Injection mold for optical part machining
By introducing a continuous cooling mechanism consisting of thermally conductive materials and semiconductor cooling chips into the injection mold used for optical component processing, the problem of inconsistent coolant temperature was solved, achieving efficient cooling and stable product quality.
CN224276074UActive Publication Date: 2026-05-26CHANGZHOU RUNBANG MOLDING TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHANGZHOU RUNBANG MOLDING TECH CO LTD
- Filing Date
- 2025-06-16
- Publication Date
- 2026-05-26
AI Technical Summary
Technical Problem
The temperature of the coolant in the existing injection molds used for processing optical components is inconsistent during the cooling process, which affects cooling efficiency and product quality.
Method used
Cooling pipes and heat rods made of thermally conductive materials, combined with semiconductor cooling chips and cooling fans, form a continuous cooling mechanism to ensure consistent coolant temperature.
Benefits of technology
This improved cooling efficiency and consistency in product cooling rate, thereby enhancing product quality.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224276074U_ABST
Abstract
The utility model discloses an injection mold for processing optical parts, which comprises a lower mold base, two groups of cooling nozzles are reserved on one side wall of the lower mold base, a cooling pipe with an S-shaped structure is arranged between the cooling nozzles, and the cooling pipe is made of heat conduction materials. The cooling device has the advantages that the continuous refrigeration mechanism composed of the heat conduction rod, the heat conduction plate, the semiconductor refrigeration piece and the cooling fan is arranged, in the process that materials are cooled through the cooling liquid, the heat conduction rod and the heat conduction plate conduct out heat in the cooling liquid, and meanwhile the semiconductor refrigeration piece refrigerates one end of the heat conduction plate; the heat dissipation fan can dissipate heat of the semiconductor chilling plate, the efficient refrigeration performance of the semiconductor chilling plate on the cooling liquid is guaranteed, the temperature of the cooling liquid is kept consistent in the flowing process, on one hand, the cooling efficiency of the semiconductor chilling plate is improved, on the other hand, the cooling rate of products is guaranteed to be consistent, and the use effect is good.
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