Semiconductor packaging assembly

Abstract

The utility model relates to the technical field of packaging equipment, and discloses a semiconductor packaging assembly, which comprises a mounting box for semiconductor packaging, a side frame fixed on the side surface of the mounting box, a cover plate hinged on the surface of the side frame, a mold box assembly arranged on the surface of the cover plate, and a fixing mechanism arranged on the surface of the mold box assembly. A jacking structure is arranged on the surface of the mold box assembly and comprises a top plate and a transverse plate, the top plate is arranged on the surface of the mold box assembly, the transverse plate is fixed to the bottom of the top plate, a driving part is arranged on the surface of the mounting box, an energy supply mechanism is arranged on the surface of the driving part, and a grabbing part is arranged on the surface of the energy supply mechanism. Through mutual cooperation of the driving component, the energy supply mechanism and the grabbing component, the packaging box can be jacked by the device, so that separation of the packaging box and the device is accelerated, and the packaging efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of packaging equipment technology, specifically a semiconductor packaging component. Background Technology

[0002] Semiconductors are integrated electronic components that play a vital role in the power industry. After semiconductors are processed, they need to be packaged. During the packaging process, relevant devices are used to place the packaging boxes.

[0003] Chinese patent CN 222672966 U discloses a loading mold for semiconductor packaging. This device uses a first spring to effectively move a sliding plate, which in turn moves a rod. The rod's movement allows for insertion or disengagement of the insertion hole, ensuring the stability of the retracted reset plate and eliminating inconvenience for workers. A second spring effectively uses its elasticity to push the reset plate to its reset position, which in turn pushes a push rod to its reset position. This push rod's reset position facilitates the movement of packaging boxes placed on the surface of the placement slot, making it easier for workers to retrieve the packaging boxes and improving their work efficiency.

[0004] However, in actual use, the elastic force of the elastic element is uncontrollable. Therefore, when the elastic element of the existing device drives the packaging box to reset, it may lift the packaging box and drop it to another place, thereby damaging the semiconductor inside the packaging box. To address this, a semiconductor packaging component is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a semiconductor packaging component to solve the problem mentioned in the background art that, in actual use, the elastic force of the elastic element is uncontrollable. Therefore, when the elastic element of the existing device drives the packaging box to reset, it may lift the packaging box and drop it elsewhere, thereby damaging the semiconductor inside the packaging box.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor packaging assembly, comprising a mounting box for semiconductor packaging, a side frame fixed to the side of the mounting box, a cover plate hinged to the surface of the side frame, a mold box assembly disposed on the surface of the cover plate, the mold box assembly being interconnected with the mounting box, a fixing mechanism disposed on the surface of the mold box assembly, the fixing mechanism being interconnected with the mounting box, a lifting structure disposed on the surface of the mold box assembly, the lifting structure comprising a top plate and a horizontal plate, the top plate being disposed on the surface of the mold box assembly, the horizontal plate being fixed to the bottom of the top plate, a driving component disposed on the surface of the mounting box, a power supply mechanism disposed on the surface of the driving component, the power supply mechanism being interconnected with the mounting box, and a gripping component disposed on the surface of the power supply mechanism.

[0007] Preferably, the mold box assembly described above includes a mold box body, mounting holes, and side plates. The mold box body is fitted between the mounting box and the cover plate. Several mounting holes are formed on the surface of the mold box body. Two side plates are symmetrically fixed to the sides of the mold box body. The top plate is fitted to the bottom of the mold box body. The position of the top plate corresponds to the position of the mounting holes.

[0008] Preferably, the fixing mechanism described above includes an insert plate, a rotating plate, a tension spring, and a base. The insert plate is inserted into the surface of the side plate, the rotating plate is slidably nested in the surface of the insert plate, the tension spring is nested and fixed in the surface of the insert plate, the other end of the tension spring is fixedly connected to the rotating plate, the base is hinged to the end of the rotating plate, and the base is fixedly connected to the outer wall of the mounting box.

[0009] Preferably, the aforementioned driving component includes a slide rod, a slider, a base, and a connecting plate. The slide rod is fixed to the inner wall of the mounting box, the slider is slidably sleeved on the surface of the slide rod, the two bases are respectively fixed to the surfaces of the slider and the cross plate, and the two ends of the connecting plate are hinged to the two bases.

[0010] Preferably, two sliders are provided, and the two sliders are symmetrically distributed about the longitudinal central axis of the slider.

[0011] Preferably, the power supply mechanism described above includes a bidirectional lead screw and a turntable. The bidirectional lead screw is threaded through the interior of the slider, and one end of the bidirectional lead screw passes through the side wall of the mounting box. The mounting box and the bidirectional lead screw are connected by a bearing, and the turntable is fixed to the end of the bidirectional lead screw.

[0012] Preferably, the gripping component described above includes a threaded rod, a gripping plate, a fixed seat, and a gripping rod. The threaded rod is threaded through the interior of the turntable, one end of the threaded rod is threadedly connected to the outer wall of the mounting box, the gripping plate is fixed to the other end of the threaded rod, the fixed seat is fixed to the side of the gripping plate, and the gripping rod is hinged to the side of the fixed seat.

[0013] Compared with the prior art, the present invention, by adopting the above technical solution, has the following technical effects:

[0014] 1. This utility model, through the cooperation of the mounting box, side frame, cover plate, mold box assembly, fixing mechanism and lifting structure, makes the lifting force controllable during use, so that the packaging box can be lifted and detached smoothly, thereby solving the problem that existing devices rely on elastic parts, which may cause the packaging box to fall to other places and damage the internal semiconductor.

[0015] 2. This utility model, through the cooperation of the driving component, the power supply mechanism and the gripping component, enables the device to lift the packaging box, thereby accelerating the separation of the packaging box from the device and improving the sealing efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic cross-sectional view of the mounting box of this utility model;

[0019] Figure 3 For the present utility model Figure 2 Enlarged structural diagram at point A in the middle;

[0020] Figure 4 For the present utility model Figure 2 Enlarged structural diagram at point B;

[0021] Figure 5 This is a three-dimensional structural diagram of the mold box assembly of this utility model;

[0022] Figure 6 This is a three-dimensional structural diagram of the gripping component of this utility model.

[0023] Explanation of reference numerals in the attached drawings: 1. Mounting box; 2. Side frame; 3. Cover plate; 4. Mold box assembly; 401. Mold box body; 402. Mounting hole; 403. Side plate; 5. Fixing mechanism; 501. Insert plate; 502. Rotating plate; 503. Tension spring; 504. Base; 6. Lifting structure; 601. Top plate; 602. Horizontal plate; 7. Drive component; 701. Slide rod; 702. Slider; 703. Base; 704. Connecting plate; 8. Power supply mechanism; 801. Two-way lead screw; 802. Turntable; 9. Gripping component; 901. Threaded rod; 902. Gripping plate; 903. Fixing seat; 904. Gripping rod. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] It should be noted that the structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which this application can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.

[0026] Example

[0027] In the Chinese patent with publication number CN 222672966 U, the elastic force of the elastic element is uncontrollable during actual use. Therefore, when the elastic element of the existing device drives the packaging box to reset, it may lift the packaging box and drop it to another place, thereby damaging the semiconductor inside the packaging box.

[0028] Please see Figure 1-6This utility model provides a technical solution: a semiconductor packaging assembly, including a mounting box 1 for semiconductor packaging. A side frame 2 is fixed to the side of the mounting box 1, and a cover plate 3 is hinged to the surface of the side frame 2. The cover plate 3 is fixed to the mounting box 1 by bolt threads. A mold box assembly 4 is provided on the surface of the cover plate 3, and the mold box assembly 4 is interconnected with the mounting box 1. A fixing mechanism 5 is provided on the surface of the mold box assembly 4, and the fixing mechanism 5 is interconnected with the mounting box 1. To ensure the stability of the lifting operation, a lifting structure 6 is provided on the surface of the mold box assembly 4. The lifting structure 6 includes a top plate 601 and a horizontal plate 602. The top plate 601 is disposed on the surface of the mold box assembly 4, and the horizontal plate 602 is fixed to the bottom of the top plate 601. A driving component 7 is provided on the surface of the mounting box 1, and a power supply mechanism 8 is provided on the surface of the driving component 7. Connected to the mounting box 1, the surface of the power supply mechanism 8 is provided with a gripping component 9. In order to store the semiconductor packaging box, a mold box assembly 4 is provided. The mold box assembly 4 includes a mold box body 401, mounting holes 402 and side plates 403. The mold box body 401 is attached between the mounting box 1 and the cover plate 3. Several mounting holes 402 are opened on the surface of the mold box body 401. Two side plates 403 are symmetrically fixed to the side of the mold box body 401. The top plate 601 is attached to the bottom of the mold box body 401. The position of the top plate 601 corresponds to the position of the mounting holes 402. In order to facilitate the lifting operation of the top plate 601, the center point of the mounting holes 402 on different mold box assemblies 4 is located at the same position. The difference between different mold box bodies 401 is only the size of the mounting holes 402 on the surface.

[0029] To facilitate the replacement of mold box assembly 4 and meet the storage requirements of packaging boxes of different sizes, a fixing mechanism 5 is provided. The fixing mechanism 5 includes an insert plate 501, a rotating plate 502, a tension spring 503, and a base 504. The insert plate 501 is inserted into the surface of the side plate 403, the rotating plate 502 is slidably nested in the surface of the insert plate 501, the tension spring 503 is nested and fixed in the surface of the insert plate 501, and the other end of the tension spring 503 is fixedly connected to the rotating plate 502. The base 504 is hinged to the end of the rotating plate 502, and the base 504 is connected to the outer surface of the mounting box 1. The wall is fixedly connected, facilitating the separation of the packaging box and the mold box body 401. A driving component 7 is provided, comprising a slide rod 701, a slider 702, a base 703, and a connecting plate 704. The slide rod 701 is fixed to the inner wall of the mounting box 1. The slider 702 is slidably sleeved on the surface of the slide rod 701. Two bases 703 are respectively fixed to the surfaces of the slider 702 and the horizontal plate 602. The two ends of the connecting plate 704 are hinged to the two bases 703. To ensure the stability of the horizontal plate 602 during lifting, two sliders 702 are provided. The slider 702 is symmetrically distributed about the longitudinal central axis of the slide rod 701. To provide power for the lifting operation, a power supply mechanism 8 is provided. The power supply mechanism 8 includes a double-acting lead screw 801 and a turntable 802. The double-acting lead screw 801 is threaded through the interior of the slider 702, and one end of the double-acting lead screw 801 passes through the side wall of the mounting box 1. The mounting box 1 and the double-acting lead screw 801 are connected by a bearing. The turntable 802 is fixed to the end of the double-acting lead screw 801 and is located outside the mounting box 1 for easy driving and locking rotation. The rear bidirectional lead screw 801 is equipped with a gripping component 9, which includes a threaded rod 901, a gripping plate 902, a fixed seat 903, and a gripping rod 904. The threaded rod 901 is threaded through the interior of the turntable 802. One end of the threaded rod 901 is threadedly connected to the outer wall of the mounting box 1. The gripping plate 902 is fixed to the other end of the threaded rod 901. The fixed seat 903 is fixed to the side of the gripping plate 902. The gripping rod 904 is hinged to the side of the fixed seat 903. The outer wall of the mounting box 1 has several threaded holes that are adapted to the threaded rod 901.

[0030] The working principle or structural principle is as follows: First, the operator selects the mold box body 401 according to the packaging box requirements. After selection, the mold box body 401 is placed on the top surface of the mounting box 1. Then, the insert plate 501 is stretched, so that the tension spring 503 is in the working state. Subsequently, the rotating plate 502 is rotated so that the insert plate 501 aligns with the side plate 403. Then, the insert plate 501 is released, and under the action of the tension spring 503, the insert plate 501 is inserted into the side plate 403, thereby fixing and limiting the mold box body 401. In accordance with this method, the other side plate 403 is connected to the insert plate 501. After that, the packaging operation can begin. During packaging, the packaging box can be placed inside the mounting hole 402, making it completely recessed into the mounting hole 402. Next, the semiconductor is placed inside the packaging box. Then, the gripper 904 drives the turntable 802 and the bidirectional lead screw 801 to rotate. During the rotation of the bidirectional lead screw 801, the surface threads will cause the sliders 702 to move closer together, thereby driving the horizontal plate 602 and the top plate 601 to rise through the base 703 and the connecting plate 704. Finally, the packaging box is lifted out of the mounting hole 402 and removed by the staff.

[0031] In summary, this device has advantages such as good stability and wide applicability.

[0032] Those skilled in the art will understand that the features described in the various embodiments and / or claims of this utility model can be combined or combined in various ways, even if such combinations or combinations are not explicitly described in this utility model. In particular, the features described in the various embodiments and / or claims of this utility model can be combined or combined in various ways without departing from the spirit and teachings of this utility model. All such combinations and / or combinations fall within the scope of this utility model.

Claims

1. A semiconductor packaging assembly, comprising a mounting box (1) for use in semiconductor packaging, characterized in that: The mounting box (1) has a side frame (2) fixed on its side. The side frame (2) has a cover plate (3) hinged to its surface. The cover plate (3) has a mold box assembly (4) on its surface. The mold box assembly (4) is connected to the mounting box (1). The mold box assembly (4) has a fixing mechanism (5) on its surface. The fixing mechanism (5) is connected to the mounting box (1). The mold box assembly (4) has a lifting structure (6) on its surface. The lifting structure (6) includes a top plate (601) and a horizontal plate (602). The top plate (601) is located on the surface of the mold box assembly (4). The horizontal plate (602) is fixed to the bottom of the top plate (601). The mounting box (1) has a driving component (7) on its surface. The driving component (7) has a power supply mechanism (8) on its surface. The power supply mechanism (8) is connected to the mounting box (1). The power supply mechanism (8) has a gripping component (9) on its surface.

2. A semiconductor packaging assembly according to claim 1, characterized in that: The mold box assembly (4) includes a mold box body (401), mounting holes (402) and side plates (403). The mold box body (401) is attached between the mounting box (1) and the cover plate (3). Several mounting holes (402) are opened on the surface of the mold box body (401). Two side plates (403) are symmetrically fixed to the side of the mold box body (401). The top plate (601) is attached to the bottom of the mold box body (401). The position of the top plate (601) corresponds to the position of the mounting holes (402).

3. A semiconductor packaging component according to claim 2, characterized in that: The fixing mechanism (5) includes a plug plate (501), a rotating plate (502), a tension spring (503), and a base (504). The plug plate (501) is inserted into the surface of the side plate (403). The rotating plate (502) is slidably nested in the surface of the plug plate (501). The tension spring (503) is nested and fixed in the surface of the plug plate (501). The other end of the tension spring (503) is fixedly connected to the rotating plate (502). The base (504) is hinged to the end of the rotating plate (502). The base (504) is fixedly connected to the outer wall of the mounting box (1).

4. A semiconductor packaging assembly according to claim 1, characterized in that: The driving component (7) includes a slide rod (701), a slider (702), a base (703), and a connecting plate (704). The slide rod (701) is fixed to the inner wall of the mounting box (1). The slider (702) is slidably sleeved on the surface of the slide rod (701). The two bases (703) are respectively fixed to the surfaces of the slider (702) and the cross plate (602). The two ends of the connecting plate (704) are hinged to the two bases (703).

5. A semiconductor packaging assembly according to claim 4, characterized in that: Two sliders (702) are provided, and the two sliders (702) are symmetrically distributed about the longitudinal central axis of the slide rod (701).

6. A semiconductor packaging assembly according to claim 4, characterized in that: The power supply mechanism (8) includes a bidirectional lead screw (801) and a turntable (802). The bidirectional lead screw (801) is threaded through the interior of the slider (702). One end of the bidirectional lead screw (801) passes through the side wall of the mounting box (1). The mounting box (1) and the bidirectional lead screw (801) are connected by a bearing. The turntable (802) is fixed to the end of the bidirectional lead screw (801).

7. A semiconductor packaging component according to claim 6, characterized in that: The gripping component (9) includes a threaded rod (901), a gripping plate (902), a fixed seat (903), and a gripping rod (904). The threaded rod (901) is threaded through the interior of the turntable (802). One end of the threaded rod (901) is threadedly connected to the outer wall of the mounting box (1). The gripping plate (902) is fixed to the other end of the threaded rod (901). The fixed seat (903) is fixed to the side of the gripping plate (902). The gripping rod (904) is hinged to the side of the fixed seat (903).

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