Circuit board for camera module and camera module
By setting filling holes on the conductive layer of the circuit board and filling them with low-modulus material, the cracking problem of the circuit board during hot processing is solved, better stress absorption and heat resistance are achieved, and the reliability and service life of the circuit board are improved.
CN224267162UActive Publication Date: 2026-05-22NANCHANG OFILM HUAGUANG TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NANCHANG OFILM HUAGUANG TECH CO LTD
- Filing Date
- 2025-05-15
- Publication Date
- 2026-05-22
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Figure CN224267162U_ABST
Abstract
The utility model relates to a circuit board for a camera module and the camera module, the circuit board comprises an insulating layer and a conductive layer, the conductive layer is stacked on the insulating layer, the conductive layer is provided with a plurality of filling holes, the filling holes are configured as filling material parts, and the elastic modulus of the material parts is smaller than that of the conductive layer. According to the circuit board provided by the invention, the plurality of filling holes are formed in the conductive layer, and the filling holes are filled with the material parts of which the elastic modulus is smaller than that of the conductive layer, so that the elastic modulus of the conductive layer can be reduced, and the elastic modulus of the circuit board is further reduced, and therefore, the circuit board is easier to deform and absorb stress; and the circuit board is not easy to damage. On the basis, when the electronic component and the circuit board are connected in a hot working mode such as welding, as the elastic modulus of the circuit board is reduced, the circuit board is easier to expand and deform after being heated, and the circuit board cannot generate larger stress due to difficulty in deformation, so that the circuit board is prevented from being damaged as much as possible.
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