A machine vision-based laser chip surface defect detection device

Abstract

This invention discloses a machine vision-based laser chip surface defect detection device, comprising a chip conveying system, an image acquisition system, and a chip acquisition platform. The chip conveying system transports a waffle box containing chips to the chip acquisition platform. The image acquisition system acquires images of each chip individually. The chip acquisition platform inspects the chips and classifies defective and non-defective chips accordingly. This invention achieves automated surface defect detection of laser chips and filters out defective chips.

Description

Technical Field

[0001] This utility model belongs to the field of laser chip surface defect detection technology, specifically relating to a laser chip surface defect detection device based on machine vision. Background Technology

[0002] Laser chips are the most crucial core components of lasers. Due to their advantages such as light weight, small size, low power consumption, long lifespan, high electro-optical conversion efficiency, high operational reliability, low cost, and ease of mass production, they have found widespread application in optoelectronics. The manufacturing process of laser chips involves many complex operations, making defects inevitable. These defects significantly impact the optical performance and stability of the laser, potentially leading to a substantial reduction in performance or even complete malfunction. Therefore, in the development and production of various laser chips, accurate and rapid detection, identification, and determination of defects help improve detection efficiency during chip production, reduce labor costs, and assist engineers in analyzing the causes of defects, improving laser chip manufacturing processes, and ultimately increasing yield and product reliability.

[0003] Currently, the most common method for detecting defects in laser chips is manual inspection. This method involves manually observing the laser chip under a high-powered microscope and identifying defects. However, this method is both time-consuming and labor-intensive. Extensive use of manual inspection leads to low efficiency, and prolonged observation of the laser chip can cause visual fatigue, thus affecting the accuracy of the inspection. How to utilize automated equipment for defect detection on laser chip surfaces to improve efficiency and accuracy is a crucial problem that urgently needs to be solved in laser chip surface defect detection. Utility Model Content

[0004] In order to overcome the above technical problems, the purpose of this utility model is to provide a laser chip surface defect detection device based on machine vision, which can realize the automated detection of surface defects of laser chips and screen out defective chips.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A laser chip surface defect detection device based on machine vision includes a chip delivery system, an image acquisition system, and a chip acquisition platform.

[0007] The chip delivery system is used to deliver the waffle box 32 containing the chip to the chip acquisition platform.

[0008] The image acquisition system is used to acquire images of each chip individually.

[0009] The chip acquisition platform is used to inspect chips, and after completion, defective chips and defect-free chips are classified.

[0010] The chip conveying system includes a feeding conveyor belt 8, a discharging conveyor belt 47, a photoelectric switch 31, and a chip pick 11.

[0011] The feeding conveyor belt 8 and the discharging conveyor belt 47 are located on both sides of the defect detection device. A chip acquisition platform is set between the feeding conveyor belt 8 and the discharging conveyor belt 47. A crossbeam 34 is set directly above the feeding conveyor belt 8 and the discharging conveyor belt 47. A photoelectric switch 33 is installed directly above the feeding conveyor belt 8 and the discharging conveyor belt 47 on the crossbeam 34. The photoelectric switch 33 is used to detect whether the waffle box containing the laser chip has moved to the designated position. The photoelectric switch 33 is used to detect whether the waffle box 32 containing the laser chip has moved to the designated position. After reaching the designated position, a signal is sent, the discharging conveyor belt moves, and the feeding conveyor belt 8 moves the waffle box to the designated position.

[0012] The chip acquisition platform includes an upper platform 25. A chip pick 11 is installed on the lead screw 12 and slide bar 17 above the upper platform 25. The chip pick 11 has a square structure with two holes at the top and a protruding elongated structure at the bottom. The upper end of the chip pick 11 has two holes for connecting the lead screw 12 and slide bar 17. The lower end of the chip pick 11 is elongated and used to move the waffle box from the feeding conveyor belt 8 to the designated image acquisition area. After the image acquisition is completed, the waffle box is moved onto the discharge conveyor belt 47.

[0013] The image acquisition system includes an industrial camera 14, a lens 16, and a light source 45; the industrial camera 14 is mounted on a camera mount 13, the lens 16 is mounted on the industrial camera 14, and the light source 45 is mounted above a light source bracket 1 44 and a light source bracket 2 46.

[0014] Among them, the first light source bracket 44 and the second light source bracket 46 are located directly below the lens 16. The first light source bracket 44 and the second light source bracket 46 are fixed by the light source connecting frame 42. The light source connector 43 connects the light source connecting frame 42 and the second crossbeam 34.

[0015] Four columns 1 are provided on the upper surface of the four corners of the base plate 9. A square frame beam 2 is provided on the top of the column 1. A slide rod 3 and a lead screw 4 are installed at the bottom of the beam 2 located on both sides of the feeding conveyor belt 8 and the discharging conveyor belt 47. A slider 5 is provided on the slide rod 3 and the lead screw 4. The bottom of the lead screw 4 is connected to a motor 7. The motor 7 is installed on a motor support 6, which is located on the surface of the base plate 9.

[0016] The slide bar 3 is parallel to the lead screw 4, and the slider 5 between the feed conveyor belt 8 and the discharge conveyor belt 47 is connected by a connecting rod, with a camera support 13 installed in the center of the connecting rod.

[0017] The chip acquisition platform includes an upper platform 25 and a lower platform 22, which are connected by a guide rail 28 and a slider 30. The upper surface of the lower platform 22 is equipped with a guide rail 28 and a motor 37. A gear 26 installed above the motor 32 meshes with a rack 29 installed at the front end of the upper platform. The upper platform 25 moves left and right above the lower platform 22, and the lower platform 22 drives the upper platform 25 to move back and forth.

[0018] Motor 24, Upper Platform 35, Lower Platform 22, Slider 3 30, Guide Rail 2 28, Gear 26, Rack 29, Motor 3 27;

[0019] Motor 24 and guide rail 23 are mounted on the base plate 9, which is the base of the entire device. The lower platform 22 is connected to guide rail 23 via slider 21 and to motor 24 via lead screw.

[0020] The two guide rails 23 installed on the base plate 9 are located on the left and right sides below the lower platform 22 and are connected to the sliders 21 on the left and right sides below the lower platform 22. The two guide rails 28 installed on the lower platform 22 are located on the front and rear sides of the upper platform 25 and are connected to the sliders 30 on the front and rear sides of the upper platform 25. The rack 29 is located at the front end of the upper platform and meshes with the gear 26. The lead screw installed on the motor 24 is parallel to the guide rails 23 and is located in the center of the two guide rails 23 on the base plate.

[0021] The beneficial effects of this utility model are:

[0022] This invention can meet the defect detection needs of laser chips of different sizes by controlling the height of the industrial camera and changing the lens. It can also replace different types of light sources and adjust the angle and height of the light sources to adapt to different detection scenarios.

[0023] The chip acquisition platform moves the laser chip via a lead screw, slider, and rack and pinion mechanism, allowing the image acquisition system to capture images of the chip at various locations for defect detection. This solves the problem of small laser chip defects, large field of view, and difficulty in acquisition. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0025] Figure 2 This is a schematic diagram of the chip transmission system.

[0026] Figure 3 This is a schematic diagram of the image acquisition system.

[0027] Figure 4 This is a schematic diagram of the chip acquisition platform structure.

[0028] Figure 5 This is a schematic diagram of the chip pick structure. Detailed Implementation

[0029] The present invention will now be described in further detail with reference to the accompanying drawings.

[0030] Reference Figure 1 A laser chip defect detection device based on machine vision includes a laser chip transmission system, an image acquisition system, and a chip acquisition platform.

[0031] The laser chip delivery system includes a feeding conveyor belt 8, a discharging conveyor belt 47, a photoelectric switch 1 31, a photoelectric switch 2 33, and a chip lever 11. The feeding conveyor belt 8 and the discharging conveyor belt 47 are installed on both sides of the device. Support frames 20 are installed on the left and right columns at the rear of the device. A sliding rod support 19, a lead screw support 18, and a crossbeam 2 34 are installed above the support frames 20. Photoelectric switches 1 31 and 2 33 are installed below the crossbeam 2 34, respectively, directly above the feeding conveyor belt 8 and the discharging conveyor belt 47. A sliding rod 2 17 is installed in the middle of the sliding rod support 19 on the left and right sides of the feeding conveyor belt 8 and the discharging conveyor belt 47. A ball screw 2 12, connected to the motor 10, is installed above the lead screw support 18. Chip lever 11 is installed above lead screw 12 and slide bar 17. A slider is installed between chip lever 11 and lead screw 12 to form a ball screw structure. A slider is installed between chip lever 11 and slide bar 17.

[0032] The image acquisition system includes an industrial camera 14, a high-magnification lens 16, and a ring light source 45. A motor 41 is mounted directly below the crossbeams 2 on both sides of the device. A motor support 40 is mounted externally to the motor 41, used to fix the motor 41 and the slide rod 39. The motor 41 is connected to a lead screw 39, with the other end fixed above the crossbeam 2 via the lead screw support. The bottom end of the slide rod 39 is fixed to the motor support 40, and the top end is fixed to the crossbeam 2. A slider 36 is mounted on the lead screw 39 and the slide rod 35, and cooperates with the slider on the other side of the device to install fixing rods 37 and 38. A fixing base 13 is mounted above the fixing rods 37 and 38, located directly above the chip inspection stage, i.e., the upper platform 25. A camera base 15 is mounted below the fixing base 13, used to mount the industrial camera 14, and the high-magnification lens 16 is connected to the industrial camera 14.

[0033] Light source connector 43 is installed at the bottom of crossbeam 2 34 to fix the light source. Light source bracket 1 44 and light source bracket 2 46 are installed above light source connector 42, and light source connector 42 is connected to light source connector 43. Ring light source 45 is installed above light source bracket 1 44 and light source bracket 2 46.

[0034] Light source bracket 1 (44) and light source bracket 2 (46) can be changed to different light source types according to different working scenarios and detection objects, such as strip light sources. The angle and height of the light source can also be adjusted, which can more clearly acquire chip images and improve the detection accuracy.

[0035] The chip acquisition platform structure includes an upper platform 25, a second motor 24, a lower platform 22, a rack 29, a gear 26, a third motor 27, a second guide rail 28, a third slider 30, a first guide rail 23, and a second slider 21.

[0036] Two guide rails 23 are installed above the base plate 9. Four sliders 21 are installed on the lower platform 22, and the sliders 21 are mounted on the guide rails 23. A motor 27 is installed above the base plate 9, and the motor 27 is connected to the lower platform 22 via a lead screw. A guide rail 28 is installed above the lower platform. Slider 30 is installed below the upper platform 25, and the upper platform 25 is connected to the guide rails 28 via slider 30. A rack is installed on the front side of the upper platform 25, and motor 27 is installed in front of it. A gear 26 is installed above motor 27 and meshes with the rack. When the waffle box 32 containing the chip moves to the center of the chip inspection platform 23, the industrial camera 14 begins to capture images of the chip surface to perform defect inspection on the laser chip.

[0037] The working principle of this utility model:

[0038] When the device starts running, the waffle box 32 containing the laser chip is conveyed into the device from the feeding conveyor belt 8. When the waffle box 32 moves along the feeding conveyor belt 8 to the area below the photoelectric switch 31, the photoelectric switch 31 detects the waffle box 32 and sends a signal to the controller to control the feeding conveyor belt 8 to stop moving. Next, the motor 10 drives the lead screw 12 to start rotating, and the chip lever 11 pushes the waffle box 32 to move from right to left. After the waffle box 32 moves to the center of the detection platform 25, the motor 10 drives the lead screw 12 to reverse. After the chip lever 11 returns to its initial position, the motor 10 stops rotating.

[0039] Furthermore, when the chip lever 11 moves the waffle box 32 containing the laser chip below the industrial camera 14, the ring light source 45 and the industrial camera 14 are activated. The motors 41 on both sides drive the lead screw to rotate, and the slider 36 moves up and down, thereby moving the industrial camera 14 up and down. The camera height is adjusted according to the size of the laser chip, and the height of the light source is adjusted by adjusting the installation of the light source connector 43. Moreover, the light source brackets 44 and 45 can be replaced with different types of light sources, such as strip light sources, according to different working scenarios and detection objects. The angle and height of the light sources can also be adjusted, allowing for clearer acquisition of chip images and improving detection accuracy.

[0040] Furthermore, during the inspection process, motor 24 drives the lead screw to rotate, controlling the lower platform 22 to move back and forth, thereby moving the waffle box 32 back and forth. Motor 3 27 drives the gear 26 to rotate, controlling the upper platform 25 to move left and right, thereby moving the waffle box 32 left and right. In conjunction with the industrial camera 14, images of the chip at various locations within the waffle box 32 can be acquired, allowing for defect detection on its surface. After the chip inspection is complete, motors 24 and 27 rotate, controlling the upper platform 25 and the lower platform 22 to move, returning the waffle box 32 to its initial position.

[0041] Furthermore, after the laser chip completes the inspection, motor 10 drives lead screw 12 to rotate, and chip lever 11 moves from right to left, moving the waffle box 32 located above the inspection table 25 to above the discharge conveyor belt 47. Photoelectric switch 33 detects the waffle box 32 and sends a signal to the controller, controlling the motor to move the discharge conveyor belt 47. If the chip is found to be defect-free, the discharge conveyor belt 47 moves the waffle box 32 forward; if the chip is found to be defective, the discharge conveyor belt 47 moves the waffle box 32 backward.

Claims

1. A laser chip surface defect detection device based on machine vision, characterized in that, Includes chip delivery system, image acquisition system, and chip acquisition platform; The chip delivery system is used to deliver the waffle box (32) containing the chip to the chip acquisition platform. The image acquisition system is used to acquire images of each chip individually. The chip acquisition platform is used to inspect chips, and after completion, defective chips and defect-free chips are classified. The chip delivery system includes a feeding conveyor belt (8), a discharging conveyor belt (47), a photoelectric switch (31), and a chip pick (11). The feeding conveyor belt (8) and the discharging conveyor belt (47) are located on both sides of the upper surface of the base plate (9). A chip acquisition platform is set in the middle of the feeding conveyor belt (8) and the discharging conveyor belt (47). A crossbeam two (34) is set directly above the feeding conveyor belt (8) and the discharging conveyor belt (47). A waffle box (32) and a photoelectric switch two (33) are installed on the crossbeam two (34) directly above the corresponding feeding conveyor belt (8) and the discharging conveyor belt (47). The photoelectric switch two (33) is used to detect whether the waffle box (32) containing the laser chip has moved to the designated position. The chip acquisition platform includes an upper platform (25). A chip pick (11) is installed on the lead screw (12) and slide bar (17) above the upper platform (25). The chip pick (11) includes a square structure with two holes at the top and a protruding elongated structure at the bottom. The chip pick (11) has two holes at the top for connecting the lead screw (12) and slide bar (17). The chip pick (11) has an elongated structure at the bottom for moving the waffle box (32) onto the discharge conveyor belt (47). 2.The machine vision-based laser chip surface defect detection device according to claim 1, wherein, Four columns (1) are provided on the upper surface of the four corners of the base plate (9). A square frame beam (2) is provided on the top of the column (1). A sliding rod (3) and a lead screw (4) are installed at the bottom of the beam (2) located on both sides of the feeding conveyor belt (8) and the discharging conveyor belt (47). A slider (5) is provided on the sliding rod (3) and the lead screw (4). The bottom of the lead screw (4) is connected to a motor (7). The motor (7) is installed on a motor support (6). The motor support (6) is located on the surface of the base plate (9). 3.The machine vision-based laser chip surface defect detection device according to claim 2, wherein, The image acquisition system includes an industrial camera (14), a lens (16), and a light source (45); the industrial camera (14) is mounted on a camera mount (13), the lens (16) is mounted on the industrial camera (14), and the light source (45) is mounted above the first light source bracket (44) and the second light source bracket (46); Among them, the first light source bracket (44) and the second light source bracket (46) are set directly below the lens (16). The first light source bracket (44) and the second light source bracket (46) are fixed by the light source connector (43). The light source connector (43) connects the light source connector (42) and the second beam (34).

4. The machine vision-based laser chip surface defect detection device according to claim 3, wherein, The slide bar (3) is parallel to the lead screw (4), and the slider (5) between the feed conveyor belt (8) and the discharge conveyor belt (47) is connected by a connecting rod, with a camera support (13) installed in the center of the connecting rod.

5. The machine vision-based laser chip surface defect detection device according to claim 1, wherein, The chip acquisition platform includes an upper platform (25) and a lower platform (22). The upper platform (25) and the lower platform (22) are connected by a guide rail (28) and a slider (30). The upper surface of the lower platform (22) is equipped with a guide rail (28) and a motor (27). A gear (26) installed above the motor (27) meshes with a rack (29) installed at the front end of the upper platform. The upper platform (25) moves left and right above the lower platform (22), and the lower platform (22) drives the upper platform (25) to move back and forth.

6. The machine vision-based laser chip surface defect detection device according to claim 5, wherein, Motor 2 (24) and guide rail 1 (23) are installed above the base plate (9). The base plate (9) is the base of the entire device. The lower platform (22) is connected to the guide rail 1 (23) through slider 2 (21) and to motor 2 (24) through a lead screw. The two guide rails (23) installed on the base plate (9) are located on the left and right sides below the lower platform (22) and connected to the sliders (21) on the left and right sides below the lower platform (22). The two guide rails (28) installed on the lower platform (22) are located on the front and rear sides of the upper platform (25) and connected to the sliders (30) on the front and rear sides of the upper platform (25). The rack (29) is located at the front end of the upper platform and meshes with the gear (26). The lead screw installed on the motor (24) is parallel to the guide rails (23) and located in the center of the two guide rails (23) on the base plate.

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