A precision engraving machine for semiconductor wafers

Abstract

This application relates to the field of precision machining, and in particular to a precision engraving machine for semiconductor wafers, comprising a frame and a worktable slidably mounted on the frame, a U-axis turntable mechanism, a storage mechanism, a positioning mechanism, and a tool driving and conveying device. The U-axis turntable mechanism includes: a turntable base for placing wafers and a turntable drive component for driving the turntable base to rotate; the storage mechanism holds the wafers to be processed; the tool driving and conveying device polishes the wafers; the wafer transfer mechanism transfers the wafers from the storage mechanism to the turntable base; the positioning mechanism includes: an abutment limiting piece, which is mounted on the frame and abuts against the edge of the turntable base when the worktable moves the turntable base toward the storage mechanism. Through the high-precision rotation of the U-axis turntable and the precise positioning of the wafers, compared to existing precision engraving machines for wafers, the processing accuracy of wafers can be improved, achieving all-around fine polishing of the wafers, thereby improving the precision and quality of wafer processing.

Description

Technical Field

[0001] This application relates to the field of precision machining, and in particular to a precision engraving machine for semiconductor wafers. Background Technology

[0002] In today's era of rapid technological advancement, the semiconductor industry has become a crucial force driving global economic growth and technological progress. As various electronic devices evolve towards higher performance, miniaturization, and multifunctionality, increasingly stringent requirements are being placed on chip performance and integration. Semiconductor wafer engraving technology, as a key link in the semiconductor manufacturing process, is undeniably important. It enables various complex processes such as wafer engraving, fine grinding, and grooving, ensuring that wafers meet diverse circuit design and performance requirements, playing a vital role in improving chip quality and performance. Currently, in the field of semiconductor wafer engraving, a common practice is to employ a three-axis linkage design (X, Y, and Z). This design changes the position of the wafer to be processed, allowing it to be translated in the front-back and left-right directions. Then, a grinding device on the Z-axis is positioned above the wafer for grinding. Furthermore, many engraving machines use ordinary material racks to store raw materials and finished products to ensure orderly production. However, these existing conventional techniques have significant shortcomings. When using a three-axis (X, Y, Z) linkage design to change the position of the wafer to be processed, the cumulative error in the X and Y axis designs prevents the equipment from achieving precise grinding of the wafer from all angles. This is especially problematic when handling small wafers, where minute movements can occur during handling and processing, leading to positional deviations. For wafers requiring high-precision grinding, such errors severely impact their quality and performance, ultimately affecting the reliability and stability of the entire semiconductor device. Utility Model Content

[0003] In order to improve the precision of wafer processing and achieve all-round fine polishing of wafers, thereby improving the accuracy and quality of wafer processing, this application provides a precision engraving machine for semiconductor wafers.

[0004] A precision engraving machine for semiconductor wafers includes a frame, and further includes a component disposed on the frame:

[0005] The worktable is slidably mounted on the frame;

[0006] U-axis turntable mechanism, the U-axis turntable mechanism includes: a turntable base for placing wafers and a turntable drive for driving the turntable base to rotate, the turntable drive is mounted on the worktable;

[0007] Storage mechanism, used to hold wafers to be processed;

[0008] A tool-driven transfer device, located above the turntable base, is used for grinding the wafer;

[0009] The wafer transfer mechanism transfers the wafers from the storage mechanism to the turntable base;

[0010] A positioning mechanism is located between the storage mechanism and the worktable. The positioning mechanism includes an abutment limiting piece, which is mounted on the frame. When the worktable moves the turntable base towards the storage mechanism, the abutment limiting piece abuts against the edge of the turntable base. By adopting the above technical solution, in this semiconductor wafer engraving machine, since the worktable is slidably mounted on the frame, when the worktable moves the turntable base of the U-axis turntable mechanism towards the storage mechanism, the abutment limiting piece of the positioning mechanism is mounted on the frame and abuts against the edge of the turntable base. This design ensures that the turntable base is precisely positioned during specific movements, reducing positional deviations caused by movement. The wafer transfer mechanism transfers the wafers from the storage mechanism to the precisely positioned turntable base, ensuring the accuracy of the wafer placement. The tool-driven transfer device, located above the turntable base, grinds the wafers. Because the wafer placement is accurate, the grinding operation on the wafers can be performed more precisely. Specifically, the U-axis turntable mechanism's turntable drive can drive the turntable base to rotate. Combined with the tool drive and transfer device, this enables omnidirectional grinding of the wafer, avoiding the cumulative error problem inherent in traditional X, Y, and Z-axis three-axis linkage designs. This effectively improves the precision and accuracy of wafer processing, thereby enhancing wafer processing quality and the reliability and stability of the entire semiconductor device. Preferably, the upper surface of the abutment limiting plate extends protruding beyond the surface of the turntable base, and the wafer on the turntable base surface abuts against the abutment limiting plate. By adopting the above technical solution, with the upper surface of the abutment limiting plate extending protruding beyond the surface of the turntable base, when a wafer is placed on the turntable base surface, the wafer will inevitably abut against the abutment limiting plate. Since the abutment limiting plate is fixedly mounted on the rack, it provides a stable abutment support point for the wafer. This "dual positioning" not only enables precise positioning of the turntable base, but also effectively restricts wafer movement by abutting against the limiting plate, preventing unnecessary displacement and wobbling. This significantly improves the stability and positioning accuracy of the wafer during processing, facilitating comprehensive fine polishing and significantly enhancing the precision and quality of wafer processing. Preferably, the limiting plate includes a mounting part and abutting part, with the mounting part mounted on the frame and the abutting part having a "V" shape. By adopting the above technical solution, the abutting part of the limiting plate has a "V" shape. When the turntable base moves towards the storage mechanism on the worktable, the "V" shape provides a guiding effect, allowing the limiting plate to abut against the edge of the turntable base more smoothly. Furthermore, this "V" shape can limit the turntable base from two different directions, which, compared to ordinary planar abutment, can more accurately determine the position of the turntable base and reduce errors caused by inaccurate positioning.Meanwhile, when processing wafers placed on the turntable base, this "V"-shaped structure can more accurately position the wafer, helping to improve the positional accuracy of the wafer in each processing stage, thereby improving the overall processing accuracy and better achieving all-round fine polishing of the wafer, ultimately improving the precision and quality of wafer processing. Preferably, the angle of the "V"-shaped bend structure is 60°-150°. By adopting the above technical solution, the angle of the "V"-shaped bend structure is limited to the range of 60°-150°. When the angle is less than 60°, the turntable base may not be able to enter the "V"-shaped bend and thus cannot play a positioning role; when the angle is greater than 150°, the bend is close to a straight line, which also cannot effectively limit the wafer and cannot accurately determine the wafer's position. Setting the angle between 60° and 150° ensures that the "V"-shaped structure accurately abuts against the wafer edge, reliably limiting the wafer's position and guaranteeing its accuracy during subsequent processing. This improves wafer processing precision, thereby enhancing processing quality and overall performance. Preferably, the system also includes a vacuum adsorption device mounted on the rack. This device includes adsorption holes evenly distributed circumferentially along the surface of the turntable base. By employing this technical solution, since the adsorption holes of the vacuum adsorption device are evenly distributed circumferentially along the turntable base surface and are typically connected to an external negative pressure pipeline, when the negative pressure pipeline is activated to generate adsorption force in the adsorption holes, a uniform adsorption effect can be applied to all parts of the wafer placed on the turntable base. This prevents wafer warping or displacement due to uneven adsorption. During wafer polishing, this effectively prevents wafer displacement or shaking during processing, greatly ensuring wafer stability and significantly improving the precision and quality of wafer processing. This allows the final processed wafer to better meet high-precision processing requirements. Preferably, the turntable drive includes a servo motor and a sensor. The servo motor is mounted on the frame, and the sensor is mounted on the turntable base. By adopting the above technical solution, the servo motor, mounted on the frame, can stably provide power for the rotation of the turntable base. The sensor, mounted on the turntable base, can sense the rotational state of the turntable base in real time, such as speed and position. Based on this precise data fed back by the sensor, the servo motor can dynamically adjust its output power and torque, thereby precisely controlling the rotational speed and angle of the turntable base. In this way, the wafer placed on the turntable base can accurately reach the preset processing position, greatly improving the processing accuracy of the wafer, effectively avoiding processing errors caused by positional deviations, and thus achieving comprehensive fine polishing of the wafer, significantly improving the precision and quality of wafer processing.Preferably, the tool driving and transferring device includes an X-axis moving component, a Z-axis moving component, and a tool assembly. The X-axis moving component is mounted on the frame, and the Z-axis moving component is vertically disposed on the X-axis moving component to allow it to slide along the X-axis. The tool assembly is disposed on the Z-axis moving component to allow it to slide vertically along the Z-axis to directly above the turntable base. By adopting the above technical solution, the tool driving and transferring device includes an X-axis moving component, a Z-axis moving component, and a tool assembly. The X-axis moving component is mounted on the frame, allowing the Z-axis moving component to slide along the X-axis, while the tool assembly is vertically disposed on the Z-axis moving component and can slide vertically along the Z-axis to directly above the turntable base. This configuration allows the tool assembly to move flexibly in both the X and Z axes, significantly expanding the tool's working range and enabling precise positioning of the wafer at any location on the turntable base. This allows for omnidirectional grinding of different parts of the wafer, avoiding grinding blind spots caused by limited tool position, significantly improving the fineness of wafer grinding, and thus enhancing the precision and quality of wafer processing, meeting the requirements of high-precision machining. Preferably, the wafer transfer mechanism includes a three-axis adjustment component and a gripping component, wherein the three-axis adjustment component drives the gripping component to move along the X, Y, and Z axes to achieve precise gripping. By adopting the above technical solution, the wafer transfer mechanism is equipped with a three-axis adjustment component and a gripping component. Since the three-axis adjustment component can drive the gripping component to move along the X, Y, and Z axes, the gripping component possesses flexible movement capabilities in three-dimensional space. This allows it to accurately reach the target position and precisely grip wafers placed at different positions and heights, effectively avoiding gripping failures or wafer damage caused by inaccurate positioning. This improves the efficiency and success rate of wafer transfer, laying a good foundation for subsequent wafer processing and contributing to improving the overall processing efficiency and product quality of the semiconductor wafer engraving machine. Preferably, the frame is equipped with a Y-axis moving component, and the worktable is positioned on the Y-axis moving component to allow it to slide along the Y-axis. By adopting the above technical solution, by setting the Y-axis moving component on the frame and positioning the worktable on the Y-axis moving component, the worktable can slide along the Y-axis. In this way, when processing semiconductor wafers, the worktable can be flexibly adjusted along the Y-axis. Compared to existing designs with fixed positions or only simple translation, it can more accurately move the turntable base placed on the worktable and the wafers of different models on it to the appropriate processing position. This avoids processing deviations caused by limited position adjustment, effectively reduces grinding errors caused by inaccurate positioning, and thus achieves fine grinding of the wafers from all angles, significantly improving the accuracy and quality of wafer processing. Preferably, there are two of each of the U-axis turntable mechanism and the tool drive and transfer device, forming two corresponding operating groups, which are set on opposite sides of the worktable and operate independently.By adopting the above technical solution, since there are two U-axis rotary table mechanisms and two corresponding tool drive and transfer devices, forming two operating groups, and these two operating groups are set up on opposite sides of the worktable and operate independently, this engraving machine can process two wafers simultaneously. Compared with existing single-operating-group engraving machines, it can process more wafers per unit time, greatly improving the overall processing efficiency. Moreover, the independent operation feature ensures that the two operating groups do not interfere with each other, can adapt to wafers of different specifications or processing requirements, flexibly allocate processing tasks, further optimize the production process, meet diverse production needs, and thus significantly enhance the practicality and market competitiveness of this semiconductor wafer engraving machine.

[0011] In summary, this application includes at least one of the following beneficial technical effects:

[0012] 1. The CNC engraving machine is equipped with a U-axis turntable mechanism and a tool drive and transfer device. Compared with the traditional X, Y, and Z three-axis linkage design, the U-axis turntable mechanism drives the turntable base to rotate through the turntable drive component to adjust the processing angle of the wafer. This eliminates the problem of cumulative error caused by the superposition of X and Y axis designs, allowing the tool drive and transfer device to grind the wafer at more angles and positions, thereby achieving all-round fine grinding of the wafer and effectively improving processing accuracy.

[0013] 2. A positioning mechanism is set up so that when the worktable moves the turntable base toward the storage mechanism, the abutment limit plate can abut against the edge of the turntable base. Due to the obstruction of the abutment limit plate, the displacement of the turntable base is restricted, thereby preventing the wafers placed on the turntable base from moving slightly due to external force or inertia during handling and processing, and reducing the positional deviation of the wafers.

[0014] 3. The adsorption holes of the vacuum adsorption device are evenly distributed around the circumference of the turntable base and connected to the negative pressure pipeline. When the negative pressure pipeline is turned on, a uniform adsorption force will be generated at the adsorption holes, which will firmly fix the wafer on the turntable base, preventing the wafer from shifting due to vibration or other factors during the polishing process, further ensuring the high precision of polishing, and comprehensively improving the precision and quality of wafer processing. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a precision engraving machine for semiconductor wafers according to this application;

[0016] Figure 2 This is a schematic diagram of the structure of the U-axis rotary table mechanism and the positioning mechanism of a precision engraving machine for semiconductor wafers according to this application.

[0017] Explanation of reference numerals in the attached drawings: 1. Frame; 2. Worktable; 3. Material storage mechanism; 4. U-axis turntable mechanism; 5. Positioning mechanism; 6. Tool drive and transfer device; 7. Wafer transfer mechanism; 8. Vacuum adsorption device; 9. Tool magazine assembly; 11. Y-axis moving assembly; 41. Turntable base; 42. Turntable drive component; 51. Mounting part; 52. Abutment part; 61. X-axis moving assembly; 62. Z-axis moving assembly; 63. Tool assembly; 71. Three-axis adjustment assembly; 72. Material gripping assembly; 81. Adsorption hole. Detailed Implementation

[0018] The following is in conjunction with the appendix Figure 1-2 This application will be described in further detail.

[0019] This application provides an embodiment of a precision engraving machine for semiconductor wafers, referring to... Figure 1 The system includes a frame 1, a worktable 2, a storage mechanism 3, a U-axis rotary table mechanism 4, a positioning mechanism 5, a tool drive and transfer device 6, a wafer transfer mechanism 7, and a vacuum adsorption device 8. The worktable 2 is slidably mounted on the frame 1. The U-axis rotary table mechanism 4 is mounted on the worktable 2 for placing wafers. The storage mechanism 3 is mounted on the frame 1 and located at the feed end of the worktable 2, for storing wafers to be processed. The tool drive and transfer device 6 is mounted on the frame 1 and located above the U-axis rotary table mechanism 4, for grinding the wafers placed on the U-axis rotary table mechanism 4. The wafer transfer mechanism 7 is mounted on the frame 1 and located on one side of the frame 1, transferring the wafers from the storage mechanism 3 to the U-axis rotary table mechanism 4. The positioning mechanism 5 is mounted on the frame 1 and located between the storage mechanism 3 and the worktable 2, for precisely positioning the U-axis rotary table mechanism 4. The vacuum adsorption device 8 is mounted on the frame 1 and connected to the U-axis rotary table mechanism 4. In this embodiment, there are two of each of the U-axis turntable mechanism 4, the material storage mechanism 3, the tool drive and transfer device 6, the wafer transfer mechanism 7, and the positioning mechanism 5, which respectively form two sets of independently operable operation groups. This is applicable to the simultaneous processing of wafers of different models, greatly improving processing efficiency.

[0020] Specifically, the worktable 2 includes a table body and a slider. The table body is used to mount the U-axis turntable mechanism 4. The table body is generally made of metal, possessing good strength and stability, and its shape is usually a rectangular flat plate. The frame 1 is equipped with a Y-axis moving assembly 11, which includes a Y-axis slide rail and a cylinder. The Y-axis slide rail is located on the frame 1, and the slider is mounted on the bottom of the table body and slides in cooperation with the Y-axis slide rail. The cylinder is connected to the table body. The cylinder drives the table body to slide along the Y-axis slide rail, thereby enabling the worktable 2 to drive the U-axis turntable mechanism 4 to slide along the Y-axis. The slider can be made of wear-resistant engineering plastic or metal alloy, and its surface is smoothed to reduce friction during sliding. The shape of the slider is adapted to the guide rail; for example, if the guide rail is dovetail-shaped, the slider is designed to fit its shape.

[0021] Specifically, in this embodiment, the two storage mechanisms 3 can be multi-layered material racks, each layer having multiple slots for placing wafers. The slots on the two material racks have different widths to accommodate wafers of different sizes. The material racks are generally composed of a metal frame and plastic partitions; the metal frame provides structural support, and the plastic partitions prevent scratching the wafers. The size and spacing of the slots are designed according to the different specifications of the wafers to accommodate various types of wafer storage.

[0022] Specifically, in this embodiment, two U-axis turntable mechanisms 4 are mounted on both sides of the worktable 2. Each mechanism includes a turntable base 41 for placing the wafer and a turntable drive unit 42 for driving the turntable base 41 to rotate. The turntable drive unit 42 includes a servo motor and a sensor. The servo motor is mounted on the frame 1 and driven by the turntable base 41 to achieve U-axis rotation of the turntable base 41. The sensor is mounted on one side of the turntable base 41. The sensor is used to detect specific features of the wafer, such as edge shape and marking positions. The rotation of the U-axis is used to adjust the angle of the wafer, allowing the sensor to detect the wafer from different angles and obtain more comprehensive information. The rotation range, speed, and other parameters of the U-axis can be precisely controlled according to the sensor's detection requirements to meet specific detection process requirements.

[0023] In this embodiment, the turntable base 41 is circular and made of lightweight and high-strength materials such as aluminum alloy. Its surface is precision-machined to ensure flatness and smoothness, thereby ensuring the stability of wafer placement. A servo motor can precisely control the rotation speed and direction, adjusting the rotation speed and angle of the turntable base 41 according to different processing requirements. Sensors, such as photoelectric sensors or Hall effect sensors, are used to detect the position and rotation status of the turntable base 41, feeding back information to the control system of the engraving machine for precise control.

[0024] The bottom of the turntable base 41 is also connected to a vacuum adsorption device 8 mounted on the frame 1. The vacuum adsorption device 8 includes adsorption holes 81 and a negative pressure pipeline. Adsorption holes 81 are evenly distributed circumferentially on the surface of the turntable base 41, and the adsorption holes 81 are connected to the negative pressure pipeline. The adsorption holes 81 can be small circular holes, evenly distributed on the surface of the turntable base 41. When the negative pressure pipeline is connected to a negative pressure source, the adsorption holes 81 generate adsorption force, firmly adsorbing the wafer onto the turntable base 41 and preventing the wafer from moving during processing.

[0025] Reference Figure 2Specifically, in this embodiment, both positioning mechanisms 5 are abutment limiting plates installed on the frame 1 and located between the worktable 2 and the material rack. When the worktable 2 drives the U-axis turntable mechanism to move towards the material rack, the abutment limiting plate can abut against the edge of the turntable base 41. This structural cooperation achieves the effect of reducing error accumulation, realizing all-round fine grinding of the wafer, and improving processing accuracy and quality. The reason is that the setting of the U-axis turntable mechanism 4 avoids the problem of traditional X and Y axis superposition error accumulation. The positioning mechanism 5 can accurately limit the turntable base 41 and the wafer.

[0026] In this embodiment, the abutment limiting piece includes a mounting part 51 and an abutment part 52. The mounting part 51 is mounted on the frame 1, and the abutment part 52 has a "V" shape, with its upper surface extending protruding from the surface of the turntable base 41. This ensures better positioning accuracy of the wafer when it abuts against the abutment limiting piece on the surface of the turntable base 41. The mounting part 51 is typically fixed to the frame 1 by bolts or welding to ensure a secure installation. The "V" shape of the abutment part 52 better fits against the edges of the turntable base 41 and the wafer, providing precise positioning. The angle of the "V" shaped bend is 60°-150°. Within this range, the angle can be selected according to different usage scenarios and wafer sizes to achieve the best positioning effect. Besides the "V" shaped bend structure of this embodiment, an arc-shaped structure can also be used, with the edge of the arc-shaped structure fitting against the edge of the turntable base 41. Specifically, in this embodiment, both tool-driven transfer devices 6 consist of an X-axis moving component 61, a Z-axis moving component 62, and a tool component 63. To achieve the movement function of the tool component 63 at a specific position, the coordinated operation of the X-axis moving component 61, the Z-axis moving component 62, and the tool component 63 is crucial. In this embodiment, the two X-axis moving components 61 serve as the actuating components for horizontal movement of the entire device. They are symmetrically distributed along the X-axis on the frame 1, and the corresponding two Z-axis moving components 62 are mounted on their respective X-axis moving components 61. Furthermore, the two Z-axis moving components 62 are vertically mounted on their respective X-axis moving components 61. When the X-axis moving component 61 is activated and operating, it drives the corresponding Z-axis moving component 62 to slide horizontally along the X-axis, thereby adjusting the horizontal position of the Z-axis moving component 62. The two tool assemblies 63 are mounted on the corresponding Z-axis moving assemblies 62. When the Z-axis moving assemblies 62 move, the tool assemblies 63 can slide up and down along the Z-axis to move closer to or further away from the turntable base 41. Therefore, through the coordinated actions of this series of components, it can be ensured that the tool assemblies 63 accurately reach the top of the turntable base 41.

[0027] The X-axis moving assembly 61 and the Z-axis moving assembly can employ either a lead screw and nut transmission mechanism or a linear guide transmission mechanism. The lead screw and nut transmission mechanism consists of a lead screw, a nut, and a motor. The motor drives the lead screw to rotate, and the nut moves linearly along the lead screw, thus achieving movement in the corresponding direction. The drive motors for the X-axis moving assembly 61 and the Z-axis moving assembly operate independently. The linear guide transmission mechanism uses a motor to drive a slider to slide on a linear guide rail. The tool assembly 63 includes a tool and a tool holder. The tool is generally a diamond tool, possessing high hardness and wear resistance. The tool holder is used to fix the tool and connects to the Y-axis moving assembly to achieve tool position adjustment. Specifically, in this embodiment, the two wafer transfer mechanisms 7 are symmetrically arranged on both sides of the frame 1 to precisely grip the wafers on the two material racks. Both wafer transfer mechanisms 7 include a three-axis adjustment assembly and a gripping assembly. The three-axis adjustment assembly includes an X-axis transfer guide rail, a Y-axis transfer guide rail, a Z-axis transfer guide rail, and a drive motor that drives the gripping assembly to move along the X, Y, and Z axes to achieve precise gripping. The three-axis adjustment assembly can also use a lead screw and nut drive mechanism or a linear guide drive mechanism to achieve movement in three directions. The gripping assembly can be a vacuum chuck or a chuck. The vacuum chuck uses negative pressure to adsorb the wafer and is suitable for gripping wafers with flat surfaces; the chuck clamps the wafer with mechanical force and is suitable for gripping wafers with a certain thickness and strength.

[0028] Specifically, the wafer engraving machine in this embodiment also includes two tool magazine assemblies 9 for storing different types of tools, so as to quickly and conveniently change tools according to actual needs. The two tool magazine assemblies 9 are located on both sides of the frame and below the two wafer transfer mechanisms 7.

[0029] The wafer engraving machine in this embodiment is equipped with a housing, which has an opening and closing door for observing the machine's operation. Doors and windows are also provided for each of the two tool magazine assemblies 9, facilitating quick tool replacement by the operator. Furthermore, the housing is equipped with a control system for convenient coordinated control of the various mechanisms. The implementation principle of this embodiment is as follows:

[0030] First, in the processing preparation stage, two wafer transfer mechanisms 7 located on both sides of the rack 1 drive the gripping assembly to move along the X, Y, and Z axes through their three-axis adjustment components. The gripping assembly accurately grips the wafer to be processed from the multi-layer storage mechanism 3 located at the feed end of the worktable 2.

[0031] Subsequently, the worktable 2 slides along the Y-axis slide rail of the Y-axis moving assembly 11 of the frame 1. Driven by the Y-axis moving assembly 11 of the frame 1, the worktable 2 moves the two U-axis turntable mechanisms (located on both sides of the worktable 2, each turntable mechanism includes a circular disc-shaped turntable base 41 made of aluminum alloy and with a precision-machined surface, and a turntable drive component 42 containing a servo motor and a sensor. The bottom of the turntable base 41 is connected to a vacuum adsorption device 8 containing an adsorption hole 81 and a negative pressure pipeline. The servo motor drives the turntable base 41 to rotate around the U-axis. The sensor is used to detect specific characteristics of the wafer to assist in adjusting the rotation angle. The U-axis rotation parameters can be precisely controlled) toward the material rack.

[0032] During the movement, two synchronous positioning mechanisms 5 (which are abutment limiting plates, including mounting parts 51 and abutment parts 52 in the shape of a "V" (angle 60°-150°), the mounting parts 51 are fixed to the frame 1 by bolts or welding, and the upper surface of the abutment parts 52 extends and protrudes from the surface of the turntable base 41) installed on the frame 1 and located between the worktable 2 and the material rack, abut against the edge of the turntable base 41, reducing the accumulation of errors and achieving accurate positioning of the wafer;

[0033] Next, the wafer is gripped by the material gripping assembly and placed on the turntable base 41. The vacuum adsorption device 8 is activated, generating adsorption force through the adsorption holes 81 to fix the wafer. Then, two tool-driven transfer devices 6 (each composed of an X-axis moving assembly, a Z-axis moving assembly, and a tool assembly 63; the X-axis moving assembly is symmetrically distributed along the X-axis on the frame 1, and the Z-axis moving assembly is vertically mounted on the X-axis moving assembly) work together. The X-axis moving assembly drives the Z-axis moving assembly to slide along the X-axis to adjust the horizontal position, and the Z-axis moving assembly drives the tool assembly 63 to slide up and down along the Z-axis to move closer to or away from the turntable base 41, ensuring that the tool assembly 63 accurately reaches directly above the turntable base 41 to grind the wafer. The U-axis turntable mechanism can adjust the wafer angle according to processing requirements, and the U-axis setting avoids the problem of accumulated errors from the traditional X and Y axes. Together with the positioning mechanism 5, it achieves all-round fine grinding of the wafer, improving processing accuracy and quality. Through this series of processes, the engraving machine can process wafers of different models simultaneously, greatly improving processing efficiency.

[0034] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A precision engraving machine for semiconductor wafers, comprising a frame (1), characterized in that, It also includes: a worktable (2) slidably disposed on the frame (1); a U-axis turntable mechanism (4), the U-axis turntable mechanism (4) including: a turntable base (41) for placing wafers and a turntable drive (42) for driving the turntable base (41) to rotate, the turntable drive (42) being mounted on the worktable (2); a storage mechanism (3) for placing wafers to be processed; and a tool drive and transfer device (6) located above the turntable base (41) for... The wafer is polished; the wafer transfer mechanism (7) transfers the wafer from the storage mechanism (3) to the turntable base (41); the positioning mechanism (5) is located between the storage mechanism (3) and the worktable (2), and the positioning mechanism (5) includes: an abutment limiting piece, which is installed on the frame (1). When the worktable (2) moves the turntable base (41) toward the storage mechanism (3), the abutment limiting piece can abut against the edge of the turntable base (41).

2. The semiconductor wafer engraving machine according to claim 1, characterized in that, The upper surface of the abutment limiting piece extends out of the surface of the turntable base (41), and the wafer on the surface of the turntable base (41) abuts against the abutment limiting piece.

3. The precision engraving machine for semiconductor wafers according to claim 1, characterized in that, The abutment limiting piece includes an mounting part (51) and an abutment part (52). The mounting part (51) is mounted on the frame (1), and the abutment part (52) has a "V" shaped structure.

4. The precision engraving machine for semiconductor wafers according to claim 3, characterized in that, The angle of the "V" shaped bend structure is 60°-150°.

5. A precision engraving machine for semiconductor wafers according to claim 1, characterized in that, It also includes a vacuum adsorption device (8) disposed on the frame (1), the vacuum adsorption device (8) including adsorption holes (81), the adsorption holes (81) being uniformly distributed circumferentially along the surface of the turntable base (41).

6. The semiconductor wafer engraving machine according to claim 1, characterized in that, The turntable drive (42) includes a servo motor and a sensor. The servo motor is mounted on the frame (1), and the sensor is mounted on the turntable base (41).

7. A precision engraving machine for semiconductor wafers according to claim 1, characterized in that, The tool drive and transfer device (6) includes an X-axis moving component (61), a Z-axis moving component (62), and a tool component (63). The X-axis moving component (61) is mounted on the frame (1). The Z-axis moving component (62) is vertically arranged on the X-axis moving component (61) to enable it to slide along the X-axis. The tool component (63) is arranged on the Z-axis moving component (62) to enable it to slide vertically along the Z-axis to directly above the turntable base (41).

8. A precision engraving machine for semiconductor wafers according to claim 1, characterized in that, The wafer transfer mechanism (7) includes a three-axis adjustment component and a gripping component. The three-axis adjustment component drives the gripping component to move along the X, Y, and Z axes to achieve precise gripping.

9. A precision engraving machine for semiconductor wafers according to claim 1, characterized in that, The frame (1) is provided with a Y-axis moving assembly (11), and the worktable (2) is disposed on the Y-axis moving assembly (11) to enable it to slide along the Y-axis.

10. A precision engraving machine for semiconductor wafers according to claim 1, characterized in that, The number of the U-axis turntable mechanism (4) and the tool drive and transfer device (6) are both two and they correspond one-to-one to form two operation groups. The two operation groups are set on both sides of the worktable (2) and operate independently.

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