Circuit board structure and electronic equipment
By using a flexible circuit board in smart wearable devices to place the temperature-compensated crystal outside the motherboard, away from heat sources, the problem of GPS crystal clock drift is solved, and the accuracy of GPS positioning is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI CHUANGGONG COMM TECH
- Filing Date
- 2025-03-31
- Publication Date
- 2026-05-22
AI Technical Summary
In smart wearable devices, the GPS crystal can experience clock drift due to proximity to heat-generating components such as audio PAs and MCUs, affecting GPS positioning accuracy.
The second circuit board structure, which uses a flexible circuit board, places the temperature compensation crystal outside the motherboard, away from the heat source, and connects it to the motherboard through the flexible circuit board to reduce the impact of heat.
This effectively reduces the risk of clock drift in temperature-compensated crystals and improves the accuracy of GPS positioning.
Smart Images
Figure CN224267158U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of smartwatch technology, and more particularly to a circuit board structure and electronic device. Background Technology
[0002] In smart wearable devices, the GPS crystal is usually located on the motherboard. However, because the motherboard contains heat-generating components such as audio PA (SMART PA) and MCU, temperature fluctuations generated by these components can easily be transmitted to the GPS crystal, causing clock drift and affecting the accuracy of GPS positioning in the wearable device. Utility Model Content
[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a circuit board structure and electronic device that can reduce the clock drift risk of GPS crystals.
[0004] An embodiment of the first aspect of this application provides a circuit board structure, including:
[0005] Motherboard;
[0006] The second circuit board is electrically connected to the motherboard. The second circuit board includes a first portion along a direction perpendicular to the motherboard, and the projection of the first portion is located outside the outline of the motherboard.
[0007] The temperature-compensated crystal is electrically connected to the first part.
[0008] According to an embodiment of the first aspect of this application, the second circuit board is a flexible circuit board.
[0009] According to an embodiment of the first aspect of this application, the second circuit board is provided with a first side button, which is located between the motherboard and the temperature-compensated crystal.
[0010] According to an embodiment of the first aspect of this application, the second circuit board is provided with a second side key, which is located at the end of the first portion.
[0011] According to an embodiment of the first aspect of this application, the overall outline of the motherboard is rectangular, and the first portion is parallel to one of the sides of the motherboard.
[0012] According to an embodiment of the first aspect of this application, the motherboard has a first interface, the second circuit board has a second interface, and the second interface is electrically connected to the first interface.
[0013] According to an embodiment of the first aspect of this application, the first interface is a BTB interface.
[0014] According to an embodiment of the first aspect of this application, a GPS chip is also included, which is disposed on the motherboard.
[0015] According to an embodiment of the first aspect of this application, it further includes at least one of an MCU control chip and a SMART PA chip, wherein the MCU control chip is disposed on the motherboard and the SMART PA chip is disposed on the motherboard.
[0016] An embodiment of the second aspect of this application provides an electronic device including the circuit board structure as described above.
[0017] As can be seen from the above technical solutions, the embodiments of this application have at least the following beneficial effects:
[0018] In the circuit board structure and electronic device provided in this application embodiment, the first part of the second circuit board is located outside the motherboard, so that the first part is far away from the motherboard. The first part is provided with a temperature compensation crystal, which can keep the temperature compensation crystal away from the motherboard, thereby achieving the purpose of keeping away from the heat source on the motherboard, and thus reducing the risk of clock drift of the temperature compensation crystal. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a front view of a circuit board structure provided in one embodiment of this application;
[0021] Figure 2 This is a right-side view of a circuit board structure provided in one embodiment of this application;
[0022] Figure 3 This is a rear view schematic diagram of a circuit board structure provided in one embodiment of this application.
[0023] Figure label:
[0024] 100. Motherboard; 110. First interface;
[0025] 200, Second circuit board; 210, Second interface; 220, First part; 230, First side key; 240, Second side key; 250, Second part;
[0026] 300, temperature-compensated crystal. Detailed Implementation
[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0028] In related technologies, GPS crystals in smart wearable devices are typically located on the motherboard. However, because the motherboard contains heat-generating components such as audio PAs (SMART PAs) and MCUs, temperature fluctuations generated by these components can easily be transmitted to the GPS crystal, causing clock drift and affecting the accuracy of GPS positioning in the wearable device.
[0029] Based on this, this application provides a circuit board structure and electronic device to effectively solve the aforementioned problems.
[0030] See Figures 1 to 3 As shown, an embodiment of the first aspect of this application discloses a circuit board structure, including a motherboard 100, a second circuit board 200, and a temperature-compensated crystal 300.
[0031] Specifically, the second circuit board 200 is electrically connected to the motherboard 100. The second circuit board 200 includes a first part 220 along a direction perpendicular to the motherboard 100. The projection of the first part 220 is located outside the outline of the motherboard 100. The temperature compensation crystal 300 is electrically connected to the first part 220.
[0032] It is understandable that the motherboard 100 contains heat sources or chips that generate heat during operation; the temperature-compensated crystal is a temperature-compensated crystal oscillator (TCXO).
[0033] In the circuit board structure provided in this application embodiment, the first part 220 of the second circuit board 200 is located outside the motherboard 100, so that the first part 220 is far away from the motherboard 100. Then, the temperature compensation crystal 300 is arranged in the first part 220, which can make the temperature compensation crystal 300 far away from the motherboard 100, thereby achieving the purpose of being far away from the heat source and reducing the risk of clock drift of the temperature compensation crystal 300.
[0034] In some embodiments of this application, the second circuit board 200 is a flexible circuit board. Flexible circuit boards are flexible, can be bent, and are easy to arrange in various non-fixed spaces, making them highly adaptable.
[0035] In this embodiment, see Figure 1The second circuit board 200 includes a second portion 250, one end of which is connected to one end of the first portion 220, and the other end of which is connected to the motherboard 100. A second interface 210 is located in the second portion 250. As shown in the figure, the second portion 250 is connected to the first interface 110 of the motherboard 100 via the second interface 210, and the other end of the second portion 250 extends outward from the motherboard 100, thus maintaining a certain distance between the second portion 250 and the motherboard 100. This effectively reduces the impact of heat generated on the motherboard 100 on the temperature-compensating crystal 300.
[0036] In some embodiments of this application, see Figures 1 to 3 The second circuit board 200 is provided with a first side button 230, which is located between the main board 100 and the temperature-compensated crystal 300. It is worth noting that the first side button 230 is electrically connected to the second circuit board 200, and the first side button 230 is used to achieve electrical connection between the second circuit board 200 and the main board 100.
[0037] It should be noted that the first side button 220 can be an operation button electrically connected to the motherboard 100, through which operation commands can be sent to the motherboard 100.
[0038] In some embodiments of this application, please refer to... Figures 1 to 3 The second circuit board 200 is provided with a second side button 240, which is located at the end of the first part 220. The second side button 240 is electrically connected to the second circuit board 200 and, through the second circuit board 200, is electrically connected to the main board 100. The second side button 240 can also be an operation button used to send operation commands to the main board 100.
[0039] It should be noted that the first side button 230 and the second side button 240 are electrically connected to the components on the motherboard 100 through the second circuit board 200.
[0040] In some embodiments of this application, see Figure 1 The overall outline of the motherboard 100 is rectangular, and the first part 220 is parallel to one of the sides of the motherboard 100. In this way, each position of the first part 220 in the second circuit board 200 is kept at a certain distance from the motherboard 100, which helps to reduce the impact of heat generated by heat sources in the motherboard 100 on the temperature-compensated crystal 300 and thus reduce clock drift.
[0041] In some embodiments of this application, see Figure 1 and Figure 2 The motherboard 100 has a first interface 110, and the second circuit board 200 has a second interface 210, which is electrically connected to the first interface 110.
[0042] In one possible implementation, see Figure 1 and Figure 2 The first interface 110 is a BTB (board-to-board) interface, and correspondingly, the second interface 210 is a BTB interface that matches the first interface 110. Based on this, the second circuit board 200 can be quickly connected or disconnected by using the first interface 110 and the second interface 210.
[0043] It is worth noting that in some other embodiments, the second interface 210 may also be electrically connected to the motherboard 100 through other forms of interfaces or directly through solder pads, which is not limited here.
[0044] In some embodiments of this application, the circuit board structure includes a GPS chip mounted on the motherboard 100. The GPS chip generates heat during operation. In this embodiment, the GPS chip is positioned on the motherboard 100, and there is a certain gap between the motherboard 100 and the temperature-compensated crystal 300. This reduces the heat generated by the GPS chip, thus minimizing clock drift in the temperature-compensated crystal 300.
[0045] In some embodiments of this application, the circuit board structure includes an MCU control chip (i.e., a microcontroller unit) mounted on the motherboard 100. The MCU control chip generates heat during operation. In this embodiment, the MCU control chip is positioned on the motherboard 100, and there is a certain gap between the motherboard 100 and the temperature-compensated crystal 300. This reduces the heat generated by the MCU control chip, thus minimizing clock drift in the temperature-compensated crystal 300.
[0046] In some embodiments of this application, the circuit board structure further includes a SMART PA (i.e., intelligent audio amplifier) chip, which is disposed on the motherboard 100. The SMART PA chip generates heat during operation. In this embodiment, the SMART PA chip is disposed on the motherboard 100, and there is a certain gap between the motherboard 100 and the temperature-compensated crystal 300. This reduces the heat generated by the SMART PA chip, thus preventing clock drift in the temperature-compensated crystal 300.
[0047] In this embodiment, the circuit board structure includes an MCU control chip (i.e., a microcontroller unit) and a SMART PA chip, both of which are mounted on the motherboard 100. The MCU control chip and / or the SMART PA chip generate heat during operation. In this embodiment, the MCU control chip and / or the SMART PA chip are arranged on the motherboard 100, and there is a certain gap between the motherboard 100 and the temperature-compensated crystal 300. This reduces the heat generated by the MCU control chip, thus minimizing clock drift in the temperature-compensated crystal 300.
[0048] The second aspect of this application discloses an electronic device including the circuit board structure described above, possessing all the technical effects of the circuit board structure described above. For example, in the electronic device of this application, since the temperature-compensated crystal 300 is far from the motherboard 100, the temperature-compensated crystal 300 is less affected by heat sources in the motherboard 100, which can reduce the probability of clock drift of the temperature-compensated crystal 300.
[0049] It should be noted that the electronic device disclosed in the second aspect of this application can be a smartwatch or other electronic devices with a temperature-compensated crystal 300, and is not limited thereto.
[0050] In traditional watch PCB (Printed Circuit Board) layouts, the GPS crystal TCXO, GPS chip, MCU control chip, and SMART PA chip are all located on the mainboard. The heat generated by these chips can affect the normal operation of the GPS crystal TCXO located on the mainboard, causing clock drift. However, in the circuit board structure and electronic device of this application embodiment, the temperature-compensated crystal 300 (TCXO) is located on the first portion 220 of the second circuit board 200. This first portion 220 is far from the heat sources on the mainboard 100 and away from the heat-generating chips on the mainboard 100, thus reducing the risk of clock drift in the watch case.
[0051] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0052] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0053] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0054] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.
[0055] It should be understood that although the steps in the flowcharts of the accompanying figures are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the accompanying figures may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.
Claims
1. A circuit board structure, characterized in that, include: Motherboard; The second circuit board is electrically connected to the motherboard. The second circuit board includes a first portion along a direction perpendicular to the motherboard, and the projection of the first portion is located outside the outline of the motherboard. The temperature-compensated crystal is electrically connected to the first part.
2. The circuit board structure according to claim 1, characterized in that, The second circuit board is a flexible circuit board.
3. The circuit board structure according to claim 1 or 2, characterized in that, The second circuit board is provided with a first side button, which is located between the motherboard and the temperature compensation crystal.
4. The circuit board structure according to claim 1 or 2, characterized in that, The second circuit board is provided with a second side key, which is located at the end of the first part.
5. The circuit board structure according to claim 1, characterized in that, The overall outline of the motherboard is rectangular, and the first part is parallel to one of the sides of the motherboard.
6. The circuit board structure according to claim 1, characterized in that, The motherboard has a first interface, and the second circuit board has a second interface, which is electrically connected to the first interface.
7. The circuit board structure according to claim 6, characterized in that, The first interface is a BTB interface.
8. The circuit board structure according to claim 1, characterized in that, It also includes a GPS chip, which is located on the motherboard.
9. The circuit board structure according to claim 1, characterized in that, It also includes at least one of an MCU control chip and a SMART PA chip, wherein the MCU control chip is disposed on the motherboard and the SMART PA chip is disposed on the motherboard.
10. An electronic device, characterized in that, Includes the circuit board structure as described in any one of claims 1 to 9.