Multi-element evaporation device and evaporation equipment
By using an independent evaporation source and gas mixing channel structure, the problems of compositional deviation and equipment complexity in multi-element alloy deposition were solved, achieving uniform deposition of alloy layers and simplifying the operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU ENPACK COMPOSITE CURRENT COLLECTORS CO LTD
- Filing Date
- 2025-06-09
- Publication Date
- 2026-05-22
Smart Images

Figure CN224266328U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of vapor deposition equipment, and in particular to a multi-element evaporation device and vapor deposition equipment. Background Technology
[0002] Currently, lithium batteries can be broadly classified into two categories: lithium metal batteries and lithium-ion batteries. The negative electrode of a lithium battery typically consists of a negative electrode current collector (usually copper foil) and a negative electrode active material disposed on the current collector. Lithium metal batteries use metallic lithium or lithium alloys as the active material in their negative electrodes, while lithium-ion batteries typically use graphite or silicon-based materials. However, in the lithium replenishment process, a layer of metallic lithium still needs to be deposited on the surface of the current collector. In other words, there is a need to shape lithium metal onto the current collector during the manufacturing process of lithium battery negative electrodes.
[0003] To improve the performance of lithium batteries, metals such as magnesium and zinc are added to lithium metal during the manufacturing process to form alloys. However, vacuum evaporation deposition technology faces significant technical bottlenecks in the field of multi-element alloy deposition. The physical properties of the evaporation boat or crucible-type evaporation source carrier used in conventional vacuum roll-to-roll coating equipment severely restrict the accurate co-deposition of multi-element alloys.
[0004] Specifically, when using an evaporation boat as the evaporation source carrier, if the vapor pressure differences among the components in the alloy are significant, the lower-pressure components will evaporate first, causing the composition to deviate from the original alloy ratio. The temperature gradient in the evaporation boat heating also affects the uniform evaporation of the alloy. Furthermore, ternary alloy vapor deposition is more challenging, requiring high stability in composition control. While using multiple evaporation boats for co-evaporation allows for more flexible composition control and is more suitable for metals with large vapor pressure differences, such as lithium, manganese, and zinc, it leads to more complex equipment and requires real-time monitoring of the deposition efficiency of each metal and adjustment of power to maintain the deposition effect, making operation cumbersome.
[0005] Using a crucible as an evaporation source carrier offers greater flexibility and precision when depositing binary or ternary alloys, but it also presents challenges such as crucible material contamination and low deposition rates. Furthermore, if multiple metals are placed in the crucible, their different evaporation temperatures make temperature control difficult, and the metal gases cannot be effectively and uniformly mixed, hindering the deposition of multi-element alloys with uniform composition distribution in the current collector.
[0006] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. Utility Model Content
[0007] The purpose of this invention is to provide a multi-element evaporation device and a vapor deposition equipment for depositing a multi-element alloy with uniformly distributed composition on a current collector.
[0008] The purpose of this utility model is achieved through the following technical solution: a multi-electrode evaporation device, comprising:
[0009] At least two independent evaporation sources, each used to independently heat and evaporate different raw materials;
[0010] The mixing channel is a through structure in the vertical direction. Its bottom opening is connected to each of the evaporation sources to receive raw material vapor, and its top opening is used to output the mixed raw material vapor.
[0011] In the direction from bottom to top, the cross-sectional area of the gas mixing channel generally shows a non-increasing trend, and at least one continuous region gradually decreases.
[0012] Furthermore, the interior of the gas mixing channel is provided with a flow guiding structure, which is adapted to guide the steam to spiral upward.
[0013] Furthermore, including;
[0014] An evaporator has at least two independent and insulated chambers inside, each chamber being used to house different containers in which the raw material to be evaporated is placed.
[0015] Heating elements are disposed in the evaporator and correspond one-to-one with each of the chambers to independently heat different chambers;
[0016] A gas mixing mechanism is connected to the evaporator and has a gas mixing channel extending vertically through it.
[0017] The chamber and the corresponding heating element together form the evaporation source.
[0018] Furthermore, the evaporator has an open-top cavity inside, and the cavity is provided with a vertical partition wall to divide the cavity into at least two independent chambers, and the bottom opening of the gas mixing channel is connected to the top opening of the cavity.
[0019] Furthermore, the partition wall that forms the cavity has heating layers on both sides, each heating layer has an independent heating element, and the heating layers are separated by a heat insulation layer.
[0020] Furthermore, the partition wall has a closed ring structure, and there is at least one partition wall, which are arranged in a nested manner. The inner space of the innermost partition wall constitutes the first chamber, the annular space between two adjacent partition walls constitutes the second chamber, and the annular space between the outermost partition wall and the cavity of the evaporator constitutes the third chamber.
[0021] Furthermore, the periphery of each partition wall is adapted to the inner periphery of the evaporator, and the central axis parallel to the vertical direction coincides with the central axis of the evaporator and the gas mixing channel.
[0022] Furthermore, it also includes a diffusion mechanism connected to the gas mixing mechanism. The diffusion mechanism has a diffusion channel formed through it in a vertical direction. The cross-sectional area of the diffusion channel is generally non-decreasing, and at least one continuous region gradually increases. The bottom opening of the diffusion channel is connected to the top opening of the gas mixing channel, and the top opening is used to output the diffused raw material vapor.
[0023] Furthermore, the top of the diffusion mechanism has a concave arc surface structure, and the gas mixing mechanism and / or the diffusion mechanism are provided with heat preservation elements. The heat preservation elements are adapted to heat the gas mixing channel and / or the diffusion channel. In the vertical direction, the length of the diffusion mechanism is less than the length of the gas mixing mechanism.
[0024] In addition, this utility model also provides a vapor deposition apparatus, comprising:
[0025] The aforementioned multi-electrode evaporation device;
[0026] The unwinding device is used to unwind the current collector to be vapor-deposited and to rewind the current collector after vapor deposition.
[0027] The current collector is adapted to flow continuously through the deposition station under the traction of the winding and unwinding device, and the multi-electrode evaporator is located below the deposition station and is adapted to evaporate the mixed gas to be deposited on the surface of the current collector.
[0028] Compared with the prior art, the present invention has the following beneficial effects: By adopting the above structure, the raw materials constituting the alloy are contained in independent evaporation sources, and the heating temperature and evaporation rate can be independently controlled, so that each raw material can evaporate at the same time, avoiding thermal interference between raw materials and ensuring that the subsequent alloy composition does not deviate from the original ratio; the evaporated raw material vapor is introduced into the mixing channel to achieve mixing, and by depositing the mixed vapor onto the current collector to be plated, the raw material of the deposited alloy layer is evenly distributed; in the direction from bottom to top, the cross-section of the mixing channel is generally non-increasing, and at least one continuous region gradually decreases. The overall non-increasing structure maintains a stable upward airflow, prevents vapor backflow or local stagnation, and ensures continuous and uniform mixing. The narrowing region of the mixing channel optimizes the vapor flow path, accelerates vapor rise and compression, and enhances the turbulent mixing effect, promoting the rapid and uniform mixing of different raw material vapors. Attached Figure Description
[0029] Figure 1 This is a schematic diagram of the vapor deposition equipment of this utility model.
[0030] Figure 2 This is a cross-sectional schematic diagram of the evaporator in this utility model.
[0031] Explanation of reference numerals in the attached figures:
[0032] 100. Multi-electrode evaporator; 110. Evaporator box; 111. Chamber; 1111. First chamber; 1112. Second chamber; 1113. Third chamber; 112. Partition wall; 1121. Heating layer; 1122. Insulation layer; 120. Gas mixing mechanism; 121. Gas mixing channel; 122. Flow guiding structure; 130. Diffusion mechanism; 131. Diffusion channel; 200. Unwinding and winding device; 210. Unwinding roller; 220. Winding roller; 230. Cooling roller; 240. Guide roller; 300. Current collector. Detailed Implementation
[0033] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.
[0034] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.
[0035] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0036] Please see Figure 1 and Figure 2As shown, a preferred embodiment of the multi-evaporation device 100 of this utility model includes an evaporation source and a mixing channel 121. There are at least two evaporation sources, each used to independently heat and evaporate different raw materials. The mixing channel 121 has a through-type structure in the vertical direction, with its bottom opening connected to each evaporation source. After the evaporation source heats and evaporates its corresponding raw material, the evaporated raw material vapor can enter the mixing channel 121 from the bottom opening, mix within the mixing channel 121, and then exit through the top outlet for vapor deposition onto the surface of the current collector 300. The raw materials include lithium, magnesium, zinc, etc., to achieve the vapor deposition of binary or multi-element alloys as needed.
[0037] By adopting the above structure, the raw materials constituting the alloy are contained in an independent evaporation source, and the heating temperature and evaporation rate can be independently controlled, so that the raw materials can evaporate at the same time, avoiding thermal interference between raw materials and ensuring that the subsequent alloy composition does not deviate from the original ratio; the evaporated raw material vapor is introduced into the mixing channel 121 to achieve mixing, and by depositing the mixed vapor onto the current collector 300 to be plated, the raw materials of the evaporated alloy layer are evenly distributed.
[0038] Preferably, the cross-section of the mixing channel 121 is non-increasing overall from bottom to top, and at least one continuous region gradually decreases in size. With this structure, the overall non-increasing structure maintains a stable upward airflow, preventing vapor backflow or local stagnation, ensuring continuous and uniform mixing. The narrowed region of the mixing channel 121 optimizes the vapor flow path, accelerates vapor ascent and compression, and enhances the turbulent mixing effect, promoting rapid and uniform mixing of different raw material vapors.
[0039] Furthermore, in the upward direction, the gas mixing channel 121 can decrease continuously or discontinuously. When the gas mixing channel 121 decreases continuously, it consists only of decreasing portions and has no constant portion with a constant cross-sectional area. When the gas mixing channel 121 decreases discontinuously, it has a constant portion with a constant cross-sectional area. This invention does not limit the specific type of decrease. The decreasing method of the decreasing portion includes, but is not limited to, single linear decrease, piecewise linear decrease, nonlinear decrease, and piecewise composite decrease. In this embodiment, single linear decrease is preferred for easier molding. The cross-section of the gas mixing channel 121 is preferably circular, and the interior of the gas mixing channel 121 is smooth to reduce the generation of dead corners.
[0040] Preferably, the mixing channel 121 is provided with a flow guiding structure 122, which is adapted to guide the steam to rise in a spiral, so that the steam of each raw material is mixed more evenly. Specifically, the flow guiding structure 122 includes, but is not limited to, spiral grooves formed on the inner wall of the mixing channel 121, spiral guide plates installed in the mixing channel 121, turbine guides, etc. The arrangement of the flow guiding structure 122 makes the steam of the raw materials move in a "cyclone" path in the mixing channel 121, so as to further mix the steam of different raw materials.
[0041] Furthermore, the multi-evaporation apparatus 100 includes an evaporation chamber 110, heating elements, and a gas mixing mechanism 120. The evaporation chamber 110 has at least two independent, heat-insulated chambers 111, each chamber 111 housing different containers. The raw material to be evaporated can be placed in the container to prevent it from flowing into different parts of the chamber 111 during the heating process, thus improving the cleanliness of the chamber 111. The container can specifically be a crucible or other high-temperature resistant carrier. The contour of the container is adapted to the contour of the chamber 111 to make them more compact, ensuring that larger containers can be installed to increase their capacity. Heating elements are located in the evaporation chamber 110 and correspond one-to-one with the chambers 111 to independently heat different chambers 111. The heating elements can specifically be resistance or non-resistance heating structures such as heating wires or induction heating coils. The chambers 111 and their corresponding heating elements cooperate to form an evaporation source. The gas mixing mechanism 120 is connected to the evaporator 110, and the gas mixing mechanism 120 has the aforementioned gas mixing channel 121 extending vertically through it.
[0042] Compared to forming a single chamber 111 in each evaporator 110, this utility model integrates each chamber 111 into the same evaporator 110, resulting in high integration, a more compact structure, reduced space occupation, and the gas mixing mechanism 120 can be directly connected to the evaporator 110 without the need for additional pipelines to connect to different evaporators 110.
[0043] Furthermore, the evaporator 110 has an open-top cavity inside, with a vertical partition wall 112 inside. The partition wall 112 is supported and fixed to the bottom of the evaporator 110 and extends towards the top of the evaporator 110 to divide the cavity into at least two independent chambers 111. The bottom opening of the mixing channel 121 is connected to the top opening of the cavity, allowing the raw material vapor evaporated in each chamber 111 to be concentrated and enter the mixing channel 121 from the top of the cavity. The two side walls of the partition wall 112 that form the chambers 111 are provided with heating layers 1121, and each heating layer 1121 is provided with an independent heating element so that the heat emitted by the heating element can directly act on the corresponding chamber 111.
[0044] If the insulation between chambers 111 is inadequate, heat radiation will cause the chamber containing materials with lower evaporation temperatures to be affected by the chamber containing materials with higher evaporation temperatures. This will intensify the boiling of the liquid formed by the melted material with lower evaporation temperatures, making it impossible to control the evaporation rate. Simultaneously, the temperature of the chamber containing the material with higher evaporation temperatures will decrease, affecting the evaporation of the material with higher evaporation temperatures; the interior of this chamber may even fail to reach the evaporation temperature. Preferably, a heat insulation layer 1122 is provided between the heating layers 1121 to isolate heat between adjacent chambers 111 and prevent heat radiation from affecting the evaporation of materials in different chambers 111. The heat insulation layer 1122 can be made of high-temperature resistant heat insulation materials such as ceramics or rock wool.
[0045] Furthermore, in one embodiment, the partition wall 112 is a plate-like structure, and there is at least one such partition wall, which divides the cavity of the evaporator 110 into at least two chambers 111 distributed in the horizontal direction. However, with the above structure, it is difficult for each chamber 111 to be directly aligned with the mixing channel 121, and the evaporated raw material vapor is relatively dispersed, which is not conducive to uniform mixing in the mixing channel 121.
[0046] In a preferred embodiment, the partition wall 112 has a closed ring structure, and there is at least one partition wall 112 arranged in a nested manner so that the cross-section of the partition walls 112 is U-shaped. In this case, the two side walls of the partition wall 112 specifically refer to the outer and inner peripheral surfaces. The inner and outer peripheral contours of the partition wall 112 are adapted to the inner peripheral contour of the evaporator 110. For example, when the inner peripheral contour of the evaporator 110 is circular, the inner and outer peripheral contours of the partition wall 112 are also circular; when the inner peripheral contour of the evaporator 110 is square, the inner and outer peripheral contours of the partition wall 112 are also square. Preferably, when multiple partition walls 112 are provided, each partition wall 112 gradually expands proportionally from the inside out. Each partition wall 112 is parallel to the vertical central axis and coincides with the central axis of the evaporator 110 and the mixing channel 121. That is, several partition walls 112 are arranged coaxially with the evaporator 110 and the mixing channel 121, which further improves the uniformity of raw material vapor mixing.
[0047] With the above structure, the inner space of the innermost partition wall 112 forms the first chamber 1111, the annular space between two adjacent partition walls 112 forms the second chamber 1112, and the annular space between the outermost partition wall 112 and the cavity of the evaporator 110 forms the third chamber 1113. Therefore, each chamber 111 is directly opposite the mixing channel 121, and the evaporated raw material vapor flows to the mixing channel 121 for more uniform mixing, thereby improving the uniformity of the alloy deposited on the current collector 300.
[0048] In this embodiment, there are two partition walls 112 to form three chambers 111, enabling ternary vapor deposition. For example, the first chamber 1111 is used to place lithium raw materials, while the second chamber 1112 and the third chamber 1113 are used to place raw materials such as magnesium and zinc, respectively.
[0049] Furthermore, the multi-electrode evaporator 100 also includes a diffusion mechanism 130 connected to the gas mixing mechanism 120. The diffusion mechanism 130 has a diffusion channel 131 extending vertically through it. The cross-sectional area of the diffusion channel 131 is generally non-decreasing, and at least one continuous region gradually increases. The bottom opening of the diffusion channel 131 is connected to the top opening of the gas mixing channel 121. The top opening is used to output the diffused raw material vapor.
[0050] By adopting the above structure, the mixed vapor flowing out of the mixing channel 121 can diffuse in the diffusion channel 131, thereby increasing the deposition area to meet the requirement of large-area deposition of multi-element alloys on the wide current collector 300.
[0051] In the bottom-up direction, the diffusion channel 131 can increase continuously or discontinuously. When the diffusion channel 131 increases continuously, it consists only of the increasing portion and has no constant portion with a constant cross-sectional area. When the diffusion channel 131 increases discontinuously, it has a constant portion with a constant cross-sectional area. This utility model does not limit this. The increasing method of the increasing portion includes, but is not limited to, single linear increase, piecewise linear increase, nonlinear increase, and piecewise composite increase. In this embodiment, single linear increase is preferred for easier molding. The cross-section of the diffusion channel 131 is also preferably circular. The diffusion channel 131 is coaxial with the gas mixing channel 121, and the interior of the diffusion channel 131 is smooth to reduce the generation of dead corners.
[0052] Preferably, in the vertical direction, the length of the diffusion mechanism 130 is less than the length of the mixing mechanism 120, so as to avoid the separation of raw material vapors with different vapor pressures due to the excessively long flow path during the diffusion process.
[0053] Preferably, the top of the diffusion mechanism 130 has a concave arc surface structure to match the contour of the current collector 300 through which it flows, so that the two can be closer together, ensuring that the raw material vapor overflowing from the top opening of the diffusion channel 131 is quickly deposited on the current collector 300, avoiding vapor loss and waste.
[0054] Furthermore, the mixing mechanism 120 and / or the diffusion mechanism 130 are provided with heat-insulating elements. The structure of the heat-insulating elements is similar to that of the heating elements, and they are suitable for heating the mixing channel 121 and / or the diffusion channel 131 to prevent the raw material vapor flowing into the mixing channel 121 and / or the diffusion channel 131 from being cooled and deposited. Preferably, in this embodiment, both the mixing mechanism 120 and the diffusion mechanism 130 are provided with heat-insulating elements, and they are suitable for independent control so that the temperature in the mixing channel 121 and the diffusion channel 131 can be adjusted separately according to actual needs, so that the mixed vapor is kept in the optimal mixing state and the subsequent deposition quality is improved.
[0055] In addition, this utility model also provides a vapor deposition equipment, including the aforementioned multi-element evaporation device 100 and a winding and unwinding device 200. The winding and unwinding device 200 is used to unwind the current collector 300 to be vapor-deposited and to wind up the current collector 300 after vapor deposition. The current collector 300 is adapted to continuously flow through the deposition station under the traction of the winding and unwinding device 200. The multi-element evaporation device 100 is located below the deposition station and is adapted to evaporate the mixed gas to deposit on the surface of the current collector 300.
[0056] The unwinding and take-up device 200 includes an unwinding roller 210, a take-up roller 220, and a cooling roller 230 located between them. The unwinding roller 210 holds a wound current collector 300 and is equipped with a rotary motor for autonomous rotation and unwinding. The unwound current collector 300 flows through the cooling roller 230 to the take-up roller 220, which is also equipped with a rotary motor to rewind the unwound current collector 300. The deposition station is located at the cooling roller 230, which has a cooling liquid circulation channel communicating with the outside to cool the current collector 300, allowing the alloy vapor-deposited onto the current collector 300 to cool rapidly and form a deposition layer. Preferably, when the current collector 300 flows through the cooling roller 230, the current collector 300 bends downwards to fit the concave arc surface at the top of the diffusion mechanism 130, resulting in a more compact relationship between the current collector 300 and the diffusion mechanism 130.
[0057] In addition, the unwinding and take-up device 200 also includes a number of guide rollers 240, which are located between the unwinding roller 210 and the cooling roller 230, and / or between the cooling roller 230 and the take-up roller 220, to guide and tension the current collector 300 so that the current collector 300 can flow reliably along a preset path.
[0058] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A multi-element evaporation device, characterized in that, include: At least two independent evaporation sources, each used to independently heat and evaporate different raw materials; The mixing channel (121) is a through structure in the vertical direction. Its bottom opening is connected to each of the evaporation sources to receive raw material vapor, and its top opening is used to output the mixed raw material vapor. In the direction from bottom to top, the cross-sectional area of the gas mixing channel (121) generally shows a non-increasing trend, and at least one continuous region gradually decreases.
2. The multi-electrode evaporator as described in claim 1, characterized in that, The mixing channel (121) is provided with a flow guiding structure (122) inside, which is adapted to guide the steam spiral upward.
3. The multi-electrode evaporator as described in claim 1, characterized in that, include; An evaporator (110) has at least two independent and heat-insulated chambers (111) inside, each of which is used to house different containers in which the raw material to be evaporated is placed; Heating elements are provided in the evaporator (110) and correspond one-to-one with the chambers (111) to independently heat different chambers (111); The gas mixing mechanism (120) is connected to the evaporator (110) and has the gas mixing channel (121) formed through it in the vertical direction; The chamber (111) and the corresponding heating element cooperate to form the evaporation source.
4. The multi-electrode evaporator as described in claim 3, characterized in that, The evaporator (110) has an open-top cavity inside, and a vertical partition wall (112) is provided inside the cavity to divide the cavity into at least two independent chambers (111). The bottom opening of the gas mixing channel (121) is connected to the top opening of the cavity.
5. The multi-electrode evaporator as described in claim 4, characterized in that, The partition wall (112) is used to form the two side walls of the chamber (111) and is provided with heating layers (1121). Each heating layer (1121) is provided with an independent heating element, and a heat insulation layer (1122) is provided between the heating layers (1121) to insulate against heat.
6. The multi-electrode evaporator as described in claim 4, characterized in that, The partition wall (112) has a closed ring structure. There is at least one partition wall (112), and they are arranged in a nested manner. The inner space of the innermost partition wall (112) forms a first chamber (1111). The annular space between two adjacent partition walls (112) forms a second chamber (1112). The annular space between the outermost partition wall (112) and the cavity of the evaporator (110) forms a third chamber (1113).
7. The multi-electrode evaporator as described in claim 6, characterized in that, The periphery of each partition wall (112) is adapted to the inner periphery of the evaporator (110), and the central axis parallel to the vertical direction coincides with the central axis of the evaporator (110) and the gas mixing channel (121).
8. The multi-electrode evaporator as described in claim 3, characterized in that, It also includes a diffusion mechanism (130) connected to the gas mixing mechanism (120). The diffusion mechanism (130) has a diffusion channel (131) extending vertically through it. The cross-sectional area of the diffusion channel (131) is generally non-decreasing, and at least one continuous region gradually increases. The bottom opening of the diffusion channel (131) is connected to the top opening of the gas mixing channel (121). The top opening is used to output the diffused raw material vapor.
9. The multi-electrode evaporator as described in claim 8, characterized in that, The top of the diffusion mechanism (130) has a concave arc surface structure. The gas mixing mechanism (120) and / or the diffusion mechanism (130) are provided with heat insulation elements. The heat insulation elements are adapted to heat the gas mixing channel (121) and / or the diffusion channel (131). In the vertical direction, the length of the diffusion mechanism (130) is less than the length of the gas mixing mechanism (120).
10. A vapor deposition apparatus, characterized in that, include: The multi-electrode evaporator (100) as described in any one of claims 1 to 9; A winding and unwinding device (200) is used to unwind the current collector (300) to be vapor-deposited and to wind up the current collector (300) after vapor deposition. The current collector (300) is adapted to flow continuously through the deposition station under the traction of the winding and unwinding device (200), and the multi-electrode evaporator (100) is located below the deposition station and is adapted to evaporate the mixed gas to be deposited on the surface of the current collector (300).