Chip front and back face detection and sorting equipment
By integrating a transmission mechanism, a bottom detection module, and a front detection module, the chip front and back detection and sorting equipment solves the problem of the single function of existing chip detection devices, realizes efficient and automated chip detection and sorting, and improves detection efficiency and production line operating efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN GRAND INNOSYS CORP
- Filing Date
- 2025-05-29
- Publication Date
- 2026-05-22
AI Technical Summary
Existing chip testing devices have limited functionality, resulting in low testing efficiency, making it difficult to guarantee production capacity and testing quality. Furthermore, repeated testing can easily damage the chips.
Design a chip front and back detection and sorting device that integrates a transmission mechanism, a bottom detection module, a front detection module and a sorting mechanism to realize automated chip detection and sorting. It includes a feeding gripper mechanism, a bottom detection module and a front detection module, and can simultaneously detect the front and back of the chip and sort good and defective products.
It improves the efficiency and accuracy of chip testing, reduces the risk of chip damage, achieves multi-functional integration, and enhances the automation level of testing and the operating efficiency of the production line.
Smart Images
Figure CN224265843U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip testing technology, and more specifically, to a chip front and back detection and sorting device. Background Technology
[0002] Chip inspection equipment is mainly used for optical inspection of packaged chips, including automated optical inspection of QFP, QFN, LGA, BGA, SOP and other packaged products. It primarily detects chip appearance defects, which mainly include: colloidal contamination, scratches, breakage, substrate cracks, burrs, holes, side scratches, dirt, cracks, copper leakage, missing, duplicate, reprinted, misaligned markings, missing corners, scratches, discoloration, cracks, and impurities, among other things.
[0003] However, the limited functionality of chip testing devices in related technologies leads to low chip testing efficiency. Utility Model Content
[0004] This invention provides a chip front and back detection and sorting device to improve the above-mentioned technical problems.
[0005] The present invention achieves the above objectives through the following technical solutions.
[0006] This utility model provides a chip front and back inspection and sorting device, which includes a mounting base, a transmission mechanism, a bottom inspection module, a feeding gripper mechanism, a front inspection module, and a sorting mechanism. The transmission mechanism is mounted on the mounting base. The feeding gripper mechanism is mounted on the mounting base and located in the transmission path of the transmission mechanism. The bottom inspection module is mounted on the mounting base and is adapted to transfer chips from the transmission mechanism to the bottom inspection module for inspection and then transfer them back to the transmission mechanism. The front inspection module is mounted on the mounting base and located in the transmission path of the transmission mechanism and is adapted to inspect the chips after they have been inspected by the bottom inspection module. The sorting mechanism is mounted on the mounting base and located in the transmission path of the transmission mechanism and is adapted to sort the chips after they have been inspected by the front inspection module into good and defective products.
[0007] In some embodiments, the mounting base includes a first mounting support and a dual-movement drive mechanism. The dual-movement drive mechanism is mounted on the first mounting support, the feeding gripper mechanism is mounted on one of the moving parts of the dual-movement drive mechanism, and the sorting mechanism is mounted on the other moving part of the dual-movement drive mechanism. The dual-movement drive mechanism drives the feeding gripper mechanism and the sorting mechanism to move along a first direction, respectively.
[0008] In some embodiments, the feeding gripper mechanism includes a feeding drive assembly and a feeding adsorption assembly. The feeding drive assembly is connected to the feeding adsorption assembly and is adapted to drive the feeding adsorption assembly to move along a second direction. The feeding adsorption assembly includes an adsorption drive member and an adsorption member. The adsorption drive member is connected to the adsorption member and is adapted to drive the adsorption member to move along a second direction.
[0009] In some embodiments, the feeding gripper mechanism includes multiple sets of feeding adsorption components and an adjusting member. The multiple sets of feeding adsorption components are arranged along a first direction, and the adjusting member is connected to the multiple sets of feeding adsorption components and is adapted to adjust the spacing between any two adjacent sets of feeding adsorption components.
[0010] In some implementations, the bottom surface detection module is located below the feeding gripper mechanism, which is adapted to move the chip on the transmission mechanism to the top of the bottom surface detection module for detection and then move it back to the transmission mechanism.
[0011] In some embodiments, the sorting mechanism includes a sorting drive component and a sorting adsorption component, wherein the sorting drive component is connected to the sorting adsorption component and is adapted to drive the sorting adsorption component to move along a second direction.
[0012] In some embodiments, the sorting mechanism further includes a height sensor, which is positioned close to the sorting adsorption component relative to the sorting drive component.
[0013] In some embodiments, the mounting base includes a second mounting support and a linear drive, the linear drive being mounted on the second mounting support, and the front detection module including a front character detection drive and a front character detection component. The linear drive is connected to the front character detection drive and adapted to drive the front character detection drive to move along a first direction, and the front character detection drive is connected to the front character detection component and adapted to drive the front character detection component to move along a second direction.
[0014] In some embodiments, the mounting base includes a third mounting support and a first driving member, the first driving member being mounted on the third mounting support. The chip front and back detection and sorting equipment also includes a transfer assembly, the first driving member being connected to the transfer assembly and adapted to drive the transfer assembly to move along a first direction to transfer the chip tray after it has been detected by the front character detection member.
[0015] In some embodiments, the mounting base includes a second drive member mounted on a third mounting bracket. The front detection module also includes a front aperture detection drive member and a front aperture detection member. The second drive member is connected to the front aperture detection drive member and adapted to drive the front aperture detection drive member to move along a first direction. The front aperture detection drive member is connected to the front aperture detection member and adapted to drive the front aperture detection member to move along a second direction, so as to detect the chip tray transferred by the transfer assembly.
[0016] In some embodiments, the conveying mechanism includes a feeding conveyor assembly and a discharging conveyor assembly, both of which are mounted on a mounting base. The feeding gripper mechanism is located in the conveying path of the feeding conveyor assembly, and the sorting mechanism is located in the conveying path of the discharging conveyor assembly.
[0017] In some implementations, the chip front and back detection and sorting equipment also includes a defective product box assembly, which is installed on the unloading conveyor assembly.
[0018] The chip front and back detection and sorting equipment provided in this embodiment of the utility model includes a transmission mechanism mounted on a mounting base, a feeding gripper mechanism mounted on the mounting base and located in the transmission path of the transmission mechanism, and a bottom detection module mounted on the mounting base. The feeding gripper mechanism is adapted to transfer chips from the transmission mechanism to the bottom detection module for detection and then transfer them back to the transmission mechanism. A front detection module is mounted on the mounting base and located in the transmission path of the transmission mechanism, and is adapted to detect chips after they have been detected by the bottom detection module. A sorting mechanism is mounted on the mounting base and located in the transmission path of the transmission mechanism, and is adapted to sort the chips after they have been detected by the front detection module into good and defective products. In this way, the chip front and back inspection and sorting equipment can transfer chips through the feeding gripper mechanism, inspect the bottom surface of the chip through the bottom surface inspection module, inspect the front surface of the chip through the front surface inspection module, and sort good and defective chips. The chip front and back inspection and sorting equipment can integrate multiple functions, which helps to enrich the functions of the chip front and back inspection and sorting equipment and improve the chip inspection efficiency. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0020] Figure 1 This diagram illustrates the internal structure of the chip front and back detection and sorting device provided in this embodiment of the invention.
[0021] Figure 2 It shows Figure 1 A schematic diagram of the feeding gripper mechanism and the sorting mechanism of a chip front and back detection and sorting equipment.
[0022] Figure 3 It shows Figure 2 A schematic diagram of the feeding gripper mechanism of a chip front and back detection and sorting equipment.
[0023] Figure 4 It shows Figure 2 A schematic diagram of the sorting mechanism in a chip front and back detection and sorting equipment.
[0024] Figure 5 It shows Figure 1 A schematic diagram of the bottom detection module of a chip front and back detection and sorting equipment.
[0025] Figure 6 It shows Figure 1 A schematic diagram of the front character detection driver and front character detection component of a chip front and back detection and sorting device.
[0026] Figure 7 It shows Figure 1 A schematic diagram of the front hole detection component and transfer assembly of a chip front and back detection and sorting equipment.
[0027] Figure 8 It shows Figure 7 A schematic diagram of the transfer component of a chip front and back detection and sorting device.
[0028] Figure 9 It shows Figure 7 A schematic diagram of the front hole detection drive and front hole detection component of the chip front and back detection and sorting equipment.
[0029] Figure 10 It shows Figure 1 A schematic diagram of the transmission mechanism of a chip front and back detection and sorting device.
[0030] Figure 11 It shows Figure 1 A schematic diagram of the load-bearing frame of the chip front and back detection and sorting equipment.
[0031] Figure 12 It shows Figure 1 A schematic diagram of the structure of the upper cover of the chip front and back detection and sorting equipment.
[0032] Reference numerals: Chip front and back detection and sorting equipment 100; Mounting base 11; First mounting support 111; Dual-actuator drive mechanism 112; Second mounting support 113; Linear drive component 114; Third mounting support 115; First drive component 116; Second drive component 117; Static elimination component 118; Conveying mechanism 12; Feeding conveyor assembly 121; Discharging conveyor assembly 122; First unloading component 1221; Second unloading component 1222; Third unloading component 1223; Bottom surface detection module 13; Feeding gripper Mechanism 14; Feeding drive assembly 141; Feeding adsorption assembly 142; Adsorption drive component 1421; Adsorption component 1422; Adjustment component 143; Front detection module 15; Front character detection drive component 151; Front character detection component 152; Front small hole detection drive component 153; Front small hole detection component 154; Sorting mechanism 16; Sorting drive assembly 161; Sorting adsorption assembly 162; Height sensor 163; Transfer assembly 17; Frame load-bearing frame 18; Frame upper cover 19; Defective product box assembly 20. Detailed Implementation
[0033] To enable those skilled in the art to better understand the embodiments of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the protection scope of this utility model.
[0034] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.
[0035] The chip inspection devices in related technologies are generally limited in function, relying on a combination of manual inspection and electron microscopy, or visual camera inspection. These single-function devices have low efficiency, requiring different personnel or equipment to perform multiple inspections for different items, making it difficult to guarantee product throughput and inspection quality. For chip products, the multi-station, multi-equipment, and repeated inspection, sorting, transfer, and conveying processes can easily damage the chips and create additional risks.
[0036] See Figure 1This utility model provides a chip front and back detection and sorting device 100, which is suitable for detecting and sorting small-sized chips. The chip front and back detection and sorting device 100 may include a chip tray in which chips are placed. The chip front and back detection and sorting device 100 includes a mounting base 11 and a transfer mechanism 12. The transfer mechanism 12 is mounted on the mounting base 11 and is used to transfer the chip tray, thereby realizing the transfer of the chip tray.
[0037] In some embodiments, the chip front and back detection and sorting equipment 100 includes a bottom detection module 13 and a feeding gripper mechanism 14. The feeding gripper mechanism 14 is installed on the mounting base 11 and located in the transmission path of the transmission mechanism 12. The bottom detection module 13 is installed on the mounting base 11. The feeding gripper mechanism 14 is adapted to transfer the chip on the transmission mechanism 12 to the bottom detection module 13 for detection and then transfer it back to the transmission mechanism 12.
[0038] Thus, when the transmission mechanism 12 transmits the chip tray along the second direction Y of the chip front and back detection and sorting equipment, the loading gripper mechanism 14 can grab the chip in the chip tray and transfer the chip to the bottom surface detection module 13 for bottom surface detection. For example, the chip can be transferred to the bottom surface detection module 13 for photographic detection of the bottom surface of the chip. After the bottom surface detection module 13 completes the detection, the loading gripper mechanism 14 transfers the detected chip back to the chip tray, thereby realizing the bottom surface detection of the chips in the chip tray. Here, the second direction Y can be the height direction of the chip front and back detection and sorting equipment 100.
[0039] Since the chip front and back detection and sorting equipment 100 is used to detect and sort small-sized chips, the feeding gripper mechanism 14 can grab multiple chips at a time, such as two, three, four, five, six, seven, eight, nine or ten chips, and transfer the multiple chips to the bottom detection module 13 to detect the bottom surface of the multiple chips. After the detection is completed, the feeding gripper mechanism 14 puts the multiple chips back into the chip tray and grabs the next group of chips, repeating the above steps until all the chips in the chip tray have been transferred to the bottom detection module 13 for detection, and then automatically replaces the next tray of chips to be inspected.
[0040] In some embodiments, the chip front and back detection and sorting equipment 100 includes a front detection module 15, which is mounted on the mounting base 11 and located in the transmission path of the transmission mechanism 12. The front detection module 15 is adapted to detect chips after they have been detected by the bottom detection module 13.
[0041] Thus, when the transmission mechanism 12 transmits the chip tray to a position close to the front detection module 15, the chip front and back detection and sorting equipment 100 can inspect the front of the chips in the chip tray through the front detection module 15. For example, the front detection module 15 can perform front character photo detection, front hole detection, etc. When all the chips in the chip tray have been inspected by the front detection module 15, the chip front and back detection and sorting equipment 100 automatically replaces the next chip tray to be inspected for inspection.
[0042] In some embodiments, the chip front and back inspection and sorting equipment 100 includes a sorting mechanism 16, which is mounted on the mounting base 11 and located in the transmission path of the transmission mechanism 12. The sorting mechanism 16 is adapted to sort the chips after they have been inspected by the front inspection module 15 into good and bad products.
[0043] Thus, when the transmission mechanism 12 transmits the chip tray to a position close to the sorting mechanism 16, the chip front and back detection and sorting equipment 100 can sort the chips in the chip tray through the sorting mechanism 16, classify the chips into good and bad products according to the detection results, and transfer them to the corresponding chip placement area, thereby realizing the sorting of chips.
[0044] The chip front and back inspection and sorting equipment 100 of this application can transfer chips through the feeding gripper mechanism 14, inspect the bottom surface of the chip through the bottom surface inspection module 13, inspect the front surface of the chip through the front surface inspection module 15, and sort the good and defective chips. The chip front and back inspection and sorting equipment 100 can integrate multiple functions, which helps to enrich the functions of the chip front and back inspection and sorting equipment 100 and improve the inspection efficiency of chips.
[0045] The chip front and back detection and sorting equipment 100 may include a computer processing unit and a control unit. The computer processing unit is connected to the bottom detection module 13 and the front detection module 15. The computer processing unit can process and analyze the image information obtained by the bottom detection module 13 and the front detection module 15, determine defects, and output data results. The control unit is connected to the feeding gripper mechanism 14 and the sorting mechanism 16. The control unit can control the action of the feeding gripper mechanism 14. The control unit can also control the sorting mechanism 16 to perform sorting according to the data results output by the computer processing unit, thereby realizing the automated control of the chip front and back detection and sorting equipment 100.
[0046] See Figure 1 and Figure 2In some embodiments, the mounting base 11 includes a first mounting support 111 and a dual-moving-element drive mechanism 112. The dual-moving-element drive mechanism 112 is mounted on the first mounting support 111. A feeding gripper mechanism 14 is mounted on one of the moving parts of the dual-moving-element drive mechanism 112, and a sorting mechanism 16 is mounted on the other moving part of the dual-moving-element drive mechanism 112. The dual-moving-element drive mechanism 112 drives the feeding gripper mechanism 14 and the sorting mechanism 16 to move along a first direction X. The first direction X can be the width direction of the chip front and back detection and sorting device 100.
[0047] In this way, each mover can independently control the movement of a component, which helps to achieve more complex motion trajectories and more precise positioning, and also helps to improve the compactness of the structure. It also allows the feeding gripper mechanism 14 and the sorting mechanism 16 to perform different tasks at different times or simultaneously, thereby improving the multifunctionality of the chip front and back detection and sorting equipment 100. This allows the chip front and back detection and sorting equipment to perform different tasks, which helps to improve the detection efficiency of chips.
[0048] In some embodiments, the chip front and back detection and sorting equipment 100 further includes a plurality of static eliminators 118, which are mounted on a first mounting bracket 111. The static eliminators 118 can be ion fans, which can blow negative ion winds onto the chips in the chip tray, thereby eliminating static electricity on the chip surface.
[0049] See Figures 2 to 4 In some embodiments, the feeding gripper mechanism 14 includes a feeding drive assembly 141 and a feeding adsorption assembly 142. The feeding drive assembly 141 is connected to the feeding adsorption assembly 142 and is adapted to drive the feeding adsorption assembly 142 to move along the second direction Y. The feeding adsorption assembly 142 includes an adsorption drive member 1421 and an adsorption member 1422. The adsorption drive member 1421 is connected to the adsorption member 1422 and is adapted to drive the adsorption member 1422 to move along the second direction Y.
[0050] Thus, the feeding drive assembly 141 can drive the adsorption member 1422 to move along the second direction Y, thereby adjusting the position of the feeding adsorption assembly 142 in the second direction Y. When the feeding adsorption assembly 142 moves to the appropriate position, the adsorption drive assembly 1421 drives the adsorption member 1422 to move along the second direction Y, so that the adsorption member 1422 moves along the second direction Y to the appropriate position, thereby adsorbing the chip in the material tray.
[0051] The feeding drive assembly 141 may include a stepper motor and a synchronous belt. The synchronous belt is connected to the feeding adsorption assembly 142 and the stepper motor. The stepper motor drives the synchronous belt to move, thereby driving the feeding adsorption assembly 142 to move. The adsorption drive component 1421 may be a cylinder, and the adsorption component 1422 may be a suction nozzle. The cylinder drives the suction nozzle to move along the second direction Y.
[0052] In some embodiments, the feeding gripper mechanism 14 includes multiple sets of feeding adsorption components 142 and an adjusting member 143. The multiple sets of feeding adsorption components 142 are arranged along a first direction X, and the adjusting member 143 is connected to the multiple sets of feeding adsorption components 142 and is adapted to adjust the spacing between any two adjacent sets of feeding adsorption components 142.
[0053] In this way, the spacing between any two adjacent sets of feeding and adsorption components 142 can be adjusted by adjusting component 143, which helps to ensure that there is a suitable spacing between any two adjacent sets of feeding and adsorption components 142, helps to ensure that a single set of feeding and adsorption components 142 has enough space to work independently, and also helps to ensure that multiple sets of feeding and adsorption components 142 have a suitable spacing to work together, thereby better adsorbing the chips in the chip tray.
[0054] Each set of feeding and adsorption components 142 includes an adsorption drive 1421 and an adsorption component 1422. Each adsorption component 1422 is mounted on a separate adsorption drive 1421 to control the extension of the adsorption component 1422. Each gas route is controlled by a separate vacuum solenoid valve and can be used independently.
[0055] See Figures 2 to 4 In some embodiments, the sorting mechanism 16 includes a sorting drive component 161 and a sorting adsorption component 162. The sorting drive component 161 is connected to the sorting adsorption component 162 and is adapted to drive the sorting adsorption component 162 to move along the second direction Y.
[0056] Thus, the sorting and adsorption assembly 162 can be driven by the sorting drive assembly 161 to move along the second direction Y, thereby adjusting the position of the sorting and adsorption assembly 162 in the second direction Y to move it to a suitable position for better sorting and adsorption of chips. The sorting and adsorption assembly 162 can sort the chips into good and bad products according to the data output by the computer processing mechanism and transfer them to the corresponding chip placement area.
[0057] The sorting drive component 161 may include a stepper motor and a synchronous belt. The synchronous belt is connected to the sorting adsorption component 162 and the stepper motor. The stepper motor drives the synchronous belt to move, thereby driving the sorting adsorption component 162 to move.
[0058] In some embodiments, the sorting mechanism 16 further includes a height sensor 163, which is disposed relative to the sorting drive assembly 161 and close to the sorting adsorption assembly 162. The height sensor 163 can be a height sensor.
[0059] In this way, the height sensor 163 can detect the height of the chips in the chip tray, and thus determine whether there are stacked or missing chips in the chip tray based on the height. This helps to reduce problems such as chip damage, misalignment or inability to pick up correctly in subsequent processing caused by stacked chips, and also helps to reduce production line interruptions or product quality degradation caused by missing chips in the chip tray.
[0060] See Figure 1 and Figure 5 In some embodiments, the bottom surface detection module 13 is disposed below the feeding gripper mechanism 14, which is adapted to transfer the chip on the transmission mechanism 12 to the top of the bottom surface detection module 13 for detection and then transfer it back to the transmission mechanism 12.
[0061] In this way, the loading gripper mechanism 14 can transfer the chip on the transfer mechanism 12 to the bottom surface inspection module 13 for inspection. For example, the bottom surface inspection module 13 includes a camera, which takes pictures of the bottom surface of the chip and transmits the image information to a computer processing structure for processing and analysis, determining defects, and outputting data results. The bottom surface inspection module 13 can inspect the bottom surface of the chip without moving, which helps to reduce the inspection error caused by the movement of the bottom surface inspection module 13 and helps to improve the accuracy of the bottom surface inspection module 13.
[0062] In some embodiments, the bottom surface detection module 13 includes a bottom surface imaging camera, a lens, a coaxial light source, and a ring light source, which are coaxially mounted and fixed. The bottom surface detection module 13 can capture images from the bottom upwards to complete the acquisition of images of the chip's bottom surface, and the images are judged by the software algorithm of the computer processing system to detect defects in the appearance of the chip's bottom surface.
[0063] The bottom detection module 13 also includes a protective cover, inside which the bottom imaging camera and lens are located to protect the bottom imaging camera and lens and reduce the risk of damage to the bottom imaging camera and lens.
[0064] See Figure 1 and Figure 6 In some embodiments, the mounting base 11 includes a second mounting support 113 and a linear drive 114, the linear drive 114 being mounted on the second mounting support 113. The front detection module 15 includes a front character detection drive 151 and a front character detection drive 152. The linear drive 114 is connected to the front character detection drive 151 and adapted to drive the front character detection drive 151 to move along a first direction X. The front character detection drive 151 is connected to the front character detection drive 152 and adapted to drive the front character detection drive 152 to move along a second direction Y.
[0065] Thus, the linear drive unit 114 can drive the front character detection drive unit 151 to move along the first direction X, thereby driving the front character detection unit 152 to move synchronously along the first direction X. Alternatively, the front character detection drive unit 151 can drive the front character detection unit 152 to move along the second direction Y, ensuring that the front character detection unit 152 is in a suitable position to better adapt to the position of the chip tray and to better detect the front characters of the chips in the chip tray. When the transfer mechanism 12 transfers the chip tray to a position close to the front character detection unit 152, the characters on the front of the chip can be detected by the front character detection unit 152. For example, the front character detection unit 152 includes a camera, which takes pictures of the characters on the front of the chip and transmits the image information to a computer processing structure for processing and analysis, determining defects, and outputting data results.
[0066] The front detection module 15 can cover the material feeding conveyor line. The front character detection component 152 can be composed of a camera, lens, coaxial light source and ring light source. The front character detection drive component 151 can be a stepper motor. The camera drives the lead screw through the stepper motor, and the slide rail guides the camera to move along the second direction Y, realizing the automatic focusing function of the camera.
[0067] See Figures 7 to 9 In some embodiments, the mounting base 11 includes a third mounting support 115 and a first driving member 116. The first driving member 116 is mounted on the third mounting support 115. The chip front and back detection and sorting equipment 100 also includes a transfer assembly 17. The first driving member 116 is connected to the transfer assembly 17 and is adapted to drive the transfer assembly 17 to move along a first direction X to transfer the chip tray after it has been detected by the front character detector 152. The first driving member 116 can be a lead screw linear motor.
[0068] Thus, the first driving component 116 can drive the transfer assembly 17 to move along the first direction X, so as to transfer the chip tray after being detected by the front character detector 152 to the next detection stage. The way the first driving component 116 drives the transfer assembly 17 to move is simple and convenient for manufacturing.
[0069] The transfer component 17 can be a gripping robot. The gripping robot uses its gripper to pick up chip trays and, under program control, places the chip trays (empty or full) to be transferred into the tray placement positions at the end of each conveyor line. The gripping robot is driven by a linear motor to move the gripper up and down along a linear guide rail. The gripper is driven by a parallel pneumatic clamp to open and close the jaws, realizing the handling and placement of the chip trays.
[0070] In some embodiments, the mounting base 11 includes a second drive member 117, which is mounted on a third mounting support 115. The front detection module 15 also includes a front aperture detection drive member 153 and a front aperture detection member 154. The second drive member 117 is connected to the front aperture detection drive member 153 and adapted to drive the front aperture detection drive member 153 to move along a first direction X. The front aperture detection drive member 153 is connected to the front aperture detection member 154 and adapted to drive the front aperture detection member 154 to move along a second direction Y, so as to detect the chip tray transferred by the transfer assembly 17.
[0071] Thus, the second driving component 117 can drive the front hole detection driving component 153 to move along the first direction X, thereby causing the front hole detection component 154 to move synchronously along the first direction X. Alternatively, the front hole detection driving component 153 can drive the front hole detection component 154 to move along the second direction Y, thereby ensuring that the front hole detection component 154 is in a suitable position to better adapt to the position of the chip tray and better detect the front holes of the chips in the chip tray. When the transfer component 17 transfers the chip tray to a position close to the front hole detection component 154, the front hole detection component 154 can be used to detect the holes on the front of the chip. For example, the front hole detection component 154 includes a camera, which takes pictures of the holes on the front of the chip and transmits the image information to a computer processing structure for processing and analysis, determining defects, and outputting data results.
[0072] The front-facing pinhole detection component 154 may include a camera, a telecentric lens, a coaxial light source, a multi-layer ring light source, etc. The front-facing pinhole detection drive component 153 may be a stepper motor. The camera drives the lead screw pair through the stepper motor, and the slide rail guides the camera to move along the second direction Y, thereby realizing the camera's automatic focusing function.
[0073] See Figure 1 and Figure 10 In some embodiments, the conveying mechanism 12 includes a feeding conveying assembly 121 and a discharging conveying assembly 122. Both the feeding conveying assembly 121 and the discharging conveying assembly 122 are mounted on the mounting base 11. The feeding gripper mechanism 14 is located in the conveying path of the feeding conveying assembly 121, and the sorting mechanism 16 is located in the conveying path of the discharging conveying assembly 122.
[0074] Thus, the chips can be fed through the feeding conveyor 121, and then transferred to the bottom detection module 13 for detection by the feeding gripper mechanism 14 before being transferred back to the feeding conveyor 121. Alternatively, the chips can be unloaded through the unloading conveyor 122, and then sorted by the sorting mechanism 16, thereby achieving chip detection and sorting.
[0075] Among them, the front character detection component 152 is located in the transmission path of the feeding conveying component 121, and the front small hole detection component 154 is located in the transmission path of the unloading conveying component 122.
[0076] In some embodiments, the chip front and back detection and sorting equipment 100 further includes a defective product box assembly 20, which is installed on the unloading conveyor assembly 122.
[0077] In this way, the sorting mechanism 16 can sort out defective products according to the test results and put the defective products into the defective product box assembly 20. This helps the chip front and back detection and sorting equipment 100 to realize the automated collection of defective products, reduces the need for manual intervention, improves the operating efficiency of the entire production line, and also helps to make reasonable use of the limited production space, avoiding the need to set up a separate defective product storage area.
[0078] The unloading conveyor assembly 122 may include a first unloading component 1221, a second unloading component 1222, and a third unloading component 1223. A defective product box assembly 20 is fixed to the side of the third unloading component 1223. For example, each conveyor line consists of two aluminum profile tracks and conveyor rails mounted on the profiles. The defective product box assembly 20 is fixed to the side of the aluminum profiles. The first unloading component 1221, second unloading component 1222, and third unloading component 1223 are installed parallel to each other on the large-plate working platform via track supports. The loading conveyor assembly 121 mainly conveys the chips to be inspected from full chip trays. The first unloading component 1221 mainly conveys and stacks defective chip trays. The second unloading component 1222 mainly conveys and stacks good chip trays. The third unloading component 1223 mainly conveys empty trays and stacks defective chips. The chip trays are held by a tray transport module placed between the two tracks of the conveyor line, which drives the chip trays to move linearly along the parallel tracks to each working position.
[0079] See Figure 11 In some embodiments, the chip front and back detection and sorting equipment 100 also includes a frame 18. The frame 18 is treated with anti-rust paint, and adjustable casters are installed at the bottom of the frame 18. The frame 18 houses the electrical control box, air source and air circuit, industrial control host, vision host, UPS power supply, etc. The working platform surface on the frame 18 is a precision-machined platform plate. The outer sides are sealed with sheet metal bending for doors and bottoms, and corresponding positions are designed with heat dissipation holes or exhaust fans. The left side of the frame 18 is equipped with a main power switch, air source, filter and pressure regulating device.
[0080] See Figure 12The chip front and back detection and sorting equipment 100 also includes a frame cover 19, which is an aluminum alloy frame with a bent sheet metal outer perimeter. The front and rear sides feature a three-sliding semi-transparent window design for easy observation of the equipment's internal operating status. Sheet metal doors are located on the left and right sides for easy maintenance and debugging. The bottom is enclosed with stainless steel plates for wear resistance and rust prevention. A four-color alarm light is installed on the top, and dual displays (visual display / industrial control display) are located on the left side of the cover's operating surface. The front is protected by a stainless steel cover that shields three conveyor tracks, providing material tray inlets and outlets (loading position, unloading position 1, unloading position 2, and unloading position 3). An accessory box is designed on the left side of the front for storing spare parts and jigs.
[0081] The working principle of the chip front and back inspection and sorting equipment 100 of this application is as follows: After power-on self-test, the chip front and back inspection and sorting equipment 100 starts the corresponding chip production program. The chip to be inspected (along with the TRAY tray) is manually placed into the material rack of the feeding conveyor component 121 and stacked. At the same time, an empty tray is placed in the third unloading component 1223 (used to place the defective products sorted from the first tray at the 1 / 2 sorting station position of the unloading conveyor component 122). At this time, after the chip front and back inspection and sorting equipment 100 detects that each tray is in place, it starts to run automatically. The tray separation mechanism separates a tray of chips to be inspected into the feeding conveyor component 121 and positions it at the bottom detection and picking position. The feeding gripper mechanism 14 picks up the chip to be inspected from the chip tray and moves it to the bottom detection module 13 to take pictures. The chip that has been photographed by the bottom camera is put back into the chip tray by the feeding gripper mechanism 14 and the next row of chips is picked up. The above-mentioned photographing action is repeated until all the chips in the chip tray are picked up and photographed. The chip tray is transported to the front character detection position via the feeding conveyor assembly 121 for front character detection. After detection, the chip tray is sent to the rear end via the feeding conveyor assembly 121 and transported to the half position of the unloading conveyor assembly 122 by the transfer assembly 17. The chip tray is then transported to the front pinhole camera position, where the front pinhole detector 154 takes pictures of the front of all chips in the chip tray to detect the quality of the pinholes on the front of the chips. After completion, the chip tray moves forward to the sorting position, where the sorting mechanism 16 sorts the defective chips according to the results output by the sorting adsorption assembly 162 based on the computer processing structure. Finally, the defective chips are removed and placed into the empty tray or defective product box assembly 20 according to their categories (placed in the third unloading assembly 1223 during startup feeding). The first unloading assembly 1221 fills the good products and then unloads and stacks them.
[0082] In summary, the chip front and back detection and sorting equipment 100 provided by this utility model has a transmission mechanism 12 mounted on a mounting base 11, a feeding gripper mechanism 14 mounted on the mounting base 11 and located in the transmission path of the transmission mechanism 12, and a bottom detection module 13 mounted on the mounting base 11. The feeding gripper mechanism 14 is adapted to transfer the chip on the transmission mechanism 12 to the bottom detection module 13 for detection and then transfer it back to the transmission mechanism 12. A front detection module 15 is mounted on the mounting base 11 and located in the transmission path of the transmission mechanism 12. The front detection module 15 is adapted to detect the chip after it has been detected by the bottom detection module 13. A sorting mechanism 16 is mounted on the mounting base 11 and located in the transmission path of the transmission mechanism 12. The sorting mechanism 16 is adapted to sort the chips after they have been detected by the front detection module 15 into good and defective products. Thus, the chip front and back inspection and sorting equipment 100 can transfer chips through the feeding gripper mechanism 14, inspect the bottom surface of the chip through the bottom surface inspection module 13, inspect the front surface of the chip through the front surface inspection module 15, and sort good and defective chips. The chip front and back inspection and sorting equipment 100 can integrate multiple functions, which helps to enrich the functions of the chip front and back inspection and sorting equipment 100 and improve the chip inspection efficiency.
[0083] In this embodiment of the invention, unless otherwise explicitly specified or limited, the term "assembly" and other such terms should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection or an indirect connection via an intermediate medium; it can be a connection within two components; it can be merely surface contact; or it can be a surface contact connection via an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.
[0084] Furthermore, the terms "first," "second," etc., are used only for distinguishing descriptions and should not be construed as referring to specific or particular structures. The description of "some embodiments" means that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this utility model. In the embodiments of this utility model, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate different embodiments or examples described in the embodiments of this utility model, as well as the features of different embodiments or examples.
[0085] The above embodiments are only used to illustrate the technical solutions of the present utility model, and are not intended to limit them. Although the embodiments of the present utility model have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present utility model, and should all be included within the protection scope of the present utility model.
Claims
1. A chip front and back detection and sorting device, characterized in that, include: Mounting base; A transmission mechanism, which is mounted on the mounting base; A feeding gripper mechanism, which is mounted on the mounting base and located in the transmission path of the transmission mechanism; A bottom surface detection module is installed on the mounting base. The feeding gripper mechanism is adapted to transfer the chip on the transmission mechanism to the bottom surface detection module for detection and then transfer it back to the transmission mechanism. A front detection module is mounted on the mounting base and located in the transmission path of the transmission mechanism. The front detection module is adapted to detect chips after they have been detected by the bottom detection module. as well as The sorting mechanism is mounted on the mounting base and located in the transmission path of the transmission mechanism. The sorting mechanism is adapted to sort the chips that have been detected by the front detection module into good and defective products.
2. The chip front and back detection and sorting equipment according to claim 1, characterized in that, The mounting base includes a first mounting support and a dual-movement drive mechanism. The dual-movement drive mechanism is mounted on the first mounting support. The feeding gripper mechanism is mounted on one of the moving parts of the dual-movement drive mechanism. The sorting mechanism is mounted on the other moving part of the dual-movement drive mechanism. The dual-movement drive mechanism drives the feeding gripper mechanism and the sorting mechanism to move along a first direction.
3. The chip front and back detection and sorting equipment according to claim 2, characterized in that, The feeding gripper mechanism includes a feeding drive component and a feeding adsorption component. The feeding drive component is connected to the feeding adsorption component and is adapted to drive the feeding adsorption component to move along a second direction. The feeding adsorption component includes an adsorption drive element and an adsorption element. The adsorption drive element is connected to the adsorption element and is adapted to drive the adsorption element to move along the second direction.
4. The chip front and back detection and sorting equipment according to claim 3, characterized in that, The feeding gripper mechanism includes multiple sets of feeding adsorption components and an adjusting component. The multiple sets of feeding adsorption components are arranged along the first direction. The adjusting component is connected to the multiple sets of feeding adsorption components and is adapted to adjust the spacing between any two adjacent sets of feeding adsorption components.
5. The chip front and back detection and sorting equipment according to claim 3, characterized in that, The bottom surface detection module is located below the feeding gripper mechanism. The feeding gripper mechanism is adapted to move the chip on the transmission mechanism to the top of the bottom surface detection module for detection and then transfer it back to the transmission mechanism.
6. The chip front and back detection and sorting equipment according to claim 2, characterized in that, The sorting mechanism includes a sorting drive component and a sorting adsorption component. The sorting drive component is connected to the sorting adsorption component and is adapted to drive the sorting adsorption component to move along a second direction.
7. The chip front and back detection and sorting equipment according to claim 6, characterized in that, The sorting mechanism also includes a height measuring sensor, which is positioned close to the sorting adsorption component relative to the sorting drive component.
8. The chip front and back detection and sorting equipment according to claim 1, characterized in that, The mounting base includes a second mounting support and a linear drive component. The linear drive component is mounted on the second mounting support. The front detection module includes a front character detection drive component and a front character detection component. The linear drive component is connected to the front character detection drive component and is adapted to drive the front character detection drive component to move along a first direction. The front character detection drive component is connected to the front character detection component and is adapted to drive the front character detection component to move along a second direction.
9. The chip front and back detection and sorting equipment according to claim 8, characterized in that, The mounting base includes a third mounting support and a first driving component. The first driving component is mounted on the third mounting support. The chip front and back detection and sorting equipment also includes a transfer component. The first driving component is connected to the transfer component and is adapted to drive the transfer component to move along the first direction to transfer the chip tray after it has been detected by the front character detection component.
10. The chip front and back detection and sorting equipment according to claim 9, characterized in that, The mounting base includes a second driving member, which is mounted on the third mounting bracket. The front detection module further includes a front aperture detection driving member and a front aperture detection member. The second driving member is connected to the front aperture detection driving member and is adapted to drive the front aperture detection driving member to move along a first direction. The front aperture detection driving member is connected to the front aperture detection member and is adapted to drive the front aperture detection member to move along a second direction, so as to detect the chip tray transferred by the transfer component.
11. The chip front and back detection and sorting equipment according to claim 1, characterized in that, The transmission mechanism includes a feeding conveyor assembly and a discharging conveyor assembly, both of which are mounted on the mounting base. The feeding gripper mechanism is located in the transmission path of the feeding conveyor assembly, and the sorting mechanism is located in the transmission path of the discharging conveyor assembly.
12. The chip front and back detection and sorting equipment according to claim 11, characterized in that, The chip front and back detection and sorting equipment also includes a defective box assembly, which is installed on the feeding and conveying assembly.