

[0003] In existing technologies, common electromagnetic shielding structures typically involve directly welding a metal shielding cover to the motherboard to cover the functional areas requiring shielding. While this welded shielding cover is simple in structure and provides reliable shielding, it also has several drawbacks. First, the structure is a one-time fixation and lacks detachability. Subsequent motherboard repair, debugging, or component replacement requires forcibly removing the shielding cover, which can easily damage the motherboard or the shielding cover itself, affecting maintenance efficiency. Second, the welding process can easily introduce quality issues such as poor welding and cold solder joints, affecting the electrical connection between the shielding cover and the motherboard and the overall shielding performance. Furthermore, traditional welding methods are difficult to adapt to certain flexible or irregularly shaped motherboard areas, limiting the flexibility and versatility of the shielding structure.

[0004] Therefore, there is an urgent need for an electromagnetic shielding structure design that can ensure electromagnetic shielding effectiveness while also possessing good maintainability, structural flexibility, and greater adaptability. Utility Model Content

[0005] In view of this, this application discloses a detachable electromagnetic shielding structure and a smartwatch, which optimizes electromagnetic shielding and anti-interference, and significantly improves the electromagnetic shielding performance of the smartwatch.

[0006] In a first aspect, this application discloses a detachable electromagnetic shielding structure, comprising: a main board having an area to be electromagnetically shielded thereon; a buckle fixed to the main board and disposed around the area to be electromagnetically shielded, wherein the central area of ​​the buckle has a slot suitable for installing a shielding cover; the length of the shielding cover matches the length of the corresponding buckle and is detachably installed in the slot of the buckle to achieve electromagnetic shielding of the area to be electromagnetically shielded.

[0007] Optionally, the buckle is an integrated buckle that surrounds the area to be electromagnetically shielded; the shielding cover is an integrated shielding cover with several downward-extending insertion pins at its bottom; the positions of the insertion pins correspond one-to-one with the slot positions of the integrated buckle, and they are inserted into the slots respectively to achieve mechanical fixation and conductive connection of the shielding cover.

[0008] Optionally, the number of clips is greater than 1, and they are distributed along the edge of the area to be electromagnetically shielded; the shielding cover is a segmented structure with multiple shielding segments corresponding to the number of clips; each shielding segment has a plug-in pin at its bottom, which is inserted into the slot of its corresponding clip to achieve mechanical fixing and conductive connection segment by segment.

[0009] Optionally, each shielding section is arranged around the area to be electromagnetically shielded, to completely enclose the area, or is arranged between the area to be electromagnetically shielded and other surrounding areas to achieve electromagnetic isolation, or is combined to have both enclosing and isolation functions.

[0010] Optionally, the plug pin has a hollow portion, and the snap fastener includes at least one protrusion, the hollow portion mating with the at least one protrusion to removably secure the plug pin in the snap fastener.

[0011] Optionally, the inner area of ​​the buckle is a conductor, the slot is electrically connected to the corresponding shield in the first direction, and is connected to the ground plane of the motherboard in the second direction, with the first direction being opposite to the second direction.

[0012] Optionally, the conductor is a metallic conductor.

[0013] Optionally, the outer area of ​​the latch is an insulator to prevent contact with functional components on the motherboard and thus avoid electrical short circuits.

[0014] Optionally, the insulator is an insulating ceramic.

[0015] Secondly, this application discloses a smartwatch, including the detachable electromagnetic shielding structure disclosed in the first aspect above.

[0016] In summary, the detachable electromagnetic shielding structure and smartwatch disclosed in this application have at least the following beneficial effects:

[0017] (1) The shielding cover is detachably installed in the slot of the clip, which facilitates the subsequent repair, replacement or debugging of the functional components on the motherboard. This avoids the problem that the motherboard is easily damaged when the traditional welded shielding cover is disassembled, thereby improving the maintainability and reusability of the whole machine.

[0018] (2) Insert the plug pins into the buckle slots. The plug pin positions correspond one-to-one with the slots to achieve conductive connection. One side of the slot is connected to the shielding cover, and the other side is connected to the motherboard ground layer so that the shielding cover can be reliably grounded, forming a closed conductive path to effectively shield electromagnetic interference, thereby improving the electromagnetic compatibility performance of the area to be electromagnetically shielded and meeting the design requirements of high-frequency and high-speed circuits.

[0019] (3) The structural design is more flexible and adjustable. It can be used for complete enclosed shielding in a compact space, as well as for electromagnetic isolation between functional areas. It is compatible with various motherboard layouts and actual use scenarios, which improves the applicability and versatility of the solution.

[0020] (4) By designing the outer side of the buckle as an insulator, the metal buckle is effectively prevented from accidentally contacting the adjacent functional components on the motherboard, reducing the risk of electrical short circuit caused by installation errors or external impacts, thereby ensuring the electrical safety and long-term stability of the whole machine. Attached Figure Description

[0021] The accompanying drawings used in the description of the embodiments of this application are briefly introduced below.

[0022] Figure 1 This is a structural example diagram of a motherboard provided in an embodiment of this application.

[0023] Figure 2 This is an example diagram of a detachable electromagnetic shielding structure (shielding cover not shown) provided in an embodiment of this application.

[0024] Figure 3 This is an example diagram of a detachable electromagnetic shielding structure (showing a shielding cover) provided in an embodiment of this application.

[0025] Figure 4 This is a structural example diagram of a connector provided in an embodiment of this application.

[0026] In the diagram: 10-Main board, 11-Electromagnetic shielding area, 12-Other areas, 13-Snap-on, 131-Protrusion, 14-Pad, 15-Shielding cover, 151-Pin, 1511-Hollow part. Detailed Implementation

[0027] To more clearly illustrate the technical solutions of the embodiments of this application, the specific implementation methods of this application will be described below with reference to the accompanying drawings. The accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without creative effort. Adjustments and improvements made without departing from the concept of this application are all within the protection scope of this application.

[0028] To keep the drawings simple, only the parts related to the corresponding embodiments are shown schematically in each figure, and they do not represent the actual structure of the product. In addition, to make the drawings simple and easy to understand, some parts with the same structure or function are only shown schematically in some figures, and there may actually be more or fewer parts with the same structure or function.

[0029] In this application, unless otherwise expressly specified and limited, ordinal numbers, such as "first," "second," etc., are used only to distinguish and describe related objects, and should not be construed as indicating or implying the relative importance or order between related objects; furthermore, they do not represent the quantity of related objects. "Multiple" includes two or more, and other quantifiers are similar. " / " is used to describe the relationship between related objects, indicating an "or" relationship between them. "And / or" is used to describe the relationship between related objects, including any combination relationship between them, such as "a and / or b" including: "a alone," "b alone," or "a and b." "One or more" or "at least one" of multiple objects refers to any object or any combination of multiple objects, such as "one or more of a1, a2, a3" or "at least one of a1, a2, a3" including: "a1 alone," "a2 alone," "a3 alone," "a1 and a2," "a1 and a3," "a2 and a3," or "a1, a2 and a3."

[0030] In modern electronic devices, the motherboard, as the system core, integrates a large number of high-speed electronic components, including processors, radio frequency modules, power modules, high-speed data interface chips, and memory. These components, operating at high frequencies and speeds, not only generate strong electromagnetic radiation themselves but are also susceptible to electromagnetic interference from the external environment. Especially in critical circuit areas such as radio frequency communication, power management, and high-speed serial buses, the lack of effective electromagnetic shielding can lead to signal crosstalk, logic errors, reduced transmission rates, and even functional failures, directly impacting the overall electrical performance and operational stability of the device.

[0031] The basic principle of electromagnetic shielding is to use conductive materials (usually metals) to reflect and absorb electromagnetic fields, thereby blocking the propagation path of electromagnetic waves in space. Specifically, when an electromagnetic wave encounters a highly conductive metal material, some of its energy is reflected back, while the rest is dissipated in the metal as eddy currents. Therefore, by placing a metal shield around the critical functional areas of the motherboard, the outward diffusion of internal electromagnetic radiation can be effectively blocked, while external electromagnetic fields can be prevented from interfering with sensitive circuits, achieving bidirectional isolation. For high-frequency circuits (such as GHz-level radio frequency signal paths), the closure of the shielding structure, grounding integrity, and contact resistance are all key factors affecting the shielding effect.

[0032] In existing technologies, the most common shielding method is to use a metal shield and fix it to the motherboard surface by welding, which is the so-called "welded shielding structure". This method has highly mature process conditions in the electronics manufacturing industry, is suitable for mass production, and has the advantages of simple structure, firm initial installation, and stable grounding path. Therefore, it is widely used in various consumer electronics products such as mobile phones, tablets, laptops, and wearable devices (such as smartwatches).

[0033] However, welded shielding covers also have several practical drawbacks. First, this structure is fixed once and cannot be disassembled. Subsequent adjustments, replacements, or repairs to chips or devices within the shielded area require forcibly removing the shielding cover or solder joints on the motherboard, easily damaging the motherboard pads or deforming and rendering the shielding cover unusable. This increases repair difficulty and cost, and in severe cases, may even necessitate replacing the entire motherboard, reducing the maintainability of the equipment. Second, the welding process requires high precision and is prone to quality issues such as cold solder joints, poor soldering, and bridging due to excessive or insufficient solder, uneven temperature control, etc. These problems can lead to poor contact between the shielding cover and the motherboard grounding layer, thus affecting the shielding effect. Furthermore, welded shielding covers, due to their rigid structure and irreversible installation method, are often unsuitable for irregularly shaped motherboards, flexible circuit boards, space-constrained areas, or post-installation shielding requirements, limiting the flexibility and modularity of structural design.

[0034] As electronic products evolve towards miniaturization, high integration, and ease of repair, the market demands higher standards for electromagnetic shielding structures: they must ensure excellent electromagnetic shielding performance while also being reusable for easy debugging and maintenance; simultaneously, they need good structural adaptability to support various motherboard types and spatial layouts. This technological trend has driven the transformation of shielding structures from traditional welded fixing methods to more modular, detachable, and flexible solutions.

[0035] Therefore, there is an urgent need to propose a new electromagnetic shielding structure design that, while ensuring the shielding effect, addresses the shortcomings of existing technologies in terms of maintainability, assembly flexibility, and structural compatibility, thereby better adapting to the complex application needs of modern electronic equipment.

[0036] The following description is in conjunction with the accompanying drawings.

[0037] Please refer to Figure 1 This diagram illustrates a structural example of a motherboard provided in an embodiment of this application. Figure 1As shown, the motherboard 10 includes an area 11 to be electromagnetically shielded, other areas 12, and clips 13. Clips 13 are positioned around the area 11 to be electromagnetically shielded, separating it from the other areas 12. Clips 13 are fixed to the motherboard 10, for example, by soldering to the motherboard 10 with pads, by screws, or by adhesive. A slot is provided in the center of clip 13 for installing a shielding cover. Figure 1 (Not shown in the image). The length of the shielding cover matches the length of the corresponding clip 13 and is detachably installed in the slot of the clip 13 to achieve electromagnetic shielding of the region 11 to be electromagnetically shielded. For example, the region 11 to be electromagnetically shielded may be a radio frequency communication module.

[0038] In the detachable electromagnetic shielding structure of this application, the clips are fixedly connected to the motherboard, while the shielding cover is detachably mounted on the clips; that is, the shielding cover does not directly contact or connect to the motherboard. The core advantage of this structural design lies in module decoupling, separating the fixed structure from the functional components. This allows the shielding cover to be replaced or upgraded independently without affecting the connection between the motherboard and the clips, thus significantly improving the flexibility of the structure and the maintainability of the system. In other words, since the shielding cover is not permanently fixed to the motherboard but is detachably installed via clips, users or maintenance personnel can easily remove or replace the shielding cover during product debugging, maintenance, or functional upgrades without damaging the original structure or performing soldering operations. This not only avoids any risks or damage to the motherboard pads, circuit paths, or component layout but also reduces the cost of reusing or replacing the shielding cover, improving the efficiency of later system maintenance.

[0039] It should be noted that the structural design of the shielding cover is closely related to its material thickness, aperture density, and surface treatment method, as these factors directly affect its electromagnetic shielding capability and thermal conductivity. In practical applications, different functional areas of the motherboard have different requirements for shielding strength and heat dissipation. For example, the radio frequency area may focus more on the integrity of electromagnetic shielding in the high-frequency band, while the high-power power management area may focus more on rapid heat dissipation. If a one-piece, non-removable shielding cover structure is used, the design parameters can only be selected once during the initial production phase, making subsequent adjustments difficult. However, with the removable structure of this application, the type of shielding cover can be flexibly selected based on actual test data or working environment requirements. For example, it can be replaced with a cover with a higher aperture ratio, stronger thermal conductivity of the material, or more shielding layers, thereby achieving a better balance between shielding performance and heat dissipation efficiency.

[0040] Furthermore, this structure boasts excellent adaptability and modular expansion capabilities. For different product models, application scenarios in different frequency bands, or debugging needs at different stages, only the shielding cover needs to be replaced to quickly adapt to new shielding strategies, without having to change the motherboard structure or redesign the shielding fixing scheme. This greatly saves product design and development time and improves the system's versatility and customization capabilities.

[0041] In some embodiments of this application, the buckle is an integrated buckle that surrounds the area to be electromagnetically shielded; the shielding cover is an integrated shielding cover with several downwardly extending plug pins at its bottom; the positions of the plug pins correspond one-to-one with the slot positions of the integrated buckle, and they are inserted into the slots respectively to achieve mechanical fixation and conductive connection of the shielding cover.

[0042] By adopting an integrated snap-fit ​​and integrated shielding cover structural design, the entire electromagnetic shielding structure forms a continuous and closed whole geometrically. Specifically, the snap-fit ​​is arranged in a closed ring structure around the area to be electromagnetically shielded, and the multiple plug-in pins at the bottom of the shielding cover correspond one-to-one with the slots on the snap-fit, achieving stable mechanical fixation and reliable conductive connection after insertion.

[0043] Compared to traditional segmented shielding structures, this integrated structure offers significant performance advantages. Because the shield is molded as a single unit, there are no seams between segments, effectively eliminating minute gaps caused by splicing errors and assembly tolerances. This significantly reduces potential leakage paths for high-frequency signals. Especially in high-frequency sensitive areas, any tiny gap can become a leakage channel or interference coupling point for electromagnetic waves. The integrated, continuous structure possesses inherent physical integrity and shielding continuity, significantly improving overall shielding integrity and high-frequency shielding effectiveness. Furthermore, this integrated structure simplifies installation procedures, reduces the number of components and assembly steps, improves production efficiency and assembly consistency, and also reduces long-term reliability risks associated with the shielding structure.

[0044] In some embodiments of this application, the number of snap fasteners is greater than one, distributed along the edge of the area to be electromagnetically shielded; the shielding cover has a segmented structure with multiple shielding segments corresponding to the number of snap fasteners; each shielding segment has a plug-in pin at its bottom, which is inserted into the slot of its corresponding snap fastener to achieve segment-by-segment mechanical fixing and conductive connection. Specifically, each segment of the shielding cover is arranged around the area to be electromagnetically shielded, used to completely enclose the area, or placed between the area to be electromagnetically shielded and other surrounding areas to achieve electromagnetic isolation, or combined to simultaneously provide both enclosing and isolation functions.

[0045] This design offers high assembly flexibility. The segmented shielding cover can be flexibly arranged to accommodate functional areas of different shapes and sizes on the motherboard, adapting to irregular structures or space-constrained installation needs, and is particularly suitable for irregular circuit areas or scenarios with complex component distributions. In actual production and assembly, it also facilitates segment-by-segment installation and debugging, improving assembly efficiency. Furthermore, compared to a one-piece shielding cover, the segmented structure has relatively lower requirements for mold processing and molding processes, reducing manufacturing complexity. During maintenance or replacement, it is not necessary to completely dismantle the shielding structure; only a portion of the shielding segment needs to be replaced, saving material costs and avoiding interference with the motherboard and other components.

[0046] Furthermore, this application designs different shielding methods to meet various electromagnetic shielding requirements, improving the overall structural flexibility. Examples include: full-enclosure shielding, electromagnetic isolation shielding, and composite shielding. Full-enclosure shielding combines multiple shielding segments into a closed-loop structure, completely enclosing the area to be shielded, suitable for core functional modules sensitive to high-frequency interference. Electromagnetic isolation shielding places shielding segments between functional areas and surrounding circuits, forming only an electromagnetic isolation barrier, suitable for mutual shielding between areas. Electromagnetic isolation shielding uses a combination of enclosing in some areas and isolating in others, achieving a refined and customized shielding strategy.

[0047] Figure 2 This is an example diagram of a detachable electromagnetic shielding structure (shielding cover not shown) provided in an embodiment of this application; Figure 3 This is an example diagram of a detachable electromagnetic shielding structure (showing a shielding cover) provided in an embodiment of this application; Figure 4 This is a structural example diagram of a connector pin provided in an embodiment of this application. Please refer to it. Figures 2 to 4 In some embodiments of this application, the plug pin 151 has a hollow portion 1511, and the snap fastener 13 includes at least one protrusion 131. The hollow portion 1511 mates with at least one protrusion 131 so that the plug pin 151 is detachably fixed in the snap fastener 13.

[0048] exist Figure 2 As can be seen, the motherboard has two latches 13, and each latch 13 includes two protrusions 131. Figure 4As can be seen, the central area of ​​the connector 151 has a hollow portion 1511. The size of the hollow portion 1511 matches the size of the protrusion 131, allowing the hollow portion 1511 and the protrusion 131 to couple together after the connector 151 of the shield 15 is inserted into the latch 13, thus achieving a fixed connection between the shield 15 and the latch 13. This fixed connection between the shield 15 and the latch 13 is detachable; that is, if needed, the shield 15 can be removed from the latch 13 and replaced with another type of shield. During replacement, the two sides of the latch 13 can be slightly separated to decouple the protrusion 131 from the hollow portion 1511, allowing the shield 15 to be removed. Figure 2 In the buckle 13, there are two protrusions 131. In some other embodiments, the buckle 13 may also include more protrusions 131 to make the connection between the shield 15 and the buckle 13 more secure. The protrusions 131 and the hollow part 1511 are preferably circular in shape. Compared with other shapes, the circular design can make it easier to install and remove the shield 15 and the buckle 13.

[0049] In some embodiments of this application, the snap-fit ​​13 is connected to the motherboard 10 via solder pads 14. This design offers advantages such as a robust structure and reliable electrical connection. Solder pads 14, as a standard circuit board connection method, facilitate mass assembly during SMT or reflow soldering, improving production efficiency. Simultaneously, the precise positioning of the solder pads 14 helps control the installation accuracy of the snap-fit ​​13, ensuring accurate alignment during the installation of the shielding cover 15. Furthermore, the soldered connection possesses good conductivity, providing a stable grounding path for the shielding structure and enhancing the overall electromagnetic shielding effect.

[0050] In some embodiments of this application, the inner region of the latch 13 is a conductor, the latch slot is electrically connected to the corresponding shielding cover 15 in a first direction, and is conductive to the ground layer of the motherboard 10 in a second direction, with the first direction being opposite to the second direction. For example, the conductor can be a metal conductor or other conductive polymer. Compared to other types of conductors, metal conductors exhibit superior electromagnetic shielding performance in applications requiring high shielding effectiveness and structural strength.

[0051] In this application, the first direction can be understood as the direction away from the motherboard 10, and the second direction can be understood as the direction towards the motherboard 10. The inner area of ​​the latch 13 can be understood as the area where the slot is located, and the outer area of ​​the latch 13 can be understood as the area that does not include the slot. This design allows the latch 13 to both mechanically fix the shielding cover 15 and provide a reliable electrical connection channel: the conductive material of the inner area of ​​the latch 13 is connected to the shielding cover in the first direction through its slot, and is connected to the grounding layer of the motherboard 10 in the second direction, thereby forming a low-impedance, continuous grounding path. This path helps to effectively introduce the electromagnetic interference signals captured by the shielding cover 15 into the ground wire, thereby improving the electromagnetic shielding efficiency and electromagnetic compatibility performance of the entire structure. In addition, the opposite arrangement of the first and second directions helps to optimize the spatial layout, which is especially suitable for compact devices, such as wearable electronic products like smartwatches.

[0052] In some embodiments of this application, the outer region of the latch 13 is an insulator to prevent contact with functional devices on the motherboard 10 that could cause an electrical short circuit. For example, the insulator is insulating ceramic. This design effectively prevents contact with functional devices on the motherboard 10 during installation or use, avoiding the risk of electrical short circuits and improving the overall electrical safety and structural compatibility of the device. It is particularly suitable for motherboard areas with dense components or limited space.

[0053] Based on a similar technical concept, this application discloses a smartwatch, including the detachable electromagnetic shielding structure disclosed in the above embodiments; the technical effects it can achieve are similar to those of the above detachable electromagnetic shielding structure, and will not be described again here.

[0054] In the above embodiments, the descriptions of each embodiment have their own emphasis. Parts not described in detail or in a particular embodiment can be referred to in the relevant descriptions of other embodiments. Furthermore, the above embodiments can be freely combined as needed.

Claims

1. A detachable electromagnetic shielding structure, characterized in that, include: The motherboard has an area on it that needs to be electromagnetically shielded. The clips fixed to the motherboard are located around the area to be electromagnetically shielded, and the central area of ​​the clips is provided with a slot suitable for installing a shielding cover. The length of the shielding cover matches the length of the corresponding buckle, and it is detachably installed in the buckle's slot to achieve electromagnetic shielding of the area to be electromagnetically shielded.

2. The detachable electromagnetic shielding structure according to claim 1, characterized in that, The buckle is an integrated buckle, which is arranged around the area to be electromagnetically shielded; The shielding cover is an integrated shielding cover with several downward-extending plug pins at its bottom; The positions of the plug pins correspond one-to-one with the slot positions of the integrated buckle, and are respectively inserted into the slots to achieve mechanical fixation and conductive connection of the shielding cover.

3. The detachable electromagnetic shielding structure according to claim 1, characterized in that, The number of the buckles is greater than 1, and they are distributed along the edge of the area to be electromagnetically shielded. The shielding cover has a segmented structure and has multiple shielding segments corresponding to the number of the buckles; Each shielding section has a plug-in pin at its bottom, which is inserted into the slot of its corresponding buckle to achieve mechanical fixation and conductive connection segment by segment.

4. The detachable electromagnetic shielding structure according to claim 3, characterized in that, Each shielding cover is arranged around the area to be electromagnetically shielded, to completely enclose the area to be electromagnetically shielded, or to be arranged between the area to be electromagnetically shielded and other surrounding areas to achieve electromagnetic isolation, or to have both enclosing and isolation functions in combination.

5. The detachable electromagnetic shielding structure according to any one of claims 2-4, characterized in that, The plug pin has a hollow portion, and the buckle includes at least one protrusion, the hollow portion matching the at least one protrusion to detachably secure the plug pin in the buckle.

6. The detachable electromagnetic shielding structure according to claim 1, characterized in that, The inner area of ​​the buckle is a conductor, and the slot is electrically connected to the corresponding shield in a first direction and conductive to the ground layer of the motherboard in a second direction. The first direction is opposite to the second direction.

7. The detachable electromagnetic shielding structure according to claim 6, characterized in that, The conductor is a metallic conductor.

8. The detachable electromagnetic shielding structure according to claim 1, characterized in that, The outer area of ​​the latch is an insulator to prevent contact with functional components on the motherboard and thus avoid electrical short circuits.

9. The detachable electromagnetic shielding structure according to claim 8, characterized in that, The insulator is an insulating ceramic.

10. A smartwatch, characterized in that, Includes the detachable electromagnetic shielding structure as described in any one of claims 1-9.

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