Transfer device and one-time reflow soldering ball mounter

Abstract

The utility model provides a transfer device, which is used for being arranged between a component machine and a ball mounter to realize process connection, and comprises a component machine discharging butt joint transfer mechanism and a ball mounter feeding butt joint transfer mechanism which are arranged in a matched butt joint manner, the component machine discharging butt joint transfer mechanism comprises a horizontally-arranged fixed low rail which is in butt joint with a component machine rail. The ball mounter feeding butt joint transfer mechanism comprises a lifting transfer rail. The lifting transfer track comprises a first working position and a second working position, and when the lifting transfer track is in the first working position, the lifting transfer track is in butt joint with the fixed low track in a matched mode to achieve transfer; and when in the second working position, the transfer mechanism is matched and butted with the ball mounter track to realize transfer. Therefore, the device can realize stable and continuous transmission of the element to be subjected to reflow soldering from the element machine to the ball mounter, reduces reflow soldering times, and improves production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of packaging manufacturing technology, and in particular to a transfer device and a single-pass reflow soldering ball-mounting machine. Background Technology

[0002] The technological development of modern electronic products relies on collaborative innovation in three core areas: semiconductor manufacturing, electronic packaging, and thermal management. Semiconductor manufacturing technology achieves chip functional integration through precision processes such as photolithography and etching; electronic packaging technology undertakes the key functions of physical protection, electrical interconnection, and three-dimensional integration, directly affecting chip performance; and thermal management technology ensures stable operation of equipment within a safe temperature range through optimized heat dissipation structures and the application of new thermally conductive materials.

[0003] In current semiconductor chip packaging processes, both back-mount component integration and ball grid array (BGA) packaging rely on multi-stage reflow soldering to achieve component fixation and electrical connection. This process not only increases production costs but also negatively impacts product lifespan. Repeated high-temperature soldering accelerates the aging of chips and packaging materials, leading to performance degradation and shortening product lifespan. Simultaneously, the stress and heat experienced by the chip during production can cause stress concentration, thermal expansion, and deformation, resulting in chip warping. This affects package flatness and precision, leading to poor contact, increased signal transmission resistance, and reduced product reliability and performance.

[0004] In actual production, repeated reflow soldering further exacerbates chip deformation and warpage. Therefore, reducing the number of reflow soldering cycles and mitigating the thermal and mechanical stresses on the chip has become a significant challenge for current semiconductor chip packaging technology. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a transfer device and a single reflow soldering ball-mounting machine to solve the problems in the prior art where back-mount component integration and ball grid array packaging require two reflow soldering processes, which leads to increased risk of chip deformation and warpage during the packaging process, as well as low production efficiency.

[0006] To achieve the above-mentioned and other related objectives, this utility model is implemented by including the following technical solutions.

[0007] This utility model provides a transfer device, which is used to connect a component machine and a ball-forming machine to realize process connection. The transfer device includes:

[0008] The component machine discharge docking and transfer mechanism and the ball-planting machine infeed docking and transfer mechanism are matched and connected.

[0009] The component machine discharge docking and transfer mechanism includes a horizontally set fixed low track, which docks with the component machine track;

[0010] The ball-planting machine feeding and docking transfer mechanism includes a lifting transfer track; the lifting transfer track includes a first working position and a second working position. In the first working position, it is matched and docked with the fixed low track to realize transfer; in the second working position, it is matched and docked with the ball-planting machine track to realize transfer.

[0011] Optionally, the fixed low track and the lifting and transfer track can be a support or frame structure to achieve the transfer purpose.

[0012] Optionally, the horizontally arranged fixed low track includes a first drive mechanism and two parallel first conveyor belts. The first drive mechanism is used to drive the first conveyor belts to transport the component machine output to the ball-forming machine feeding docking and transfer mechanism.

[0013] Optionally, the lifting and transfer track includes a second drive mechanism, a third drive mechanism, and two parallel second conveyor belts; the second drive mechanism is used to drive the second conveyor belts so that the component machine moves linearly in the horizontal direction, and the third drive mechanism is used to drive the lifting and transfer track to move in the vertical direction.

[0014] Optionally, the first driving mechanism includes a first driving motor, a first transmission screw, and a first transmission wheel; the output end of the first driving motor is connected to the first transmission screw to drive its rotation; the first transmission wheel is fixed on the first transmission screw to rotate synchronously; and the first conveyor belt is sleeved on the first transmission wheel.

[0015] Optionally, the component machine discharge docking and transfer mechanism further includes a first control module, which is electrically connected to the first drive mechanism and is used to control the operation of the first drive mechanism.

[0016] Optionally, the second drive mechanism includes a second drive motor, a second transmission screw, and a second transmission wheel;

[0017] The output end of the second drive motor is connected to the second transmission screw to make it rotate; the second transmission wheel is fixed on the second transmission screw to follow its rotation; the second conveyor belt is sleeved on the second transmission wheel.

[0018] Optionally, the third drive mechanism includes a third drive motor and a third transmission screw;

[0019] The output end of the third drive motor is connected to the third transmission screw to make it rotate; the third transmission screw is fixedly connected to the lifting and transporting track and drives it to rise and fall vertically.

[0020] Optionally, the component machine output includes a carrier tray carrying components to be reflow soldered.

[0021] Optionally, the feeding and transfer mechanism of the ball-planting machine includes:

[0022] A horizontal positioner is installed at the end of the process of the lifting and transferring track to detect whether the bearing plate has reached the end of the lifting and transferring track;

[0023] The vertical positioner, located at the second working position, is used to assist in controlling the rising height of the lifting and transfer track.

[0024] Optionally, the lifting height of the lifting and transfer track is 20 to 50 cm.

[0025] Optionally, the ball-planting machine feeding and docking transfer mechanism further includes: a second control module, which is electrically connected to the second drive mechanism and the third drive mechanism; controls the operation of the second drive mechanism according to the signal of the horizontal positioner; and controls the operation of the third drive mechanism according to the signal of the vertical positioner.

[0026] This utility model also provides a one-time reflow soldering ball-planting machine, including the transfer device as described above; along the process direction, a component machine, a component machine discharge docking transfer mechanism, a ball-planting machine feed docking transfer mechanism, and a ball-planting machine are sequentially distributed; the component machine also includes a component machine control module, and the ball-planting machine also includes a ball-planting machine control module.

[0027] Optionally, the single-pass reflow soldering ball-planting machine further includes a main control module, which is electrically connected to the component machine control module, the first control module, the second control module and the ball-planting machine control module to enable coordinated matching of production cycles.

[0028] The beneficial effects of this utility model are as follows:

[0029] This invention, through a transfer device, enables the smooth and continuous transfer of components to be reflow soldered from the component machine to the ball-forming machine, reducing the number of reflow soldering operations and improving production efficiency. Attached Figure Description

[0030] Figure 1 These are schematic diagrams of products with and without back-mounted components in the prior art; the left diagram shows products without back-mounted components, and the right diagram shows products with back-mounted components.

[0031] Figure 2 This is a schematic diagram of the reflow soldering process; where ASIS: secondary furnace represents the two reflow soldering processes in the prior art, TOBE: primary furnace represents the one reflow soldering process of this utility model; Routing represents the process, and Reflow represents reflow soldering.

[0032] Figure 3 This is a schematic diagram of the overall structure of the device in one embodiment of the present invention.

[0033] Figure 4This is a partial structural schematic diagram of the component machine discharge docking and transfer mechanism in one embodiment of this utility model.

[0034] Figure 5 This is a deformation diagram of the heat dissipation ring of the product after reflow soldering, measured by the device in one embodiment of the present invention using moiré fringes; ASIS: secondary furnace indicates the deformation diagram of the product after two reflow solderings in the prior art at room temperature and high temperature; TOBE: primary furnace indicates the deformation diagram of the product after one reflow soldering in one embodiment of the present invention at room temperature and high temperature.

[0035] Reference numerals: 1. Component machine; 2. Component machine discharge docking and transfer mechanism; 3. Ballering machine feed docking and transfer mechanism; 4. Ballering machine; 11. Component machine track; 21. Fixed low track; 31. Lifting and transfer track; 311. First working position of lifting and transfer track; 312. Second working position of lifting and transfer track; 41. Ballering machine track; M1. First drive motor; M2. Second drive motor; M3. Third drive motor; 501. Carrying plate; 502. First conveyor belt; 503. First transmission screw. Detailed Implementation

[0036] The following reference Figures 1 to 5 This invention describes a transfer device for reducing the number of reflow soldering operations. In the description of this embodiment, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0037] Unless otherwise expressly specified and limited, the terms "set," "install," "connect," "link," "fix," and "couple" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0038] In the description of this embodiment, the reference to terms such as "one embodiment," "some embodiments," etc., means that a specific feature, structure, material, or characteristic described in connection with that embodiment is included in at least one embodiment of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments.

[0039] In semiconductor chip packaging processes, such as Figure 1 As shown in the blue box in the right image, some components can be mounted on the back of the substrate due to design or space constraints. Compared to Figure 1 The left image does not use a back-mounted component design, which helps optimize the semiconductor chip layout and improve space utilization.

[0040] In existing technologies, back-mount components require pre-coating the back pads of the substrate with an uncured solder paste layer. A component mounting machine then positions and attaches the metallized solder ends of components such as capacitors to the corresponding pads. The components have metallized solder ends that match the solder paste layer on the substrate. During the mounting process, physical bonding and fixation between the components and the substrate are achieved solely through the adhesion of the solder paste and mechanical positioning. Figure 2 The CAB process is completed. At this point, the adhesion between the component and the substrate is only a physical adhesion, which is not strong and unstable. In existing technologies, such as... Figure 2 The left figure shows ASIS (Secondary Reflow Soldering) process, representing the existing technology's process flow. Since the component assembly group and the ball-mounting group operate independently and discontinuously, it's generally necessary to manually remove components from the component assembly group and transport them by trolley to the reflow oven for a first reflow soldering (first reflow) process. Then, they are manually transported to the ball-mounting group for ball placement and subsequent reflow soldering (second reflow). Therefore, the back-mount component and ball-mounting processes require two separate reflow soldering steps: one after back-mounting and one after ball placement. Manual handling of components easily leads to damage during transport, and the two reflow soldering processes significantly impact the final device performance, causing more pronounced warpage and deformation, which can lead to defects and instability in subsequent device performance. Figure 2As shown in the right figure, TOBE (One Reflow Soldering) represents the process flow of this invention. Back-mount components and the ball-mounting process only require one reflow soldering operation. Specifically, the process is as follows: First, back-mount components (such as capacitors) are adhered to the back of the substrate using solder paste through a mounting device. At this stage, no reflow soldering is performed. Instead, the components are transferred to a ball-mounting machine via a conversion device, where the ball-mounting process is executed, and the reflow soldering function of the ball-mounting machine provides a single reflow soldering fixation. This solution not only avoids the probability of component damage caused by manual handling but also reduces the number of reflow soldering operations, decreases component deformation and warping, and improves production efficiency.

[0041] like Figure 3 As shown, this embodiment of the utility model provides a transfer device, which is used to connect the component machine 1 and the ball-forming machine 4 to realize process connection. The transfer device includes:

[0042] The component machine discharge docking and transfer mechanism 2 and the ball-planting machine feed docking and transfer mechanism 3 are matched and connected.

[0043] The component machine discharge docking and transfer mechanism 2 includes a horizontally set fixed low track 21, which docks with the component machine track 11;

[0044] The ball-planting machine feeding and docking transfer mechanism 3 includes a lifting transfer track 31; the lifting transfer track 31 includes a first working position 311 and a second working position 312. In the first working position 311, it matches and docks with the fixed low track 21 to achieve transfer; in the second working position 312, it matches and docks with the ball-planting machine track 41 to achieve transfer. The transfer device realizes the process connection between the component machine 1 and the ball-planting machine 4.

[0045] In such Figure 4 In some embodiments shown, the horizontally arranged fixed low track 21 includes a first drive mechanism and two parallel first conveyor belts 502. The first drive mechanism is used to drive the first conveyor belts 502 to transport the component machine's output material to the ball-forming machine's feeding docking and transfer mechanism 3. The component machine's output docking and transfer mechanism 2 realizes the connection and transmission between the component machine 1 and the ball-forming machine's feeding docking and transfer mechanism 3.

[0046] For example, like Figure 4 In a further embodiment shown, the parallel first transmission belt 502 is a circulating motion conveyor belt, such as a self-rotating one.

[0047] In one embodiment, the distance between two parallel first conveyor belts 502 is 20 to 50 cm, such as 33 cm.

[0048] In some embodiments of this utility model, the lifting and transfer track 31 includes a second drive mechanism, a third drive mechanism, and two parallel second conveyor belts; the second drive mechanism drives the second conveyor belts to make the component machine discharge linearly in the horizontal direction, and the third drive mechanism drives the lifting and transfer track 31 to move in the vertical direction. This ensures that the second conveyor belts on the lifting and transfer track can move linearly in either the horizontal or vertical direction.

[0049] In one embodiment of this utility model, the fixed low track 21 and the lifting and transfer track 31 adopt a frame structure.

[0050] In some embodiments of this utility model, the first driving mechanism includes a first driving motor M1, a first transmission screw 503, and a first transmission wheel; the output end of the first driving motor M1 is connected to the first transmission screw 503 to drive its rotation; the first transmission wheel is fixed on the first transmission screw 503 to rotate synchronously; the first conveyor belt 502 is sleeved on the first transmission wheel (e.g., ...). Figure 4 (as shown); to achieve orderly transmission of the first drive mechanism.

[0051] In a more specific embodiment of this utility model, the horizontally arranged fixed low track can be as follows: Figure 4 As shown, it includes a track body (or frame structure) forming at least two parallel rods, and a plurality of first transmission wheels are disposed on the track body to form two sets of corresponding transmission wheel sets (e.g., there are a total of 4 first transmission wheels, and two of the first transmission wheels are respectively disposed at both ends of the parallel rods and are correspondingly disposed with the transmission wheel of the other parallel rod, as shown in the figure). Figure 4 As shown), a first transmission belt is fitted onto the transmission wheel assembly on one of the rods, and another first transmission belt is fitted onto the transmission wheel assembly on the other rod. The two first transmission belts are arranged in parallel and corresponding positions. The first transmission screw 503 is the rotating shaft of one of the transmission wheel assemblies. Thus, the first transmission wheel assembly rotates with the rotation of the first transmission screw 503. The first transmission screw 503 is driven to rotate by the first drive motor M1.

[0052] In some embodiments of this utility model, the component machine discharge docking and transfer mechanism 2 further includes a first control module, which is electrically connected to the first drive mechanism and used to control the operation of the first drive mechanism. The first control module can control the start, stop, and speed of the first drive mechanism, making corresponding adjustments from the perspective of ensuring the orderly and stable operation of the component machine discharge docking and transfer mechanism.

[0053] In some embodiments of this utility model, the second drive mechanism includes a second drive motor M2, a second transmission screw, and a second transmission wheel; the output end of the second drive motor is connected to the second transmission screw to make it rotate; the second transmission wheel is fixed on the second transmission screw to follow its rotation; and the second conveyor belt is sleeved on the second transmission wheel. This method enables the second conveyor belt to linearly transport components in the horizontal direction.

[0054] In some embodiments of this utility model, the third drive mechanism includes a third drive motor M3 and a third transmission screw; the output end of the third drive motor M3 is connected to the third transmission screw to make it rotate; the third transmission screw is fixedly connected to the lifting and transferring track 31 and drives it to lift vertically. Generally, the third drive mechanism can be provided in the feeding and docking transfer mechanism of the ball-planting machine.

[0055] In a specific embodiment, the specific implementation method of the horizontal transfer of the ball-planting machine's feeding docking and transfer mechanism is as follows: Figure 4 Consistent with what is shown.

[0056] In some alternative embodiments of this utility model, the lifting and transfer track is further provided with a vertically arranged transmission rack, and the transmission wheel can be a gear, thereby engaging with the transmission rack to achieve lifting.

[0057] In some embodiments of this utility model, the component discharge machine includes a support tray carrying components to be reflow soldered, such as... Figure 4 As shown. The carrier tray 501 is conveyed by a first conveyor belt and a second conveyor belt, and its surface is provided with limiting grooves to smoothly convey the components to be reflow soldered. Figure 4 In the embodiment shown, the support plate 501 is mounted on two parallel first conveyor belts 502, with its two sides supported by the two first conveyor belts 502 respectively, and achieves synchronous movement based on friction.

[0058] In one embodiment of this utility model, such as Figure 4 As shown, the first conveyor belt 502 is mounted on the fixed low track 21 of the component machine's discharge docking and transfer mechanism 2. The carrier plate 501 is mounted on two parallel first conveyor belts 502 and is transported by the first conveyor belts 502. In a specific embodiment, two first conveyor belts 502 are arranged in parallel on the fixed low track 21, and the carrier plate 501 straddles the surfaces of the two conveyor belts and is driven and transported by them. In a case such as Figure 4 In the specific embodiment shown, the track body or frame structure has limiting structures on both sides with a height higher than the conveyor belt to constrain and ensure that the carrier plate 501 moves smoothly in the horizontal plane, avoiding unexpected risks such as the carrier plate slipping from the side during transfer. In the following embodiments, when a horizontal positioner is involved, it can be provided on the limiting structure.

[0059] A single carrier plate can be equipped with multiple limiting grooves to support multiple substrates. In a... Figure 4 In the specific embodiment shown, the carrier plate 501 has a size of 32.3cm (length) × 13.7cm (width) and its surface is provided with 5 square limiting grooves of 6.0cm × 6.0cm, which can be used to accurately place the same size and pre-processed substrate; each substrate has 50 fixed points, which are used to place capacitor components of 0.6mm × 0.3mm.

[0060] In some embodiments of this utility model, the horizontal docking distance between the first conveyor belt and the second conveyor belt is 0.1 to 1 cm, and in one specific embodiment it is 0.5 cm.

[0061] In one specific embodiment, the conveyor belt in this application is made of rubber. Its friction transmission and the guiding effect of the limiting groove enable the substrate to maintain a stable posture during the transfer process, ensuring the positioning accuracy requirements of the subsequent reflow soldering process.

[0062] In some embodiments of this utility model, the feeding and transfer mechanism 3 of the ball-planting machine includes:

[0063] A horizontal positioner is installed at the end of the process of the lifting and transferring rail 31 to detect whether the bearing plate has reached the end of the lifting and transferring rail 31.

[0064] A vertical positioner, located at the second working position 312, is used to assist in controlling the rising height of the lifting and transferring track 31. After the above two positioners sense the carrier plate, they assist in starting and stopping the carrier plate's linear movement in the horizontal direction or vertically upward.

[0065] In one embodiment of this utility model, the lifting height of the lifting and transfer track is 30cm, which compensates for the height difference between the discharge end of the component machine and the infeed end of the ball-planting machine.

[0066] In some embodiments of this utility model, the feeding and docking transfer mechanism 3 of the ball-planting machine further includes: a second control module, which is electrically connected to the second drive mechanism and the third drive mechanism; controls the operation of the second drive mechanism according to the signal of the horizontal positioner; controls the operation of the third drive mechanism according to the signal of the vertical positioner; controls the start-stop sequence and speed of the second drive mechanism and the third drive mechanism to ensure the orderly and stable operation of the feeding and docking transfer mechanism of the ball-planting machine.

[0067] In this application, when the horizontal positioner senses the arrival of the carrier plate, it sends a message to the second control module, which then controls the second drive motor M2 to stop operating. In one embodiment, the horizontal positioner is a position sensor. Furthermore, the vertical positioner can also be a position sensor.

[0068] In the above technical solution of this application, when the vertical positioner senses that the lifting and transfer track has reached the second working position 312, the vertical positioner sends a signal to the second control module, and the second control module controls the third drive motor M3 to stop working (i.e. stop rising); at this time, the second control module controls the second drive motor M2 to rotate, so that the components on the second conveyor belt are transferred to the ball-planting machine track 41, until the horizontal positioner no longer senses the carrier plate 501, the horizontal positioner sends a signal to the second control module to control the third drive mechanism to work so that the lifting and transfer track 31 descends to the first working position 311.

[0069] In some embodiments of this invention, the height difference between the second working position 312 and the first working position 311 is preset in the second control module. Alternatively, a vertical locator may be additionally provided at the first working position 311 to sense the return of the lifting track to the first working position 311 and send a signal to the second control module.

[0070] When the lifting and transfer track 31 descends from the second working position 312, the third drive motor M3 is started to drive the third transmission screw to reverse. When the cumulative displacement reaches the preset height difference, the second control module issues a command to stop the third drive motor M3 from reversing, thereby realizing the accurate descent of the lifting and transfer track to the first working position 311.

[0071] The second control module can control the second drive motor M2 and the third drive motor M3 to repeat the above steps according to the positioner signal, so as to realize the orderly operation of the ball-planting machine feeding docking and transfer mechanism in the horizontal and vertical directions, and ensure the coordinated matching of production rhythm.

[0072] This utility model embodiment also provides a single-pass reflow soldering ball-mounting machine, which includes a component machine 1, a component machine discharge docking and transfer mechanism 2, a ball-mounting machine feed docking and transfer mechanism 3, and a ball-mounting machine 4, arranged sequentially along the process direction; the component machine 1 also includes a component machine control module, and the ball-mounting machine 4 also includes a ball-mounting machine control module; it realizes the smooth transfer of components from the component machine to the ball-mounting machine and only requires one reflow soldering and curing, reducing the risk of deformation and warping caused by reflow soldering during the packaging process and improving production efficiency.

[0073] In some embodiments of this utility model, the single-pass reflow soldering ball-planting machine further includes a main control module, which is electrically connected to the component machine control module, the first control module, the second control module, and the ball-planting machine control module to coordinate and match the production cycle. This ensures that the carrier tray can enter the component machine, the component machine discharge docking and transfer mechanism, the ball-planting machine feed docking and transfer mechanism, and the ball-planting machine in an orderly and continuous sequence, undergoing the corresponding processes of the component machine and the ball-planting machine, and performing reflow soldering only once.

[0074] In one embodiment, the component machine control module is used to control the working state of the component machine track, such as whether it is working or its working speed. In another embodiment, the ball-planting machine control module is used to control the working state of the ball-planting machine track, such as whether it is working or its working speed.

[0075] In one embodiment of this utility model, the main control module is electrically connected to the component machine control module, the first control module, the second control module, and the ball-planting machine control module. The main control module controls the operation of the first control module based on the operation status of the component machine control module, and also provides feedback to the second control module to control the operation of both the component machine control module and the first control module; the main control module also controls the operation of the ball-planting machine control module based on the second control module. Specific details will not be elaborated here, as long as the continuous coordination of the component machine, transfer device, and ball-planting machine in this application can be achieved.

[0076] In some embodiments and comparative examples of this utility model, a warpage tester is used to perform thermal deformation warpage analysis tests on the reflow soldered chips, detecting the deformation of the chips at room temperature (30°C) and high temperature (260°C), thereby evaluating the reliability and stability of the chips. The results are as follows... Figure 5 As shown, ASIS (secondary reflow soldering) represents a chip prepared by two reflow soldering processes in the prior art, which was used as a comparative example for thermal deformation and warpage analysis testing, and the detected chip deformation was 614 μm. TOBE (first reflow soldering) represents a chip prepared by only one reflow soldering process in the embodiment, and the detected chip deformation was only 376 μm. It can be seen that this utility model can reduce the number of reflow soldering processes, reduce the risk of chip deformation and warpage caused by heat and force during the packaging process, reduce the risk of product failure, improve the reliability and stability of the chip, and ensure that electronic devices operate stably within the normal operating temperature range.

[0077] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A transfer device, characterized in that, The transfer device is used to connect the component machine and the ball-forming machine to achieve process connection. The transfer device includes: The component machine discharge docking and transfer mechanism and the ball-planting machine infeed docking and transfer mechanism are matched and connected. The component machine discharge docking and transfer mechanism includes a horizontally set fixed low track, which docks with the component machine track; The ball-planting machine feeding and docking transfer mechanism includes a lifting transfer track; the lifting transfer track includes a first working position and a second working position. In the first working position, it is matched and docked with the fixed low track to realize transfer; in the second working position, it is matched and docked with the ball-planting machine track to realize transfer.

2. The transfer device according to claim 1, characterized in that, The horizontally set fixed low track includes a first drive mechanism and two parallel first conveyor belts. The first drive mechanism is used to drive the first conveyor belts to transport the component machine output to the ball-forming machine feeding docking and transfer mechanism.

3. The transfer device according to claim 1, characterized in that, The lifting and transfer track includes a second drive mechanism, a third drive mechanism, and two parallel second conveyor belts; the second drive mechanism is used to drive the second conveyor belts so that the component machine outputs material in a straight line in the horizontal direction, and the third drive mechanism is used to drive the lifting and transfer track to move in the vertical direction.

4. The transfer device according to claim 2, characterized in that, The first drive mechanism includes a first drive motor, a first transmission screw, and a first transmission wheel; the output end of the first drive motor is connected to the first transmission screw to drive its rotation. The first drive wheel is fixed to the first drive screw to rotate synchronously; the first conveyor belt is sleeved on the first drive wheel.

5. The transfer device according to claim 1, characterized in that, The component machine discharge docking and transfer mechanism also includes a first control module, which is electrically connected to the first drive mechanism and is used to control the operation of the first drive mechanism.

6. The transfer device according to claim 3, characterized in that, The second drive mechanism includes a second drive motor, a second transmission screw, and a second transmission wheel; The output end of the second drive motor is connected to the second transmission screw to make it rotate; the second transmission wheel is fixed on the second transmission screw to follow its rotation; the second conveyor belt is sleeved on the second transmission wheel; And / or, the third drive mechanism includes a third drive motor and a third transmission screw; The output end of the third drive motor is connected to the third transmission screw to make it rotate; the third transmission screw is fixedly connected to the lifting and transporting track and drives it to rise and fall vertically.

7. The transfer device according to claim 2, characterized in that, The component machine output includes a carrier tray that carries components to be reflowed for soldering.

8. The transfer device according to claim 1, characterized in that, The feeding and transfer mechanism of the ball-planting machine includes: A horizontal positioner is installed at the end of the process of the lifting and transferring track to detect whether the bearing plate has reached the end of the lifting and transferring track; The vertical positioner, located at the second working position, is used to assist in controlling the rising height of the lifting and transfer track; And / or, the lifting height of the lifting and transferring track is 20 to 50 cm.

9. The transfer device according to claim 8, characterized in that, The ball-planting machine feeding and docking transfer mechanism further includes: a second control module, which is electrically connected to the second drive mechanism and the third drive mechanism; it controls the operation of the second drive mechanism according to the signal of the horizontal positioner; and it controls the operation of the third drive mechanism according to the signal of the vertical positioner.

10. A single-pass reflow welding ball-planting machine, characterized in that, The device includes the transfer device as described in any one of claims 1 to 9; along the process direction, a component machine, a component machine discharge docking transfer mechanism, a ball-planting machine feed docking transfer mechanism, and a ball-planting machine are sequentially distributed; the component machine further includes a component machine control module, and the ball-planting machine further includes a ball-planting machine control module; And / or, it also includes a main control module, which is electrically connected to the component machine control module, the first control module, the second control module and the ball-planting machine control module, for coordinating and matching production cycles.

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