Efficient heat dissipation edge computing box

Abstract

The utility model relates to a kind of high-efficiency heat-dissipating edge computing box, to the poor heat dissipation effect, loud or complex structure problem of existing edge computing box, including shell and circuit board component, heating element is equipped on circuit board component, shell top plate upper surface has multiple heat dissipation fins, still including the heat plate that heat transfer medium circulates heat dissipation between hot area and cold area, heat plate is fixed on top plate lower surface, lower surface is pasted with heating element, heat plate hot area is close to heating element, cold area is close to top plate.Heat plate liquid working medium absorbs heating element heat and vaporizes to rise to cold area, heat is dissipated through top plate, steam condenses and backflows to hot area to circulate heat dissipation.The utility model realizes efficient heat transfer by heat plate phase change circulation, and heat dissipation effect is good, simultaneously without fan, reduce equipment noise, simplify assembly procedure, save installation space, improve equipment running stability and environmental adaptability.

Description

Technical Field

[0001] This utility model belongs to the field of edge computing technology, and in particular relates to an edge computing box with high-efficiency heat dissipation. Background Technology

[0002] An edge computing box is a high-performance hardware device integrating edge computing capabilities, serving as the core hardware carrier in the edge computing field. Because it not only possesses the ability to process large volumes of data locally but also boasts superior real-time computing power, it is widely used in the field of safe production, primarily in various vertical industries such as power, chemical, coal mining, and transportation. It also includes scenarios such as smart property management, smart city management, smart canteens, smart construction sites, smart campuses, and smart parks. Therefore, edge computing boxes must meet the requirements of high performance and comprehensive functionality. Such high-performance, high-power products inevitably generate high heat; thus, excellent heat dissipation is a necessary condition to support their powerful computing performance. With the continuous improvement of the operating parameters and integration of power electronic components, their unit heat generation has increased dramatically.

[0003] Currently, edge computing boxes mainly use the following two heat dissipation methods:

[0004] 1. Using the fins on the outer casing for natural heat dissipation results in poor heat dissipation and may reduce the working efficiency of the edge computing box, as shown in Chinese patent document with patent application number 202420067677.6.

[0005] 2. Using the heat sink and fan built into the casing for heat dissipation not only has limited heat dissipation effect, but also generates some noise from the edge computing box, the assembly process is relatively complicated, and it occupies a lot of space, as shown in Chinese patent document with patent application number 202421218243.8. Utility Model Content

[0006] Based on this, and to address the aforementioned technical problems, an edge computing box with high-efficiency heat dissipation is provided.

[0007] The technical solution adopted in this utility model is as follows:

[0008] An efficient heat dissipation edge computing box includes a housing and a circuit board assembly disposed within the housing. The circuit board assembly has a heat-generating element. The top plate of the housing has a plurality of heat dissipation fins covering its upper surface. The box is characterized by further including a heat plate for heat dissipation through a phase change cycle of a working fluid in a hot zone and a cold zone. The heat plate is fixed to the lower surface of the top plate, and the lower surface of the heat plate is in contact with the heat-generating element. The hot zone of the heat plate is close to the heat-generating element, and the cold zone is close to the top plate.

[0009] The beneficial effects of this utility model are as follows:

[0010] 1. Significantly improved heat dissipation efficiency: Through the phase change cycle of the working fluid inside the hot plate (liquid absorbs heat and vaporizes → steam rises and dissipates heat → condenses and flows back), efficient heat transfer between the heating element and the top plate is achieved. Compared with traditional natural heat dissipation or fan cooling methods, the heat exchange efficiency is higher, and the heat of the core components can be quickly dissipated, effectively solving the problem of performance degradation caused by overheating of the edge computing box.

[0011] 2. Significantly reduced operating noise: The traditional fan cooling structure is eliminated, and silent operation is achieved through pure passive phase change cooling, avoiding interference from mechanical fan noise. It is especially suitable for noise-sensitive scenarios such as offices, homes, and medical facilities.

[0012] 3. Simplified structure and convenient assembly: Complex components such as fans and air ducts are omitted, simplifying the assembly process, reducing production complexity and labor costs, and improving the consistency of equipment assembly.

[0013] 4. Optimized space utilization: No need to reserve space for fan installation and airflow channels, which can significantly reduce the overall size of the device and meet the installation requirements of miniaturization and lightweighting in edge computing scenarios.

[0014] 5. Enhanced reliability and stability: Eliminating easily damaged moving parts such as fans reduces the risk of mechanical failure, improves the long-term stability of equipment operation, and at the same time reduces maintenance frequency and costs, extending product lifespan. Attached Figure Description

[0015] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments:

[0016] Figure 1 A three-dimensional structural diagram of an edge computing box with high heat dissipation provided for an embodiment of this utility model;

[0017] Figure 2 An exploded view of an edge computing box with high heat dissipation provided in an embodiment of this utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the lower surface of the top plate in an embodiment of the present utility model;

[0019] Figure 4 This is a schematic diagram of the structure of the hot plate and heat pipe fixed on the lower surface of the top plate according to an embodiment of the present invention;

[0020] Figure 5 This is a cross-sectional view of an edge computing box with high heat dissipation provided in an embodiment of the present invention. Detailed Implementation

[0021] The embodiments of this utility model will be described below with reference to the accompanying drawings. It should be noted that the embodiments described in this specification are not exhaustive and do not represent the only embodiments of this utility model. The following corresponding embodiments are only for clearly illustrating the utility model content of this patent and are not intended to limit its implementation. For those skilled in the art, different variations and modifications can be made based on the described embodiments. Any obvious variations or modifications that fall within the technical concept and utility model content of this utility model are also within the protection scope of this utility model.

[0022] like Figure 1 and Figure 2 As shown, this application embodiment provides an edge computing box with high-efficiency heat dissipation, including a housing 1100, a circuit board assembly 1200 disposed within the housing 1100, a heat plate 1300, and a heat pipe 1400.

[0023] like Figure 1 and Figure 2 As shown, the outer shell 1100 is composed of a top plate 1110, left and right side plates 1120, a front panel 1130, a rear panel 1140, and a bottom plate 1150. The top plate 1110 and the left and right side plates 1120 are integrally connected and form an inverted U-shape. The front panel 1130, the rear panel 1140, and the bottom plate 1150 are fixed to the top plate 1110 and the left and right side plates 1120 by bolts.

[0024] The upper surface of the top plate 1110 is covered with multiple heat dissipation fins 1111. The multiple heat dissipation fins 1111 are arranged side by side and spaced apart along the left and right directions of the outer shell 1100. The length direction of the heat dissipation fins 1111 is the front and back direction of the outer shell 1100.

[0025] like Figure 3 As shown, the lower surface of the top plate 1110 has a rectangular lower protrusion 1112 in the front-to-back direction at the middle position, and the middle of the rectangular lower protrusion 1112 has an upwardly recessed groove 1112a for accommodating the hot plate 1300.

[0026] The lower surface of the top plate 1110 has a first groove 1113 and two second grooves 1114 for accommodating the heat pipe 1400. One end of the first groove 1113 starts at the rear sidewall of the groove 1112a and then extends sequentially to the rear, left, forward, right, rear, left, and forward, ending at the right sidewall of the groove 1112a. The first groove 1113 has multiple meandering sections. The two second grooves 1114 start at the front sidewall of the groove 1112a and then extend forward in parallel straight lines with gradually increasing spacing, ending at the rear area of ​​the front section of the first groove 1113. The first groove 1113 and the two second grooves 1114 together form a layout that is evenly distributed around the groove 1112a.

[0027] like Figure 3 As shown, the lower surface of the top plate 1110 also has a plurality of mounting posts 1115 and guide posts 1116 for mounting the circuit board assembly 1200.

[0028] Both left and right side panels 1120 have multiple heat dissipation fins arranged side-by-side at intervals, and both are fixed to mounting brackets 1121 by bolts. The mounting brackets 1121 have mounting holes. (See attached image.) Figure 1 and Figure 2 .

[0029] like Figure 2 As shown, the front panel 1130 has a slot for exposing terminals located on the front side of the circuit board assembly 1200. The position of the slot is determined according to the position of the terminal. The size and shape of the slot are basically the same as those of the corresponding terminal to prevent a large amount of external dust from entering the device cavity.

[0030] like Figure 2 As shown, the rear panel 1140 has a slot for exposing terminals located on the rear side of the circuit board assembly 1200. The slot is substantially the same size and shape as the corresponding terminal to prevent a large amount of external dust from entering the device cavity.

[0031] like Figure 2 As shown, the circuit board assembly 1200 includes a PCBA baseboard 1210 and a PCBA computing board 1220.

[0032] The PCBA base plate 1210 has mounting holes and guide holes. The mounting holes correspond vertically to the mounting posts 1115, and the guide holes correspond vertically to the guide posts 1116. The PCBA base plate 1210 is fixed by screws that connect to the threaded holes on the mounting posts 1115 through the mounting holes, thus enabling the PCBA base plate 1210 to be suspended below the top plate 1110.

[0033] The PCBA baseboard 1210 has multiple terminals, which are arranged on the front and rear sides of the baseboard 1210. The types of terminals include USB, indicator lights, switches, power, system debugging, reset, audio, video, network port, storage, SIM card socket, etc.

[0034] The PCBA calculation board 1220 is located above the PCBA base plate 1210. It is fixed to the PCBA base plate 1210 via a connector and forms an electrical connection. It has a heating element 1221 on it. (See attached image) Figure 5 .

[0035] In this embodiment, the heating element 1221 refers to the computing chip.

[0036] like Figure 4As shown, the hot plate 1300 is adapted to the groove 1112a and is fixed in the groove 1112a by using resin as an adhesive. The lower surface of the hot plate 1300 is in contact with the upper surface of the computing chip. See [reference needed]. Figure 5 .

[0037] There are three heat pipes 1400, which are respectively adapted to the first groove 1113 and the two second grooves 1114. Resin is used as an adhesive to secure them precisely within the first groove 1113 and the two second grooves 1114, so that the three heat pipes 1400 are evenly distributed around the hot plate 1300. (See attached image.) Figure 4 It can make full use of the top plate 1300 for distributed heat dissipation.

[0038] Both the hot plate 1300 and the heat pipe 1400 have capillary channels on their inner walls, which can dissipate heat through the phase change cycle of the internal working fluid. This is existing technology and will not be described in detail here. The capillary channels near the top plate 1110 can be considered as cold zones, while the remaining capillary channels are considered as hot zones. For the hot plate 1300, the capillary channels on the lower side near the computing chip constitute the hot zone. The hot zone of the heat pipe 1400 is connected to the hot zone of the hot plate 1300, and the cold zone of the heat pipe 1400 is connected to the cold zone of the hot plate 1300. The hot zone of the hot plate 1300 contains a working fluid (liquid). The liquid absorbs heat from the heating element 1221, turns into steam, and rises to the cold zone of the hot plate 1300. The heat is absorbed by the top plate 1110, the steam condenses back into liquid, and returns to the hot zone. The heat pipe 1400 plays an auxiliary role, further consuming the heat that the hot plate 1300 cannot consume in time. That is, some of the steam in the hot zone of the hot plate 1300 can rise from the hot zone of the heat pipe 1400 to the cold zone of the heat pipe 1400 for consumption. The condensate formed returns to its hot zone via the cold zone of the hot plate 1300. Of course, for application scenarios where the hot plate 1300 alone can consume heat in time, the heat pipe 1400 can also be omitted.

[0039] It is understandable that, in addition to the computing chip, the PCBA computing board 1220 can also contain other heat-generating components, such as DDR memory, inductors, etc. Accordingly, there can be one hot plate 1300, the lower surface of which is in contact with all the heat-generating components; or there can be multiple hot plates 1300, with the lower surfaces of multiple hot plates 1300 corresponding one-to-one with the heat-generating components or in a one-to-many manner.

[0040] As can be seen from the above, the edge computing box with high heat dissipation provided in this application embodiment has the following beneficial effects:

[0041] 1. Significantly improved heat dissipation efficiency: Through the phase change cycle of the working fluid inside the hot plate (liquid absorbs heat and vaporizes → steam rises and dissipates heat → condenses and flows back), efficient heat transfer between the heating element and the top plate is achieved. Compared with traditional natural heat dissipation or fan cooling methods, the heat exchange efficiency is higher, and the heat of the core components can be quickly dissipated, effectively solving the problem of performance degradation caused by overheating of the edge computing box.

[0042] 2. Significantly reduced operating noise: The traditional fan cooling structure is eliminated, and silent operation is achieved through pure passive phase change cooling, avoiding interference from mechanical fan noise. It is especially suitable for noise-sensitive scenarios such as offices, homes, and medical facilities.

[0043] 3. Simplified structure and convenient assembly: Complex components such as fans and air ducts are omitted, simplifying the assembly process, reducing production complexity and labor costs, and improving the consistency of equipment assembly.

[0044] 4. Optimized space utilization: No need to reserve space for fan installation and airflow channels, which can significantly reduce the overall size of the device and meet the installation requirements of miniaturization and lightweighting in edge computing scenarios.

[0045] 5. Enhanced reliability and stability: Eliminating easily damaged moving parts such as fans reduces the risk of mechanical failure, improves the long-term stability of equipment operation, and at the same time reduces maintenance frequency and costs, extending product lifespan.

[0046] In addition, heat pipes help the hot plate dissipate heat, ensuring that the edge computing box can operate stably in high-load, high-heat-generating usage scenarios.

[0047] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A high-efficiency heat dissipation edge computing box, comprising a housing and a circuit board assembly disposed within the housing, the circuit board assembly having a heat-generating element, and a plurality of heat dissipation fins covering the upper surface of the top plate of the housing, characterized in that, It also includes a heat plate for dissipating heat through a phase change cycle of the working fluid in the hot and cold zones. The heat plate is fixed to the lower surface of the top plate, and the lower surface of the heat plate is in contact with the heating element. The hot zone of the heat plate is close to the heating element, and the cold zone is close to the top plate.

2. The edge computing box with high-efficiency heat dissipation according to claim 1, characterized in that, The left and right side panels of the outer casing each have multiple heat dissipation fins arranged side by side at intervals.

3. The edge computing box with high-efficiency heat dissipation according to claim 1, characterized in that, It also includes multiple heat pipes, which are fixed to the lower surface of the top plate and are all connected to the hot plate.

4. The edge computing box with high-efficiency heat dissipation according to claim 3, characterized in that, The lower surface of the top plate has a groove for adapting to the hot plate and a plurality of grooves for adapting to the plurality of heat pipes, and the hot plate and the heat pipes are respectively fixed in the groove and the corresponding groove.

5. The edge computing box with high-efficiency heat dissipation according to claim 4, characterized in that, The multiple heat pipes are evenly distributed around the hot plate.

6. The edge computing box with high-efficiency heat dissipation according to claim 3, characterized in that, The hot zone of the heat pipe is connected to the hot zone of the hot plate, and the cold zone of the heat pipe is connected to the cold zone of the hot plate.

7. The edge computing box with high-efficiency heat dissipation according to claim 1, characterized in that, The circuit board assembly includes a PCBA base plate and a PCBA computing board. The PCBA base plate is suspended below the top plate, and the PCBA computing board is located above the PCBA base plate and is fixed to the PCBA base plate via a connector.

8. A high-efficiency heat dissipation edge computing box according to any one of claims 1-7, characterized in that, The number of heating elements is multiple, and the number of hot plates is one, with the lower surface of the hot plate in contact with all the heating elements.

9. A high-efficiency heat dissipation edge computing box according to any one of claims 1-7, characterized in that, The number of heating elements is multiple, the number of hot plates is multiple, and the lower surfaces of the multiple hot plates are attached to the heating elements in a one-to-one correspondence, or the lower surfaces of the multiple hot plates are attached to the heating elements in a one-to-many manner.

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