A teaching device for a front-end module robot of semiconductor equipment

Abstract

This utility model discloses a teaching device for a front-end module robot of semiconductor equipment, including a front-opening transfer box. Several stepped grooves are provided on the left and right sides inside the transfer box. An auxiliary positioning plate is installed between the stepped grooves on the left and right sides. The surface of the auxiliary positioning plate has long guide grooves and short guide grooves that match the end effector of the robotic arm. Limiting blocks are provided on the outer sides of the long and short guide grooves. The long and short guide grooves are arranged parallel to each other on the auxiliary positioning plate. A tapered hole is provided at the bottom of the auxiliary positioning plate. This utility model ensures compatibility between the front-opening transfer box, the pre-alignment platform, and the wafer fixing platform; through the limiting design, the insertion posture of the robot's end effector is precisely controlled, improving teaching accuracy and repeatability, and avoiding errors caused by subjective judgment.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor equipment technology, and specifically relates to a teaching device for a front-end module robot of semiconductor equipment. Background Technology

[0002] In semiconductor manufacturing equipment, the process of automatically transporting wafers from the front-opening wafer transfer box to subsequent process modules relies on robots inside the front-end module of the equipment to perform precise positioning and gripping operations. To ensure the accuracy of the robot's gripping and placement, it needs to be "taught" after initial installation or maintenance, that is, the coordinate parameters of each target position need to be determined.

[0003] Existing teaching methods primarily rely on manual operation of the robotic arm to reach a set position, with the operating system recording the coordinates as reference values ​​for automatic operation. This process has several problems: operators need to make multiple fine adjustments, which is cumbersome, time-consuming, and labor-intensive, and it is difficult to ensure high consistency in each operation; in some equipment environments, the internal space of the front-end module is narrow and the lighting is poor, resulting in poor visibility and low teaching efficiency of traditional teaching methods, and it is also easy to collide with the wafer transport path, posing safety hazards; in addition, the accuracy of manual judgment of positioning is highly subjective and easily introduces errors, affecting the handling and measurement of wafers in subsequent process modules. Therefore, there is an urgent need for a teaching device for front-end module robots of semiconductor equipment to solve the above problems. Utility Model Content

[0004] In view of the problems mentioned above in the background technology, the purpose of this utility model is to provide a teaching device for a front-end module robot of semiconductor equipment.

[0005] To achieve the above-mentioned technical objectives, the technical solution adopted by this utility model is as follows:

[0006] A teaching device for a front-end module robot of a semiconductor device includes a front-opening transfer box. The front-opening transfer box has several stepped grooves on its left and right sides. An auxiliary positioning plate is installed between the stepped grooves on the left and right sides. The surface of the auxiliary positioning plate has long guide grooves and short guide grooves that match the end effector of the robotic arm. Limiting blocks are provided on the outer sides of the long guide grooves and short guide grooves. The long guide grooves and short guide grooves are arranged parallel to each other on the auxiliary positioning plate. The bottom of the auxiliary positioning plate has a conical hole.

[0007] Furthermore, the stepped grooves on the left and right sides are arranged sequentially from top to bottom within the front-opening conveyor box, with equal spacing between two adjacent stepped grooves, and a total of 25 layers of stepped grooves. This structural design facilitates placement for teaching purposes.

[0008] Furthermore, the auxiliary positioning plate and the limiting block are integrally formed. This structural design improves the connection strength.

[0009] Further defining the feature, it also includes a pre-alignment platform with a tapered protrusion at its top that matches a tapered hole. This structural design ensures a tight fit between the tapered protrusion and the tapered hole, guaranteeing concentricity during teaching.

[0010] Further specifying, it also includes a wafer fixing platform, with inlet and outlet slots on both sides of the surface of the wafer fixing platform. The limiting block precisely matches the inlet and outlet slots, and the wafer fixing platform also has several vacuum suction holes. This structural design allows the limiting block to precisely match the inlet and outlet slots. When the end effector of the teaching robot enters, the limiting block can physically limit the end effector to adjust its posture.

[0011] The beneficial effects of this utility model are as follows: This utility model can be well adapted between front-opening wafer transfer boxes, pre-alignment platforms, and wafer fixing platforms, improving the versatility and applicability of the device, reducing teaching difficulties caused by equipment differences, and precisely controlling the insertion posture of the robot end controller through limiting blocks and guide grooves, avoiding the subjectivity of manual operation, effectively improving teaching accuracy and repeatability, reducing teaching errors, ensuring the accuracy of wafer pick-up and measurement in subsequent process modules, solving the safety hazards of poor visibility and easy collision of wafer transfer paths in traditional teaching methods, improving the safety and reliability of the teaching process, reducing the operational difficulty and workload of operators, and improving teaching efficiency. Attached Figure Description

[0012] This utility model can be further illustrated by the non-limiting embodiments given in the accompanying drawings;

[0013] Figure 1 This is a schematic diagram of the axonometric structure of a teaching device for a front-end module robot of a semiconductor device according to an embodiment of the present invention;

[0014] Figure 2 This is a schematic diagram of the front axonometric structure of an auxiliary positioning plate for a teaching device for a front-end module robot of a semiconductor device, according to an embodiment of the present invention.

[0015] Figure 3 This is a schematic diagram of the back axial side structure of an auxiliary positioning plate for a teaching device for a front-end module robot of a semiconductor device according to an embodiment of the present invention.

[0016] Figure 4 This is a schematic diagram of a wafer fixing platform structure for a teaching device for a front-end module robot of a semiconductor device, according to an embodiment of the present invention.

[0017] Figure 5 This is a schematic diagram of the assembly structure of a wafer fixing platform and an auxiliary positioning plate for a teaching device for a front-end module robot of a semiconductor device according to an embodiment of the present invention.

[0018] The symbols for the main components are explained below:

[0019] 1. Front-opening transfer box; 2. Step groove; 3. Auxiliary positioning plate; 4. Long guide groove; 5. Short guide groove; 6. Limiting block; 7. Conical hole; 8. Wafer fixing platform; 9. Inlet / outlet groove; 10. Vacuum adsorption hole. Detailed Implementation

[0020] To enable those skilled in the art to better understand this utility model, the technical solution of this utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0021] like Figure 1-5 As shown, this utility model discloses a teaching device for a front-end module robot of a semiconductor device. The front-opening transfer box 1 has several stepped grooves 2 on the left and right sides inside. An auxiliary positioning plate 3 is installed between the stepped grooves 2 on the left and right sides. The surface of the auxiliary positioning plate 3 is provided with long guide grooves 4 and short guide grooves 5 that match the end effector of the robotic arm. Limiting blocks 6 are provided on the outer sides of the long guide grooves 4 and short guide grooves 5. The long guide grooves 4 and short guide grooves 5 are arranged in parallel on the auxiliary positioning plate 3. The bottom of the auxiliary positioning plate 3 is provided with a conical hole 7.

[0022] Preferably, the stepped grooves 2 on both sides are arranged sequentially from top to bottom inside the front-opening conveyor box 1, with equal spacing between two adjacent stepped grooves 2, and the stepped grooves 2 are arranged in 25 layers. This structural design facilitates placement for teaching purposes. In practice, other arrangement shapes of the stepped grooves 2 can also be considered depending on the specific circumstances.

[0023] Preferably, the auxiliary positioning plate 3 and the limiting block 6 are integrally formed. This structural design improves the connection strength. In practice, other connection structure shapes for the auxiliary positioning plate 3 and the limiting block 6 can also be considered depending on the specific circumstances.

[0024] Preferably, it also includes a pre-alignment platform with a tapered protrusion on top that matches the tapered hole 7. This structural design ensures a tight fit between the tapered protrusion and the tapered hole 7, guaranteeing concentricity during teaching. In practice, other structural shapes of the pre-alignment platform can also be considered depending on the specific circumstances.

[0025] Preferably, the device also includes a wafer fixing platform 8, with entry / exit slots 9 on both sides of its surface. A limiting block 6 precisely engages with the entry / exit slots 9. The wafer fixing platform 8 also has several vacuum suction holes 10. This structural design ensures a precise fit between the limiting block 6 and the entry / exit slots 9. When the end effector of the teaching robot enters, the limiting block 6 can physically limit the end effector's orientation. In practice, other structural shapes of the wafer fixing platform 8 can also be considered depending on the specific circumstances.

[0026] In this embodiment:

[0027] Teaching method for handling wafers on layers 1-25 in a front-opening wafer transfer box

[0028] The auxiliary positioning plate 3 is inserted into any layer of the front-opening transfer box 1. The end effector of the robotic arm enters along the long guide groove 4 and short guide groove 5 on the surface of the auxiliary positioning plate 3. Through the guiding and limiting effect of the long guide groove 4 and short guide groove 5 on the end effector, the operator can easily obtain the X, Y, and T axis coordinate information of the end effector at that position. During the entry and exit of the end effector, the limit block 6 limits its position to prevent the end effector from deviating and ensure the accuracy of coordinate acquisition. After the coordinates are obtained, the operating system records the position coordinates as a reference value for subsequent automatic operation.

[0029] Teaching on wafer pick-and-place on the pre-alignment platform

[0030] The tapered hole 7 at the bottom of the auxiliary positioning plate 3 is tightly fitted with the tapered protrusion on the pre-alignment platform to ensure that the auxiliary positioning plate 3 and the pre-alignment platform are concentric. Then, the end effector of the robotic arm enters the pre-alignment platform along the long guide groove 4 and the short guide groove 5 on the upper surface of the auxiliary positioning plate 3. Through the concentric fit between the auxiliary positioning plate 3 and the pre-alignment platform, the position coordinates of the end effector on the pre-alignment platform are accurately located. In this process, the problem caused by the concentricity error of the wafer on the pre-alignment platform is effectively solved, ensuring the accurate recording of coordinates and providing a reliable reference for the subsequent automatic operation of the robot.

[0031] Teaching demonstration of wafer handling on the wafer mounting platform of the overlay error measurement equipment

[0032] The auxiliary positioning plate 3 is placed on the wafer fixing platform 8, so that the limiting block 6 on the upper surface of the auxiliary positioning plate 3 is precisely matched with the inlet / outlet slot 9 on the surface of the wafer fixing platform 8. When the end effector of the robotic arm enters, the limiting block 6 adjusts the y-axis posture of the end effector through physical limiting, helping the operator to adjust the wafer to the center position. Then, with the assistance of the long guide slot 4 and short guide slot 5 on the upper surface of the auxiliary positioning plate 3, the coordinate information of the end effector at this position is accurately obtained and recorded by the operating system to complete the teaching operation in this scenario.

[0033] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A teaching device for a front-end module robot of a semiconductor device, comprising a front-opening transfer box (1), wherein the front-opening transfer box (1) has a plurality of stepped grooves (2) on its left and right sides, characterized in that: An auxiliary positioning plate (3) is installed between the stepped grooves (2) on the left and right sides. The surface of the auxiliary positioning plate (3) is provided with a long guide groove (4) and a short guide groove (5) that match the end effector of the robotic arm. Limiting blocks (6) are provided on the outer sides of the long guide groove (4) and the short guide groove (5). The long guide groove (4) and the short guide groove (5) are arranged in parallel on the auxiliary positioning plate (3). A tapered hole (7) is provided at the bottom of the auxiliary positioning plate (3).

2. The teaching device for a front-end module robot of a semiconductor device according to claim 1, characterized in that: The stepped grooves (2) on the left and right sides are arranged sequentially from top to bottom in the front-opening conveyor box (1), wherein the distance between two adjacent stepped grooves (2) is equal, and the stepped grooves (2) are arranged in 25 layers.

3. The teaching device for a front-end module robot of a semiconductor device according to claim 2, characterized in that: The auxiliary positioning plate (3) and the limiting block (6) are integrally formed.

4. The teaching pendant for a front-end module robot of a semiconductor device according to claim 3, characterized in that: It also includes a pre-alignment platform, the top of which is provided with a tapered protrusion that matches a tapered hole (7).

5. A teaching device for a front-end module robot of a semiconductor device according to claim 4, characterized in that: It also includes a wafer fixing platform (8), on both sides of the surface of the wafer fixing platform (8) are provided with inlet and outlet slots (9), the limiting block (6) is precisely matched with the inlet and outlet slots (9), and the wafer fixing platform (8) is also provided with a number of vacuum adsorption holes (10).

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