Chip radiator structure

Abstract

The utility model relates to a chip radiator structure, which comprises a radiator joint, a radiator cover plate and a radiator cold plate, the radiator cold plate is provided with a cold plate concave cavity, and a microstructure rib column perpendicular to the bottom face is arranged in the cold plate concave cavity so as to enhance heat exchange. The radiator cold plate and the cover plate bottom surface groove of the radiator cover plate form a clearance fit structure through cold plate positioning rib edges arranged around the cold plate concave cavity so as to be quickly positioned and mounted; the radiator cold plate is pressed on the chip; a cover plate body of the radiator cover plate is provided with a cover plate through hole communicated with the radiator joint; the radiator cover plate is hermetically connected with the radiator cold plate and forms a heat exchange cavity with the cold plate concave cavity; and the radiator joints are connected with the radiator cover plate to form a flowing channel through which a cooling working medium flows into the heat exchange cavity from the radiator joint on one side and then is discharged from the radiator joint on the other side. Compared with the prior art, the utility model has multiple seals, and is reliable and stable in operation; a fluid channel is optimized, and the heat dissipation efficiency is improved; and the heat dissipation effect is improved.

Description

Technical Field

[0001] This utility model relates to the field of chip heat dissipation technology, and in particular to a chip heat sink structure. Background Technology

[0002] With the rapid development of microelectronics technology, chip integration is constantly increasing and chip size is shrinking. This has led to a significant increase in core heat generation and heat accumulation due to stacking, resulting in a sharp increase in heat flux density. Chip performance is highly sensitive to operating temperature, making thermal design increasingly important. To ensure stable chip operation and extend its lifespan, heat dissipation technology plays a crucial role in chip development.

[0003] Common chip heat sinks can be categorized into several types based on their heat dissipation methods, including air cooling, heat pipe heat sinks, liquid cooling, semiconductor refrigeration, and compressor refrigeration. Among these, liquid cooling is further divided into phase change liquid cooling and non-phase change liquid cooling. Phase change liquid cooling is the preferred choice for heat dissipation of high-heat-generating chips due to its compact design, good heat dissipation effect, and low noise.

[0004] However, conventional liquid cooling devices suffer from structural design deficiencies, resulting in limited heat dissipation effects, low heat exchange efficiency, and an inability to sustain high-power heat dissipation. This makes them unsuitable for meeting the heat dissipation requirements of high heat flux density chips. Patent CN201510338846.0 discloses a chip heat sink, comprising: a heat conductor, a heat sink, and a heat sink fin. The heat conductor includes a first heat conductor and a second heat conductor connected to the first heat conductor. The first heat conductor is used to contact the chip. The heat sink has a receiving cavity filled with a heat dissipation liquid. The heat conductor is sealed to the receiving cavity. The second heat conductor is housed within the receiving cavity and at least partially inserted into the heat dissipation liquid. The heat sink fin is disposed on the heat sink. The aforementioned chip heat sink has a cavity within the heat sink body, and a second heat conductor is at least partially inserted into the heat dissipation liquid. Utilizing the fluidity of the liquid, the heat generated by the electronic components is rapidly absorbed by the heat dissipation liquid through the heat conductor and dispersed onto the heat sink through the inner wall of the cavity. The heat is then dissipated into the air through heat sink fins via convection, radiation, and conduction, facilitating rapid heat transfer and dispersion and improving the heat dissipation performance of the chip heat sink. However, the performance of the heat dissipation liquid is limited; under long-term high-temperature environments, the sealing material may age or deform.

[0005] Therefore, designing novel and efficient cooling and heat dissipation devices is a common concern for those skilled in the art. Utility Model Content

[0006] The purpose of this invention is to overcome the shortcomings of the existing chip heat sink, such as low heat exchange efficiency, poor heat dissipation effect, and unstable operation, and to provide a chip heat sink structure that improves the heat exchange efficiency and heat dissipation effect of the chip heat sink, and ensures reliable and stable operation.

[0007] This utility model provides a chip heat sink structure, including: a heat sink connector, a heat sink cover plate, and a heat sink cold plate;

[0008] The heat sink cold plate has a cold plate cavity, and microstructure ribs perpendicular to the bottom surface are provided in the cold plate cavity to enhance heat transfer; the heat sink cold plate forms a gap fit structure with the bottom groove of the heat sink cover plate through the cold plate positioning ribs arranged around the cold plate cavity for quick positioning and installation; the heat sink cold plate is pressed onto the chip.

[0009] The radiator cover plate has a through hole that communicates with the radiator joint; the radiator cover plate is sealed to the radiator cold plate by welding or screws and forms a heat exchange chamber with the cold plate cavity.

[0010] The radiator joint is connected to the radiator cover plate by welding or threaded connection, forming a flow channel in which the cooling working fluid flows into the heat exchange chamber from one side of the radiator joint and then exits from the other side of the radiator joint.

[0011] Furthermore,

[0012] When the radiator connector is connected to the radiator cover plate by welding, the radiator connector is a customized connector structure, and the radiator connector includes: an inlet connector, a connector bottom surface, and a connector channel; the inlet connector is used to connect to external pipelines; the connector channel communicates with the through hole of the cover plate, and the through hole of the cover plate is a gradually expanding hole structure;

[0013] When the radiator connector is threadedly connected to the radiator cover plate, the through hole of the cover plate is a threaded hole.

[0014] Furthermore,

[0015] When the radiator cover plate is sealed to the radiator cold plate by welding, brazing filler metal is filled between the second cover plate contact surface of the radiator cover plate and the cold plate contact surface of the radiator cold plate to achieve sealing and connection.

[0016] When the radiator cover is sealed to the radiator cold plate by screws, a sealing gasket is provided between the second cover plate contact surface of the radiator cover and the cold plate contact surface of the radiator cold plate to achieve a seal. The radiator cover and the radiator cold plate are provided with corresponding and evenly distributed screw holes around their periphery to achieve connection by screws.

[0017] Furthermore, the outer contour dimension of the planar projection of the cold plate positioning rib is smaller than the planar projection contour dimension of the groove on the bottom surface of the cover plate; the height dimension of the cold plate positioning rib is smaller than the depth dimension of the groove on the bottom surface of the cover plate.

[0018] The cold plate cavity has a cavity transition structure and a cavity bottom surface below the cover plate through hole, so that the cooling working fluid flows smoothly and evenly into the cold plate cavity.

[0019] Furthermore, the microstructured ribs are disposed on the bottom surface of the concave cavity. The shape of the microstructured ribs is one or more of the following: rectangular cross-section prism, rectangular cross-section cone, rectangular cross-section frustum, trapezoidal prism, trapezoidal cone, trapezoidal frustum, parallelogram prism, parallelogram cone, parallelogram frustum, triangular prism, triangular cone, triangular frustum, circular prism, circular cone, circular frustum, elliptical prism, elliptical cone, elliptical frustum, hemispherical, or umbrella-shaped. The arrangement of the microstructured ribs is either straight or staggered. Straight-line ribs are arranged parallel to each other longitudinally or transversely along the radiator, which can effectively provide a larger contact area, thereby improving heat exchange efficiency; staggered rib arrangement can increase the disturbance of the fluid, promote heat exchange between the liquid and the rib surface, thereby enhancing heat dissipation performance.

[0020] When the microstructure ribs are umbrella-shaped, the umbrella structure consists of a head structure and a root structure. The head structure and root structure can be the same or different, and both are selected from one or more of the following: rectangular cross-section prism, trapezoidal prism, cone, frustum, parallelogram prism, triangular prism, circular prism, elliptical prism, and umbrella shape. The circumcenters of the horizontal projection contours of the root and head of the umbrella structure can coincide or be offset according to design requirements. R1 is defined as the circumradius of the horizontal projection contour of the root, and R2 is defined as the circumradius of the horizontal projection contour of the head. When the root and head are offset, the offset distance is less than or equal to the sum of R1 and R2.

[0021] When the shape of the microstructure rib is umbrella-shaped, the ratio of the outer radius of the root to the outer radius of the head is 0.1 to 10, and the height ratio of the root to the head can be adjusted to any value according to design requirements.

[0022] Furthermore, the bottom surface of the cold plate cavity is provided with a bottom capillary structure; when the thickness of the bottom capillary structure is 0, the bottom surface of the cavity is a smooth metal surface.

[0023] Furthermore, the microstructure ribs are provided with rib capillary structures, and the thickness of the rib capillary structures accounts for 0% to 100% of the total thickness of the microstructure ribs.

[0024] When the thickness of the capillary structure of the rib column is 0%, the microstructure rib column is a completely solid rib column; when the thickness of the capillary structure of the rib column is 100%, the microstructure rib column is composed of a completely porous capillary structure.

[0025] Furthermore, when the microstructure rib is umbrella-shaped, a gap capillary structure is provided around the root of the microstructure rib.

[0026] The bottom capillary structure, rib capillary structure, and gap capillary structure are all porous capillary structures; the porous capillary structure is constructed by metal powder sintering, metal wire sintering, or a mixture of metal powder and metal wire sintering, and the thickness at different positions or regions is adjusted differently according to design requirements.

[0027] Furthermore, the heat sink cold plate is provided with cold plate mounting holes and is pressed onto the chip through a connecting structure;

[0028] The connection structure includes a connecting screw, a preload spring, and a connecting nut. The preload spring is sleeved inside the connecting screw. The connecting screw passes through the cold plate mounting hole and the chip mounting surface. The connecting nut is screwed into the end of the connecting screw to achieve connection and fixation.

[0029] Furthermore, the space between the heat sink's cold plate and the chip's contact surface is filled with thermally conductive silicone grease or liquid metal. When the thermal medium is liquid metal, a protective design is present around the chip to prevent liquid metal leakage from damaging the motherboard.

[0030] Furthermore, the cooling medium is selected from one of deionized water, electronic fluorinated fluid, heat transfer oil, ammonia, or nanofluid.

[0031] The basic application principle of this utility model is as follows: the low-temperature cooling medium enters the heat sink through the joint hole of a heat sink connector, and flows smoothly into the heat exchange cavity with microstructure ribs through the through hole of the cover plate and the concave cavity transition structure for efficient heat exchange, carrying away the heat conducted from the chip to the heat sink cold plate and then being discharged to the external pipeline through the heat sink connector on the other side.

[0032] Compared with the prior art, the present invention has the following advantages:

[0033] (1) Enhanced heat dissipation structure. The protruding part of the umbrella-shaped rib structure of this utility model helps to enhance the turbulence effect of the fluid and improve the dispersion of bubbles. The ribs create a complex flow path during the fluid flow process, making it difficult for bubbles to form large aggregates in the fluid, thereby reducing the bubble detachment diameter and increasing the bubble detachment speed.

[0034] (2) Improved heat dissipation. The bottom surface of the concave cavity, the microstructure ribs and the gap between the ribs can all be formed by sintering copper powder particles to form a capillary structure. The capillary structure can significantly increase the surface area inside the heat sink and enhance the supply of liquid through the capillary effect, thereby strengthening convective heat transfer.

[0035] (3) Optimized fluid channels to improve heat dissipation efficiency. The cover plate gradually expanding hole and concave cavity transition structure design of this utility model can help the fluid smoothly transition to the larger channel, thereby reducing the resistance loss caused by the sudden acceleration or deceleration of the fluid; it also helps to reduce the velocity change amplitude of the fluid when passing through the orifice, and the uniform flow velocity distribution helps to improve heat dissipation efficiency, so that the fluid covers the surface inside the radiator more evenly.

[0036] (4) Multiple seals ensure reliable and stable operation. This invention achieves rapid positioning and installation of the joint-cover plate and cover plate-cold plate during welding connections through grooves on the top and bottom surfaces of the cover plate, respectively, providing guidance for assembly and positioning during welding. Welded connections can distribute stress more evenly while providing good airtightness, which is crucial for heat dissipation systems that require prevention of cooling medium leakage or air ingress. Attached Figure Description

[0037] Figure 1 Exploded view of the overall structure of a welded radiator;

[0038] Figure 2 This is an assembly drawing of the overall structure of a welded radiator.

[0039] Figure 3 A cross-sectional view of the overall structure of a welded radiator;

[0040] Figure 4 This is a schematic diagram of the radiator connector structure;

[0041] Figure 5 Schematic diagram of the radiator cover plate Figure 1 ;

[0042] Figure 6 Schematic diagram of the radiator cover plate Figure 2 ;

[0043] Figure 7 This is a structural schematic diagram of a radiator cold plate (the microstructure ribs are rectangular cross-section columns);

[0044] Figure 8 A schematic diagram illustrating the shape characteristics of the microstructured ribs;

[0045] Figure 9 A schematic diagram of the structure of a heat sink with staggered triangular ribs;

[0046] Figure 10 A schematic diagram of the structure of a heat sink with straight T-shaped ribs;

[0047] Figure 11 A schematic diagram of an umbrella-shaped microstructure rib column;

[0048] Figure 12 Schematic diagram of the capillary structure inside the cavity of the cold plate Figure 1 ;

[0049] Figure 13 Schematic diagram of the capillary structure inside the cavity of the cold plate Figure 2 ;

[0050] Figure 14 This is a structural diagram of the connection structure;

[0051] Figure 15 This is a schematic diagram of the overall structure of the welded heat sink in Example 3.

[0052] Figure reference numerals: 1-Radiator connector; 11-Inlet connector; 12-Bottom surface of connector; 13-Connector channel;

[0053] 2-Radiator cover; 21-Cover plate body; 22-Cover plate through hole; 23-Cover plate top surface groove; 24-First cover plate mating surface; 25-Cover plate bottom surface groove; 26-Second cover plate mating surface;

[0054] 3-Radiator cold plate; 31-Cold plate bonding surface; 32-Cold plate positioning rib; 33-Cold plate cavity; 331-Cavity transition structure; 332-Cavity bottom surface; 34-Microstructure rib; 341-Bottom surface capillary structure; 342-Rib capillary structure; 343-Gap capillary structure; 35-Cold plate mounting hole;

[0055] 4-Connecting structure; 41-Connecting screw; 42-Preload spring; 43-Connecting nut. Detailed Implementation

[0056] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. Component models, material names, connection structures, control methods, algorithms, and other features not explicitly described in this technical solution are considered common technical features disclosed in the prior art.

[0057] Example 1

[0058] This embodiment provides a chip heat sink structure, such as Figure 1-7 As shown, it includes: radiator connector 1, radiator cover plate 2 and radiator cold plate 3;

[0059] The heat sink cold plate 3 is provided with a cold plate cavity 33, and micro-structured ribs 34 perpendicular to the bottom surface are provided in the cold plate cavity 33 to enhance heat exchange; the heat sink cold plate 3 forms a gap fit structure with the bottom groove 25 of the heat sink cover plate 2 through the cold plate positioning ribs 32 arranged around the cold plate cavity 33 to quickly position and install; the heat sink cold plate 3 is pressed onto the chip.

[0060] The radiator cover plate 2 has a cover plate through hole 22 on the cover plate body 21 that communicates with the radiator joint 1; the radiator cover plate 2 forms a sealed connection with the radiator cold plate 3 by welding or screwing and forms a heat exchange cavity with the cold plate cavity 33.

[0061] The radiator connector 1 is connected to the radiator cover plate 2 by welding or threaded connection, forming a flow channel in which the cooling working fluid flows into the heat exchange chamber from one side of the radiator connector 1 and then exits from the other side of the radiator connector 1.

[0062] In a specific implementation,

[0063] When the radiator connector 1 is connected to the radiator cover plate 2 by welding, the radiator connector 1 is a customized connector structure, which includes: an inlet connector 11, a connector bottom surface 12, and a connector channel 13; the inlet connector 11 is used to connect to external pipelines; the radiator cover plate 2 is provided with a cover plate top surface groove 23 and a first cover plate contact surface 24, the radiator connector 1 is placed in the cover plate top surface groove 23, and brazing filler metal is filled between the connector bottom surface 12 and the first cover plate contact surface 24 to achieve welding connection; the connector channel 13 communicates with the cover plate through hole 22, and the cover plate through hole 22 is a gradually expanding hole structure;

[0064] When the radiator connector 1 is threadedly connected to the radiator cover plate 2, the radiator connector 1 is one of the following: a standard threaded quick-connect fitting, a pagoda fitting, a compression fitting, or a quick-tight fitting, and the through hole 22 of the cover plate is a threaded hole.

[0065] In a specific implementation,

[0066] When the radiator cover plate 2 is sealed to the radiator cold plate 3 by welding, the space between the second cover plate contact surface 26 of the radiator cover plate 2 and the cold plate contact surface 31 of the radiator cold plate 3 is filled with brazing filler metal to achieve sealing and connection.

[0067] When the radiator cover plate 2 is sealed to the radiator cold plate 3 by screws, a sealing gasket is provided between the second cover plate contact surface 26 of the radiator cover plate 2 and the cold plate contact surface 31 of the radiator cold plate 3 to achieve sealing. The radiator cover plate 2 and the radiator cold plate 3 are provided with corresponding and evenly distributed screw holes on their periphery to achieve connection by screws.

[0068] In a specific embodiment, the outer contour dimension of the planar projection of the cold plate positioning rib 32 is smaller than the planar projection contour dimension of the groove 25 on the bottom surface of the cover plate; the height dimension of the cold plate positioning rib 32 is smaller than the depth dimension of the groove 25 on the bottom surface of the cover plate.

[0069] The cold plate cavity 33 is provided with a cavity transition structure 331 and a cavity bottom surface 332 below the cover plate through hole 22, so that the cooling working fluid flows smoothly and evenly into the cold plate cavity 33.

[0070] like Figure 8 As shown, in a specific embodiment, the microstructure ribs 34 are disposed on the bottom surface 332 of the concave cavity. The shape of the microstructure ribs 34 is one or more of the following: rectangular cross-section prism, rectangular cross-section cone, rectangular cross-section frustum, trapezoidal prism, trapezoidal cone, trapezoidal frustum, parallelogram prism, parallelogram cone, parallelogram frustum, triangular prism, triangular cone, triangular frustum, circular prism, circular cone, circular frustum, elliptical prism, elliptical cone, elliptical frustum, hemispherical, or umbrella-shaped. The arrangement of the microstructure ribs 34 is either straight or staggered. Straight-line ribs are arranged parallel to each other longitudinally or transversely along the radiator, effectively providing a larger contact area, thereby improving heat exchange efficiency; staggered rib arrangements can increase fluid disturbance, promote heat exchange between the liquid and the rib surface, thereby enhancing heat dissipation performance. Figure 9 This is a schematic diagram of the structure of a heatsink with staggered triangular ribs; for example... Figure 10 This is a schematic diagram of the structure of a heat sink with straight-line T-shaped ribs.

[0071] like Figure 12 , 13 As shown, in a specific embodiment, the bottom surface 332 of the cold plate cavity 33 is provided with a bottom capillary structure 341; when the thickness of the bottom capillary structure 341 is 0, the bottom surface 332 of the cavity is a smooth metal surface.

[0072] In a specific embodiment, the microstructure rib 34 is provided with a rib capillary structure 342, and the thickness of the rib capillary structure 342 accounts for 0% to 100% of the total thickness of the microstructure rib 34; preferably, the thickness of the rib capillary structure 342 accounts for 5% to 25% of the total thickness of the microstructure rib 34.

[0073] When the thickness of the rib capillary structure 342 is 0%, the microstructure rib 34 is a completely solid rib; when the thickness of the rib capillary structure 342 is 100%, the microstructure rib 34 is composed of a completely porous capillary structure.

[0074] The bottom capillary structure 341, the rib capillary structure 342, and the gap capillary structure 343 are all porous capillary structures. The porous capillary structure is constructed by metal powder sintering, metal wire sintering, or a mixture of metal powder and metal wire sintering, and the thickness at different positions or regions is adjusted differently according to design requirements.

[0075] In a specific embodiment, the heat sink cold plate 3 is provided with cold plate mounting holes 35 and is pressed onto the chip through the connecting structure 4;

[0076] like Figure 14 As shown, the connection structure 4 includes: a connecting screw 41, a preload spring 42, and a connecting nut 43. The preload spring 42 is sleeved inside the connecting screw 41. The connecting screw 41 passes through the cold plate mounting hole 35 and the chip mounting surface. The connecting nut 43 is screwed into the end of the connecting screw 41 to achieve connection and fixation.

[0077] In a specific embodiment, the space between the heat sink 3 and the chip contact surface is filled with thermally conductive silicone grease or liquid metal. When the thermal medium is liquid metal, a protective design is provided around the chip to prevent liquid metal leakage from damaging the motherboard.

[0078] In a specific embodiment, the cooling medium is selected from one of deionized water, electronic fluorinated liquid, heat transfer oil, ammonia, or nanofluid.

[0079] The basic application principle of this utility model is as follows: the low-temperature cooling medium enters the heat sink through the joint hole 13 of a heat sink joint 1, and flows smoothly into the heat exchange cavity with microstructure ribs 34 through the cover plate through hole 22 and the concave cavity transition structure 331 for efficient heat exchange, and takes away the heat conducted from the chip to the heat sink cold plate 3 and then discharges to the external pipeline through the heat sink joint 1 on the other side.

[0080] Example 2

[0081] This embodiment provides a chip heat sink structure, characterized in that it includes: a heat sink connector 1, a heat sink cover plate 2, and a heat sink cold plate 3;

[0082] The heat sink cold plate 3 is provided with a cold plate cavity 33, and micro-structured ribs 34 perpendicular to the bottom surface are provided in the cold plate cavity 33 to enhance heat exchange; the heat sink cold plate 3 forms a gap fit structure with the bottom groove 25 of the heat sink cover plate 2 through the cold plate positioning ribs 32 arranged around the cold plate cavity 33 to quickly position and install; the heat sink cold plate 3 is pressed onto the chip.

[0083] The radiator cover plate 2 has a cover plate through hole 22 on the cover plate body 21 that communicates with the radiator joint 1; the radiator cover plate 2 forms a sealed connection with the radiator cold plate 3 by welding or screwing and forms a heat exchange cavity with the cold plate cavity 33.

[0084] The radiator connector 1 is connected to the radiator cover plate 2 by welding or threaded connection, forming a flow channel in which the cooling working fluid flows into the heat exchange chamber from one side of the radiator connector 1 and then exits from the other side of the radiator connector 1.

[0085] In a specific implementation,

[0086] When the radiator connector 1 is connected to the radiator cover plate 2 by welding, the radiator connector 1 includes: an inlet connector 11, a connector bottom surface 12, and a connector channel 13; the inlet connector 11 is used to connect to external pipelines; the radiator cover plate 2 is provided with a cover plate top surface groove 23 and a first cover plate contact surface 24, the radiator connector 1 is placed in the cover plate top surface groove 23, and brazing filler metal is filled between the connector bottom surface 12 and the first cover plate contact surface 24 to achieve welding connection; the connector channel 13 communicates with the cover plate through hole 22, and the cover plate through hole 22 is a gradually expanding hole structure.

[0087] In a specific implementation,

[0088] When the radiator cover plate 2 is sealed to the radiator cold plate 3 by welding, the space between the second cover plate contact surface 26 of the radiator cover plate 2 and the cold plate contact surface 31 of the radiator cold plate 3 is filled with brazing filler metal to achieve sealing and connection.

[0089] When the radiator cover plate 2 is sealed to the radiator cold plate 3 by screws, a sealing gasket is provided between the second cover plate contact surface 26 of the radiator cover plate 2 and the cold plate contact surface 31 of the radiator cold plate 3 to achieve sealing. The radiator cover plate 2 and the radiator cold plate 3 are provided with corresponding and evenly distributed screw holes on their periphery to achieve connection by screws.

[0090] In a specific embodiment, the outer contour dimension of the planar projection of the cold plate positioning rib 32 is smaller than the planar projection contour dimension of the groove 25 on the bottom surface of the cover plate; the height dimension of the cold plate positioning rib 32 is smaller than the depth dimension of the groove 25 on the bottom surface of the cover plate.

[0091] The cold plate cavity 33 is provided with a cavity transition structure 331 and a cavity bottom surface 332 below the cover plate through hole 22, so that the cooling working fluid flows smoothly and evenly into the cold plate cavity 33.

[0092] like Figure 11As shown, when the microstructure rib 34 has an umbrella-shaped shape, the umbrella structure is divided into a head structure and a root structure. The head structure and the root structure can be the same or different, and both are selected from one or more of the following: rectangular cross-section prism, trapezoidal prism, cone, frustum, parallelogram prism, triangular prism, circular prism, elliptical prism, and umbrella shape. The circumcenters of the horizontal projection contours of the root and head of the umbrella structure can coincide or be misaligned according to design requirements. R1 is defined as the circumradius of the horizontal projection contour of the root, and R2 is defined as the circumradius of the horizontal projection contour of the head. When the root and head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2.

[0093] The ratio of the outer radius of the root to the outer radius of the head is 0.1 to 10, and the height ratio of the root to the head can be adjusted to any value according to design requirements.

[0094] like Figure 12 , 13 As shown, in a specific embodiment, the bottom surface 332 of the cold plate cavity 33 is provided with a bottom capillary structure 341; when the thickness of the bottom capillary structure 341 is 0, the bottom surface 332 of the cavity is a smooth metal surface.

[0095] In a specific embodiment, the microstructure rib 34 is provided with a rib capillary structure 342, and the thickness of the rib capillary structure 342 accounts for 0% to 100% of the total thickness of the microstructure rib 34; preferably, the thickness of the rib capillary structure 342 accounts for 5% to 25% of the total thickness of the microstructure rib 34.

[0096] When the thickness of the rib capillary structure 342 is 0%, the microstructure rib 34 is a completely solid rib; when the thickness of the rib capillary structure 342 is 100%, the microstructure rib 34 is composed of a completely porous capillary structure.

[0097] In a specific embodiment, when the microstructure rib 34 is umbrella-shaped, a gap capillary structure 343 is provided around the root of the microstructure rib 34.

[0098] The bottom capillary structure 341, the rib capillary structure 342, and the gap capillary structure 343 are all porous capillary structures. The porous capillary structure is constructed by metal powder sintering, metal wire sintering, or a mixture of metal powder and metal wire sintering, and the thickness at different positions or regions is adjusted differently according to design requirements.

[0099] In a specific embodiment, the heat sink cold plate 3 is provided with cold plate mounting holes 35 and is pressed onto the chip through the connecting structure 4;

[0100] like Figure 14As shown, the connection structure 4 includes: a connecting screw 41, a preload spring 42, and a connecting nut 43. The preload spring 42 is sleeved inside the connecting screw 41. The connecting screw 41 passes through the cold plate mounting hole 35 and the chip mounting surface. The connecting nut 43 is screwed into the end of the connecting screw 41 to achieve connection and fixation.

[0101] In a specific embodiment, the space between the heat sink 3 and the chip contact surface is filled with thermally conductive silicone grease or liquid metal. When the thermal medium is liquid metal, a protective design is provided around the chip to prevent liquid metal leakage from damaging the motherboard.

[0102] In a specific embodiment, the cooling medium is selected from one of deionized water, electronic fluorinated liquid, heat transfer oil, ammonia, or nanofluid.

[0103] The basic application principle of this utility model is as follows: the low-temperature cooling medium enters the heat sink through the joint hole 13 of a heat sink joint 1, and flows smoothly into the heat exchange cavity with microstructure ribs 34 through the cover plate through hole 22 and the concave cavity transition structure 331 for efficient heat exchange, and takes away the heat conducted from the chip to the heat sink cold plate 3 and then discharges to the external pipeline through the heat sink joint 1 on the other side.

[0104] Example 3

[0105] like Figure 15 As shown, the heat sink connector 1 in this embodiment is installed in a left-right oriented, opposite-side installation manner. This opposite-side installation method can adapt to different server chassis layouts, ensuring good compatibility of the cold head structure. Other technical features are the same as in Embodiment 2.

[0106] Components not described in detail in this embodiment are all existing components that can be purchased through public channels.

[0107] The above description of the embodiments is provided to enable those skilled in the art to understand and use the utility model. It will be apparent to those skilled in the art that various modifications can be easily made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, the present utility model is not limited to the above embodiments, and any improvements and modifications made by those skilled in the art based on the disclosure of the present utility model without departing from its scope should be within the protection scope of the present utility model.

Claims

1. A chip heat sink structure, characterized in that, include: Radiator connector (1), radiator cover plate (2) and radiator cold plate (3); The heat sink cold plate (3) is provided with a cold plate cavity (33), and microstructure ribs (34) perpendicular to the bottom surface are provided in the cold plate cavity (33); the heat sink cold plate (3) forms a clearance fit structure with the groove (25) on the bottom surface of the heat sink cover plate (2) through the cold plate positioning rib (32) arranged around the cold plate cavity (33); the heat sink cold plate (3) is pressed onto the chip; The radiator cover plate (2) has a cover plate through hole (22) on its cover plate body (21) that communicates with the radiator joint (1); the radiator cover plate (2) forms a sealed connection with the radiator cold plate (3) and forms a heat exchange cavity with the cold plate cavity (33). The radiator connector (1) is connected to the radiator cover plate (2) to form a flow channel through which the cooling working fluid flows into the heat exchange chamber from one side of the radiator connector (1) and then exits from the other side of the radiator connector (1).

2. The chip heat sink structure according to claim 1, characterized in that, When the radiator connector (1) is connected to the radiator cover plate (2) by welding, it includes: an inlet connector (11), a connector bottom surface (12) and a connector channel (13); the inlet connector (11) is used to connect to external pipelines; the connector channel (13) is connected to the cover plate through hole (22), and the cover plate through hole (22) is a gradually expanding hole structure; When the radiator connector (1) is threadedly connected to the radiator cover plate (2), the through hole (22) of the cover plate is a threaded hole.

3. The chip heat sink structure according to claim 1, characterized in that, The cold plate positioning rib (32) is fitted into the groove (25) on the bottom surface of the cover plate; the height dimension of the cold plate positioning rib (32) is smaller than the depth dimension of the groove (25) on the bottom surface of the cover plate.

4. The chip heat sink structure according to claim 1, characterized in that, The cold plate cavity (33) is provided with a cavity transition structure (331) and a cavity bottom surface (332) below the cover plate through hole (22) so that the cooling working fluid flows smoothly and evenly into the cold plate cavity (33).

5. A chip heat sink structure according to claim 1, characterized in that, The microstructure ribs (34) are shaped as one or more of the following: rectangular cross-section prism, rectangular cross-section cone, rectangular cross-section frustum, trapezoidal prism, trapezoidal cone, trapezoidal frustum, parallelogram prism, parallelogram cone, parallelogram frustum, triangular prism, triangular cone, triangular frustum, circular prism, circular cone, circular frustum, elliptical prism, elliptical cone, elliptical frustum, hemispherical or umbrella-shaped; the microstructure ribs (34) are arranged in a straight line or an alternating arrangement.

6. A chip heat sink structure according to claim 5, characterized in that, When the microstructure rib (34) is umbrella-shaped, it includes a root and a head arranged from the inside to the outside on the bottom surface (332) of the concave cavity; Wherein, the root and the head structures may be the same or different, and are selected from one or more of the following shapes: rectangular cross-section prism, rectangular cross-section cone, rectangular cross-section frustum, trapezoidal prism, trapezoidal cone, trapezoidal frustum, parallelogram prism, parallelogram cone, parallelogram frustum, triangular prism, triangular cone, triangular frustum, circular prism, circular cone, circular frustum, elliptical prism, elliptical cone, elliptical frustum, and hemispherical shape.

7. A chip heat sink structure according to claim 6, characterized in that, The circumcenters of the horizontal projection contours of the root and the head coincide or are misaligned. The radius of the circumcircle of the horizontal projection contour of the root is denoted as R1, and the radius of the circumcircle of the horizontal projection contour of the head is denoted as R2. The ratio of R1 to R2 is 0.1 to 10. When the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2.

8. A chip heat sink structure according to claim 6, characterized in that, When the microstructure rib (34) is umbrella-shaped, the root periphery of the microstructure rib (34) is provided with a gap capillary structure (343).

9. A chip heat sink structure according to claim 1, characterized in that, The microstructure rib (34) is a solid rib covered with rib capillary structure (342), and the thickness of the rib capillary structure (342) accounts for 0%~100% of the total thickness of the microstructure rib (34); the bottom surface of the cavity (332) is covered with bottom surface capillary structure (341).

10. A chip heat sink structure according to claim 1, characterized in that, The heat sink cold plate (3) is provided with cold plate mounting holes (35) and is pressed onto the chip through a connecting structure (4); The connection structure (4) includes: a connecting screw (41), a preload spring (42) and a connecting nut (43). The preload spring (42) is sleeved inside the connecting screw (41). The connecting screw (41) passes through the cold plate mounting hole (35) and the chip mounting surface. The connecting nut (43) is screwed into the end of the connecting screw (41) to achieve connection and fixation.

Images