Novel high-temperature-resistant and high-voltage-resistant circuit board for energy storage device

Abstract

The utility model discloses a novel high-temperature-resistant and high-pressure-resistant circuit board for an energy storage device, which belongs to the technical field of circuit boards and comprises a circuit board body. A plurality of groups of electric appliance elements are arranged on the upper side surface of the circuit board main body, a heat conduction and heat dissipation layer is embedded in the circuit board main body, and a box body is mounted on one side of the top of the circuit board main body. Then the pressurized air flows out along the air outlet and the flow guide through groove, the airflow in the flow guide channel conveys the heat in the circuit board main body outwards, and the airflow flowing out from the air outlet can accelerate the flow speed of hot air around electrical components at the top of the circuit board main body and accelerate the diffusion of the heat; meanwhile, heat generated by the electric appliance elements is absorbed by the heat conduction and dissipation layer and then conducted from the interior of the circuit board body to the side face, the heat conduction and dissipation layer and the circuit board body are matched to cool and dissipate heat, and the high-temperature resistance of the circuit board body is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a novel high-temperature and high-voltage resistant circuit board for energy storage devices. Background Technology

[0002] Printed circuit boards (PCBs) are broadly classified into three categories based on the number of layers: single-sided, double-sided, and multilayer PCBs. First, there's the single-sided PCB. In the most basic PCB, components are concentrated on one side, while conductors are on the other. Because the conductors only appear on one side, this type of PCB is called a single-sided PCB. Single-sided PCBs are generally simple to manufacture and inexpensive, but their disadvantage is that they cannot be used for overly complex products. Double-sided PCBs are an extension of single-sided PCBs. When single-layer wiring cannot meet the needs of electronic products, double-sided PCBs are used. Both sides have copper plating and traces, and vias can be used to connect the lines between the two layers, forming the required network connections. Multilayer PCBs refer to printed circuit boards with three or more conductive pattern layers laminated with insulating materials in between, and the conductive patterns are interconnected as required. Multilayer PCBs are a product of the development of electronic information technology towards high speed, multifunctionality, large capacity, small size, thinness, and lightweight.

[0003] In the prior art, Chinese utility model publication CN222764176U discloses a high-temperature and high-voltage resistant circuit board for an energy storage device, comprising a circuit board body. The front side of the circuit board body has two integrally formed sliding grooves and four integrally formed fastening grooves, respectively located on the left and right sides of the two sliding grooves. Sliding plates are slidably connected inside each of the two sliding grooves. Connecting plates are fixedly connected to the upper sides of the two sliding plates. Three mounting grooves are provided on the upper side of the connecting plates, and connecting frames are snapped into the interiors of the three mounting grooves. Cooling fans are fixedly connected inside the connecting frames. Adjustment mechanisms are provided on both sliding plates, comprising two fixed plates, two fastening blocks, two connecting rods, two threaded rods, and two fastening nuts. This allows for the addition and adjustment of the cooling fan's position, thereby improving the heat dissipation effect of the circuit board.

[0004] The above technical solution uses a cooling fan mounted on the outside of the circuit board to cool the circuit board through passive heat dissipation. However, since the circuit board is usually encapsulated inside the equipment, if the cooling fan fails, the temperature of the circuit board will rise sharply, directly affecting the stability of the circuit board. Summary of the Invention

[0005] The purpose of this invention is to provide a novel high-temperature and high-voltage resistant circuit board for energy storage devices. By combining a cooling fan assembly and a heat-conducting heat dissipation layer, the circuit board body is cooled, thereby improving heat dissipation efficiency and solving the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a novel high-temperature and high-voltage resistant circuit board for energy storage devices, comprising:

[0007] Circuit board body;

[0008] The circuit board body has multiple sets of electrical components on its upper side. The circuit board body has a heat-conducting and heat-dissipating layer embedded inside. A box is installed on one side of the top of the circuit board body. The top of the box has a mounting groove, and a cooling fan assembly for cooling is installed in the mounting groove. An air duct structure is provided inside the circuit board and on the box.

[0009] Preferably, the air duct structure includes an exhaust port on the housing and a flow guide channel inside the circuit board body. The exhaust port is located on the side of the housing near the electrical components. The air inlet of the flow guide channel is connected to the housing. The other end of the flow guide channel is provided with multiple sets of air outlets. The air outlets are located on the upper side of the circuit board body and around the electrical components.

[0010] Preferably, the heat-conducting and heat-dissipating layer has protrusions integrally provided at both ends, the protrusions extending to the outer side of the circuit board body, and the extending direction of the protrusions being perpendicular to the extending direction of the flow channel.

[0011] Preferably, the airflow channel is located above the heat dissipation layer, and both the air inlet and outlet of the airflow channel are inclined.

[0012] Preferably, the inner cavity of the box is provided with an inclined surface, which corresponds to the exhaust port.

[0013] Preferably, a phase change energy storage capsule is disposed on the heat-conducting and heat-dissipating layer, and the electrical components are in direct contact with the phase change energy storage capsule.

[0014] Preferably, the housing is fixedly connected to the circuit board body by mounting screws, and the circuit board body has mounting holes for mounting and fixing.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] This invention uses a cooling fan assembly to pressurize the air outside the box and introduce it into the box. The pressurized air then flows outward along the exhaust port and the guide channel. The airflow inside the guide channel transports the heat inside the circuit board to the outside. The airflow from the exhaust port can accelerate the flow rate of hot air around the electrical components on the top of the circuit board, thus accelerating the heat diffusion. At the same time, the heat generated by the electrical components is absorbed by the heat-conducting and heat-dissipating layer and then conducted from the inside of the circuit board to the sides. The two work together to cool down the circuit board and improve its high-temperature resistance.

[0017] This invention incorporates a phase change energy storage capsule within the heat-conducting and heat-dissipating layer. This allows for the absorption of instantaneous high temperatures, followed by slow release. However, this prevents the localized temperature inside the circuit board from rising too rapidly, thus hindering the outward dissipation of heat. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0019] Figure 2 This is a partial cross-sectional three-dimensional structural diagram of the main body of the circuit board of this utility model;

[0020] Figure 3 This is a cross-sectional perspective view of the three-dimensional structure of the box body of this utility model;

[0021] Figure 4 This is a three-dimensional structural diagram of the heat-conducting and heat-dissipating layer of this utility model.

[0022] The following are the labels in the diagram: 1. Circuit board body; 2. Electrical components; 3. Heat-conducting and heat-dissipating layer; 31. Protrusion; 4. Box; 5. Cooling fan assembly; 6. Exhaust vent; 7. Airflow channel; 8. Air inlet; 9. Air outlet; 10. Inclined surface; 11. Phase change energy storage capsule. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] This utility model provides, for example Figures 1-4 The novel high-temperature and high-voltage resistant circuit board for energy storage devices shown includes:

[0025] Circuit board body 1; Circuit board body 1 can adopt a composite structure design of ceramic inner frame and metal outer frame, which can simultaneously achieve insulation and heat dissipation functions;

[0026] The circuit board body 1 has multiple sets of electrical components 2 on its upper side. The circuit board body 1 has a heat-conducting and heat-dissipating layer 3 embedded inside. A box 4 is installed on one side of the top of the circuit board body 1. The top of the box 4 has a mounting groove, and a cooling fan assembly 5 for cooling is installed in the mounting groove. An air duct structure is provided inside the circuit board and on the box 4. The heat-conducting and heat-dissipating layer 3 is embedded inside the circuit board body 1 during the lamination process.

[0027] The cooling fan assembly 5 pressurizes the air outside the box 4 and introduces it into the box 4. The pressurized air then flows outward along the exhaust port 6 and the guide channel. The airflow inside the guide channel 7 transports the heat inside the circuit board body 1 outward. The airflow from the exhaust port 6 can accelerate the flow rate of hot air around the electrical components 2 on the top of the circuit board body 1, thus accelerating the heat diffusion. At the same time, the heat generated by the electrical components 2 is absorbed by the heat-conducting and heat-dissipating layer 3 and then conducted from the inside of the circuit board body 1 to the side. The two work together to cool down the circuit board body 1 and improve its high-temperature resistance.

[0028] Among them, such as Figure 2 As shown:

[0029] The air duct structure includes an exhaust port 6 on the housing 4 and a guide channel 7 inside the circuit board body 1. The exhaust port 6 is located on the side of the housing 4 near the electrical component 2. The air inlet 8 of the guide channel 7 is connected to the housing 4. Multiple sets of air outlets 9 are provided at the other end of the guide channel 7. The air outlets 9 are located on the upper side of the circuit board body 1 and around the electrical component 2. The exhaust port 6 and the guide channel 7 facilitate the coordination with the cooling fan assembly 5 to guide the airflow, change the path of the airflow, and then remove the heat from the circuit board body 1 to reduce the temperature of the circuit board body 1.

[0030] Furthermore, such as Figure 4 As shown:

[0031] The heat-conducting and heat-dissipating layer 3 has protrusions 31 integrally provided at both ends. The protrusions 31 extend to the outer side of the circuit board body 1. The extension direction of the protrusions 31 is perpendicular to the extension direction of the flow channel 7. The protrusions 31 facilitate the connection between the heat-conducting and heat-dissipating layer 3 and the outside world, allowing heat to diffuse into the outside air. At the same time, the extension direction of the protrusions 31 and the extension direction of the flow channel 7 are limited to achieve multi-directional heat dissipation and prevent heat from being conducted to one side, which would cause the heat on one side to accumulate and rise.

[0032] Preferred, such as Figure 2 As shown:

[0033] The airflow channel 7 is located above the heat conduction and heat dissipation layer 3. The air inlet 8 and air outlet 9 of the airflow channel 7 are both set at an angle. By setting the airflow channel 7 above the heat conduction and heat dissipation layer 3, when the airflow flows through the airflow channel 7, it can also carry away some of the heat on the heat conduction and heat dissipation layer 3, forming a multi-dimensional diffusion of heat.

[0034] It is worth noting that, such as Figure 3 As shown:

[0035] The inner cavity of the box 4 is provided with an inclined surface 10, which corresponds to the exhaust port 6. The inclined surface 10 facilitates the guidance of airflow, prevents air from forming vortices inside the box 4, and reduces the initial speed of the airflow.

[0036] In a further preferred embodiment, such as Figure 4 As shown:

[0037] A phase change energy storage capsule 11 is provided on the heat-conducting and heat dissipation layer 3. The phase change energy storage capsule 11 is made of wax-based material. The electrical component 2 is in direct contact with the phase change energy storage capsule 11. By providing the phase change energy storage capsule 11 inside the heat-conducting and heat dissipation layer 3, the instantaneous high temperature can be absorbed and then slowly released. However, the local temperature inside the circuit board body 1 may rise too quickly, making it impossible to start dissipating heat outward.

[0038] In addition, such as Figure 1 As shown:

[0039] The box 4 is fixedly connected to the circuit board body 1 by mounting screws. The circuit board body 1 has mounting holes for mounting and fixing. The mounting screws facilitate the fixed connection of the box 4, and the mounting holes are used to fix the circuit board body 1.

[0040] In practical use, the cooling fan assembly 5 is powered on, and then the cooling fan assembly 5 drives air into the box 4, so that the air forms an airflow with a certain pressure inside the box 4. After being guided by the inclined surface 10, part of the airflow flows directly out of the box 4 from the exhaust port 6, which can accelerate the airflow around the electrical component 2. Part of the airflow enters the circuit board body 1 along the guide channel 7. Then, through heat exchange, a part of the heat inside the circuit board body 1 is carried away and discharged from the circuit board body 1 from the exhaust port 9. At the same time, the instantaneous heat generated by the electrical component 2 can be instantly absorbed by the phase change energy storage capsule 11 and then slowly released into the heat conduction and heat dissipation layer 3. The heat diffuses outward along the heat conduction and heat dissipation layer 3.

[0041] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A novel high-temperature and high-voltage resistant circuit board for energy storage devices, characterized in that, include: Circuit board body (1); The circuit board body (1) has multiple electrical components (2) on its upper side. The circuit board body (1) has a heat-conducting and heat-dissipating layer (3) embedded inside. A box (4) is installed on one side of the top of the circuit board body (1). The top of the box (4) has an installation groove, and a cooling fan assembly (5) for cooling is installed in the installation groove. An air duct structure is provided inside the circuit board and on the box (4).

2. The high-temperature and high-voltage resistant circuit board for a novel energy storage device according to claim 1, characterized in that: The air duct structure includes an exhaust port (6) on the box (4) and a guide channel (7) inside the circuit board body (1). The exhaust port (6) is located on the side of the box (4) close to the electrical component (2). The air inlet (8) of the guide channel (7) is connected to the box (4). The other end of the guide channel (7) is provided with multiple sets of air outlets (9). The air outlets (9) are located on the upper side of the circuit board body (1) and around the electrical component (2).

3. The high-temperature and high-voltage resistant circuit board for a novel energy storage device according to claim 1, characterized in that: The heat-conducting and heat-dissipating layer (3) has protrusions (31) integrally provided at both ends. The protrusions (31) extend to the outside of the circuit board body (1). The extension direction of the protrusions (31) is perpendicular to the extension direction of the flow channel (7).

4. The high-temperature and high-voltage resistant circuit board for a novel energy storage device according to claim 2, characterized in that: The flow channel (7) is located above the heat dissipation layer (3), and the air inlet (8) and air outlet (9) of the flow channel (7) are both set at an angle.

5. The high-temperature and high-voltage resistant circuit board for a novel energy storage device according to claim 1, characterized in that: The inner cavity of the box (4) is provided with an inclined surface (10), which corresponds to the exhaust port (6).

6. The high-temperature and high-voltage resistant circuit board for a novel energy storage device according to claim 1, characterized in that: A phase change energy storage capsule (11) is provided on the heat-conducting and heat-dissipating layer (3), and the electrical component (2) is in direct contact with the phase change energy storage capsule (11).

7. The high-temperature and high-voltage resistant circuit board for a novel energy storage device according to claim 1, characterized in that: The box (4) is fixedly connected to the circuit board body (1) by mounting screws. The circuit board body (1) has mounting holes for mounting and fixing.

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