Packaging mold

Abstract

The utility model belongs to the technical field, and particularly relates to a packaging structure and a packaging mold. The packaging structure comprises a packaging body and a cooling fin, and the side edge of the packaging body is provided with at least one positioning hole. The cooling fin is attached to the surface of the packaging body, and a positioning hole penetrating through the packaging body is communicated to the surface of the cooling fin. The bridge rectifier packaging body is used for solving the problem that the bridge rectifier packaging body is poor in heat dissipation effect. The surface of the packaging body is provided with the cooling fins in an attached mode, the temperature of the packaging body is dissipated in an accelerated mode, meanwhile, the positioning holes are formed in the packaging body, the positioning holes are communicated with the cooling fins, the cooling fins can be abutted against and fixed through the positioning holes when the cooling fins are combined with the packaging body, and the situation that glue overflows during plastic packaging of the packaging body is avoided.

Description

Technical Field

[0001] This utility model belongs to the technical field, specifically relating to a packaging structure and packaging mold. Background Technology

[0002] Rectifier circuits primarily utilize the unidirectional conductivity of diodes. A half-wave rectifier circuit, in particular, requires only one diode and one load resistor. Its advantages include simple circuit structure, low cost, and ease of understanding and implementation. However, its disadvantages are also apparent: half-wave rectification has lower efficiency. Because it only utilizes half a cycle of the AC voltage, the output DC voltage ripple is relatively large, and the rectification efficiency is also low.

[0003] With the development of technology, full-wave rectifier circuits began to be used, and the concept of bridge rectifiers emerged. A bridge rectifier is a rectifier device that packages four diodes together. It is usually square in shape and has four leads. The four diodes inside the bridge rectifier are connected in the manner of a bridge rectifier circuit, thus forming a diode bridge rectifier circuit. This packaging form makes the circuit design simpler and reduces the wiring errors and space occupation that may occur when connecting four diodes individually.

[0004] However, bridge rectifiers generate heat during operation. The heat dissipation method of bridge rectifiers is to conduct internal heat to the surface through the encapsulation material and then dissipate the heat to the surrounding air through the surface of the encapsulation. This heat dissipation method is not very effective and cannot achieve the required heat dissipation effect. Utility Model Content

[0005] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a packaging structure and packaging mold to solve the problem of poor heat dissipation of bridge rectifier package.

[0006] On the one hand, the technical solution of this utility model to solve the above-mentioned technical problems is as follows: a packaging structure, comprising:

[0007] The package body has at least one positioning hole on its side;

[0008] A heat sink is attached to the surface of the package, and the positioning hole through the package connects to the surface of the heat sink.

[0009] Compared with existing technologies, the above technical solutions have the following beneficial effects:

[0010] A heat sink is attached to the surface of the package to accelerate the dissipation of the package's temperature. At the same time, positioning holes are provided on the package, which are connected to the heat sink. When the heat sink is attached to the package, the positioning holes hold the heat sink in place and prevent glue overflow during the encapsulation process.

[0011] Based on the above technical solution, the embodiments of this application can be further improved as follows:

[0012] In one embodiment, the heat sink is a metal heat sink or a ceramic heat sink.

[0013] In one embodiment, two positioning holes are provided, and the two positioning holes are symmetrically arranged on both sides of the package body.

[0014] On the other hand, this utility model also discloses a packaging mold for forming the above-mentioned packaging structure, which includes a lower mold and an upper mold that matches the lower mold. The upper mold is provided with a pin that passes through the positioning hole and the pin is used to abut against the surface of the heat sink.

[0015] In one embodiment, the lower mold is provided with a stepped groove that matches the heat sink.

[0016] In one embodiment, the end of the ejector pin abuts against the edge of the stepped groove and the heat sink.

[0017] In one embodiment, the upper mold and the lower mold are provided with a plurality of baffles at intervals to separate the upper mold and the lower mold to form a plurality of mold recesses for molding the package body, and the stepped groove is provided in the mold recesses.

[0018] In one embodiment, the upper mold is provided with a pin, and the lower mold is provided with a pin sleeve that matches the pin.

[0019] In one embodiment, the upper mold is provided with a through-hole for ejector pins. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of this utility model.

[0022] Figure 2 This is a front view structural diagram of the upper mold in Embodiment 2 of this utility model.

[0023] Figure 3 This is a front view structural diagram of the lower mold in Embodiment 2 of this utility model.

[0024] Figure 4This is a cross-sectional view of the upper and lower molds in Embodiment 2 of this utility model.

[0025] Figure label:

[0026] 1. Package; 2. Heat sink; 3. Positioning holes;

[0027] 4. Upper mold; 5. Lower mold; 6. Ejector pin; 7. Step groove; 8. Retaining wall; 9. Mold socket; 10. Pin; 11. Pin sleeve; 12. Ejector pin hole. Detailed Implementation

[0028] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of protection of the present invention.

[0029] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this utility model pertains.

[0030] In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly defined.

[0032] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0033] Example 1

[0034] like Figure 1As shown, the present invention provides a packaging structure comprising: a package body 1 and a heat sink 2. The package body 1 is used to enclose the internal diode, serving to provide insulation and heat conduction.

[0035] At least one positioning hole 3 is provided on the side of the package 1. The positioning hole 3 can be a complete hole that passes through the package 1 or a notch located on the side of the package 1. It mainly passes through the front and back of the package 1. The heat sink 2 is attached to the surface of the package 1. Specifically, the heat sink 2 is attached to the front or back of the package 1 to achieve a better heat dissipation effect. The positioning hole 3 that passes through the package 1 is connected to the surface of the heat sink 2, so that the heat sink 2 located on the back of the package 1 can be contacted from the front of the package 1 through the positioning hole 3, which facilitates the positioning of the heat sink 2.

[0036] A heat sink 2 is attached to the surface of the package 1 to accelerate the dissipation of the temperature of the package 1. At the same time, a positioning hole 3 is provided on the package 1, which is connected to the heat sink 2. When the heat sink 2 is combined with the package 1, the positioning hole 3 can hold the heat sink 2 in place and prevent the heat sink 2 from overflowing during the plastic encapsulation of the package 1.

[0037] In this embodiment, the heat sink 2 is a metal heat sink 2 or a ceramic heat sink 2.

[0038] To ensure the stability of the heat sink 2, two positioning holes 3 are provided. The two positioning holes 3 are symmetrically arranged on both sides of the package body 1. Two ejector pins 6 can be inserted through the two positioning holes 3 to abut and fix the heat sink 2, thus avoiding glue overflow during packaging.

[0039] Example 2

[0040] like Figure 2-4 This embodiment also discloses a packaging mold for forming the above-mentioned packaging structure, which includes a lower mold 5 and an upper mold 4 that matches the lower mold 5. The upper mold 4 is provided with an ejector pin 6 that passes through the positioning hole 3. The ejector pin 6 is used to abut against the surface of the heat sink 2. Specifically, when the upper mold 4 and the lower mold 5 are closed, the ejector pin 6 of the upper mold 4 is used to pass through the positioning hole 3 and abut against the heat sink 2 located in the lower mold 5 to fix the heat sink 2.

[0041] To further ensure the position of the heat sink 2 during packaging and prevent the heat sink 2 from rotating, the lower mold 5 is provided with a stepped groove 7 that matches the heat sink 2. The stepped groove 7 is a recessed space in which the heat sink 2 is placed. The edges of the stepped groove 7 limit the heat sink 2 and prevent the stepped groove 7 from rotating or undergoing other actions.

[0042] Specifically, the thickness of the heat sink 2 is consistent with that of the stepped groove 7, so that the end of the ejector pin 6 abuts against the edge of the stepped groove 7 and the heat sink 2. At this time, the bottom end of the ejector pin 6 can abut against both the stepped groove 7 and the heat sink 2. Through the abutment of the ejector pin 6, the vertical displacement of the heat sink 2 in the stepped groove 7 can be restricted, thus avoiding the situation of glue overflow during encapsulation.

[0043] The upper mold 4 and the lower mold 5 are provided with a plurality of baffles 8 at intervals to separate the upper mold 4 and the lower mold 5 to form a plurality of mold recesses 9 for molding the package body 1. Each mold recess 9 is used to place the filler material of the package body 1. The stepped groove 7 is provided in the mold recess 9 so that the heat sink 2 can be integrally molded with the package body 1 during packaging.

[0044] To ensure the positioning of the entire package 1 in each mold cavity 9, the upper mold 4 is provided with a pin 10, and the lower mold 5 is provided with a pin sleeve 11 that matches the pin 10. When the upper mold 4 and the lower mold 5 are closed, the pin 10 and the pin sleeve 11 are nested together.

[0045] To facilitate demolding, the upper mold 4 is provided with ejector pin holes 12. When the upper mold 4 and the lower mold 5 are separated, the ejector pin holes 12 can prevent sticking. At the same time, the ejector pin holes 12 contain mold serial numbers so that each piece of material can be identified in which mold cavity 9.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A packaging mold for forming a packaging structure, characterized in that, The packaging structure includes: The package body has at least one positioning hole on its side; A heat sink is attached to the surface of the package body, and the positioning hole through the package body is connected to the surface of the heat sink. The packaging mold includes a lower mold and an upper mold that matches the lower mold. The upper mold is provided with an ejector pin that passes through the positioning hole and is used to abut against the surface of the heat sink.

2. The packaging mold according to claim 1, characterized in that, The heat sink can be a metal heat sink or a ceramic heat sink.

3. The packaging mold according to claim 1, characterized in that, The positioning hole is provided in two parts, and the two positioning holes are symmetrically arranged on both sides of the package body.

4. The packaging mold according to claim 1, characterized in that, The lower mold is provided with stepped grooves that match the heat sink.

5. The packaging mold according to claim 4, characterized in that, The end of the ejector pin abuts against the edge of the stepped groove and the heat sink.

6. The packaging mold according to claim 4, characterized in that, The upper and lower molds are provided with several baffles at intervals to separate the upper and lower molds and form several mold recesses for molding the package body. The stepped groove is provided in the mold recess.

7. The packaging mold according to claim 1, characterized in that, The upper mold is provided with a pin, and the lower mold is provided with a pin sleeve that matches the pin.

8. The packaging mold according to claim 1, characterized in that, The upper mold is provided with ejector pin holes.

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