A server heat dissipation structure

Abstract

This utility model discloses a server heat dissipation structure, relating to the field of heat dissipation structures. It includes a base plate and a heat spreader. Multiple sets of first fins are mounted on the top of the base plate, and multiple sets of connecting pipes are also provided on the top of the base plate. Contact pipes are fixed to the ends of the connecting pipes, and the connecting pipes and contact pipes constitute heat pipes. The top of the heat spreader contacts the bottom of the contact pipes, and a protruding plate is mounted on the bottom of the heat spreader. This utility model solves the problem of existing air-cooling methods where the ends of the connecting pipes penetrate the first fins, and the contact pipes contact the bottom of the second fins and the top of the heat spreader. Through the connecting pipes, heat spreader, first fins, and second fins, better heat dissipation is achieved. The baffle can block airflow within the limited space, allowing airflow to pass only through the gaps between the first and second fins, thus achieving a better heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structures, specifically a server heat dissipation structure. Background Technology

[0002] With the evolution of semiconductor technology, the wattage of CPU processors has been increasing day by day, and the power consumption has been growing. Heat dissipation design has also become a major field and issue. Heat dissipation is the key to determining whether a server can reduce long-term costs and achieve stable performance. Poor heat dissipation can lead to the failure of system components and a reduction in system lifespan. At the same time, the electricity cost of data center cooling will also increase significantly, which may bring unpredictable risks.

[0003] With increasingly limited space for heat dissipation in modern server devices and a sharp increase in CPU heat flux density, air-cooled products have become the mainstream design method for electronic heat dissipation due to their simple production structure, high mass production capability, and low cost. However, air-cooled heat dissipation has low efficiency, which leads to poor heat dissipation effect. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide a server heat dissipation structure to solve the technical problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a server heat dissipation structure, including a base plate and a heat spreader plate. The top of the base plate is equipped with multiple sets of first fins, and the top of the base plate is provided with multiple sets of connecting pipes. The ends of the connecting pipes are fixed with contact pipes, and the connecting pipes and contact pipes constitute heat pipes. The top of the heat spreader plate contacts the bottom of the contact pipes, and the bottom of the heat spreader plate is equipped with a protruding plate. The contact pipes are laid flat on top of the base plate. The top of the heat spreader plate is provided with a retaining plate, and the top of the retaining plate is provided with multiple sets of second fins.

[0006] By adopting the above technical solution, the problem of existing air-cooled heat dissipation methods is solved. The end of the connecting pipe passes through the first fin, and the contact pipe contacts the bottom of the second fin and the top of the heat spreader. Through the connecting pipe, heat spreader, first fin and second fin, heat dissipation can be better achieved. The baffle can block the airflow in the limited space, so that the airflow can only pass through the gap between the first fin and the second fin, thereby achieving a better heat dissipation effect.

[0007] The present invention is further configured such that both ends of the second fin and the first fin are fixed with horizontal plates, and the horizontal plates are in contact with the bottom plate and the heat exchange plate.

[0008] Preferably, the horizontal plate can increase the contact area between the second fin and the heat dissipation plate and the card plate, thereby increasing the heat dissipation area. The first fin can increase the contact area with the base plate, thereby increasing the heat dissipation area of ​​the first fin.

[0009] The present invention is further configured such that a through hole is provided inside the first fin, and the inner wall of the through hole is in contact with the outer wall of the connecting pipe.

[0010] Preferably, the through hole not only limits the end of the connecting pipe, but also allows the first fin to contact the connecting pipe for better heat dissipation.

[0011] The present invention is further configured such that the cross-section of the contact tube is rectangular.

[0012] Preferably, the rectangular arrangement of the contact tubes increases the contact area with the heat spreader, thereby enabling better heat dissipation.

[0013] The present invention is further provided that a baffle is fixed on the top of the base plate.

[0014] Preferably, the baffle can block the airflow. When the airflow blows towards the baffle, the baffle blocks the airflow, so the airflow will flow to one side and pass through the gap between the first fin and the second fin.

[0015] The present invention is further configured such that the heat spreader and the card plate are fixed by welding.

[0016] Preferably, the clamping plate engages with the outer wall of multiple sets of contact tubes, thereby limiting the position of the contact tubes. Welding can fix the clamping plate and the heat spreader plate together, thus avoiding the problem of the contact tubes separating from the heat spreader plate.

[0017] In summary, the present invention has the following main advantages:

[0018] This invention solves the problem of existing air-cooled heat dissipation methods by incorporating a base plate, a heat spreader, a first fin, a second fin, a connecting pipe, and a contact pipe. The end of the connecting pipe passes through the first fin, and the contact pipe contacts the bottom of the second fin and the top of the heat spreader. The connecting pipe and the contact pipe form a heat pipe, which extends the heat dissipation path and improves the heat dissipation effect. The connecting pipe, heat spreader, first fin, and second fin enable better heat dissipation. The baffle blocks the airflow in the confined space, allowing the airflow to pass only through the gap between the first fin and the second fin, thus achieving better heat dissipation. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is a side view of the present invention;

[0021] Figure 3This is a schematic diagram showing the connection between the contact tube and the card plate of this utility model;

[0022] Figure 4 This is a schematic diagram showing the connection between the connecting pipe and the contact pipe of this utility model;

[0023] Figure 5 This is a perspective view of the first fin of this utility model;

[0024] Figure 6 This is a perspective view of the second fin of this utility model.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1. Base plate; 2. Baffle; 3. First fin; 4. Heat spreader; 5. Clamping plate; 6. Second fin; 7. Connecting pipe; 8. Convex plate; 9. Contact pipe; 10. Through hole; 11. Horizontal plate; 12. Thermal pad. Detailed Implementation

[0027] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0028] The embodiments of this utility model will be described below based on its overall structure.

[0029] Please see Figures 1-6 The system includes a base plate 1 and a heat spreader 4. Multiple sets of first fins 3 are mounted on the top of the base plate 1, and multiple sets of connecting pipes 7 are also mounted on the top of the base plate 1. Contact pipes 9 are fixed to the ends of the connecting pipes 7, and the connecting pipes 7 and contact pipes 9 constitute a heat pipe. The top of the heat spreader 4 contacts the bottom of the contact pipes 9, and a protruding plate 8 is mounted on the bottom of the heat spreader 4. The contact pipes 9 are laid flat above the base plate 1. A retaining plate 5 is mounted on the top of the heat spreader 4, and multiple sets of second fins 6 are mounted on the top of the retaining plate 5. The base plate 1, heat spreader 4, heat pipes, first fins 3, and second fins constitute a heat dissipation structure, which dissipates heat from the server. Multiple sets of thermal conductive pads 12 are mounted on the bottom of the protruding plate 8, which facilitate better heat conduction, allowing the heat spreader 4 to dissipate heat more effectively.

[0030] For details regarding the above embodiments, please refer to [link / reference]. Figure 5 and Figure 6 Both ends of the second fin 6 and the first fin 3 are fixed with horizontal plates 11, and the horizontal plates 11 are in contact with the base plate 1 and the heat dissipation plate 4. The horizontal plates 11 can increase the contact area between the second fin 6 and the heat dissipation plate 4 and the card plate 5, thereby increasing the heat dissipation area. The first fin 3 can increase the contact area with the base plate 1, thereby increasing the heat dissipation area of ​​the first fin 3.

[0031] For details regarding the above embodiments, please refer to [link / reference]. Figure 1 and Figure 5 The first fin 3 has a through hole 10 inside, and the inner wall of the through hole 10 is in contact with the outer wall of the connecting pipe 7. The through hole 10 can not only limit the end of the connecting pipe 7, but also make the first fin 3 contact the connecting pipe 7 for better heat dissipation.

[0032] For details regarding the above embodiments, please refer to [link / reference]. Figure 3 and Figure 4 The cross-section of the contact tube 9 is set to a rectangle. The rectangular design of the contact tube 9 can increase the contact area between it and the heat spreader 4, thereby enabling better heat dissipation.

[0033] For details regarding the above embodiments, please refer to [link / reference]. Figure 1 and Figure 3 A baffle 2 is fixed on the top of the base plate 1. The baffle 2 can block the airflow. When the airflow blows towards the baffle 2, the baffle 2 blocks the airflow, so the airflow will flow to one side and pass through the gap between the first fin 3 and the second fin 6.

[0034] For details regarding the above embodiments, please refer to [link / reference]. Figure 1 and Figure 3 The heat spreader 4 and the clamping plate 5 are fixed by welding. The clamping plate 5 is clamped onto the outer wall of the multiple sets of contact tubes 9, thereby limiting the contact tubes 9. The welding method can fix the clamping plate 5 and the heat spreader 4, thus avoiding the problem of the contact tubes 9 separating from the heat spreader 4.

[0035] In practical operation, this invention involves installing multiple sets of contact tubes 9 on the top of the heat spreader 4. The bottom plane of the contact tubes 9 allows for better contact with the heat spreader 4. The end of the connecting tube 7 is inserted into the through hole 10, and the connecting tube 7 contacts the first fin 3. Then, the clamping plate 5 is engaged with the outer wall of the contact tube 9, and the clamping plate 5 is fixedly connected to the heat spreader 4 by welding. The heat dissipation structure is then installed at a designated location. Due to limited space at the designated location, during air cooling, the airflow blows towards the baffle 2. Under the action of the baffle 2, the airflow will flow to one side. Finally, the airflow will pass through the gap between the first fin 3 and the second fin 6, dissipating heat from the first fin 3 and the second fin 6, thus improving the heat dissipation effect of the first fin 3 and the second fin 6. The heat is then further dissipated through the heat spreader and heat pipes, resulting in even better heat dissipation.

[0036] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A server heat dissipation structure comprising a bottom plate (1) and a heat plate (4), characterized in that: The top of the base plate (1) is equipped with multiple sets of first fins (3), and the top of the base plate (1) is provided with multiple sets of connecting pipes (7). The end of the connecting pipe (7) is fixed with a contact pipe (9), and the connecting pipe (7) and the contact pipe (9) constitute a heat pipe. The top of the heat spreader (4) is in contact with the bottom of the contact pipe (9), and the bottom of the heat spreader (4) is equipped with a protruding plate (8). The contact pipe (9) is laid flat above the base plate (1). The top of the heat spreader (4) is provided with a clamping plate (5), and the top of the clamping plate (5) is provided with multiple sets of second fins (6).

2. The server heat dissipation structure of claim 1, wherein: Both ends of the second fin (6) and the first fin (3) are fixed with a horizontal plate (11), and the horizontal plate (11) is in contact with the bottom plate (1) and the heat spreader (4).

3. The server heat dissipation structure according to claim 1, characterized in that: The first fin (3) has a through hole (10) inside, and the inner wall of the through hole (10) is in contact with the outer wall of the connecting pipe (7).

4. The server heat dissipation structure according to claim 1, characterized in that: The cross-section of the contact tube (9) is set to rectangular.

5. A server heat dissipation structure according to claim 1, characterized in that: A baffle (2) is fixed to the top of the base plate (1).

6. A server heat dissipation structure according to claim 1, characterized in that: The heat spreader (4) and the card plate (5) are fixed by welding.

7. A server heat dissipation structure according to claim 1, characterized in that: The bottom of the convex plate (8) is provided with multiple sets of thermal conductive pads (12).

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