Circuit board and electronic equipment

Abstract

The utility model discloses a circuit board and electronic equipment, and relates to the technical field of electronic equipment. The circuit board comprises a substrate, and the substrate is at least sequentially provided with a first straight section, a bent section and a second straight section in the first direction. A first side of the substrate is provided with a first circuit layer, the first circuit layer forms a plurality of first patterns on the first straight section and the second straight section, each first pattern is provided with a first hollowed-out part, the first circuit layer forms a plurality of second patterns on the bent section, each second pattern is provided with a second hollowed-out part, and each second hollowed-out part is provided with a second hollowed-out part. The size of at least part of the second hollowed-out part is larger than that of the first hollowed-out part; wherein the first direction is any linear direction on the substrate.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to a circuit board and an electronic device. Background Technology

[0002] With the continuous upgrading of electronic devices, foldable screen electronic devices are gradually entering the public eye.

[0003] Typically, in a foldable screen, a transmission line needs to be set up at the corresponding rotation position, passing through the hinge assembly and connecting the circuit boards on both sides to achieve data transmission.

[0004] However, the stress in the bending area of ​​the transmission line is greater, making it easy to break, resulting in a shorter lifespan of the circuit board. Utility Model Content

[0005] The first aspect of this application provides a circuit board, which includes...

[0006] A substrate having at least a first straight section, a bent section, and a second straight section sequentially along a first direction;

[0007] A first circuit layer is provided on a first side of the substrate. The first circuit layer forms a plurality of first patterns on the first straight section and the second straight section. The first patterns have first cutouts. The first circuit layer forms a plurality of second patterns on the bent section. The second patterns have second cutouts. At least some of the second cutouts are larger in size than the first cutouts.

[0008] Wherein, the first direction is any straight line direction on the substrate.

[0009] In some modified embodiments of the first aspect of this application, the aforementioned circuit board, wherein the size of the second pattern is larger than the size of the first pattern.

[0010] In some modified embodiments of the first aspect of this application, the aforementioned circuit board, wherein both the first pattern and the second pattern are ring-shaped.

[0011] In some modified embodiments of the first aspect of this application, the aforementioned circuit board, wherein the first circuit layer includes a transition region;

[0012] The transition zone connects the first graphic and the second graphic simultaneously between the bent section and the first straight section, and between the bent section and the second straight section.

[0013] In some modified embodiments of the first aspect of this application, the aforementioned circuit board further includes a second circuit layer;

[0014] The second circuit layer is disposed on the second side of the substrate opposite to the first side, and the second circuit layer passes through the substrate and is connected to the first circuit layer;

[0015] The second circuit layer has at least one stretching hole on the second circuit layer of the bent section, and the stretching hole extends along the first direction.

[0016] In some modified embodiments of the first aspect of this application, the aforementioned circuit board, wherein the stretching hole extends to the first straight section and the second straight section at both ends along the first direction, respectively.

[0017] In some modified embodiments of the first aspect of this application, the aforementioned circuit board further includes a first protective layer and a second protective layer;

[0018] The first protective layer and the second protective layer are respectively disposed on the side of the first circuit layer away from the substrate and the side of the second circuit layer away from the substrate;

[0019] Wherein, the thickness of the first protective layer corresponding to the bending segment is less than the thickness of the second protective layer corresponding to the bending segment.

[0020] In some modified embodiments of the first aspect of this application, the aforementioned circuit board, wherein the first protective layer includes a first insulating layer and a first outer decorative layer;

[0021] The first insulating layer is disposed on the side of the first circuit layer away from the substrate, and the first insulating layer has a notch corresponding to the position of the bent section;

[0022] The first outer decorative layer is disposed on the side of the first insulating layer opposite to the substrate to cover the notch.

[0023] In some modified embodiments of the first aspect of this application, the aforementioned circuit board, wherein the second protective layer comprises a second insulating layer, a shielding layer and a second outer decorative layer stacked sequentially;

[0024] The second insulating layer is located between the shielding layer and the second circuit layer.

[0025] The second outer decorative layer is disposed on the side of the shielding layer opposite to the substrate.

[0026] A second aspect of this application provides an electronic device comprising:

[0027] A first body and a second body are rotatably connected; the first body contains a motherboard, and the second body contains a second circuit board.

[0028] Circuit board, the circuit board including a substrate;

[0029] The substrate has at least a first straight section, a bent section, and a second straight section sequentially along a first direction; a first circuit layer is provided on a first side of the substrate, the first circuit layer forms a plurality of first patterns on the first straight section and the second straight section, the first patterns having first cutouts, the first circuit layer forms a plurality of second patterns on the bent section, the second patterns having second cutouts, at least some of the second cutouts having a size larger than the first cutouts; the first direction is any straight line direction on the substrate.

[0030] Wherein, the bent section of the circuit board corresponds to the rotational connection between the first body and the second body, the first straight section of the circuit board extends to the first body, the first circuit layer located on the first straight section is electrically connected to the motherboard, the second straight section of the circuit board extends to the second body, and the first circuit layer located on the second straight section is connected to the second circuit board. Attached Figure Description

[0031] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0032] Figure 1 A schematic diagram of a first structure of the first side of the circuit board provided in this embodiment is shown.

[0033] Figure 1A schematically shown Figure 1 Enlarged diagram of A in the middle;

[0034] Figure 2 A schematic diagram of a second structure of the first side of the circuit board provided in this embodiment is shown.

[0035] Figure 2A schematically shown Figure 2 Enlarged diagram of B in the diagram;

[0036] Figure 3 A schematic diagram of the structure of the second side of the circuit board provided in this embodiment is shown.

[0037] Figure 3A schematically shown Figure 3 Enlarged diagram of C in the middle;

[0038] Figure 4 A schematic cross-sectional view of the circuit board provided in this embodiment is shown.

[0039] Reference numerals in the attached figures: Substrate 1, First straight section 11, Bending section 12, Second straight section 13, First circuit layer 2, First pattern 3, First cutout 31, Second pattern 4, Second cutout 41, Transition area 5, Second circuit layer 6, Stretched hole 61, Differential line 62, Power line 7, First protective layer 8, First insulating layer 81, First outer decorative layer 82, Notch 83, Second protective layer 9, Second insulating layer 91, Shielding layer 92, Second outer decorative layer 93, First direction a, Second direction b. Detailed Implementation

[0040] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0041] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains.

[0042] The technical solution of this application embodiment is to solve the above-mentioned technical problems, and the general idea is as follows:

[0043] Example 1

[0044] Reference Appendix Figure 1 and attached Figure 1A The circuit board provided in this application embodiment includes a substrate 1. The substrate 1 has at least a first straight section 11, a bent section 12, and a second straight section 13 sequentially along a first direction a. A first circuit layer 2 is provided on a first side of the substrate 1. The first circuit layer 2 forms a plurality of first patterns 3 on the first straight section 11 and the second straight section 13. The first patterns 3 have first cutouts 31. The first circuit layer 2 forms a plurality of second patterns 4 on the bent section 12. The second patterns 4 have second cutouts 41. At least a portion of the size of the second cutouts 41 is larger than the size of the first cutouts 31.

[0045] Wherein, the first direction a is any straight line direction on the substrate 1.

[0046] Specifically, in order to solve the problem that the transmission lines in the bending area of ​​existing circuit boards are subject to high stress, are easily broken, and have a short service life, the circuit board provided in this embodiment sets the first circuit layer 2 on the bending section 12 and the first circuit layer 2 on the straight section as patterns with different cutout sizes. This makes the coverage area and density of the first circuit layer 2 on the bending section 12 lower than that on the straight section, thereby improving the bendability and toughness of the bending section 12, preventing the circuit board from breaking due to frequent bending, and thus improving the service life of the circuit board.

[0047] The substrate 1 serves as the main support structure and carrier for the circuit layers of the circuit board. It can be made of rigid material or a material with a certain degree of toughness or elasticity, such as polyimide, metal plate, ceramic substrate, etc. The shape and size of the substrate 1 can be designed and adjusted according to the actual product needs, and are not limited here. In this embodiment, the substrate 1 has at least a first straight segment 11, a bent segment 12 and a second straight segment 13 along the first direction a. It is easy to understand that the substrate provided in this embodiment can be used, but is not limited to, in foldable electronic devices, such as foldable mobile phones, touch input foldable laptops, etc. The number of the first straight segment 11, the bent segment 12 and the second straight segment 13 can be designed and adjusted according to the specific number of folds, and are not limited here. For example, if a foldable mobile phone has three screens, and adjacent screens can be folded, then the substrate 1 needs to have the first straight segment 11, the bent segment 12, the second straight segment 13, the second bent segment and the third straight segment arranged in sequence, with the first straight segment 11, the second straight segment 13 and the third straight segment each corresponding to one screen. The first direction 'a' can be the length direction or the width direction of the substrate 1, or it can be an inclined direction with an angle relative to the length direction or the width direction of the substrate 1.

[0048] The first circuit layer 2 can be made of metals such as copper, aluminum, silver, gold, and nickel. It covers the first side surface of the substrate 1 and forms conductive paths through etching, serving as power lines, ground lines, etc. In this embodiment, the following description will use the first circuit layer 2 as a ground line as an example. In this embodiment, the first circuit layer 2 is provided on the first side of the substrate 1 corresponding to the first straight section 11, the bent section 12, and the second straight section 13. The first circuit layer 2 on the first straight section 11 and the second straight section 13 forms several first patterns 3, and the second circuit layer 2 on the bent section 12 forms several second patterns 4. The first patterns 3 and the second patterns 4 can be the same or different. They can be closed patterns, such as: rings, rectangular rings, rhombuses, etc., or they can be open patterns, such as: text shapes, irregular shapes, etc. When the first patterns 3 and the second patterns 4 are closed patterns, the corresponding cutouts are the annular openings in the middle of the ring. When the first patterns 3 and the second patterns 4 are open patterns, the corresponding cutouts are the missing parts used to form the special pattern. Of course, regardless of the type of pattern... Both the first cutout 31 and the second cutout 41 are areas of the substrate 1 not covered by the first circuit layer 2. The second cutout 41 on the bent section 12 may have some cutouts larger than the size of the first cutout 31, or all of the second cutouts 41 may be larger than the size of the first cutout 31. For example, the second cutout 41 at the center of the bent section 12 relative to the straight section may be larger than the first cutout 31, while the second cutout 41 at the junction of the bent section 12 and the straight section may not be larger than the first cutout 31. Alternatively, all the second cutouts 41 on the bent section 12 from the junction with the first straight section 11 to the junction with the second straight section 13 may be larger than the first cutout 31. This reduces the area of ​​the substrate 1 covered by the first circuit layer 2 and the grid density at the bent section 12, thereby improving the bendability of the bent section 12 relative to the straight section. The first figures 3 can be arranged regularly or irregularly, and the second figures 4 are arranged similarly. As grounding wires, the first figures 3 and the second figures 4 are connected to each other. They can be connected within the straight section, within the bent section 12, or at the junction between the straight section and the bent section 12.

[0049] As listed above, the circuit board provided in this application has a first circuit layer 2 configured to form patterns with different cutout sizes in the straight section and the bent section 12, so that the first circuit layer 2 corresponding to the bent section 12 can improve the bendability of the bent section, reduce the coverage area and density of the circuit layer, improve toughness, and prevent the circuit board from breaking due to frequent bending; thereby solving the problem that the transmission lines in the bending area of ​​the existing circuit board have high stress, are easy to break, and have a short service life.

[0050] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships, such as A and / or B. Specifically, it can be understood as: A and B can be included at the same time, A can exist alone, or B can exist alone, and any of the above three situations can be met.

[0051] Furthermore, in the specific implementation of the circuit board provided in this embodiment, the size of the second pattern 4 is larger than the size of the first pattern 3.

[0052] Understandably, in order to ensure that the bending segment 12 has sufficient bendability, in this embodiment, the size of the second graphic 4 can be set to be larger than the size of the first graphic 3. For example, when both the second graphic 4 and the first graphic 3 are rhombuses, the grid size of the second graphic 4 is larger than the grid size of the first graphic 3 and the second cutout 41 is larger than the first cutout 31. Obviously, the coverage area of ​​the second graphic 4 is further smaller than the coverage area of ​​the first graphic 3, and the grid density at the bending segment 12 is further smaller than the grid density at the straight segment, which greatly improves the bendability of the bending segment 12.

[0053] Further, see attached document. Figure 1 and attached Figure 1A In the circuit board provided in this embodiment, both the first pattern 3 and the second pattern 4 are ring-shaped.

[0054] It is understandable that, in order to simplify the manufacturing process and improve production efficiency, the first shape 3 and the second shape 4 can be set as rings in this embodiment, which can be, but are not limited to, circular rings, rectangular rings, rhomboid rings, triangular rings, etc.; in this setting, the first shape 3 and the second shape 4 are both relatively regular shapes, and the required etching mask is less difficult to form and manufacture. Furthermore, when the first shape 3 and the second shape 4 are connected to each other between the straight section and the bent section 12, they can be directly connected by the extension of their own regular shapes without the need for additional connection methods. For example: refer to the attached... Figure 2 and attached Figure 2A Taking a rectangular ring as an example, where both the first shape 3 and the second shape 4 are rectangular rings, the first shape 3 and the second shape 4 can extend towards each other at the intersection of the straight section and the bent section 12 until they contact the nearest shape structure, ensuring that the first circuit layer 2 of the straight section and the bent section 12 are interconnected, thus achieving a grounding effect. In this embodiment, the second shape 4 can be set to a line width of 0.1mm and an internal cutout size of 0.6mm*0.6mm to at least meet the requirement of the target number of swings, for example, to meet the lifespan requirement of at least 25,000 swings.

[0055] Further, see attached document. Figure 2 and attached Figure 2AIn the circuit board provided in this embodiment, the first circuit layer 2 includes a transition area 5; the transition area 5 connects the first pattern 3 and the second pattern 4 simultaneously between the bent section 12 and the first straight section 11, and between the bent section 12 and the second straight section 13.

[0056] Understandably, to simplify the manufacturing process and improve production efficiency, a transition zone 5 is provided in this embodiment. The transition zone 5 serves as a common connection area between the first shape 3 and the second shape 4. It can be located within a straight section, within a bent section 12, or partially within a straight section and partially within a bent section 12. The transition zone 5 extends along a second direction b, which is perpendicular to the first direction a. It can be perpendicular to each other or approximately perpendicular. The transition zone 5 can be... Figure 1 The straight line shown can also be wavy, sawtooth, etc., as long as it can provide a connecting and converging area for the first graphic 3 and the second graphic 4 on both sides of the transition area 5. In this setting, the outer boundary areas of the first graphic 3 and the second graphic 4 are clear, do not interfere with each other, and do not intersect with each other, reducing the difficulty of the etching process and improving the forming efficiency.

[0057] Further, see attached document. Figure 3 and attached Figure 3A The circuit board provided in this embodiment further includes a second circuit layer 6 in a specific implementation; the second circuit layer 6 is disposed on the second side opposite to the first side of the substrate 1, and the second circuit layer 6 passes through the substrate 1 and is connected to the first circuit layer 2; wherein, the second circuit layer 6 is provided with at least one stretching hole 61 on the second circuit layer 6 of the bending section 12, and the stretching hole 61 extends along the first direction a.

[0058] Understandably, in order to reduce the overall size of the circuit board, decrease the required space, and improve the spatial adaptability of the circuit board within the device, a second circuit layer 6 is provided on the second side of the substrate 1 in this embodiment. The second circuit layer 6 can be electrically connected to the first circuit layer 2, i.e., the grounding wire, through a via at the end of the substrate 1 along the first direction a. Figure 3The state shown at the top and bottom ends. The second circuit layer 6 may include a number of functional lines spaced along the second direction a and extending along the first direction a. These may include, but are not limited to, power lines, display driver positive power supply voltage lines (ELVDD), display driver negative power supply voltage lines (ELVSS), 0-level ground lines (ND), differential lines 62 (high-speed traces), etc. The 0-level ground lines (ND) are connected in parallel with the ground lines of the first circuit layer 2 and are grounded together. This configuration is easily understood by those skilled in the art and will not be elaborated further here. In this embodiment, at least one stretch hole 61 may be provided on the second circuit layer 6. The stretch hole 61 is provided on the functional lines. The stretch hole 61 may be provided on the functional lines with a relatively large width in the second direction b. Of course, as long as the functional lines have width, the stretch hole 61 can be provided. The size of the stretch hole 61 along the second direction b can be designed and adjusted according to the width of the functional lines. The number of stretch holes 61 on the same function line can also be designed and adjusted according to actual needs, as long as the required overcurrent capacity is met. For example, if the thickness of the copper layer, i.e., the second circuit layer 6, is 1 / 3 ounce (OZ), and a 1A current requires a 1.5mm wide function line as support for the overcurrent capacity, when the width of the function line is 2mm, there can be 0.5mm of width for setting the stretch holes 61. The width of the stretch holes 61 can be designed and adjusted according to actual needs. A single stretch hole 61 can be set on the total width of 0.5mm, or two or more stretch holes 61 can be set separately so that the sum of their widths is 0.5mm. For example, in this embodiment, if the thickness of the second circuit layer 6 is 1 / 3 ounce (OZ), the display drive positive power supply voltage line (ELVDD) can be a 3V power supply line, requiring an overcurrent of 4.5A. If the effective width remaining after excluding the width of the stretching hole 61 in the second direction b is at least 6.75mm, then in this embodiment, the total width of the display driver positive power supply voltage line (ELVDD) can be set to 7.1mm, the width of each stretching hole 61 is 0.089mm, and three stretching holes 61 are arranged at intervals in the second direction b. The width of the display driver positive power supply voltage line (ELVDD) between adjacent stretching holes 61 is 2.3mm, thus the entire display driver positive power supply voltage line (ELVDD) can support a current of 4.6A, meeting the 4.5A requirement. In this arrangement, the stretching hole 61 reduces the coverage area of ​​the corresponding functional line in the bending section 12, improves the bendability of the bending section 12, reduces the possibility of circuit board breakage caused by repeated bending in the bending section 12, and thus extends the service life of the circuit board. The size of the stretching hole 61 in the bending section 12 along the first direction a can be designed and adjusted according to actual needs. It can be the same length as the bending section 12 or smaller than the size of the bending section 12. In this embodiment, additional power lines 7 can also be provided on the first side of the substrate 1. The number of power lines 7 can be designed and adjusted according to actual needs, for example: Figure 1As shown, two power lines 7 are spaced apart on the first side of the substrate 1. The difference between these power lines 7 and the display driver positive power supply voltage line (ELVDD) can be the size of the driving object and the driving power supply. For example, if the display driver positive power supply voltage line (ELVDD) is a 3V power line, then power line 7 can be 5V or 6V to meet the driving requirements of different devices and improve the applicability of the circuit board. Correspondingly, the first pattern 3 on the first circuit layer 2 corresponding to the differential line 62 needs to be set to a grid density that meets the relevant impedance requirements. The first circuit layer 2 corresponding to the differential line 62 serves as a reference cluster. Under the premise of the line width of the differential line 62 and the corresponding impedance standard, the reference cluster needs to be designed with the corresponding grid density. This setting is easily understood by those skilled in the art. In this embodiment, the first pattern 3 corresponding to the differential line 62 can be set to a line width of 0.1mm and an internal cutout size of 0.2mm*0.2mm. Of course, it can be understood that this description refers to the first circuit layer 2 located on the straight section. Furthermore, to make the ground voltage difference between the two adapters on the first straight section 11 and the second straight section 13 of the circuit board approach zero, this embodiment can also set the first circuit layer 2 on other straight sections without corresponding differential line 62 positions to a form with a larger grid density and a larger line width, so that the resistance of the first circuit layer 2 on the straight section is smaller, thereby making the voltage difference at the two adapters approach zero, i.e. Figure 1 and Figure 2 The state shown in the image.

[0059] Further, see attached document. Figure 3 and attached Figure 3A In the circuit board provided in this embodiment, in a specific implementation, the stretching hole 61 extends from both ends of the first direction a to the first straight section 11 and the second straight section 13, respectively.

[0060] Understandably, in order to extend the service life of the circuit board and prevent the second circuit layer 6 from cracking at the stretching hole 61 when the bending section 12 is bent, in this embodiment, the stretching hole 61 is extended at both ends along the first direction a. The extension length can be, but is not limited to, 0.5mm, so that it extends into the first straight section 11 and the second straight section 13. This makes the two ends of the stretching hole 61 along the first direction a less stressed when the bending section 12 is bent, thus avoiding cracking and extending the service life of the circuit board.

[0061] Further, see attached document. Figure 4The circuit board provided in this embodiment further includes a first protective layer 8 and a second protective layer 9 in a specific implementation; the first protective layer 8 and the second protective layer 9 are respectively disposed on the side of the first circuit layer 2 away from the substrate 1 and the side of the second circuit layer 6 away from the substrate 1; wherein, the thickness of the first protective layer 8 corresponding to the bending segment 12 is less than the thickness of the second protective layer 9 corresponding to the bending segment 12.

[0062] Understandably, in order to further improve the bendability of the bending segment 12 and extend the service life of the circuit board, the second protective layer 9 corresponding to the bending segment 12 can be thinned in this embodiment. The first protective layer 8 and the second protective layer 9 can protect and support the first circuit layer 2 and the second circuit layer 6 and shield against electromagnetic interference (EMI). Specifically, since the second circuit layer 6 has various functional lines, the second protective layer 9 can be set as a protective layer with shielding function in this embodiment. The first protective layer 8 corresponds to the first circuit layer 2 as the ground wire, so the first protective layer 8 may not have shielding function. Therefore, the thickness of the first protective layer 8 at the position corresponding to the bending segment 12 can be set to be less than the thickness of the second protective layer 9 at the corresponding position to improve the bendability of the bending segment 12. This can be achieved by thinning the thickness or by directly removing the first protective layer 8 at that position.

[0063] Accordingly, the first protective layer 8 may include a first insulating layer 81 and a first outer decorative layer 82 stacked sequentially; the first insulating layer 81 is disposed on the side of the first circuit layer 2 away from the substrate 1; the first insulating layer 81 has a notch 83 corresponding to the position of the bent section 12, and the first outer decorative layer 83 is disposed on the side of the shielding layer 82 away from the substrate 1 to cover the notch 83.

[0064] It is understandable that, in order to achieve the supporting function of the first protective layer 8 and the structural feature of a relatively small thickness, the first protective layer 8 in this embodiment is configured to include a first insulating layer 81 and a first decorative layer 82 stacked sequentially. The first insulating layer 81 may be, but is not limited to, polyimide, which can be bonded to the substrate 1 by an adhesive. The first insulating layer 81 and the adhesive can be used to eliminate or hollow out the structure at the corresponding bending section 12, thereby reducing the total thickness of the circuit board at the bending section 12 and improving its bendability. In addition, the first insulating layer 81 fully covers other positions on the first side of the substrate 1. The first decorative layer 83 may be, but is not limited to, Teflon, which fully covers the first side of the substrate 1 and uses its black appearance to serve as a decorative function. It may, but is not limited to, cover the notch 83 to form a complete appearance of the circuit board and maintain integrity and consistency.

[0065] Accordingly, the second protective layer 9 may include a second insulating layer 91, a shielding layer 92 and a second outer decorative layer 93 stacked sequentially; the second insulating layer 91 is located between the shielding layer 92 and the second circuit layer 6, and the second outer decorative layer 93 is disposed on the side of the shielding layer away from the substrate 1.

[0066] It is understandable that, in order to achieve the supporting and shielding functions of the second protective layer 9, in this embodiment, the second protective layer 9 is configured to include a second insulating layer 91, a shielding layer 92, and a second decorative layer 93. The second insulating layer 91 may be, but is not limited to, polyimide, which fully covers the second side of the substrate 1 and can be bonded to the substrate 1 with an adhesive. The shielding layer 82 may be, but is not limited to, a silver film. The second decorative layer 93 may be, but is not limited to, Teflon, which fully covers the second side of the substrate 1 and uses its black appearance to serve as a decorative function, forming a complete appearance of the circuit board and maintaining integrity and consistency.

[0067] Example 2

[0068] This embodiment provides an electronic device, which includes a circuit board, a first body and a second body rotatably connected; the first body contains a motherboard, and the second body contains a second circuit board.

[0069] The circuit board includes a substrate 1; the substrate 1 has at least a first straight section 11, a bent section 12, and a second straight section 13 sequentially along a first direction a; a first circuit layer 2 is provided on a first side of the substrate 1, the first circuit layer 2 forms a plurality of first patterns 3 on the first straight section 11 and the second straight section 13, the first patterns 3 having first cutouts 31, the first circuit layer 2 forms a plurality of second patterns 4 on the bent section 12, the second patterns 4 having second cutouts 41, at least a portion of the second cutouts 41 having a size larger than the size of the first cutouts 31; the first direction a is any straight line direction on the substrate 1.

[0070] Wherein, the bent section 12 of the circuit board corresponds to the rotational connection between the first body and the second body, the first straight section 11 of the circuit board extends to the first body, the first circuit layer 2 placed on the first straight section 11 is electrically connected to the motherboard, the second straight section 13 of the circuit board extends to the second body, and the first circuit layer 2 placed on the second straight section 13 is connected to the second circuit board.

[0071] It is understood that the circuit board provided in this embodiment is the same circuit board described in Embodiment 1. Its structure and working principle are described in detail in Embodiment 1, and will not be elaborated further here.

[0072] The electronic device provided in this embodiment may be, but is not limited to, a foldable phone, a laptop, a tablet computer, etc., such as a laptop computer with a touch input terminal, a tablet computer with a foldable keyboard, etc.

[0073] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A circuit board, characterized by, It includes: A substrate having at least a first straight section, a bent section, and a second straight section sequentially along a first direction; A first circuit layer is provided on a first side of the substrate. The first circuit layer forms a plurality of first patterns on the first straight section and the second straight section. The first patterns have first cutouts. The first circuit layer forms a plurality of second patterns on the bent section. The second patterns have second cutouts. At least some of the second cutouts are larger in size than the first cutouts. Wherein, the first direction is any straight line direction on the substrate.

2. The circuit board according to claim 1, characterized in that: The size of the second graphic is larger than the size of the first graphic.

3. The circuit board according to claim 1 or 2, characterized in that: Both the first and second shapes are circular.

4. The circuit board according to claim 1, characterized in that: The first circuit layer includes a transition region; The transition zone connects the first graphic and the second graphic simultaneously between the bent section and the first straight section, and between the bent section and the second straight section.

5. The circuit board according to claim 1, characterized in that: It also includes a second circuit layer; The second circuit layer is disposed on the second side of the substrate opposite to the first side, and the second circuit layer passes through the substrate and is connected to the first circuit layer; The second circuit layer has at least one stretching hole on the second circuit layer of the bent section, and the stretching hole extends along the first direction.

6. The circuit board according to claim 5, characterized in that: The stretching hole extends from both ends along the first direction to the first straight section and the second straight section, respectively.

7. The circuit board according to claim 5, characterized in that: It also includes a first protective layer and a second protective layer; The first protective layer and the second protective layer are respectively disposed on the side of the first circuit layer away from the substrate and the side of the second circuit layer away from the substrate; Wherein, the thickness of the first protective layer corresponding to the bending segment is less than the thickness of the second protective layer corresponding to the bending segment.

8. The circuit board according to claim 7, characterized in that: The first protective layer includes a first insulating layer and a first outer decorative layer; The first insulating layer is disposed on the side of the first circuit layer away from the substrate, and the first insulating layer has a notch corresponding to the position of the bent section; The first outer decorative layer is disposed on the side of the first insulating layer opposite to the substrate to cover the notch.

9. The circuit board according to claim 7, characterized in that: The second protective layer includes a second insulating layer, a shielding layer, and a second outer decorative layer stacked sequentially. The second insulating layer is located between the shielding layer and the second circuit layer; The second outer decorative layer is disposed on the side of the shielding layer opposite to the substrate.

10. An electronic device, comprising: It includes: A first body and a second body are rotatably connected; the first body contains a motherboard, and the second body contains a second circuit board. Circuit board, the circuit board including a substrate; The substrate has at least a first straight section, a bent section and a second straight section in sequence along a first direction; a first circuit layer is provided on a first side of the substrate, the first circuit layer forms a plurality of first patterns on the first straight section and the second straight section, the first patterns having first cutouts, the first circuit layer forms a plurality of second patterns on the bent section, the second patterns having second cutouts, and at least a portion of the size of the second cutouts is larger than the size of the first cutouts. The first direction is any straight line direction on the substrate; Wherein, the bent section of the circuit board corresponds to the rotational connection between the first body and the second body, the first straight section of the circuit board extends to the first body, the first circuit layer located on the first straight section is electrically connected to the motherboard, the second straight section of the circuit board extends to the second body, and the first circuit layer located on the second straight section is connected to the second circuit board.

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