An automatic partition grinding device

Abstract

This application provides an automatic partition grinding device, including a partition, a grinding table, and a grinding mechanism. The grinding mechanism includes a grinding wheel, a grinding slide, and a grinding track. The grinding slide is movably mounted on the grinding track, and the grinding wheel is mounted on the grinding slide. The grinding table has a positioning groove, which is horizontally positioned. The partition is placed in the positioning groove, and the grinding wheel is positioned outside the groove opening and close to it. The extension direction of the positioning groove is parallel to the direction of the grinding track. When the partition is placed in the positioning groove, the grinding wheel rotates to grind the partition against it. The grinding slide moves back and forth along the grinding track, and the grinding wheel moves along with it, repeatedly grinding the partition to achieve uniform grinding. This avoids prolonged grinding of localized areas of the partition and prevents deformation due to excessively high local temperatures. During the grinding process, the grinding effect of the partition can be monitored at any time to ensure the grinding effect.

Description

Technical Field

[0001] This application relates to the technical field of partition processing, and in particular to an automatic partition grinding device. Background Technology

[0002] A rubber partition is a sheet or barrier made of rubber material used to separate spaces, areas, or objects. Rubber partitions can come in a wide variety of forms, uses, and properties. Due to their good toughness and durability, rubber partitions are the most common type of partition.

[0003] Existing partition grinding devices have the following main drawbacks: hand-held partitions and grinding with a grinding machine require high operator skills, have low grinding efficiency, and high labor costs; prolonged grinding of a localized area of ​​the partition may cause local deformation due to excessive heat. Summary of the Invention

[0004] To address the shortcomings in the aforementioned background technology, an automatic partition grinding device is proposed.

[0005] This application provides an automatic partition polishing device, including a partition, a polishing table, and a polishing mechanism. The polishing mechanism is provided with a polishing wheel, a polishing slide, and a polishing track. The polishing slide is movably mounted on the polishing track, and the polishing wheel is mounted on the polishing slide. The polishing table is provided with a positioning groove, which is arranged horizontally. The partition is located in the positioning groove, and the polishing wheel is located outside the opening of the positioning groove and close to the opening of the positioning groove. The direction of the positioning groove is parallel to the direction of the polishing track.

[0006] Preferably, the automatic partition grinding device further includes a traction mechanism, which drives the grinding slide to move back and forth along the grinding track.

[0007] Preferably, the traction mechanism includes a traction belt, traction wheels, and a traction motor. The traction belt is wound around the traction wheels, and the traction motor drives the traction wheels to rotate. The traction belt is arranged parallel to the grinding track, and the grinding slide is fixed on the traction belt.

[0008] Preferably, the bottom of the positioning groove is provided with a positioning hole; the partition includes a suspended part, which is located at the bottom end of the partition and can pass through the positioning hole.

[0009] Preferably, the partition further includes a positioning part and a surface to be polished. The positioning part is located at the upper end of the partition, and the surface to be polished is located at the top of the positioning part. The shape of the positioning groove is adapted to the shape of the positioning part, and the surface to be polished extends out of the groove opening of the positioning groove.

[0010] Preferably, multiple positioning slots are provided, and the positioning slots are evenly distributed along the transverse direction of the grinding table.

[0011] Preferably, the grinding mechanism also includes a grinding motor, which is located at the rear end of the grinding wheel and can drive the grinding wheel to rotate.

[0012] Preferably, the polishing mechanism further includes a protective cover, which is semi-circular, and the polishing wheel is located inside the protective cover.

[0013] The beneficial effects of this utility model are:

[0014] The automatic partition sanding device is used to sand the partitions, roughening their surface to facilitate subsequent glue application. The partition is placed in a positioning groove, and the sanding wheel rests against its surface. The sanding wheel rotates, sanding the partition within the positioning groove. The sanding slide moves back and forth along the sanding track, with the sanding wheel following, repeatedly sanding the partition to achieve uniform surface sanding. This avoids prolonged sanding of specific areas, preventing deformation due to excessive localized heat. The sanding process can be monitored continuously to ensure optimal results. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A schematic diagram of an automatic partition grinding device;

[0017] Figure 2 This is a schematic diagram of the grinding mechanism and the traction mechanism;

[0018] Figure 3 This is a schematic diagram of the working principle of the automatic partition grinding device.

[0019] The symbols in the diagram are marked as follows:

[0020] 1 is the partition, 11 is the suspended part, 12 is the positioning part, and 13 is the surface to be polished;

[0021] 2 is the grinding table, 21 is the positioning groove, and 211 is the positioning hole;

[0022] 3 is the grinding mechanism, 31 is the grinding wheel, 32 is the grinding slide, 33 is the grinding track, 34 is the grinding motor, and 35 is the protective cover;

[0023] 4 is the traction mechanism, 41 is the traction belt, 42 is the traction wheel, and 43 is the traction motor. Detailed Implementation

[0024] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0025] Example

[0026] like Figures 1 to 3 As shown, an automatic partition grinding device includes a partition 1, a grinding table 2, and a grinding mechanism 3. The grinding mechanism 3 is provided with a grinding wheel 31, a grinding slide 32, and a grinding track 33. The grinding slide 32 is movably mounted on the grinding track 33, and the grinding wheel 31 is mounted on the grinding slide 32. The grinding table 2 is provided with a positioning groove 21, which is arranged horizontally. The partition 1 is located in the positioning groove 21, and the grinding wheel 31 is located outside the opening of the positioning groove 21 and close to the opening of the positioning groove 21. The direction of the positioning groove 21 is parallel to the direction of the grinding track 33.

[0027] The automatic partition sanding device is used to sand the partition 1, making its surface rougher to facilitate subsequent glue application. The partition 1 is placed in the positioning groove 21, and the sanding wheel 31 is placed against the surface of the partition 1. The sanding wheel 31 rotates to sand the partition 1 in the positioning groove 21. The sanding slide 32 moves back and forth along the sanding track 33, and the sanding wheel 31 moves along with it, repeatedly sanding the partition 1 back and forth, thereby sanding the surface of the partition 1 evenly. This avoids prolonged sanding of local areas of the partition 1 and prevents the partition 1 from deforming due to excessive local temperature. During the sanding process, the sanding effect of the partition 1 can be monitored at any time to ensure the sanding effect of the partition 1.

[0028] The automatic partition grinding device also includes a traction mechanism 4, which drives the grinding slide 32 to move back and forth along the grinding track 33 to realize the automation of the equipment.

[0029] The traction mechanism 4 includes a traction belt 41, a traction wheel 42, and a traction motor 43. The traction belt 41 is wound around the traction wheel 42, and the traction motor 43 drives the traction wheel 42 to rotate. The traction belt 41 is arranged parallel to the grinding track 33, and the grinding slide 32 is fixed on the traction belt 41. Using the traction belt 41 to drive the grinding slide 32 to move can adapt to long-distance reciprocating motion, and the operation is smooth and reliable.

[0030] The bottom of the positioning groove 21 is provided with a positioning hole 211; the partition 1 includes a suspended part 11, which is located at the bottom end of the partition 1 and can pass through the positioning hole 211; the suspended part 11 passes through the positioning hole 211 to prevent the bottom of the partition 1 from contacting the inner wall of the positioning groove 21 and affecting the position or angle of the partition 1, so as to ensure that the partition 1 can be placed stably in the positioning groove 21, thereby ensuring the polishing effect.

[0031] The partition 1 also includes a positioning part 12 and a surface to be polished 13. The positioning part 12 is located at the upper end of the partition 1, and the surface to be polished 13 is located at the top of the positioning part 12. The shape of the positioning groove 21 is adapted to the shape of the positioning part 12, and the surface to be polished 13 extends out of the groove of the positioning groove 21.

[0032] Multiple positioning slots 21 are provided and are evenly distributed along the transverse direction of the grinding table 2; the traction mechanism 4 drives the grinding slide 32 to move back and forth along the grinding track 33, which can realize the simultaneous grinding of multiple partitions 1 and improve grinding efficiency.

[0033] The grinding mechanism 3 also includes a grinding motor 34, which is located at the rear end of the grinding wheel 31 and can drive the grinding wheel 31 to rotate. In this embodiment, a transmission wheel and a transmission belt are also provided between the grinding motor 34 and the grinding wheel 31. The transmission ratio is controlled by the transmission wheel and the transmission belt, thereby controlling the rotational speed of the grinding wheel 31.

[0034] The grinding mechanism 3 also includes a protective cover 35, which is semi-circular. The grinding wheel 31 is located inside the protective cover 35. The protective cover 35 can prevent the debris generated during grinding from being discharged and splashed, and prevent the dust from being completely diffused into the environment, thus protecting the production environment. A dust removal pipe can also be installed inside the protective cover 35 to further improve the dust removal effect.

[0035] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A device for automatically polishing a separator comprising a separator, a polishing table and a polishing mechanism, characterized in that: The grinding mechanism includes a grinding wheel, a grinding slide, and a grinding track. The grinding slide is movably mounted on the grinding track, and the grinding wheel is mounted on the grinding slide. The grinding table has a positioning groove, which is horizontally positioned. A partition is located inside the positioning groove, and the grinding wheel is located outside the opening of the positioning groove and close to the opening of the positioning groove. The direction of the positioning groove is parallel to the direction of the grinding track.

2. The automatic baffle polishing apparatus according to claim 1, wherein It also includes a traction mechanism, which drives the grinding slide to move back and forth along the grinding track.

3. The device according to claim 2, wherein The traction mechanism includes a traction belt, a traction wheel, and a traction motor. The traction belt is wound around the traction wheel, and the traction motor drives the traction wheel to rotate. The traction belt is arranged parallel to the grinding track, and the grinding slide is fixed on the traction belt.

4. The device according to any one of claims 1 to 3, wherein The bottom of the positioning groove is provided with a positioning hole; the partition includes a suspended part, which is located at the bottom end of the partition and can pass through the positioning hole.

5. The device according to claim 4, wherein The partition also includes a positioning part and a surface to be polished. The positioning part is located at the upper end of the partition, and the surface to be polished is located at the top of the positioning part. The shape of the positioning groove is adapted to the shape of the positioning part, and the surface to be polished extends out of the groove opening of the positioning groove.

6. The device according to any one of claims 1 to 3, wherein The positioning groove is provided in multiple ways and is evenly distributed along the transverse direction of the grinding table.

7. The device according to any one of claims 1 to 3, wherein The polishing mechanism also includes a polishing motor, which is located at the rear end of the polishing wheel and can drive the polishing wheel to rotate.

8. The automatic partition grinding device according to any one of claims 1 to 3, characterized in that, The polishing mechanism also includes a protective cover, which is semi-circular, and the polishing wheel is disposed inside the protective cover.

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