A wafer fixing mechanism for wafer laser cutting

Abstract

This utility model discloses a wafer fixing mechanism for wafer laser cutting, relating to the field of wafer processing technology. This wafer fixing mechanism, through the movable design of the clamping plate, can be flexibly adjusted according to the size of the wafer. Whether it is a small-sized chip wafer or a large-sized wafer substrate, it can achieve precise fixing, effectively solving the problem that traditional fixing methods are difficult to adapt to various wafer sizes. Through the precise cooperation of gears, gear rings, and limiting teeth, it ensures high stability during wafer fixing and rotation, avoiding cutting deviations caused by wafer displacement, significantly improving the accuracy and yield of wafer cutting. Furthermore, the wafer can be adjusted at multiple angles while fixed, meeting the diverse requirements of different cutting processes for wafer angles, greatly improving the versatility and applicability of the equipment.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, specifically a wafer fixing mechanism for wafer laser cutting. Background Technology

[0002] In the semiconductor manufacturing industry, wafer dicing is a crucial step in the chip production process. As chip integration continues to increase and dimensions continue to shrink, the requirements for the precision and stability of wafer dicing become increasingly stringent. Existing wafer fixing mechanisms have fixed positions, and when dicing at different locations on the wafer, the dicing position cannot be quickly adjusted. It is necessary to remove the wafer from the mechanism surface, adjust the wafer position, and then fix it again for dicing. This results in low dicing efficiency and makes it difficult to meet the requirements of complex chip dicing processes. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a wafer fixing mechanism for wafer laser cutting, thereby solving the problems mentioned in the background section.

[0004] Existing wafer fixing mechanisms have fixed positions. When cutting wafers at different locations, the cutting position of the wafer cannot be quickly adjusted. The wafer needs to be removed from the surface of the mechanism, the position of the wafer needs to be adjusted, and then it needs to be fixed and cut again. The cutting efficiency is low and it is difficult to meet the requirements of complex chip cutting processes.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A wafer fixing mechanism for laser wafer cutting includes a mounting box, a connecting cylinder rotatably connected to the top of the mounting box, a first fixing cylinder fixedly connected to the top of the connecting cylinder, a placement tray fixedly connected to the top of the first fixing cylinder, a placement groove formed on the top of the placement tray, a clamping plate slidably connected inside the placement groove, a gear ring fixedly connected inside the connecting cylinder, a fixing plate fixedly connected inside the mounting box, and a third gear rotatably connected to the top of the fixing plate, one side of the third gear meshing with the gear ring.

[0007] Preferably, the fixed plate is rotatably connected to a rotating shaft inside, a second fixed cylinder is fixedly connected to the outside of the rotating shaft, a support plate is rotatably connected to the outside of the second fixed cylinder, a first movable plate is slidably connected to the outside of the rotating shaft, and a connecting rod is fixedly connected between the bottom of the first movable plate and the support plate.

[0008] Preferably, a third fixed cylinder is rotatably connected inside the fixed plate, and a first gear is fixedly connected to the outside of the third fixed cylinder, with one side of the first gear meshing with the third gear.

[0009] Preferably, a fourth limiting plate is fixedly connected to the bottom of the third fixed cylinder, and a third limiting plate is fixedly connected to the top of the second fixed cylinder, and the third limiting plate and the fourth limiting plate are used in conjunction.

[0010] Preferably, a connecting plate is fixedly connected inside the first fixed cylinder, a second gear is rotatably connected to the bottom of the connecting plate, an arc-shaped groove is opened on the top of the second gear, and a connecting column is slidably connected inside the arc-shaped groove.

[0011] Preferably, a second movable plate is slidably connected inside the connecting plate, one end of the connecting column is fixedly connected to the second movable plate, and one side of the second movable plate is fixedly connected to the clamping plate.

[0012] Preferably, a fifth limiting plate is fixedly connected to one side of the second gear, a sixth limiting plate is fixedly connected to the other side of the second gear, a second limiting plate is fixedly connected to the top of the rotating shaft, a first limiting plate is fixedly connected to the top of the first moving plate, the second limiting plate and the sixth limiting plate are used in conjunction, and the first limiting plate and the fifth limiting plate are used in conjunction.

[0013] Preferably, a fixing frame is slidably connected inside the fixing plate, a motor is fixedly connected to the bottom of the fixing frame, the bottom of the rotating shaft passes through one side of the fixing frame and is fixedly connected to the output end of the motor, and a cylinder is fixedly connected inside the mounting box, with the output end of the cylinder fixedly connected to the fixing frame.

[0014] This invention provides a wafer fixing mechanism for wafer laser cutting. Compared with the prior art, it has the following advantages:

[0015] 1. This wafer fixing mechanism for laser wafer cutting, through the movable design of the clamping plate, can be flexibly adjusted according to the size of the wafer. Whether it is a small chip wafer or a large wafer substrate, it can achieve precise fixing, effectively solving the problem that traditional fixing methods are difficult to adapt to various wafer sizes.

[0016] 2. The wafer fixing mechanism for wafer laser cutting ensures high stability during wafer fixing and rotation through the precise coordination of gears, gear rings, and limiting teeth. This avoids cutting deviations caused by wafer displacement, significantly improving the precision and yield of wafer cutting. Furthermore, the wafer can be adjusted at multiple angles while fixed, meeting the diverse requirements of different cutting processes for wafer angles, greatly improving the versatility and applicability of the equipment. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2This is a schematic diagram of the internal structure of the present invention;

[0019] Figure 3 This is a schematic diagram of the internal structure of the mounting box of this utility model;

[0020] Figure 4 This is a schematic diagram of the rotating shaft structure of this utility model;

[0021] Figure 5 This is a schematic diagram of the second gear structure of this utility model;

[0022] Figure 6 This utility model Figure 5 A magnified structural diagram of part A in the middle section.

[0023] In the diagram: 1. Mounting box; 2. Connecting cylinder; 3. First fixed cylinder; 4. Placement tray; 5. Placement groove; 6. Clamping plate; 7. Fixing plate; 8. Fixing frame; 9. Cylinder; 10. Motor; 11. Rotating shaft; 12. Second fixed cylinder; 13. Support plate; 14. Connecting rod; 15. First moving plate; 16. First limiting plate; 17. Second limiting plate; 18. First gear; 19. Third limiting plate; 20. Fourth limiting plate; 21. Gear ring; 22. Second gear; 23. Connecting plate; 24. Arc groove; 25. Third gear; 26. Fifth limiting plate; 27. Connecting column; 28. Second moving plate; 29. ​​Sixth limiting plate; 30. Third fixed cylinder. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figures 1 to 6This utility model provides a technical solution: a wafer fixing mechanism for wafer laser cutting, including a mounting box 1, a connecting cylinder 2 rotatably connected to the top of the mounting box 1, the connecting cylinder 2 rotating along the top of the mounting box 1, a first fixing cylinder 3 fixedly connected to the top of the connecting cylinder 2, the connecting cylinder 2 rotating and causing the first fixing cylinder 3 to rotate, a placement tray 4 fixedly connected to the top of the first fixing cylinder 3, the first fixing cylinder 3 rotating and causing the placement tray 4 to rotate, a placement groove 5 opened on the top of the placement tray 4, wafers are placed in the placement groove 5, a clamping plate 6 is slidably connected inside the placement groove 5, the clamping plate 6 moves to fix the wafers, a toothed ring 21 is fixedly connected inside the connecting cylinder 2, the toothed ring 21 rotating and causing the connecting cylinder 2 to rotate, a fixing plate 7 fixedly connected inside the mounting box 1, a third gear 25 rotatably connected to the top of the fixing plate 7, one side of the third gear 25 meshing with the toothed ring 21, the third gear 25 rotating and causing the toothed ring 21 to rotate.

[0026] Furthermore, a rotating shaft 11 is rotatably connected inside the fixed plate 7, and a second fixed cylinder 12 is fixedly connected to the outside of the rotating shaft 11. The rotating shaft 11 rotates, causing the second fixed cylinder 12 to rotate. A support plate 13 is rotatably connected to the outside of the second fixed cylinder 12, and the second fixed cylinder 12 rotates inside the support plate 13. A first moving plate 15 is slidably connected to the outside of the rotating shaft 11, and the first moving plate 15 moves along the outside of the rotating shaft 11. A connecting rod 14 is fixedly connected between the bottom of the first moving plate 15 and the support plate 13, and the support plate 13 moves the first moving plate 15 through the connecting rod 14.

[0027] Furthermore, a third fixed cylinder 30 is rotatably connected inside the fixed plate 7, and a first gear 18 is fixedly connected to the outside of the third fixed cylinder 30. The rotation of the third fixed cylinder 30 causes the first gear 18 to rotate. One side of the first gear 18 is meshed with the third gear 25, and the rotation of the first gear 18 causes the third gear 25 to rotate.

[0028] Furthermore, a fourth limiting plate 20 is fixedly connected to the bottom of the third fixed cylinder 30, and a third limiting plate 19 is fixedly connected to the top of the second fixed cylinder 12. The third limiting plate 19 and the fourth limiting plate 20 are used in conjunction. Both the third limiting plate 19 and the fourth limiting plate 20 have limiting teeth on one side. When the second fixed cylinder 12 brings the third limiting plate 19 close to the fourth limiting plate 20, so that the teeth on one side of the third limiting plate 19 and the fourth limiting plate 20 mesh, the rotating shaft 11 drives the first gear 18 to rotate through the second fixed cylinder 12 and the third fixed cylinder 30.

[0029] Furthermore, a connecting plate 23 is fixedly connected inside the first fixed cylinder 3. A second gear 22 is rotatably connected to the bottom of the connecting plate 23. The second gear 22 rotates along one side of the connecting plate 23. An arc-shaped groove 24 is provided on the top of the second gear 22. The rotation of the second gear 22 causes the arc-shaped groove 24 to rotate. A connecting column 27 is slidably connected inside the arc-shaped groove 24. The rotation of the arc-shaped groove 24 causes the connecting column 27 to move.

[0030] Furthermore, a second movable plate 28 is slidably connected inside the connecting plate 23. One end of the connecting post 27 is fixedly connected to the second movable plate 28, and one side of the second movable plate 28 is fixedly connected to the clamping plate 6. The connecting post 27 moves, causing the second movable plate 28 to move, and the second movable plate 28 moves, causing the clamping plate 6 to move, thereby fixing wafers of different sizes.

[0031] Furthermore, a fifth limiting plate 26 is fixedly connected to one side of the second gear 22, and a sixth limiting plate 29 is fixedly connected to the other side of the second gear 22. A second limiting plate 17 is fixedly connected to the top of the rotating shaft 11, and a first limiting plate 16 is fixedly connected to the top of the first moving plate 15. Limiting teeth are provided on one side of the fifth limiting plate 26, the sixth limiting plate 29, the first limiting plate 16, and the second limiting plate 17. The second limiting plate 17 and the sixth limiting plate 29 cooperate with each other. When the rotating shaft 11 moves away from the side of the sixth limiting plate 29 with the second limiting plate 17, the second gear 22 will not rotate. The first limiting plate 16 and the fifth limiting plate 26 cooperate with each other. The first moving plate 15 moves and moves the first limiting plate 16 closer to the fifth limiting plate 26, so that the teeth on one side of the fifth limiting plate 26 and the second limiting plate 17 mesh, thereby fixing the position of the second gear 22.

[0032] Furthermore, a fixed frame 8 is slidably connected inside the fixed plate 7, and a motor 10 is fixedly connected to the bottom of the fixed frame 8. The bottom of the rotating shaft 11 passes through one side of the fixed frame 8 and is fixedly connected to the output end of the motor 10. When the motor 10 is turned on, it drives the rotating shaft 11 to rotate. A cylinder 9 is fixedly connected inside the mounting box 1, and the output end of the cylinder 9 is fixedly connected to the fixed frame 8. When the cylinder 9 is turned on, it drives the fixed frame 8 to move, and the movement of the fixed frame 8 drives the rotating shaft 11 to move.

[0033] In use, when it is necessary to fix and cut the wafer, the wafer is placed in the placement slot 5 on the top of the placement tray 4. After ensuring that the sixth limiting plate 29 and the second limiting plate 17 are engaged, the motor 10 is turned on. The output end of the motor 10 drives the rotating shaft 11 to rotate. The rotating shaft 11 drives the second gear 22 to rotate. When the second gear 22 rotates, the arc-shaped groove 24 opened on its top rotates accordingly. The connecting column 27 in the arc-shaped groove 24 slides in the groove. The connecting column 27 drives the second moving plate 28 to move. The second moving plate 28 then drives the clamping plate 6 to move, thereby fixing wafers of different sizes. When it is necessary to adjust the cutting angle of the wafer, the cylinder 9 is started. The output end of the cylinder 9 pushes the fixing frame 8. The fixing frame 8 drives the rotating shaft 11 to move, thereby causing the second fixing cylinder 12, the first moving plate 15 and other components connected to the rotating shaft 11 to produce corresponding displacements. During this process, the second limiting plate 17 on the top of the rotating shaft 11 moves away from the side of the sixth limiting plate 29. The support plate 13 drives the first moving plate 15 to move via the connecting rod 14, causing the first limiting plate 16 to approach the fifth limiting plate 26. When the limiting teeth on one side of the two plates mesh, the position of the second gear 22 is fixed, preventing the second gear 22 from rotating. At the same time, the third limiting plate 19 approaches the fourth limiting plate 20, and the limiting teeth on one side of the two plates mesh. The rotating shaft 11 rotates, driving the first gear 18 to rotate via the second fixed cylinder 12 and the third fixed cylinder 30. Since the first gear 18 is meshed with the third gear 25, the rotation of the first gear 18 will drive the third gear 25 to rotate. The third gear 25 then meshes with the toothed ring 21 inside the connecting cylinder 2, thereby realizing the rotation of the connecting cylinder 2. The rotation of the connecting cylinder 2 sequentially drives the first fixed cylinder 3 and the placement disk 4 at the top to rotate, adjusting the angle of the wafer. Throughout the cutting process, this mechanism ensures that the wafer is always in a stable fixed state through the precise cooperation of each component, providing a reliable foundation for laser cutting.

[0034] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0035] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer fixing mechanism for wafer laser cutting, comprising a mounting box (1), characterized in that: The top of the mounting box (1) is rotatably connected to a connecting cylinder (2), the top of the connecting cylinder (2) is fixedly connected to a first fixing cylinder (3), the top of the first fixing cylinder (3) is fixedly connected to a placement plate (4), the top of the placement plate (4) is provided with a placement groove (5), the inside of the placement groove (5) is slidably connected to a clamping plate (6), the inside of the connecting cylinder (2) is fixedly connected to a gear ring (21), the inside of the mounting box (1) is fixedly connected to a fixing plate (7), the top of the fixing plate (7) is rotatably connected to a third gear (25), one side of the third gear (25) is meshed with the gear ring (21).

2. The wafer fixing mechanism for wafer laser cutting according to claim 1, characterized in that: The fixed plate (7) is rotatably connected to a rotating shaft (11), and a second fixed cylinder (12) is fixedly connected to the outside of the rotating shaft (11). A support plate (13) is rotatably connected to the outside of the second fixed cylinder (12). A first moving plate (15) is slidably connected to the outside of the rotating shaft (11). A connecting rod (14) is fixedly connected between the bottom of the first moving plate (15) and the support plate (13).

3. The wafer fixing mechanism for wafer laser cutting according to claim 2, characterized in that: The fixed plate (7) is rotatably connected to a third fixed cylinder (30), and a first gear (18) is fixedly connected to the outside of the third fixed cylinder (30). One side of the first gear (18) is meshed with the third gear (25).

4. The wafer fixing mechanism for wafer laser cutting according to claim 3, characterized in that: The bottom of the third fixed cylinder (30) is fixedly connected to the fourth limiting plate (20), and the top of the second fixed cylinder (12) is fixedly connected to the third limiting plate (19). The third limiting plate (19) and the fourth limiting plate (20) are used together.

5. A wafer fixing mechanism for wafer laser cutting according to claim 2, characterized in that: The first fixed cylinder (3) is fixedly connected to a connecting plate (23), and the bottom of the connecting plate (23) is rotatably connected to a second gear (22). The top of the second gear (22) is provided with an arc groove (24), and the inside of the arc groove (24) is slidably connected to a connecting column (27).

6. A wafer fixing mechanism for wafer laser cutting according to claim 5, characterized in that: The connecting plate (23) has a second movable plate (28) slidably connected inside. One end of the connecting column (27) is fixedly connected to the second movable plate (28), and one side of the second movable plate (28) is fixedly connected to the clamping plate (6).

7. A wafer fixing mechanism for wafer laser cutting according to claim 5, characterized in that: A fifth limiting plate (26) is fixedly connected to one side of the second gear (22), a sixth limiting plate (29) is fixedly connected to the other side of the second gear (22), a second limiting plate (17) is fixedly connected to the top of the rotating shaft (11), a first limiting plate (16) is fixedly connected to the top of the first moving plate (15), the second limiting plate (17) and the sixth limiting plate (29) are used together, and the first limiting plate (16) and the fifth limiting plate (26) are used together.

8. A wafer fixing mechanism for wafer laser cutting according to claim 7, characterized in that: The fixed plate (7) is slidably connected to a fixed frame (8), and a motor (10) is fixedly connected to the bottom of the fixed frame (8). The bottom of the rotating shaft (11) passes through one side of the fixed frame (8) and is fixedly connected to the output end of the motor (10). The mounting box (1) is fixedly connected to a cylinder (9), and the output end of the cylinder (9) is fixedly connected to the fixed frame (8).

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