Wafer stage device of multifunctional ion beam deposition and etching machine

Abstract

The utility model provides a wafer stage device of a multifunctional ion beam deposition and etching machine, which comprises a stage plate, one side of the top end of the stage plate is connected with a rotating arm, the rotating arm and the stage plate are driven to rotate through an external rotation driving mechanism, the bottom end of the stage plate is connected with a sealing box body, the stage plate and the sealing box body form a cavity, and the sealing box body is connected with the sealing box body. A carrier driving assembly and a wafer lifting assembly are connected in the cavity, a groove with an outward opening is formed in the side, close to the external rotation driving mechanism, of the rotating arm, the groove is connected with the external rotation driving mechanism in a clamped mode and then connected with the external rotation driving mechanism through a bolt, and the contact area between the external rotation driving mechanism and the rotating arm is indirectly increased; the external rotation driving mechanism can bear the carrying table plate and the rotating arm, so that the carrying table plate and the rotating arm are prevented from falling down under the self-gravity, the external rotation driving mechanism and the rotating arm are connected more stably, the requirement of the etching process is ensured, and the safety is improved.

Description

Technical Field

[0001] This utility model belongs to the field of vacuum evaporation equipment technology, and more specifically, relates to a wafer stage device for a multifunctional ion beam deposition and etching machine. Background Technology

[0002] In the fields of semiconductor processes or microelectromechanical systems, patterning using ion beam etching is a very common anisotropic etching method. Due to the high compatibility of IBE with etching materials, it can etch materials that are difficult to process by micro-fabrication processes, such as metals, ceramics, and various compounds. It plays an important supplementary role to wet etching and chemical reactive ion etching.

[0003] The existing patent publication number, CN118588529A, discloses an IBE ion beam etching apparatus, comprising: a vacuum chamber, a vacuum pump assembly mounted above the vacuum chamber, an ion beam generator mounted on the rear wall of the vacuum chamber, a rotary drive structure mounted on the left side of the vacuum chamber, an etching stage rotatably mounted inside the vacuum chamber, the rotary drive structure driving and connecting the etching stage, a wafer feed port opened on the right side wall of the vacuum chamber, the etching stage comprising a stage plate, and a rotary drive assembly, a wafer lifting and clamping assembly, a baffle drive cylinder, and a sensing device fixedly mounted in the space within the stage plate and the sealed box. The above components are fixedly connected to the stage plate, and the connection is sealed. This invention allows the wafer etching process to be in an adjustable angle state, enabling more precise and complex etching, significantly improving etching stability and yield, with a high degree of automation and improved etching efficiency.

[0004] However, in the existing technology, the external rotating mechanism is directly fixed to the rotating arm with bolts. After long-term use, due to the gravity of the etching stage and other components on it, the bolts may bend downwards, causing the etching stage and other components on it to fall downwards, affecting the etching process requirements and also damaging other components, which poses a certain danger. Utility Model Content

[0005] Therefore, to solve the above-mentioned technical problems, this utility model proposes a wafer stage device for a multifunctional ion beam deposition and etching machine, including a stage plate 10. A rotating arm 20 is connected to one side of the top of the stage plate 10. The rotating arm 20 is used to connect to an external rotation drive mechanism, which drives the rotating arm 20 and the stage plate 10 to rotate. A sealed box 30 is connected to the bottom of the stage plate 10, and the stage plate 10 and the sealed box 30 form a cavity. A stage drive assembly 40 and a wafer lifting assembly 50 are connected inside the cavity. The rotating arm 20 has an outward-facing groove 60 on the side near the external rotary drive mechanism. After the groove 60 engages with the external rotary drive mechanism and is connected by bolts, it indirectly increases the contact area between the external rotary drive mechanism and the rotating arm 20. Furthermore, by providing the groove 60, the external rotary drive mechanism can support the platform 10 and the rotating arm 20, preventing the platform 10 and the rotating arm 20 from falling downwards under their own weight. This makes the connection between the external rotary drive mechanism and the rotating arm 20 more stable, thereby ensuring the requirements of the etching process and improving safety.

[0006] A wafer stage device for a multifunctional ion beam deposition and etching machine includes a stage plate 10. A rotating arm 20 is connected to one side of the top of the stage plate 10. The rotating arm 20 is used to connect to an external rotation drive mechanism. The external rotation drive mechanism drives the rotating arm 20 and the stage plate 10 to rotate. A sealed housing 30 is connected to the bottom of the stage plate 10. The stage plate 10 and the sealed housing 30 form a chamber. A stage drive assembly 40 and a wafer lifting assembly 50 are connected in the chamber. The rotating arm 20 has an outward-facing groove 60 on the side near the external rotation drive mechanism. The groove 60 is engaged with the external rotation drive mechanism and connected by bolts, indirectly increasing the contact area between the external rotation drive mechanism and the rotating arm 20. Also, by providing the groove 60, the external rotation drive mechanism can support the stage plate 10 and the rotating arm 20, preventing the stage plate 10 and the rotating arm 20 from falling downwards under their own weight.

[0007] Furthermore, the platform plate 10 and the rotating arm 20 are integrally formed, resulting in strong structural stability.

[0008] Furthermore, on the side of the stage plate 10 away from the rotating arm 20, a pin retaining ring connecting plate 70, a water-cooled plate sealing plate 80, a water-cooled plate 90, a wafer carrier plate 100, a wafer substrate 110, and a wafer retaining ring 120 are sequentially arranged above it. The output end of the stage drive assembly 40 passes through the pin retaining ring connecting plate 70 and connects to the bottom end of the water-cooled plate sealing plate 80. A lifting rod assembly 130 and a pin assembly 140 are connected to the top of the pin retaining ring connecting plate 70, and the pin assembly 140 is located in the inner circle of the lifting rod assembly 130. One end of the lifting rod assembly 130 is connected to the pin. The pressure ring connecting plate 70 is connected, and the other end passes through the water-cooled plate sealing plate 80, the water-cooled plate 90 and the wafer carrier plate 100 in sequence, and is connected to the wafer pressure ring 120. One end of the ejector pin assembly 140 is connected to the ejector pin pressure ring connecting plate 70, and the other end passes through the water-cooled plate sealing plate 80, the water-cooled plate 90 and the wafer carrier plate 100 in sequence, and abuts against the wafer substrate 110. The stage driving assembly 40 drives the water-cooled plate sealing plate 80 to rotate, which in turn drives the ejector pin pressure ring connecting plate 70 to rotate, thereby making the wafer substrate 110 uniformly coated.

[0009] Furthermore, the bottom end of the ejector pin pressure ring connecting plate 70 is connected to the wafer lifting assembly 50. The wafer lifting assembly 50 is used to control the lifting of the ejector pin pressure ring connecting plate 70, drive the lifting rod assembly 130 and the ejector pin assembly 140 to lift, thereby drive the lifting of the wafer pressure ring 120, and control the clamping or lifting of the wafer substrate 110.

[0010] Furthermore, the top of the water-cooled plate 90 is connected to the wafer carrier plate 100. The lower surface of the wafer carrier plate 100 is provided with a first airflow channel 150, and the upper surface of the wafer carrier plate 100 is provided with a second airflow channel 160. The first airflow channel 150 is connected to the water-cooled plate 90 to form a complete gas channel for passing through low-temperature gas. The wafer carrier plate 100 is also provided with a plurality of auxiliary airflow channels 170. One end of the auxiliary airflow channel 170 is connected to the first airflow channel 150, and the other end is connected to the second airflow channel 160. The wafer substrate 110 is placed above the second airflow channel 160. When the wafer substrate 110 is coated, the wafer substrate 110 is cooled by passing through the low-temperature gas.

[0011] Furthermore, the water-cooled plate 90 is provided with a first air inlet in the middle, which is connected to one end of the first airflow channel 150. The first airflow channel 150 is a double-ring structure extending from the middle to the outer ring, and the second airflow channel 160 is a multi-ring structure extending from the middle to the outer ring, which is used to increase the cooling area.

[0012] Furthermore, the cryogenic gas is helium.

[0013] Furthermore, the bottom end of the water-cooled plate 90 is connected to the water-cooled plate sealing plate 80. The lower surface of the water-cooled plate 90 is provided with a liquid circulation tank 180. The liquid circulation tank 180 and the water-cooled plate sealing plate 80 below it are connected to form a complete liquid flow channel. The middle part of the water-cooled plate sealing plate 80 is provided with a water inlet 190, a water outlet 200 and a second air inlet 210. The water inlet 190 is connected to one end of the liquid flow channel and the water outlet 200 is connected to the other end of the liquid flow channel. It is used to introduce external coolant and cool the water-cooled plate 90, and finally cool the wafer substrate 110. The second air inlet 210 is connected to the first air inlet.

[0014] Furthermore, the water-cooled plate 80, the water-cooled plate 90, and the wafer carrier plate 100 are integrally formed, providing good sealing performance, so that the coolant in the liquid flow channel will not leak when the wafer substrate 110 is coated.

[0015] Furthermore, the platform driving assembly 40 includes a drive motor 401, a reducer 402, and a magnetic fluid 403. The output end of the drive motor 401 is connected to the input end of the reducer 402. The magnetic fluid 403 is fixedly sleeved with the platform plate 10. A magnetic fluid shaft 404 is connected inside the magnetic fluid 403. A first synchronous pulley 220 is connected to the output end of the reducer 402. A second synchronous pulley 230 is connected to the input end of the magnetic fluid shaft 404. The first synchronous pulley 220 and the second synchronous pulley 230 are connected by a synchronous belt 240. The output end of the magnetic fluid shaft 404 passes through the ejector pin pressure ring connecting plate 70 and is connected to the water-cooled plate sealing plate 80. Under the drive of the drive motor 401, the magnetic fluid shaft 404 is rotated, which in turn drives the water-cooled plate sealing plate 80 to rotate, causing the ejector pin pressure ring connecting plate 70 to rotate as well.

[0016] Furthermore, the magnetic fluid shaft 404 has a hollow structure, and the magnetic fluid 403 is provided with three connection holes 250, which are respectively connected to the water inlet 190, the water outlet 200 and the second air inlet 210 in the middle of the water-cooled plate sealing plate 80. The input end of the connection hole 250 is connected to the pipeline of the external water-cooling device and the low-temperature gas device.

[0017] Furthermore, the wafer lifting assembly 50 includes a lifting drive cylinder 501, a cylinder hoisting cylinder 502, and a bellows 503. The stage plate 10 is fixedly sleeved with the cylinder hoisting cylinder 502 near the lower part of the ejector pin pressure ring connecting plate 70. The pneumatic extension end of the lifting drive cylinder 501 passes through the cylinder hoisting cylinder 502 and is connected to the ejector pin pressure ring connecting plate 70. The bellows 503 is sleeved on the pneumatic extension end of the lifting drive cylinder 501 to keep the pneumatic extension end of the lifting drive cylinder 501 in a sealed state, preventing the vacuum of the ion beam etching machine from being damaged.

[0018] Furthermore, a dual-crystal sensor 260 is provided at the top of the stage plate 10 near the wafer substrate 110 to monitor the coating status of the wafer substrate 110.

[0019] The beneficial effects of this utility model are as follows: This utility model proposes a wafer stage device for a multifunctional ion beam deposition and etching machine, including a stage plate 10. A rotating arm 20 is connected to one side of the top of the stage plate 10. The rotating arm 20 is used to connect to an external rotation drive mechanism, which drives the rotating arm 20 and the stage plate 10 to rotate. A sealed box 30 is connected to the bottom of the stage plate 10, and the stage plate 10 and the sealed box 30 form a cavity. A stage drive assembly 40 and a wafer lifting assembly 50 are connected inside the cavity. The rotating arm 20... A groove 60 with an outward opening is provided on the side near the external rotary drive mechanism. After the groove 60 is engaged with the external rotary drive mechanism and connected by bolts, it indirectly increases the contact area between the external rotary drive mechanism and the rotating arm 20. Furthermore, by providing the groove 60, the external rotary drive mechanism can support the platform plate 10 and the rotating arm 20, preventing the platform plate 10 and the rotating arm 20 from falling downwards under their own weight. This makes the connection between the external rotary drive mechanism and the rotating arm 20 more stable, thereby ensuring the requirements of the etching process and improving safety. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0021] Figure 2 This is a partial structural schematic diagram of the present invention.

[0022] Figure 3 This is a partial structural schematic diagram of the present invention.

[0023] Figure 4 This is a partial structural schematic diagram of the present invention.

[0024] Figure 5 This is a partial enlarged view of the structure of this utility model.

[0025] Figure 6 This is a partial structural schematic diagram of the present invention.

[0026] Explanation of key component symbols:

[0027] Platform plate 10, rotating arm 20, sealed box 30, platform drive assembly 40, drive motor 401, reducer 402, magnetic fluid 403, magnetic fluid shaft 404, wafer lifting assembly 50, lifting drive cylinder 501, cylinder hoisting cylinder 502, bellows 503, groove 60, ejector pin pressure ring connecting plate 70, water-cooled plate sealing plate 80, water-cooled plate 90, wafer carrier plate 100, wafer substrate 110, wafer pressure ring 120, hoisting rod assembly 130, ejector pin assembly 140, first airflow channel 150, second airflow channel 160, auxiliary airflow channel 170, liquid circulation tank 180, water inlet 190, water outlet 200, second air inlet 210, first synchronous pulley 220, second synchronous pulley 230, synchronous belt 240, connecting hole 250, dual crystal sensor 260.

[0028] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0029] The following embodiments are described to aid in understanding this application. These embodiments are not, and should not be, construed in any way as limiting the scope of protection of this application.

[0030] In the following description, those skilled in the art will recognize that throughout this discussion, components may be described as individual functional units (which may include subunits), but those skilled in the art will recognize that various components or portions thereof may be divided into individual components or may be integrated together (including integrated within a single system or component).

[0031] Furthermore, the connection between components or systems is not intended to be limited to a direct connection; on the contrary, data between these components may be modified, reformatted, or otherwise altered by intermediate components. Additionally, other or fewer connections may be used. It should also be noted that the terms "connection," "link," or "input" should be understood to include direct connections, indirect connections via one or more intermediate devices, and wireless connections. Example 1:

[0032] like Figure 1 The diagram shown is a schematic representation of the overall structure of this utility model; as shown... Figure 2 The diagram shown is a partial structural schematic of this utility model; as shown... Figure 3 The diagram shown is a partial structural schematic of this utility model; as shown... Figure 4 The diagram shown is a partial structural schematic of this utility model; as shown... Figure 5The image shown is a partially enlarged view of the structure of this utility model; as shown... Figure 6 The diagram shown is a partial structural schematic of this utility model.

[0033] A wafer stage device for a multifunctional ion beam deposition and etching machine includes a stage plate 10. A rotating arm 20 is connected to one side of the top of the stage plate 10. The rotating arm 20 is connected to an external rotation drive mechanism, which drives the rotating arm 20 and the stage plate 10 to rotate. A sealed housing 30 is connected to the bottom of the stage plate 10, forming a chamber with the stage plate 10. A stage drive assembly 40 and a wafer lifting assembly 50 are connected inside the chamber. A groove 60 with an outward opening is provided on the side near the external rotary drive mechanism. After the groove 60 is engaged with the external rotary drive mechanism and connected by bolts, it indirectly increases the contact surface between the external rotary drive mechanism and the rotating arm 20. Also, by providing the groove 60, the external rotary drive mechanism can support the platform plate 10 and the rotating arm 20, preventing the platform plate 10 and the rotating arm 20 from falling downward under their own weight. The platform plate 10 and the rotating arm 20 are integrally formed, resulting in strong structural stability.

[0034] Above the stage plate 10 on the side away from the rotating arm 20, there are sequentially arranged a pin retaining ring connecting plate 70, a water-cooled plate sealing plate 80, a water-cooled plate 90, a wafer carrier plate 100, a wafer substrate 110, and a wafer retaining ring 120. The output end of the stage drive assembly 40 passes through the pin retaining ring connecting plate 70 and is connected to the bottom end of the water-cooled plate sealing plate 80. The top of the pin retaining ring connecting plate 70 is connected to a lifting rod assembly 130 and a pin assembly 140, and the pin assembly 140 is located in the inner ring of the lifting rod assembly 130. One end of the lifting rod assembly 130 is connected to the pin retaining ring. One end of the ejector pin assembly 140 is connected to the ejector pin ring connecting plate 70, and the other end passes through the water-cooled plate sealing plate 80, the water-cooled plate 90 and the wafer carrier plate 100 in sequence before connecting to the wafer pressure ring 120. One end of the ejector pin assembly 140 is connected to the ejector pin ring connecting plate 70, and the other end passes through the water-cooled plate sealing plate 80, the water-cooled plate 90 and the wafer carrier plate 100 in sequence before abutting against the wafer substrate 110. The stage driving assembly 40 drives the water-cooled plate sealing plate 80 to rotate, which in turn drives the ejector pin ring connecting plate 70 to rotate, thereby making the wafer substrate 110 uniformly coated.

[0035] The bottom end of the ejector pin pressure ring connecting plate 70 is connected to the wafer lifting assembly 50. The wafer lifting assembly 50 is used to control the lifting of the ejector pin pressure ring connecting plate 70, drive the lifting rod assembly 130 and the ejector pin assembly 140 to lift, thereby drive the lifting of the wafer pressure ring 120, and control the clamping or lifting of the wafer substrate 110.

[0036] The top of the water-cooled plate 90 is connected to the wafer carrier plate 100. The lower surface of the wafer carrier plate 100 is provided with a first airflow channel 150, and the upper surface of the wafer carrier plate 100 is provided with a second airflow channel 160. The first airflow channel 150 is connected to the water-cooled plate 90 to form a complete gas channel for passing low-temperature gas. The wafer carrier plate 100 also provides multiple auxiliary airflow channels 170. One end of each auxiliary airflow channel 170 is connected to the first airflow channel 150, and the other end is connected to the second airflow channel 160. The wafer substrate 110 is placed above the second airflow channel 160. When the wafer substrate 110 is coated, it is cooled by passing through a low-temperature gas. The water-cooled plate 90 has a first air inlet in the middle, which is connected to one end of the first airflow channel 150. The first airflow channel 150 is a double-ring structure extending from the middle to the outer ring, and the second airflow channel 160 is a multi-ring structure extending from the middle to the outer ring, which is used to increase the cooling area. The low-temperature gas is helium.

[0037] The bottom end of the water-cooled plate 90 is connected to the water-cooled plate sealing plate 80. The lower surface of the water-cooled plate 90 is provided with a liquid circulation tank 180. The liquid circulation tank 180 and the water-cooled plate sealing plate 80 below it are connected to form a complete liquid flow channel. The middle part of the water-cooled plate sealing plate 80 is provided with a water inlet 190, a water outlet 200 and a second air inlet 210. The water inlet 190 is connected to one end of the liquid flow channel and the water outlet 200 is connected to the other end of the liquid flow channel. It is used to introduce external coolant and cool the water-cooled plate 90, and finally cool the wafer substrate 110. The second air inlet 210 is connected to the first air inlet.

[0038] The water-cooled plate 80, the water-cooled plate 90, and the wafer carrier plate 100 are integrally formed, with good sealing performance, so that the coolant in the liquid flow channel will not leak when the wafer substrate 110 is coated.

[0039] The platform drive assembly 40 includes a drive motor 401, a reducer 402, and a magnetorheological fluid 403. The output end of the drive motor 401 is connected to the input end of the reducer 402. The magnetorheological fluid 403 is fixedly sleeved with the platform plate 10. A magnetorheological fluid shaft 404 is connected inside the magnetorheological fluid 403. A first synchronous pulley 220 is connected to the output end of the reducer 402, and a second synchronous pulley 230 is connected to the input end of the magnetorheological fluid shaft 404. The first synchronous pulley 220 and the second synchronous pulley 230 are connected by a synchronous belt 240. The output end of the magnetorheological fluid shaft 404 passes through the platform plate 10. The ejector pin pressure ring connecting plate 70 is connected to the water-cooled plate sealing plate 80. Driven by the drive motor 401, the magnetic fluid shaft 404 rotates, which in turn drives the water-cooled plate sealing plate 80 to rotate, causing the ejector pin pressure ring connecting plate 70 to rotate together. The magnetic fluid shaft 404 has a hollow structure. The magnetic fluid shaft 403 is provided with three connecting holes 250, which are respectively connected to the water inlet 190, the water outlet 200 and the second air inlet 210 in the middle of the water-cooled plate sealing plate 80. The input end of the connecting hole 250 is connected to the pipeline of the external water-cooling device and the low-temperature gas device.

[0040] The wafer lifting assembly 50 includes a lifting drive cylinder 501, a cylinder hoisting cylinder 502, and a bellows 503. The stage plate 10 is fixedly sleeved with the cylinder hoisting cylinder 502 near the lower part of the ejector pin pressure ring connecting plate 70. The pneumatic extension end of the lifting drive cylinder 501 passes through the cylinder hoisting cylinder 502 and is connected to the ejector pin pressure ring connecting plate 70. The bellows 503 is sleeved on the pneumatic extension end of the lifting drive cylinder 501 to keep the pneumatic extension end of the lifting drive cylinder 501 in a sealed state to prevent the vacuum of the ion beam etching machine from being damaged.

[0041] A dual-crystal sensor 260 is provided at the top of the stage plate 10 near the wafer substrate 110 for monitoring the coating status of the wafer substrate 110.

[0042] The beneficial effects of this utility model are as follows: This utility model proposes a wafer stage device for a multifunctional ion beam deposition and etching machine, including a stage plate 10. A rotating arm 20 is connected to one side of the top of the stage plate 10. The rotating arm 20 is used to connect to an external rotation drive mechanism, which drives the rotating arm 20 and the stage plate 10 to rotate. A sealed box 30 is connected to the bottom of the stage plate 10, and the stage plate 10 and the sealed box 30 form a cavity. A stage drive assembly 40 and a wafer lifting assembly 50 are connected inside the cavity. The rotating arm 20... A groove 60 with an outward opening is provided on the side near the external rotary drive mechanism. After the groove 60 is engaged with the external rotary drive mechanism and connected by bolts, it indirectly increases the contact area between the external rotary drive mechanism and the rotating arm 20. Furthermore, by providing the groove 60, the external rotary drive mechanism can support the platform plate 10 and the rotating arm 20, preventing the platform plate 10 and the rotating arm 20 from falling downwards under their own weight. This makes the connection between the external rotary drive mechanism and the rotating arm 20 more stable, thereby ensuring the requirements of the etching process and improving safety.

[0043] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A wafer stage device for a multifunctional ion beam deposition and etching machine, comprising a stage plate (10), a rotating arm (20) connected to one side of the top of the stage plate (10), the rotating arm (20) being connected to an external rotation drive mechanism, the external rotation drive mechanism driving the rotating arm (20) and the stage plate (10) to rotate, a sealed housing (30) connected to the bottom of the stage plate (10), the stage plate (10) and the sealed housing (30) forming a chamber, a stage drive assembly (40) and a wafer lifting assembly (50) being connected inside the chamber, characterized in that: The rotating arm (20) has an outward-facing groove (60) on the side near the external rotating drive mechanism. After the groove (60) is engaged with the external rotating drive mechanism, it is connected by bolts, which indirectly increases the contact area between the external rotating drive mechanism and the rotating arm (20). Furthermore, by providing the groove (60), the external rotating drive mechanism can support the platform plate (10) and the rotating arm (20), thus preventing the platform plate (10) and the rotating arm (20) from falling downwards under their own weight.

2. The wafer stage device for the multifunctional ion beam deposition and etching machine according to claim 1, characterized in that: The platform plate (10) and the rotating arm (20) are integrally formed, resulting in strong structural stability.

3. The wafer stage device for the multifunctional ion beam deposition and etching machine according to claim 2, characterized in that: The stage plate (10) is provided with a pin retaining ring connecting plate (70), a water-cooled plate sealing plate (80), a water-cooled plate (90), a wafer carrier plate (100), a wafer substrate (110), and a wafer retaining ring (120) in sequence above the side away from the rotating arm (20). The output end of the stage drive assembly (40) passes through the pin retaining ring connecting plate (70) and is connected to the bottom end of the water-cooled plate sealing plate (80). The top of the pin retaining ring connecting plate (70) is connected with a lifting rod assembly (130) and a pin assembly (140), and the pin assembly (140) is located in the inner ring of the lifting rod assembly (130). One end of the lifting rod assembly (130) is connected to the pin retaining ring. The ring connecting plate (70) is connected, and the other end passes through the water-cooled plate sealing plate (80), the water-cooled plate (90) and the wafer carrier plate (100) in sequence, and is connected to the wafer pressure ring (120). One end of the ejector pin assembly (140) is connected to the ejector pin pressure ring connecting plate (70), and the other end passes through the water-cooled plate sealing plate (80), the water-cooled plate (90) and the wafer carrier plate (100) in sequence, and abuts against the wafer substrate (110). The water-cooled plate sealing plate (80) is rotated by the stage driving assembly (40), which in turn drives the ejector pin pressure ring connecting plate (70) to rotate, thereby making the wafer substrate (110) uniformly coated.

4. The wafer stage device for the multifunctional ion beam deposition and etching machine according to claim 3, characterized in that: The bottom end of the ejector pin ring connecting plate (70) is connected to the wafer lifting assembly (50). The wafer lifting assembly (50) is used to control the lifting of the ejector pin ring connecting plate (70), drive the lifting rod assembly (130) and the ejector pin assembly (140) to lift, thereby drive the lifting of the wafer ring (120), and control the clamping or lifting of the wafer substrate (110).

5. The wafer stage device for the multifunctional ion beam deposition and etching machine according to claim 4, characterized in that: The top of the water-cooled plate (90) is connected to the wafer carrier plate (100). The lower surface of the wafer carrier plate (100) is provided with a first airflow channel (150), and the upper surface of the wafer carrier plate (100) is provided with a second airflow channel (160). The first airflow channel (150) is connected to the water-cooled plate (90) to form a complete gas channel for passing through low-temperature gas. The wafer carrier plate (100) is also provided with a plurality of auxiliary airflow channels (170). One end of the auxiliary airflow channel (170) is connected to the first airflow channel (150), and the other end is connected to the second airflow channel (160). The wafer substrate (110) is placed above the second airflow channel (160). When the wafer substrate (110) is coated, the wafer substrate (110) is cooled by passing through low-temperature gas.

6. The wafer stage device for the multifunctional ion beam deposition and etching machine according to claim 5, characterized in that: The water-cooled plate (90) has a first air inlet in the middle, which is connected to one end of the first airflow channel (150). The first airflow channel (150) is a double-ring structure extending from the middle to the outer ring, and the second airflow channel (160) is a multi-ring structure extending from the middle to the outer ring, which is used to increase the cooling area.

7. The wafer stage device for the multifunctional ion beam deposition and etching machine according to claim 6, characterized in that: The bottom end of the water-cooled plate (90) is connected to the water-cooled plate sealing plate (80). The lower surface of the water-cooled plate (90) is provided with a liquid circulation tank (180). The liquid circulation tank (180) and the water-cooled plate sealing plate (80) below it are connected to form a complete liquid flow channel. The middle part of the water-cooled plate sealing plate (80) is provided with a water inlet (190), a water outlet (200) and a second air inlet (210). The water inlet (190) is connected to one end of the liquid flow channel, and the water outlet (200) is connected to the other end of the liquid flow channel. It is used to introduce external coolant and cool the water-cooled plate (90) and finally cool the wafer substrate (110). The second air inlet (210) is connected to the first air inlet.

8. The wafer stage device for the multifunctional ion beam deposition and etching machine according to claim 7, characterized in that: The water-cooled plate cover (80), the water-cooled plate (90) and the wafer carrier plate (100) are integrally formed and have good sealing performance, so that the coolant in the liquid flow channel will not leak when the wafer substrate (110) is coated.

9. The wafer stage device for the multifunctional ion beam deposition and etching machine according to claim 8, characterized in that: The platform drive assembly (40) includes a drive motor (401), a reducer (402), and a magnetorheological fluid (403). The output end of the drive motor (401) is connected to the input end of the reducer (402). The magnetorheological fluid (403) is fixedly sleeved with the platform plate (10). A magnetorheological fluid shaft (404) is connected inside the magnetorheological fluid (403). A first synchronous pulley (220) is connected to the output end of the reducer (402). The input end of the magnetorheological fluid shaft (404) is connected to... A second synchronous pulley (230) is provided. The first synchronous pulley (220) and the second synchronous pulley (230) are connected by a synchronous belt (240). The output end of the magnetic fluid shaft (404) passes through the ejector pin pressure ring connecting plate (70) and is connected to the water-cooled plate sealing plate (80). Under the drive of the drive motor (401), the magnetic fluid shaft (404) is driven to rotate, which in turn drives the water-cooled plate sealing plate (80) to rotate, so that the ejector pin pressure ring connecting plate (70) rotates together.

10. The wafer stage device for the multifunctional ion beam deposition and etching machine according to claim 9, characterized in that: The wafer lifting assembly (50) includes a lifting drive cylinder (501), a cylinder hoisting cylinder (502), and a bellows (503). The stage plate (10) is fixedly sleeved with the cylinder hoisting cylinder (502) near the bottom of the ejector pin pressure ring connecting plate (70). The pneumatic extension end of the lifting drive cylinder (501) passes through the cylinder hoisting cylinder (502) and is connected to the ejector pin pressure ring connecting plate (70). The bellows (503) is sleeved on the pneumatic extension end of the lifting drive cylinder (501) to keep the pneumatic extension end of the lifting drive cylinder (501) in a sealed state to prevent the vacuum of the ion beam etching machine from being damaged.

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