An LTE antenna

Abstract

This utility model discloses an LTE antenna, relating to the field of antenna technology. It includes a circuit board (FPC); a radiating circuit formed on the front side of the circuit board through an etching process, comprising multiple frequency band resonant structures, including the LTE frequency band; a groove, the front portion of the circuit board excluding the frequency band resonant structures; a feed point, located on one end surface of the groove; a gap, located at the end of the circuit board near the feed point and extending to the middle of the circuit board; and an adhesive layer, located on the back side of the circuit board and covering the back side. The antenna is directly attached using the adhesive layer, eliminating the need for a traditional antenna bracket. Furthermore, the radiator's placement on the circuit board enhances the antenna's radiation directionality and improves radiation performance. The FPC substrate is ultra-thin and flexible, adapting to curved surfaces and significantly improving antenna integration efficiency and reliability. It is suitable for space-constrained scenarios such as IoT terminals and automotive devices.

Description

Technical Field

[0001] This utility model relates to the field of antenna technology, specifically to an LTE antenna. Background Technology

[0002] With the development of mobile communication technology, all electronic devices can not only be interconnected and intelligent, but the trend of miniaturization of electronic devices is also intensifying. This requires structural size to be small enough for various wearable products, while also requiring high electrical performance, which has brought great difficulties to the traditional terminal antenna design.

[0003] Existing LTE antennas mostly use rigid PCBs or metal sheet structures. Due to the difficulty of fitting the rigid substrate to the curved device shell, additional fasteners are required, increasing assembly costs. In addition, traditional soldering power supply methods are prone to poor contact due to vibration. As a result, the performance of existing antennas has become more limited in practical use and is difficult to adapt to the trend of electronic devices gradually becoming smaller. Utility Model Content

[0004] To address the technical deficiencies in the background art, this utility model discloses an LTE antenna, relating to the field of antenna technology, which solves the aforementioned technical problems and meets practical needs. The specific technical solution is as follows:

[0005] An LTE antenna, comprising:

[0006] Circuit board, wherein the circuit board is an FPC;

[0007] The radiating circuit is formed on the front side of the circuit board by an etching process, and the radiating circuit includes a resonant structure for multiple frequency bands, including the LTE frequency band.

[0008] The groove is the front part of the circuit board excluding the frequency band resonant structure;

[0009] A feed point is provided on one end surface of the groove;

[0010] A gap is provided at the end of the circuit board near the feed point and extends to the middle of the circuit board;

[0011] An adhesive layer is applied to the back of the circuit board and covers the back of the circuit board.

[0012] As a further embodiment of the present invention, a release paper is provided on the outer side of the adhesive layer, and the release paper has at least one cut line on the outer side of the end of the gap located in the middle of the circuit board.

[0013] As a further embodiment of the present invention, the portion of the circuit board located outside the gap on both sides is provided with through holes, one of which penetrates the radiation circuit, and the other of which is located at one end of the groove away from the feed point.

[0014] As a further embodiment of this utility model, the radiation circuit is distributed around the edge of the circuit board.

[0015] As a further embodiment of this utility model, the radiation circuit is a copper foil, the thickness of which is 17um~19um, and the width of which is 3.22mm~3.28mm.

[0016] As a further embodiment of this utility model, the cross-sectional shape of the gap is Z-shaped.

[0017] As a further embodiment of this utility model, the length of the circuit board is 25.20mm~25.24mm, and the width of the circuit board is 18.4mm~18.8mm.

[0018] The beneficial effects of this utility model are as follows: Direct adhesive bonding eliminates the need for traditional antenna brackets, and the radiator's placement on the circuit board enhances the antenna's radiation directionality and improves its radiation effect. The use of FPC substrate, with its ultra-thin and flexible characteristics, adapts to curved surfaces, making installation more convenient and enhancing compatibility. It also provides strong structural stability, significantly improving antenna integration efficiency and reliability, and is suitable for space-constrained scenarios such as IoT terminals and vehicle-mounted devices. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the front structure of the LTE antenna;

[0020] Figure 2 This is a schematic diagram of the back structure of the LTE antenna.

[0021] Figure 3 This is a diagram showing the antenna return loss of the LTE antenna.

[0022] In the diagram, 1 is the circuit board; 2 is the radiating circuit; 3 is the groove; 4 is the feed point; 5 is the gap; 6 is the adhesive layer; 7 is the cut line; 8 is the through hole; and 9 is the release paper. Detailed Implementation

[0023] The embodiments of this utility model will be described below with reference to the accompanying drawings and related examples:

[0024] This utility model discloses an LTE antenna, such as Figures 1-3 As shown, it includes:

[0025] Circuit board 1, wherein the circuit board 1 is an FPC; the FPC substrate has ultra-thin and flexible characteristics, and is suitable for curved surface devices;

[0026] The radiating circuit 2 is formed on the front side of the circuit board 1 by etching. The radiating circuit 2 includes multiple frequency band resonant structures, including the LTE frequency band. The frequency band resonant structures generate a resonance that can cover 1.71G-2.69GMHz.

[0027] Recess 3 is the front part of the circuit board 1 excluding the frequency band resonant structure;

[0028] Feed point 4 is located on one end surface of the groove 3;

[0029] The gap 5 is provided at the end of the circuit board 1 near the feed point 4 and extends to the middle of the circuit board 1; the gap 5 can widen the 0.8G 0.96GMHz bandwidth so that it can fully cover 0.7G 0.96GMHz.

[0030] An adhesive layer 6 is disposed on the back of the circuit board 1 and covers the back of the circuit board 1; the adhesive layer 6 allows for direct bonding and installation, eliminating the need for a traditional antenna bracket, making the installation process more convenient and enhancing compatibility.

[0031] It should be noted that the radiator of this LTE antenna is mounted on circuit board 1, which makes the antenna radiation more directional, has a better radiation effect, and has strong structural stability. It significantly improves the antenna integration efficiency and reliability, and is suitable for space-constrained scenarios such as IoT terminals and vehicle equipment.

[0032] It needs to be further explained that, such as Figure 2 As shown, a release paper 9 is provided on the outer side of the adhesive layer 6, and the release paper 9 has at least one cut line 7 on the outer side of the end of the gap 5 located in the middle of the circuit board 1.

[0033] When the LTE antenna needs to be installed on the device by adhesive, the release paper 9 can be peeled off to expose the adhesive layer 6, so that the back of the LTE antenna can be pasted onto the device to install the device antenna. The setting of the cutting line 7 allows the release paper 9 on the back of the LTE antenna to be partially peeled off as needed according to the actual installation situation, thereby meeting the needs of different devices when installing antennas, and further enhancing the compatibility of LTE antenna installation.

[0034] It needs to be further explained that, such as Figure 1 and Figure 2As shown, the circuit board 1 has through holes 8 on both sides outside the gap 5. One of the through holes 8 passes through the radiation circuit 2, and the other through hole 8 is located at one end of the groove 3 away from the feed point 4.

[0035] The through-hole 8 allows the LTE antenna to be externally fixed, thus fixing its position. This makes the LTE antenna installation more diverse and further meets the needs of different devices when installing antennas.

[0036] Specifically, such as Figure 1 As shown, the radiation circuit 2 is distributed around the edge of the circuit board 1.

[0037] Among them, the radiation circuit 2 is distributed around the circuit board 1, which not only makes the antenna radiation range more directional, but also achieves omnidirectional coverage.

[0038] Specifically, such as Figure 1 As shown, the radiation circuit 2 is made of copper foil, the thickness of which is 17um to 19um and the width of which is 3.22mm to 3.28mm.

[0039] The aforementioned radiating circuit 2 can make the overall size of the antenna smaller, so as to adapt the antenna to installation and operation in small spaces, and can also balance the requirements of electromagnetic shielding and flexibility.

[0040] It needs to be further explained that, such as Figure 1 As shown, the cross-sectional shape of the gap 5 is Z-shaped.

[0041] Among them, the gap 5 enables the coupling of the high-frequency band resonant structure and the mid-frequency band resonant structure. The shape of the gap 5 increases its extension length, which can increase the antenna bandwidth.

[0042] It needs to be further explained that, such as Figure 1 As shown, the length of the circuit board 1 is 25.20mm~25.24mm, and the width of the circuit board 1 is 18.4mm~18.8mm.

[0043] The use of a small circuit board 1 reduces the overall size of the antenna, allowing it to be installed in smaller devices.

[0044] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An LTE antenna, characterized by, include: Circuit board, wherein the circuit board is an FPC; The radiating circuit is formed on the front side of the circuit board by an etching process, and the radiating circuit includes a resonant structure for multiple frequency bands, including the LTE frequency band. The groove is the front part of the circuit board excluding the frequency band resonant structure; A feed point is provided on one end surface of the groove; A gap is provided at the end of the circuit board near the feed point and extends to the middle of the circuit board; An adhesive layer is applied to the back of the circuit board and covers the back of the circuit board.

2. The LTE antenna of claim 1, wherein, A release paper is provided on the outside of the adhesive layer, and the release paper has at least one cut line on the portion of the end of the gap located in the middle of the circuit board.

3. The LTE antenna of claim 1, wherein, The circuit board is provided with through holes on both sides of the gap. One of the through holes passes through the radiation circuit, and the other through hole is located at one end of the groove away from the feed point.

4. The LTE antenna of claim 3, wherein, The radiating circuit is distributed around the edge of the circuit board.

5. The LTE antenna according to claim 3, characterized in that, The radiating circuit is made of copper foil, the thickness of which is 17um to 19um and the width of which is 3.22mm to 3.28mm.

6. The LTE antenna according to claim 1, characterized in that, The cross-sectional shape of the gap is Z-shaped.

7. The LTE antenna according to claim 1, characterized in that, The circuit board has a length of 25.20mm to 25.24mm and a width of 18.4mm to 18.8mm.

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