Reinforcing plate and semiconductor packaging structure
By setting a resistance reinforcement zone at the corner of the reinforcing plate, the problem of adhesive degradation and delamination in semiconductor packaging is solved, improving the reliability and mechanical stability of the packaging structure and extending its service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU TF AMD SEMICON CO LTD
- Filing Date
- 2025-04-14
- Publication Date
- 2026-05-22
AI Technical Summary
In semiconductor packaging, the mismatch in the coefficients of thermal expansion between the substrate, adhesive, and reinforcing plate materials can lead to adhesive degradation and delamination at corners, affecting the mechanical stability and reliability of the package.
A resistance enhancement zone is set at the corner of the reinforcing plate. The complexity of the glue flow path is increased by designing a stepped surface and a roughened surface, which reduces the fluidity of the glue and prevents the glue from shrinking into the inside of the reinforcing plate.
It effectively improves the problem of adhesive degradation and delamination at corners, enhances the reliability of the encapsulation structure and the filling state of the adhesive, and strengthens the mechanical stability and service life of the product.
Smart Images
Figure CN224267274U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor packaging technology, and more specifically, to a reinforcing plate and a semiconductor packaging structure. Background Technology
[0002] In modern electronic devices, semiconductor packaging technology is crucial for ensuring chip performance, reliability, and lifespan. With the increasing complexity and operating frequency of integrated circuits, higher demands are placed on the mechanical stability and thermal management of the packaging structure. Stiffeners, as a common reinforcement structure, are widely used in various packaging designs to improve the overall rigidity, heat dissipation, and electromagnetic shielding effectiveness of the package.
[0003] However, in practical applications, due to the mismatch in the coefficients of thermal expansion (CTE) between the substrate, adhesive, and reinforcing plate materials, adhesive degradation often occurs at the four corners of the reinforcing plate when subjected to high and low temperature shocks. This degradation not only affects the overall mechanical stability of the package but may also lead to adhesive delamination, thereby reducing product reliability. Summary of the Invention
[0004] This application provides at least one reinforcing plate and semiconductor packaging structure. The reinforcing plate can effectively reduce the flowability of adhesive at corners, thereby improving the problem of adhesive degradation and delamination at corners and improving product reliability.
[0005] In a first aspect, embodiments of this application provide a reinforcing plate applied to a semiconductor packaging structure. The semiconductor packaging structure includes a substrate and a chip. The chip is disposed on the surface of the substrate and electrically connected to the substrate. The reinforcing plate is attached to the substrate and surrounds the chip by adhesive. The reinforcing plate includes a mounting surface attached to the substrate, and a resistance reinforcement area is provided at the corner of the mounting surface to prevent the adhesive from shrinking inward toward the reinforcing plate.
[0006] In one alternative embodiment, there is a height difference between the resistance reinforcement area and the remaining positions of the mounting surface, such that the thickness of the adhesive between the resistance reinforcement area and the substrate is greater than the thickness of the adhesive between the remaining positions of the mounting surface and the substrate.
[0007] In one alternative embodiment, the resistance enhancement zone is a stepped surface that gradually deviates from the substrate from the inside out.
[0008] In one alternative implementation, the number of steps in the resistance enhancement zone is not less than three.
[0009] In one alternative embodiment, the stepped structure includes transverse steps and longitudinal steps, which are symmetrically arranged relative to the diagonal of the reinforcing plate.
[0010] In one alternative embodiment, the extension direction of the transverse step is consistent with the length direction of the reinforcing plate, and the extension direction of the longitudinal step is consistent with the width direction of the reinforcing plate.
[0011] In one alternative embodiment, the stepped structure is formed by a rectangular notch provided on the mounting surface.
[0012] In one alternative embodiment, the resistance-enhancing region has a roughened surface.
[0013] Secondly, embodiments of this application also provide a semiconductor packaging structure, including the reinforcing plate described in any of the first aspects.
[0014] The above-mentioned technical solution of this application has the following beneficial technical effects:
[0015] The reinforcing plate of this application embodiment has a resistance reinforcement zone at the corner. This resistance reinforcement zone can reduce the flowability of the adhesive at the corner, so that it will not shrink inward after being subjected to high and low temperature impacts, and can still maintain a good filling state. This can improve the problem of adhesive degradation and delamination at the corner and improve the reliability of the product.
[0016] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments consistent with this application and, together with the specification, serve to explain the technical solutions of this application. It should be understood that the following drawings only show some embodiments of this application and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.
[0018] Figure 1 This illustration shows a structural schematic diagram of a reinforcing plate provided in an embodiment of this application;
[0019] Figure 2 It shows Figure 1 The bottom view of the provided reinforcing plate;
[0020] Figure 3It shows Figure 1 Side view of the provided reinforcing plate;
[0021] Figure 4 It shows Figure 1 A sectional view of the provided reinforcing plate in the AA direction;
[0022] Figure 5 It shows Figure 1 A schematic diagram of the reinforcement plate's packaging is provided.
[0023] Figure 6 The stress state diagram of the encapsulating adhesive of the existing reinforcing plate is shown;
[0024] Figure 7 It shows Figure 1 Stress state diagram of the encapsulating adhesive for the provided reinforcing plate;
[0025] In the diagram, 100 is the reinforcing plate; 101 is the mounting surface; 110 is the resistance enhancement area; 111 is the transverse step; 112 is the longitudinal step; 200 is the substrate; 300 is the chip; and 400 is the adhesive. Detailed Implementation
[0026] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the present application.
[0027] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0028] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0029] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0030] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0031] refer to Figures 1 to 5 This application provides a semiconductor packaging structure including a substrate 200, a chip 300, and a reinforcing plate 100. The chip 300 is disposed on the surface of the substrate 200 and electrically connected to the substrate 200. The reinforcing plate 100 is attached to the substrate 200 and surrounds the chip 300 using adhesive 400. In a specific implementation, the pins on the surface of the substrate 200 can realize the electrical connection between the chip 300 and the outside. The reinforcing plate 100 is used to improve the overall rigidity, heat dissipation performance, and electromagnetic shielding effect of the package.
[0032] The reinforcing plate 100 provided in this embodiment includes a mounting surface 101 attached to a substrate 200. A resistance reinforcement region 110 is provided at the corner of the mounting surface 101 to prevent the adhesive 400 from shrinking inwards towards the reinforcing plate 100. In specific implementations, the resistance reinforcement region 110 can reduce the flowability of the adhesive 400, preventing it from shrinking inwards towards the reinforcing plate 100 after being subjected to high and low temperature shocks, thus maintaining a good filling state. This improves the problem of adhesive 400 degradation and delamination at the corner, enhancing product reliability.
[0033] Optionally, in this embodiment, there is a height difference between the resistance reinforcement area 110 and the remaining positions of the mounting surface 101, so that the thickness of the adhesive 400 between the resistance reinforcement area 110 and the substrate 200 is greater than the thickness of the adhesive 400 between the remaining positions of the mounting surface 101 and the substrate 200. That is, the distance between the resistance reinforcement area 110 and the substrate 200 is greater than the distance between the remaining positions of the mounting surface 101 and the substrate 200, thus increasing the thickness of the adhesive 400 between the resistance reinforcement area 110 and the substrate 200. In a specific implementation, the interface between the resistance reinforcement area 110 and the remaining positions of the mounting surface 101 will hinder the increase in the thickness of the adhesive 400, preventing it from shrinking inwards towards the reinforcing plate 100, thereby enabling the resistance reinforcement area 110 to reduce the flowability of the adhesive 400.
[0034] It is possible to provide a notch at the corner of the mounting surface 101 so that there is a height difference between the resistance reinforcement area 110 and the rest of the mounting surface 101.
[0035] Alternatively, additional layers or thickening can be provided at other locations on the mounting surface 101 to create a height difference between the resistance reinforcement area 110 and the other locations on the mounting surface 101.
[0036] Optionally, in this embodiment, the resistance-enhancing region 110 is a stepped surface that gradually deviates from the substrate 200 from the inside out. This configuration increases the complexity of the adhesive 400's flow path, increasing its flow resistance and further reducing the fluidity of the adhesive 400. Figure 6 and Figure 7 As shown, the stress of the adhesive 400 at the corner of the traditional reinforcing plate 100 is relatively large, while the stress of the adhesive 400 at the corner of the reinforcing plate 100 in this embodiment is relatively small, even reduced by 88%.
[0037] Optionally, in this embodiment, the resistance enhancement zone 110 has at least three steps. It should be understood that as the number of steps increases, the complexity of the flow path of the adhesive 400 will further increase, thereby further increasing the flow resistance of the adhesive 400 and reducing its fluidity.
[0038] Optionally, in this embodiment, the resistance reinforcement zone 110 includes a transverse step 111 and a longitudinal step 112, which are symmetrically arranged relative to the diagonal of the reinforcing plate 100. That is, the steps of the stepped surface are bent along the diagonal of the reinforcing plate 100 to form the transverse step 111 and the longitudinal step 112. This arrangement increases the complexity of the adhesive 400's flow path while also dispersing stress, reducing local stress concentration, and helping to delay the degradation of the adhesive 400 and extend its service life.
[0039] Optionally, in this embodiment, the extension direction of the transverse step 111 is consistent with the length direction of the reinforcing plate 100, and the extension direction of the longitudinal step 112 is consistent with the width direction of the reinforcing plate 100.
[0040] Optionally, in this embodiment, the stepped structure can be formed by rectangular notches provided on the mounting surface 101. For example, multiple rectangular notches can be sequentially provided at the corners of the mounting surface 101, with the adjacent two sides of the multiple rectangular notches aligned with the adjacent two sides of the reinforcing plate 100. Furthermore, the depth of the multiple rectangular notches gradually decreases while the length gradually increases, thus forming a transverse step 111 and a longitudinal step 112, and the method is relatively simple.
[0041] Optionally, in this embodiment, the resistance reinforcement region 110 has a roughened surface. That is, the surface of the resistance reinforcement region 110 is a rough surface. In specific implementations, this roughened surface can be formed by mechanical polishing, chemical etching, or laser roughening. This configuration can form a tiny uneven structure on the surface of the resistance reinforcement region 110, increasing the actual contact area and frictional resistance with the adhesive 400, reducing the risk of the adhesive 400 degrading inwards towards the reinforcing plate 100 after being subjected to high and low temperature shocks, and ensuring the integrity of the encapsulation structure.
[0042] The reinforcing plate 100 of this application embodiment has a resistance reinforcement zone 110 at its corner. The resistance reinforcement zone 110 can reduce the flowability of the adhesive 400 at the corner, so that it will not shrink inward after being subjected to high and low temperature impacts, and can still maintain a good filling state. This can improve the problem of degradation and delamination of the adhesive 400 at the corner and improve the reliability of the product.
[0043] One or more embodiments in this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this specification should be included within the protection scope of this application.
[0044] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A reinforcing plate applied to a semiconductor packaging structure, the semiconductor packaging structure including a substrate and a chip, the chip being disposed on the surface of the substrate and electrically connected to the substrate, the reinforcing plate being attached to the substrate by adhesive and surrounding the chip, characterized in that... The reinforcing plate includes a mounting surface that is attached to the substrate, and a resistance reinforcement zone is provided at the corner of the mounting surface to prevent the adhesive from shrinking inward toward the reinforcing plate.
2. The reinforcing plate according to claim 1, characterized in that, There is a height difference between the resistance reinforcement area and the rest of the mounting surface, so that the thickness of the adhesive between the resistance reinforcement area and the substrate is greater than the thickness of the adhesive between the rest of the mounting surface and the substrate.
3. The reinforcing plate according to claim 2, characterized in that, The resistance enhancement zone is a stepped surface that gradually deviates from the substrate from the inside out.
4. The reinforcing plate according to claim 3, characterized in that, The number of steps in the resistance enhancement zone shall not be less than three.
5. The reinforcing plate according to claim 3, characterized in that, The resistance enhancement zone includes a transverse step and a longitudinal step, which are symmetrically arranged with respect to the diagonal of the reinforcing plate.
6. The reinforcing plate according to claim 5, characterized in that, The extension direction of the transverse step is consistent with the length direction of the reinforcing plate, and the extension direction of the longitudinal step is consistent with the width direction of the reinforcing plate.
7. The reinforcing plate according to claim 5, characterized in that, The resistance enhancement zone is formed by a rectangular notch provided on the mounting surface.
8. The reinforcing plate according to claim 1, characterized in that, The resistance-enhancing region has a roughened surface.
9. A semiconductor packaging structure, characterized in that, Includes the reinforcing plate as described in any one of claims 1-8.