A compact multi-band signal integration device

Abstract

This utility model discloses a compact multi-band signal integration device, including a dielectric substrate, a high-frequency transmission line, a first input port, a second input port, a third input port, and an integrated output port. The high-frequency transmission line includes a main transmission channel and three independent branch circuits. The main transmission channel is arranged in a continuous zigzag pattern, and the branch circuits are asymmetrically distributed along the extension direction of the main channel. Two grounding vias are provided in the branch circuit corresponding to the third input port, with conductive layers covering the inner walls and periphery of the vias. The dielectric substrate thickness is 0.4–1.0 mm, and the overall size is 50% of that of a conventional device with the same function. Ultra-thin and compact design: Through the zigzag main channel and asymmetrical branch layout, the overall size is compressed to 50% of the conventional solution, adapting to miniaturized base station antennas. High-frequency extension optimization: Grounding vias are added for the 3300–4200MHz frequency band to reduce distributed capacitance effects and improve high-frequency signal transmission efficiency and VSWR stability. Cost and performance are balanced, and installation is convenient.

Description

Technical Field

[0001] This utility model relates to the field of wireless communication equipment technology, and in particular to a compact multi-band signal integration device. Background Technology

[0002] With the widespread adoption of 5G communication technology, base station antennas need to support wider frequency band coverage (such as Sub-6GHz and millimeter-wave bands). Traditional combiners, due to their large size and limited high-frequency performance, cannot meet the demands for compactness and high-frequency expansion. Existing technologies, cavity or air-wire combiners suffer from bulky size and high manufacturing costs; while PCB-based microstrip combiners can reduce size, they suffer from significant high-frequency signal loss and lack optimized design for ultra-wideband frequencies. Furthermore, existing solutions exhibit insufficient impedance matching stability above 3300MHz, easily leading to signal reflection. Therefore, there is an urgent need for an integrated device that balances miniaturization, wideband support, and high-frequency stability. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing a compact multi-band signal integration device.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A compact multi-band signal integrated device includes a dielectric substrate, a high-frequency transmission line, a first input port, a second input port, a third input port, and an integrated output port;

[0006] The high-frequency transmission line includes a main transmission channel and three independent branch circuits. The main transmission channel is arranged in a continuous zigzag shape, and the branch circuits are asymmetrically distributed along the extension direction of the main channel.

[0007] The branch circuit corresponding to the third input port is provided with two grounding vias, and the inner wall and periphery of the vias are covered with a conductive layer.

[0008] The dielectric substrate thickness is 0.4~1.0mm, and the overall size is 50% of that of a conventional device with the same function.

[0009] A further technical solution is that the operating frequency band of the third input port is 3300~4200MHz, and the linewidth of its corresponding branch circuit is smaller than that of other branch circuits.

[0010] A further technical solution involves grounding via diameters of 0.2~0.5mm.

[0011] A further technical solution involves using a high-frequency PCB substrate with a dielectric constant of 2.0 to 3.2 as the dielectric substrate.

[0012] A further technical solution involves providing mounting and positioning holes at the four corners and the center of the edge of the dielectric substrate, with a hole diameter ≤3.5mm.

[0013] A further technical solution involves providing a ground plane on one side of the dielectric substrate.

[0014] Compared with the prior art, the present invention provides a compact multi-band signal integration device, which has the following advantages:

[0015] 1. Ultra-thin and compact design: Through a zigzag main channel and asymmetrical branch layout, the overall size is compressed to 50% of the traditional solution, making it suitable for miniaturized base station antennas;

[0016] 2. High-frequency extension optimization: Grounding vias are added for the 3300~4200MHz frequency band to reduce distributed capacitance effect and improve high-frequency signal transmission efficiency and VSWR stability;

[0017] 3. Cost and performance balance: The use of thin high-frequency substrates and precision etching processes reduces material costs while ensuring multi-band isolation better than 25dB;

[0018] 4. Ease of installation: The miniature positioning hole design is compatible with standard fasteners, simplifying the assembly process. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a compact multi-band signal integration device proposed in this utility model;

[0020] Figure 2 This is a schematic diagram of the ground plane structure of a compact multi-band signal integration device proposed in this utility model.

[0021] In the diagram: 1. Dielectric substrate; 2. Main transmission channel; 3. First input port; 4. Second input port; 5. Third input port; 6. Grounding via; 7. Integrated output port; 8. Mounting positioning hole; 9. Ground plane. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model. In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of the present utility model.

[0023] Example 1: Refer to Figure 1 - Figure 2 A compact multi-band signal integrated device includes a dielectric substrate 1, a high-frequency transmission line, a first input port 3, a second input port 4, a third input port 5, and an integrated output port 7.

[0024] The high-frequency transmission line includes a main transmission channel 2 and three independent branch circuits. The main transmission channel 2 is arranged in a continuous zigzag shape, and the branch circuits are asymmetrically distributed along the extension direction of the main channel.

[0025] The branch circuit corresponding to the third input port 5 is provided with two grounding through holes 6, and the inner wall and periphery of the through holes are covered with a conductive layer.

[0026] The dielectric substrate 1 has a thickness of 0.4~1.0mm and its overall size is 50% of that of a conventional device with the same function.

[0027] The aforementioned compact multi-band signal integration device has a third input port 5 operating in the frequency band of 3300~4200MHz, and the linewidth of its corresponding branch circuit is smaller than that of other branch circuits.

[0028] In the aforementioned compact multi-band signal integration device, the diameter of the grounding via 6 is 0.2~0.5mm.

[0029] The aforementioned compact multi-band signal integration device, wherein the dielectric substrate 1 is a high-frequency PCB material with a dielectric constant of 2.0~3.2.

[0030] The compact multi-band signal integration device has mounting and positioning holes 8 at the four corners and the middle of the edge of the dielectric substrate 1, with a hole diameter ≤ 3.5 mm.

[0031] The aforementioned compact multi-band signal integration device has a ground plane 9 on one side of the dielectric substrate 1.

[0032] Working principle: To solve the problems of excessive size, insufficient high-frequency performance and poor signal integrity of existing combiners, this utility model provides a compact multi-band signal integration device. Through structural optimization and innovative grounding design, it achieves a 50% reduction in size, an extension of the high-frequency band to 4200MHz, and a significant improvement in signal transmission stability.

[0033] Using polytetrafluoroethylene (PTFE) as the substrate, the preferred dielectric constant is 2.65, and the substrate thickness is 0.75 mm. A continuous zigzag-shaped main transmission channel 2 (1.0-1.2 mm linewidth) and three branch circuits are formed by precision etching of the surface copper layer. The third branch circuit 5 (corresponding to the 3300~4200MHz frequency band) has an optimized linewidth of 1-1.8 mm, and 0.25 mm diameter grounding vias 6 are provided at distances of 55 mm and 78 mm from the port. The inner walls of the vias are chemically plated with copper to achieve a low-impedance connection with the underlying ground plane. Mounting and positioning holes 8 are distributed at the four corners of the substrate (1.0 mm diameter) and the midpoint of the long side (0.8 mm diameter), and are fixed with M1.2 screws. Actual measurements show that the device has an insertion loss ≤0.5 dB and a port isolation ≥28 dB at 4200 MHz.

[0034] Example 2: Further optimization: The frequency band of the first input port 3 is 617~960MHz, the frequency band of the second input port 4 is 1710~2700MHz, and the frequency band of the third input port 5 is 3300~4200MHz;

[0035] The linewidth and line length of each branch circuit are designed differently based on the impedance matching requirements of the target frequency band;

[0036] The dielectric substrate 1 is a high-frequency copper-clad laminate, and the copper clad layer on the surface is etched to form the high-frequency transmission line;

[0037] The dielectric substrate 1 has mounting and positioning holes at its four corners and in the middle, with a hole diameter of less than 3.5 mm.

[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The above description is merely a preferred embodiment of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. A compact multi-band signal integration device, characterized by, It includes a dielectric substrate (1), a high-frequency transmission line, a first input port (3), a second input port (4), a third input port (5), and an integrated output port (7); The high-frequency transmission line includes a main transmission channel (2) and three independent branch circuits. The main transmission channel (2) is arranged in a continuous zigzag shape, and the branch circuits are asymmetrically distributed along the extension direction of the main channel. The branch circuit corresponding to the third input port (5) is provided with two grounding through holes (6), and the inner wall and periphery of the through holes are covered with a conductive layer; The dielectric substrate (1) has a thickness of 0.4 to 1.0 mm and its overall size is 50% of that of a conventional device with the same function.

2. The compact multi-band signal integrated device of claim 1, wherein, The operating frequency band of the third input port (5) is 3300-4200MHz, and the line width of its corresponding branch circuit is smaller than that of other branch circuits.

3. The compact multi-band signal integrated device of claim 1, wherein, The diameter of the grounding through hole (6) is 0.2 to 0.5 mm.

4. The compact multi-band signal integrated device of claim 1, wherein, The dielectric substrate (1) is a high-frequency PCB material with a dielectric constant of 2.0 to 3.

2.

5. The compact multi-band signal integrated device of claim 1, wherein, The dielectric substrate (1) has mounting and positioning holes (8) at its four corners and the middle of its edges, with a hole diameter ≤ 3.5 mm.

6. The compact multi-band signal integrated device of claim 1, wherein, A ground plane (9) is provided on one side of the dielectric substrate (1).

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