Ceramic spiral heat dissipation high-voltage silicon stack

Abstract

The utility model relates to the technical field of high-voltage silicon stacks, in particular to a ceramic spiral heat dissipation high-voltage silicon stack. Comprising a ceramic PCB (Printed Circuit Board), a high-voltage diode, a ceramic spiral radiating tube and an epoxy resin shell, the high-voltage diode and the ceramic spiral radiating tube are fixedly connected to the top layer and the bottom layer of the ceramic PCB; the ceramic PCB, the high-voltage diode and the ceramic spiral heat dissipation pipe are installed in the epoxy resin shell, and the epoxy resin shell packages the ceramic PCB, the high-voltage diode and the ceramic spiral heat dissipation pipe. The ceramic spiral heat dissipation pipe is combined with the ceramic PCB, heat generated in the working process is conducted out from the ceramic PCB, high temperature generated in the working process can be effectively dissipated, it is guaranteed that the device works stably for a long time, and stable operation can be achieved under the severe working condition. Epoxy resin is adopted for packaging, so that the insulating property and mechanical strength of the whole device are enhanced.

Description

Technical Field

[0001] This utility model relates to the field of high-voltage silicon stack technology, specifically a ceramic spiral heat dissipation high-voltage silicon stack. Background Technology

[0002] High-voltage silicon diode stacks, as important high-voltage rectifier devices, are widely used in high-voltage power supplies, high-voltage rectifiers, and other equipment. They can perform functions such as rectification and filtering, voltage transformation, and voltage multiplication / boosting in circuits, while indirectly enhancing the system's isolation and protection capabilities through insulation design. High-voltage silicon diode stacks are typically composed of multiple rectifier diodes connected in series, or multiple single-chip diodes meeting parameter requirements are stacked, sintered, and packaged into an integrated structure. During operation, the unidirectional conductivity of the diodes is utilized to rectify sinusoidal alternating current into unidirectional direct current, ensuring that the current flows in only one direction. In the circuit, the diode characteristics in the high-voltage silicon diode stack are used to prevent reverse current from flowing, protecting other components in the circuit from damage by reverse voltage, thus providing a certain degree of isolation and protection.

[0003] However, traditional high-voltage rectifier silicon stacks have the following problems in high-frequency operating environments:

[0004] 1. Insufficient heat dissipation performance: High-frequency operation will cause a significant increase in the heat generated by the device. Traditional heat dissipation structures are difficult to meet the heat dissipation requirements, which can easily lead to overheating and damage to the device.

[0005] 2. Poor heat resistance of encapsulation materials: Traditional resin encapsulation materials are prone to aging in high-frequency and high-temperature environments, which affects the lifespan of devices.

[0006] 3. Inadequate structural design: The external lead-out section and heat dissipation structure design of traditional silicon stacks do not fully consider the high-frequency operating characteristics, resulting in uneven heat distribution and local overheating. Utility Model Content

[0007] In order to overcome the shortcomings of the existing technology, this utility model provides a ceramic spiral heat dissipation high-voltage silicon stack, which solves the problems of traditional high-voltage rectifier silicon stacks in high-frequency working environments.

[0008] To achieve the above objectives, the present invention adopts the following technical solution:

[0009] A ceramic spiral heat sink high-voltage silicon stack includes a ceramic PCB circuit board, a high-voltage diode, a ceramic spiral heat pipe, and an epoxy resin shell; the high-voltage diode and the ceramic spiral heat pipe are fixed to the top and bottom layers of the ceramic PCB circuit board; the epoxy resin shell encapsulates the ceramic PCB circuit board, the high-voltage diode, and the ceramic spiral heat pipe, and the ceramic PCB circuit board, the high-voltage diode, and the ceramic spiral heat pipe are installed inside the epoxy resin shell, with the end of the ceramic spiral heat pipe protruding from the epoxy resin shell.

[0010] The high-voltage diodes are mounted in multiple rows on a ceramic PCB circuit board. Each row of high-voltage diodes is equally spaced, and adjacent rows of high-voltage diodes are staggered. The ceramic spiral heat sink is placed next to the high-voltage diodes, and the ceramic spiral heat sinks in the same row are spaced apart from the high-voltage diodes.

[0011] Furthermore, the high-voltage diodes are symmetrically fixed to the top and bottom surfaces of the ceramic PCB circuit board.

[0012] Furthermore, the ceramic spiral heat dissipation pipe is symmetrically fixed to the top and bottom surfaces of the ceramic PCB circuit board.

[0013] Furthermore, the ceramic spiral heat dissipation tube has a spiral structure inside.

[0014] Furthermore, it also includes copper embedded parts, which are fixed to both sides of the ceramic PCB circuit board and extend out of the epoxy resin shell.

[0015] Furthermore, the copper embedded part is a brass electrode embedded nut.

[0016] Compared with the prior art, the present invention has at least the following technical effects or advantages:

[0017] 1. This utility model uses a ceramic PCB circuit board as the mounting base to improve the electrical performance of the device at high frequencies and ensure circuit stability. The high-voltage diode and ceramic spiral heat sink are fixed to the top and bottom layers of the ceramic PCB circuit board. The high-voltage diode has high-voltage rectification function, adapting to high-current and high-voltage operating environments, ensuring rectification efficiency while improving the overall performance and lifespan of the device. The ceramic spiral heat sink, combined with the ceramic PCB circuit board, conducts heat generated during operation away from the ceramic PCB circuit board, effectively dissipating the high temperature generated during operation and ensuring stable operation of the device for extended periods, even under harsh working conditions. Epoxy resin encapsulation enhances the overall insulation performance and mechanical strength of the device, ensuring it does not fail in complex environments, improving shock and vibration resistance, and guaranteeing the reliability and stability of electrical connections.

[0018] 2. The high-voltage diode and ceramic spiral heat sink are arranged symmetrically in a cross pattern, which not only disperses heat but also optimizes the spatial structure and improves performance indicators.

[0019] 3. The ceramic spiral heat dissipation tube of this utility model has a spiral structure inside, which locks and guides the hot air flow, increasing and expanding the heat extraction and dissipation capacity.

[0020] 4. The copper embedded part of this utility model is fixed to both sides of the ceramic PCB circuit board and extends out of the outer shell as an external connection terminal.

[0021] 5. This utility model significantly improves the performance and reliability of high-voltage rectifier silicon stacks, meets the requirements of modern power electronic systems for high-performance, high-frequency, and high heat dissipation efficiency of devices, and has broad application prospects. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0023] Figure 2 This is a three-dimensional structural diagram of the present invention (excluding the epoxy resin shell).

[0024] Figure 3 This is a schematic front view of the structure of this utility model (excluding the epoxy resin shell).

[0025] Figure 4 This is a three-dimensional structural diagram of the present invention from another angle (excluding the epoxy resin shell).

[0026] In the picture:

[0027] 1. Ceramic PCB circuit board; 2. High voltage diode; 3. Ceramic spiral heat sink; 4. Epoxy resin shell; 5. Copper embedded parts. Detailed Implementation

[0028] The embodiments of this utility model are described in detail below. To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this utility model or its application or use. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0029] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] In the description of this utility model, it should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this utility model. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0032] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0033] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0034] like Figure 1-4 As shown, a ceramic spiral heat sink high-voltage silicon stack includes a ceramic PCB circuit board 1, a high-voltage diode 2, a ceramic spiral heat sink 3, an epoxy resin shell 4, and a copper embedded part 5.

[0035] The ceramic PCB circuit board 1 serves as the mounting reference and possesses excellent insulation and high-temperature thermal conductivity. This invention utilizes a ceramic AMB copper-clad laminate PCB process, forming highly reliable circuit connections by laminating copper onto a ceramic substrate. This process significantly improves the operating frequency response of devices and reduces problems caused by thermal expansion mismatch.

[0036] High voltage diode 2 can adapt to high current and high voltage operating environments, ensuring rectification efficiency while improving the overall performance and lifespan of the device.

[0037] The high-voltage diode 2 and the ceramic spiral heat sink 3 are fixed to the top and bottom layers of the ceramic PCB circuit board 1. The ceramic PCB circuit board 1, the high-voltage diode 2 and the ceramic spiral heat sink 3 are installed inside the epoxy resin shell 4. The end of the ceramic spiral heat sink 3 is exposed outside the epoxy resin shell 4. The epoxy resin shell 4 encapsulates the ceramic PCB circuit board 1, the high-voltage diode 2 and the ceramic spiral heat sink 3.

[0038] In this embodiment, three rows of high-voltage diodes 2 are installed on the top surface of the ceramic PCB circuit board 1, and three rows of high-voltage diodes 2 are installed on the bottom surface of the ceramic PCB circuit board 1. The high-voltage diodes 2 on the top surface and the high-voltage diodes 2 on the bottom surface are arranged symmetrically one-to-one.

[0039] High-voltage diodes 2 are arranged at equal intervals in each row, with adjacent rows of high-voltage diodes 2 being staggered. Ceramic spiral heat sinks 3 are placed next to the high-voltage diodes 2, with the ceramic spiral heat sinks 3 in the same row being spaced apart from the high-voltage diodes 2. The ceramic spiral heat sinks 3 on the top surface and the ceramic spiral heat sinks 3 on the bottom surface are arranged symmetrically, one-to-one.

[0040] The ceramic spiral heat pipe 3 has a spiral structure inside.

[0041] The copper embedded part 5 is fixed to the left and right sides of the ceramic PCB circuit board 1 and extends out of the epoxy resin shell 4. The copper embedded part 5 is a brass electrode embedded nut.

[0042] This invention uses a PCB circuit board with ceramic AMB copper-clad laminate as the mounting reference, improving the electrical performance of the device at high frequencies and ensuring circuit stability. The high-voltage diode 2 and the ceramic spiral heat sink 3 are fixed to the top and bottom layers of the ceramic PCB circuit board 1. The high-voltage diode 2 has high-voltage rectification capabilities, adapting to high-current and high-voltage operating environments, ensuring rectification efficiency while improving the overall performance and lifespan of the device. The ceramic spiral heat sink 3, combined with the ceramic PCB circuit board 1, conducts heat generated during operation away from the ceramic PCB circuit board 1, effectively dissipating the high temperature generated during operation and ensuring stable operation of the device for extended periods, even under harsh working conditions. Epoxy resin encapsulation enhances the overall insulation performance and mechanical strength of the device, ensuring it does not fail in complex environments, improving shock and vibration resistance, and guaranteeing the reliability and stability of electrical connections.

[0043] In this invention, the high-voltage diode 2 and the ceramic spiral heat sink 3 are arranged in a cross-symmetrical manner to disperse heat while optimizing the spatial structure and improving performance indicators.

[0044] The ceramic spiral heat dissipation tube 3 of this utility model has an internal spiral structure that locks and guides the hot airflow, thereby increasing and expanding the heat extraction and dissipation capacity.

[0045] The copper embedded part 5 of this utility model is fixed to both sides of the ceramic PCB circuit board 1 and extends out of the epoxy resin shell 4 as an external connection terminal.

[0046] This invention significantly improves the performance and reliability of high-voltage rectifier silicon stacks, meets the requirements of modern power electronic systems for high-performance, high-frequency, and high heat dissipation efficiency devices, and has broad application prospects.

[0047] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A ceramic spiral heat dissipation high-voltage silicon stack, characterized in that: Includes ceramic PCB circuit board, high voltage diode, ceramic spiral heat pipe and epoxy resin shell; The high-voltage diode and the ceramic spiral heat sink are fixed to the top and bottom layers of the ceramic PCB circuit board. The epoxy resin shell encapsulates the ceramic PCB circuit board, the high-voltage diode, and the ceramic spiral heat pipe. The ceramic PCB circuit board, the high-voltage diode, and the ceramic spiral heat pipe are installed inside the epoxy resin shell, with the end of the ceramic spiral heat pipe protruding from the epoxy resin shell.

2. The ceramic spiral heat dissipation high-voltage silicon stack according to claim 1, characterized in that: The high-voltage diodes are mounted in multiple rows on a ceramic PCB circuit board, with each row of high-voltage diodes arranged at equal intervals and adjacent rows of high-voltage diodes arranged alternately. The ceramic spiral heat sink is positioned next to the high-voltage diode, with the ceramic spiral heat sinks in the same row spaced apart from the high-voltage diode.

3. The ceramic spiral heat dissipation high-voltage silicon stack according to claim 1, characterized in that: The high-voltage diodes are symmetrically fixed to the top and bottom surfaces of the ceramic PCB circuit board.

4. The ceramic spiral heat dissipation high-voltage silicon stack according to claim 1, characterized in that: The ceramic spiral heat sink is symmetrically fixed to the top and bottom surfaces of the ceramic PCB circuit board.

5. The ceramic spiral heat dissipation high-voltage silicon stack according to claim 1, characterized in that: The ceramic spiral heat dissipation tube has a spiral structure inside.

6. The ceramic spiral heat dissipation high-voltage silicon stack according to claim 1, characterized in that: It also includes copper embedded parts, which are fixed to both sides of the ceramic PCB circuit board and extend out of the epoxy resin shell.

7. A ceramic spiral heat dissipation high-voltage silicon stack according to claim 6, characterized in that: The copper embedded part is a brass electrode embedded nut.

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