An adjustable temperature experimental device based on a semiconductor refrigeration chip

Abstract

This invention provides an adjustable temperature experimental device based on a thermoelectric cooler, comprising: an experimental chamber body, an animal placement plate, a control component, a first power supply, a thermoelectric cooler, and a heat sink. The experimental chamber body has a first receiving cavity with a vertically upward-opening cavity for containing liquid, and the heat sink is immersed in the liquid. The animal placement plate is fitted onto the thermoelectric cooler. The thermoelectric cooler is positioned above and connected to the heat sink. The control component is mounted on the experimental chamber body and connected to both the first power supply and the thermoelectric cooler. The first power supply supplies power to the control component, and the control component changes the current supplied to the thermoelectric cooler, thereby changing the temperature of the animal placement plate. Since the thermoelectric cooler does not generate any noise during cooling or heating, it does not interfere with the recording of ultrasonic waves in the soundproof chamber. Therefore, it can reduce the error of the recorded ultrasonic waves and improve the accuracy of the experimental results.

Description

Technical Field

[0001] This utility model relates to the field of experimental equipment technology, and in particular to an adjustable temperature experimental device based on a semiconductor refrigeration chip. Background Technology

[0002] In biological experiments, the animals to be studied are usually placed in animal test chambers. For example, to monitor the response of newborn animals to temperature changes, the newborn animals can be placed in an animal test chamber, which is then placed in a soundproof box for recording ultrasound waves. The ultrasound waves emitted by the newborn animals when the temperature changes are recorded, and by recording the ultrasound waves emitted by the newborn animals when the temperature changes, the response of the newborn animals to temperature changes can be inferred.

[0003] Currently, refrigeration / heating devices consisting of main components such as condensers, evaporators, four-way valves, expansion valves, and compressors can be used for cooling or heating. However, the compressor generates noise during operation, and the fans or water-cooling methods used in related technologies also generate noise during heat dissipation. This noise can affect animal behavior, causing the animal to produce ultrasound waves under different behaviors. These ultrasound waves produced by the animal under different behaviors can interfere with the ultrasound waves emitted when the temperature changes, resulting in errors in the recording of the ultrasound waves emitted by the animal when the temperature changes, and thus making the experimental results inaccurate. Utility Model Content

[0004] The purpose of this invention is to provide an adjustable temperature experimental device based on a semiconductor refrigeration chip, so as to reduce noise interference on the ultrasonic waves emitted when the temperature changes, reduce the error in recording the ultrasonic waves, and improve the accuracy of experimental results. The specific technical solution is as follows:

[0005] This utility model provides an adjustable temperature experimental device based on a semiconductor refrigeration chip. The experimental device includes: an experimental chamber body, an animal placement plate, a control component, a first power supply, a semiconductor refrigeration chip, and a heat sink.

[0006] The experimental chamber body is provided with a first receiving cavity with a vertically upward opening; the first receiving cavity is used to contain liquid so that the heat sink is immersed in the liquid;

[0007] The animal placement plate is attached to the top of the thermoelectric cooler; the thermoelectric cooler is disposed above the heat sink, and the thermoelectric cooler is connected to the heat sink;

[0008] The control component is mounted on the experimental chamber body and is connected to the first power supply and the thermoelectric cooler, respectively, so that the first power supply supplies power to the control component and the control component changes the current supplied to the thermoelectric cooler, so that the thermoelectric cooler changes the temperature of the animal placement plate based on the change in the supply current.

[0009] Optionally, the experimental apparatus further includes: a temperature sensor; the animal placement plate has a temperature sensor placement hole;

[0010] The temperature sensor is placed in the temperature sensor placement hole;

[0011] The temperature sensor is connected to the control component so that the temperature sensor can feed back the measured temperature to the control component.

[0012] Optionally, the experimental setup may also include a switching module and a second power supply;

[0013] The control component is connected to the switching module, which is also connected to the second power supply and the thermoelectric cooler to switch the direction of the current flowing through the thermoelectric cooler under the control of the control component, thereby allowing the thermoelectric cooler to switch between cooling mode and heating mode.

[0014] Optionally, the control components include: a button module, a display, and a control board;

[0015] Both the button module and the display are connected to the control board;

[0016] The control board is also connected to the first power supply, the switching module, and the temperature sensor.

[0017] Optionally, the experimental chamber body is further provided with a second receiving cavity; the bottom of the second receiving cavity is provided with a through hole to connect the second receiving cavity with the first receiving cavity;

[0018] The second receiving cavity is used to accommodate the control component and the switching module; the through hole is used to allow the connection lines between the semiconductor cooling chip and the switching module, as well as the connection lines between the temperature sensor and the control component, to pass through.

[0019] Optionally, the length of the animal placement plate is greater than the length of the heat sink, and / or the width of the animal placement plate is greater than the width of the heat sink.

[0020] Optionally, the length, height, and width of the experimental chamber body are all less than or equal to 20cm.

[0021] Optionally, the length and width of the animal placement board are less than or equal to 15cm; the thickness is less than or equal to 0.5cm.

[0022] Optionally, the heat sink and the animal placement plate are made of copper or aluminum.

[0023] This utility model provides an adjustable temperature experimental device based on a semiconductor refrigeration chip, comprising: an experimental chamber body, an animal placement plate, a control component, a first power supply, a semiconductor refrigeration chip, and a heat sink; the experimental chamber body has a first accommodating cavity with a vertically upward opening; the first accommodating cavity is used to contain liquid so that the heat sink is immersed in the liquid; the animal placement plate is attached to the top of the semiconductor refrigeration chip; the semiconductor refrigeration chip is disposed above the heat sink and connected to the heat sink; the control component is installed on the experimental chamber body and is connected to both the first power supply and the semiconductor refrigeration chip, so that the power supply provides power to the control component, and the control component changes the current supplied to the semiconductor refrigeration chip, so that the semiconductor refrigeration chip changes the temperature of the animal placement plate based on the change in the supply current.

[0024] In this way, the temperature of the animal placement plate can be adjusted using this semiconductor thermostat, thereby achieving temperature regulation during the experiment. Since the semiconductor thermostat does not generate any noise during cooling or heating, it will not interfere with the recording of ultrasonic waves emitted by the animals in the soundproof enclosure when the temperature changes. Therefore, the error in the recorded ultrasonic waves can be reduced, thus improving the accuracy of the experimental results. Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above simultaneously. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0026] Figure 1 This is a first-view perspective perspective of an adjustable temperature experimental device based on a semiconductor refrigeration chip, according to an embodiment of the present invention.

[0027] Figure 2 This is a second perspective view of an adjustable temperature experimental device based on a semiconductor refrigeration chip, according to an embodiment of the present invention.

[0028] Figure 3 This is a front view of an adjustable temperature experimental device based on a semiconductor refrigeration chip according to an embodiment of the present invention.

[0029] Figure 4This is a top view of an adjustable temperature experimental device based on a semiconductor refrigeration chip according to an embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of the first connection method of electronic devices in an adjustable temperature experimental device based on a semiconductor refrigeration chip according to an embodiment of the present invention.

[0031] Figure 6 This is a schematic diagram of a second connection method of electronic devices in an adjustable temperature experimental device based on a semiconductor refrigeration chip, according to an embodiment of this utility model.

[0032] Figure label:

[0033] Experimental chamber body 1; animal placement plate 2; control components 3; first power supply 4; semiconductor cooling chip 5; heat sink 6; temperature sensor 7; switching module 8; second power supply 9; first receiving cavity 11; second receiving cavity 12; temperature sensor placement hole 21; button module 31; display 32; control board 33. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art based on this application are within the protection scope of the present utility model.

[0035] To address the problems existing in the prior art, this utility model provides an adjustable temperature experimental device based on a semiconductor cooling chip, which reduces noise interference with ultrasound, lowers the error in recorded ultrasound, and improves the accuracy of experimental results.

[0036] The adjustable temperature experimental device based on a semiconductor refrigeration chip according to an embodiment of this utility model will be described in detail below. See also: Figures 1-6 ,in, Figure 1 This is a first-view perspective perspective of an adjustable temperature experimental device based on a semiconductor refrigeration chip, according to an embodiment of the present invention. Figure 2 This is a second perspective view of an adjustable temperature experimental device based on a semiconductor refrigeration chip, according to an embodiment of the present invention. Figure 3 This is a front view of an adjustable temperature experimental device based on a semiconductor refrigeration chip according to an embodiment of the present invention. Figure 4 This is a top view of an adjustable temperature experimental device based on a semiconductor refrigeration chip according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the first connection method of electronic devices in an adjustable temperature experimental device based on a semiconductor refrigeration chip according to an embodiment of the present invention. Figure 6This is a schematic diagram of a second connection method of electronic devices in an adjustable temperature experimental device based on a semiconductor refrigeration chip, according to an embodiment of this utility model.

[0037] like Figures 1-5 As shown, the adjustable temperature experimental device based on a semiconductor refrigeration chip includes: an experimental chamber body 1, an animal placement plate 2, a control component 3, a power supply 4, a semiconductor refrigeration chip 5, and a heat sink 6.

[0038] The experimental chamber body 1 is provided with a first receiving cavity 11 with a vertically upward opening; the first receiving cavity 11 is used to contain liquid so that the heat sink 6 is immersed in the liquid;

[0039] The animal placement plate 2 is attached to the top of the thermoelectric cooler 5; the thermoelectric cooler 5 is placed above the heat sink 6, and the thermoelectric cooler 5 is connected to the heat sink 6.

[0040] Control component 3 is installed on the main body 1 of the experimental chamber, and, as Figure 5 As shown, the control component 3 is connected to the first power supply 4 and the thermoelectric cooler 5, respectively, so that the first power supply 4 supplies power to the control component 3, and the control component 3 changes the current supplied to the thermoelectric cooler 5, so that the thermoelectric cooler 5 changes the temperature of the animal placement plate 2 based on the change in the supply current. The first power supply 4 can be a 5V regulated power supply.

[0041] In some examples, the thermoelectric cooler 5 includes a heating surface and a cooling surface. The working principle of the thermoelectric cooler is as follows: based on the thermoelectric effect, when the semiconductor material is energized, the current flows from the N-type semiconductor (positive electrode) to the P-type semiconductor (negative electrode). Through the thermoelectric effect, the semiconductor material on one side becomes cold and the other side becomes hot. If the direction of the current is reversed, that is, the positive and negative electrodes are reversed, the hot and cold surfaces will also be reversed.

[0042] Therefore, when the thermoelectric cooling device is used for heating, the surface of the thermoelectric cooling chip 5 that is in contact with the animal placement plate 2 is the heating surface, and the surface of the thermoelectric cooling chip that is connected to the heat sink 6 is the cooling surface. At this time, the liquid in the first receiving cavity 11 can be water, and the temperature of the water can be the same as or similar to the temperature in the laboratory.

[0043] When the thermoelectric cooling-based adjustable temperature experimental device is used for cooling, the surface of the thermoelectric cooling chip 5 that is in contact with the animal placement plate 2 is the cooling surface, and the surface of the thermoelectric cooling chip 5 that is connected to the heat sink 6 is the heating surface. At this time, the liquid in the first receiving cavity 11 can be water for cooling, and the temperature of the water can be lower than the temperature in the laboratory. For example, it can be water with a lower temperature.

[0044] In addition, by placing the thermoelectric cooler 5 above the heat sink 6 and connecting the thermoelectric cooler 5 to the heat sink 6, the thermoelectric cooler 5 will not be immersed in the liquid when the heat sink 6 is immersed in the liquid, thus preventing the thermoelectric cooler 5 from being damaged by immersion in the liquid.

[0045] In some examples, since both copper and aluminum tubes have good thermal conductivity, the thermoelectric cooler 5 and the heat sink 6 can be connected by copper or aluminum tubes to achieve rapid heat conduction between the thermoelectric cooler 5 and the heat sink 6.

[0046] In some other examples, thermally conductive silicone can be used to connect the aforementioned semiconductor cooling chip 5 to the animal placement plate 2.

[0047] The adjustable temperature experimental device based on a semiconductor thermoelectric cooler according to this invention eliminates the need for conventional refrigeration / heating devices consisting of condensers, evaporators, four-way valves, throttle valves, and compressors. Instead, the semiconductor thermoelectric cooler can be used to adjust the temperature of the animal placement plate under the control of the control components, thereby achieving temperature regulation during the experiment. Since the semiconductor thermoelectric cooler does not generate any noise during refrigeration or heating, it will not interfere with the recording of ultrasonic waves emitted by the animals in the soundproof box when the temperature changes. Therefore, the error of the recorded ultrasonic waves can be reduced, thereby improving the accuracy of the experimental results.

[0048] Furthermore, compared to the various expensive compressors, condensers, and evaporators required in existing refrigeration / heating devices, the overall cost of the semiconductor refrigeration chip and heat sink used in this embodiment is very low, which can significantly save costs. Moreover, since it does not require the use of complex compressors, condensers, and evaporators, the size of the thermoelectric refrigeration chip-based adjustable temperature experimental device can be small enough to be easily accommodated in small spaces such as soundproof boxes.

[0049] In some examples, the experimental setup also includes: a temperature sensor 7; correspondingly, such as Figures 1-4 As shown, the animal placement plate 2 has a temperature sensor placement hole 21; the temperature sensor 7 is placed in the temperature sensor placement hole 21.

[0050] like Figure 6 As shown, the temperature sensor 7 is connected to the control component 3 so that the temperature sensor 7 can feed back the measured temperature to the control component 3. The temperature sensor 7 can be a PT100 type temperature sensor.

[0051] The control component 3 can be a component in the prior art. The control program of the control component 3 for the semiconductor cooling chip adopts the control program in the prior art, which will not be described in detail here.

[0052] In some examples, such as Figure 6 As shown, the experimental apparatus also includes a switching module 8 and a second power supply 9. In this case, the control component 3 is connected to the switching module 8, which is also connected to the second power supply 9 and the thermoelectric cooler 5. Under the control of the control component 3, the switching module 8 switches the direction of the current flowing through the thermoelectric cooler 5, thereby switching the thermoelectric cooler between cooling and heating modes. The second power supply 9 can be a 12V regulated power supply, and the switching module can be an L298N type switching module. Through this L298N type switching module, bidirectional temperature control for both cooling and heating can be achieved using the same experimental apparatus.

[0053] In some examples, such as Figure 6 As shown, the control component 3 includes: a button module 31, a display 32, and a control board 33; the button module 31 and the display 32 are both connected to the control board 33; the control board 33 is also connected to the first power supply 4, the switching module 8, and the temperature sensor 7.

[0054] The button module 31 can be a conventional button module, which may include four buttons, such as a power button, a setting button, a temperature increment button, and a temperature decrement button. The power button is used to control the entire adjustable temperature experimental device based on a semiconductor refrigeration chip to turn on or off. The setting button is used to set the working mode, which includes three modes: heating mode, cooling mode, and automatic mode. The temperature increment and temperature decrement buttons are used to set the desired temperature value.

[0055] The display 32 is a liquid crystal display, for example, an LCD1602 type liquid crystal display, which can be used to display various temperature data in real time, including the current set temperature, the current real-time temperature fed back by the temperature sensor, and the current working mode. The heating mode is displayed as H, the cooling mode is displayed as C, and the automatic mode is displayed as A.

[0056] The aforementioned control board 33 is a programmable development board used to achieve automatic temperature control. This allows the development board to control the heating and cooling functions of the thermoelectric cooler based on commands input from the button module, and simultaneously control the display 32 to show various temperature data in real time. For example, this control board can be an Arduino UNO development board, on which existing control programs can be programmed to control the heating and / or cooling functions of the thermoelectric cooler based on commands input from the button module, and to control the display 32 to show various temperature data in real time.

[0057] Understandable Figure 5 The control component 3 in the middle may also include a button module 31, a display 32, and a control board 33;

[0058] Both the button module 31 and the display 32 are connected to the control board 33; and the control board 33 is also connected to the first power supply 4 and the semiconductor cooling chip 5.

[0059] In some examples, such as Figures 1-4 As shown, the experimental chamber body 1 is also provided with a second receiving cavity 12; the bottom of the second receiving cavity 12 is provided with a through hole to connect the second receiving cavity 12 with the first receiving cavity 11. The opening direction of the second receiving cavity 12 can be the same as or different from the opening direction of the first receiving cavity 11. A partition plate with a certain thickness is provided between the two receiving cavities, and the aforementioned through hole is provided on the partition plate at the bottom of the second receiving cavity 12.

[0060] The second receiving cavity 12 is used to receive the control component 3 and the switching module 8; the through hole is used to allow the connection lines between the semiconductor cooling chip 5 and the switching module 8, as well as the connection lines between the temperature sensor 7 and the control component 3, to pass through.

[0061] By setting up a second receiving cavity and placing the control component 3 and the switching module 8 in the second receiving cavity, the adjustable temperature experimental device based on a semiconductor refrigeration chip can be easily transported.

[0062] In some examples, the length of the animal placement plate 2 is greater than the length of the heat sink 6, and / or the width of the animal placement plate 2 is greater than the width of the heat sink 6.

[0063] In some other examples, the length, height, and width of the experimental box body 1 are all less than or equal to 20cm.

[0064] In some other examples, the length and width of the animal placement board 2 are less than or equal to 15 cm; and the thickness is less than or equal to 0.5 cm.

[0065] In some other examples, the heat sink 6 and the animal placement plate 2 are made of copper or aluminum.

[0066] When conducting the experiment, the animal to be studied (e.g., a mouse) can be placed on the animal placement plate first. Then, tap water can be filled into the experimental chamber, and the heat sink can be immersed in the tap water. Note that the water level should not exceed the highest point of the heat sink to avoid the tap water hitting the thermoelectric cooler and damaging it. Then, the temperature sensor can be inserted into the temperature sensor placement hole of the animal placement plate of the device. Finally, the adjustable temperature experimental device based on the thermoelectric cooler provided in this embodiment of the present invention can be used to conduct the experiment. That is, the thermoelectric cooler can be controlled to cool and / or heat through the control components.

[0067] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model are included within the scope of protection of this utility model.

Claims

1. An adjustable temperature experimental device based on a semiconductor refrigeration chip, characterized in that, The experimental apparatus includes: an experimental chamber body (1), an animal placement plate (2), a control component (3), a first power supply (4), a semiconductor cooling chip (5), and a heat sink (6). The experimental chamber body (1) is provided with a first receiving cavity (11) with a vertically upward opening; the first receiving cavity (11) is used to contain liquid so that the heat sink (6) is immersed in the liquid; The animal placement plate (2) is attached to the upper part of the semiconductor cooling chip (5); the semiconductor cooling chip (5) is disposed above the heat sink (6), and the semiconductor cooling chip (5) is connected to the heat sink (6); The control component (3) is installed on the experimental box body (1), and the control component (3) is connected to the first power supply (4) and the semiconductor cooling chip (5) respectively, so that the first power supply (4) supplies power to the control component (3), and the control component (3) changes the current supplied to the semiconductor cooling chip (5), so that the semiconductor cooling chip (5) changes the temperature of the animal placement plate (2) based on the change of the supply current.

2. The adjustable temperature experimental device based on a semiconductor refrigeration chip according to claim 1, characterized in that, The experimental apparatus also includes: a temperature sensor (7); the animal placement plate (2) has a temperature sensor placement hole (21); The temperature sensor (7) is placed in the temperature sensor placement hole (21); The temperature sensor (7) is connected to the control component (3) so that the temperature sensor (7) can feed back the measured temperature to the control component (3).

3. The adjustable temperature experimental device based on a semiconductor refrigeration chip according to claim 2, characterized in that, The experimental device also includes a switching module (8) and a second power supply (9). The control component (3) is connected to the switching module (8), which is also connected to the second power supply (9) and the thermoelectric cooler (5) to switch the direction of the current flowing through the thermoelectric cooler (5) under the control of the control component (3), thereby allowing the thermoelectric cooler to switch between cooling mode and heating mode.

4. The adjustable temperature experimental device based on a semiconductor refrigeration chip according to claim 3, characterized in that, The control component (3) includes: a button module (31), a display (32), and a control board (33); Both the button module (31) and the display (32) are connected to the control board (33); The control board (33) is also connected to the first power supply (4), the switching module (8), and the temperature sensor (7).

5. The adjustable temperature experimental apparatus based on a semiconductor refrigeration chip according to any one of claims 3 to 4, characterized in that, The experimental box body (1) is also provided with a second receiving cavity (12); the bottom of the second receiving cavity (12) is provided with a through hole to connect the second receiving cavity (12) with the first receiving cavity (11); The second receiving cavity (12) is used to receive the control component (3) and the switching module (8); the through hole is used to allow the connection line between the semiconductor cooling chip (5) and the switching module (8) and the connection line between the temperature sensor (7) and the control component (3) to pass through.

6. The adjustable temperature experimental device based on a semiconductor refrigeration chip according to claim 1, characterized in that, The length of the animal placement plate (2) is greater than the length of the heat sink (6), and / or the width of the animal placement plate (2) is greater than the width of the heat sink (6).

7. The adjustable temperature experimental device based on a semiconductor refrigeration chip according to claim 1, characterized in that, The length, height and width of the experimental box body (1) are all less than or equal to 20cm.

8. The adjustable temperature experimental device based on a semiconductor refrigeration chip according to claim 1, characterized in that, The length and width of the animal placement board (2) are less than or equal to 15cm; the thickness is less than or equal to 0.5cm.

9. The adjustable temperature experimental device based on a semiconductor refrigeration chip according to claim 1, characterized in that, The heat sink (6) and the animal placement plate (2) are made of copper or aluminum.

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