A corrosion-resistant electromagnetic shielding heat dissipation circuit board

Abstract

This utility model provides a corrosion-resistant electromagnetic shielding heat dissipation circuit board, including a circuit board body, side plate structures, a top frame, an anti-corrosion film, and a shielding plate structure. Each side plate has a serpentine heat dissipation channel inside. The shielding plate structure comprises a metal mesh shielding layer and a phase change thermally conductive layer. The phase change thermally conductive layer is positioned towards the side of the circuit board body and has an embedded array of hexagonally densely arranged silicon carbide micropillars. The metal mesh shielding layer includes an upper copper mesh layer and a lower copper mesh layer, with the copper meshes of the upper and lower layers forming an orthogonal relationship. The top frame includes a hollow frame, a coarse filter layer, and a fine filter layer. The coarse filter layer covers the upper surface of the hollow frame, the fine filter layer covers the lower surface of the hollow frame, and the anti-corrosion film covers the upper surface of the coarse filter layer. It has excellent corrosion resistance, electromagnetic shielding, and heat dissipation functions.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a corrosion-resistant electromagnetic shielding heat dissipation circuit board. Background Technology

[0002] Chinese Patent Publication No. CN222721745U, published on April 4, 2025, discloses an anti-corrosion coated circuit board, comprising a circuit board and an anti-corrosion film. Side plates are mounted on all four sides of the circuit board via hinges. Multiple side plates are combined to form a limiting frame. A top frame is located above the limiting frame, and the anti-corrosion film is installed inside the top frame. A shielding plate, which inserts into the side plates and is used for electromagnetic shielding, is located inside the limiting frame. This utility model has a simple structure; the side plates can open upwards and snap onto a fixing base, while the top frame can cover the limiting frame. The top frame, side plates, and anti-corrosion film effectively cover the surface of the circuit board, preventing external moisture from contacting the circuit board and electronic components, greatly increasing safety and service life. The existing technology has the following drawbacks: weak electromagnetic shielding and insufficient heat dissipation, otherwise, the service life will be affected. Therefore, improvements are urgently needed. Utility Model Content

[0003] Based on this, the purpose of this utility model is to provide a corrosion-resistant electromagnetic shielding heat dissipation circuit board with good corrosion resistance, electromagnetic shielding and heat dissipation functions.

[0004] This utility model provides a corrosion-resistant electromagnetic shielding heat dissipation circuit board, including a circuit board body, a side plate structure, a top frame, an anti-corrosion film, and a shielding plate structure. The side plate structure is connected to the circuit board body through a stitching hole hinge structure to form a limiting frame. The top frame covers the limiting frame and is connected through a post and slot structure. The side plate structure includes side plate bodies respectively surrounding the four sides of the circuit board body.

[0005] Each of the side plates has a serpentine heat dissipation channel inside, and the inner wall of the serpentine heat dissipation channel is coated with a graphene coating.

[0006] The shielding plate structure comprises a metal mesh shielding layer and a phase change thermal conductive layer. The phase change thermal conductive layer is disposed on one side of the circuit board body and is embedded with a hexagonal densely arranged array of silicon carbide micropillars. The metal mesh shielding layer comprises an upper copper mesh layer and a lower copper mesh layer, and the copper meshes of the upper copper mesh layer and the lower copper mesh layer are orthogonal.

[0007] The top frame includes a hollow frame, a coarse filter layer, and a precision filter layer. The coarse filter layer is correspondingly disposed on the upper surface of the hollow frame, the precision filter layer is correspondingly disposed on the lower surface of the hollow frame, and the anti-corrosion film is correspondingly disposed on the upper surface of the coarse filter layer.

[0008] Preferably, the phase change thermal conductive layer is a paraffin / expanded graphite composite material layer.

[0009] Preferably, the upper copper mesh layer has a mesh size of 0.5mm × 0.5mm; the lower copper mesh layer has a mesh size of 2mm × 2mm, and the upper copper mesh layer and the lower copper mesh layer are vertically welded to the phase change heat-conducting layer by copper pillars.

[0010] Preferably, the top of the silicon carbide micropillar array is provided with a conical groove, the depth of which is 1 / 5 to 1 / 3 of the height of the micropillar, and the conical groove is filled with a paraffin / boron nitride composite phase change material.

[0011] Preferably, the two inner sides of the limiting frame along its length are each formed with a fitting guide groove, and the two sides of the shielding plate along its length are each formed with a guide block that is embedded in the fitting guide groove.

[0012] Preferably, the coarse filter layer is a meltblown electret fiber filter; the precision filter layer is an electrospun nanofiber filter.

[0013] Preferably, the anti-corrosion film is a polytetrafluoroethylene or Teflon film layer with a porosity ≥85% and a pore size of 0.1-0.3μm.

[0014] The beneficial effects of this utility model are as follows: each side plate has a serpentine heat dissipation channel inside, and the inner wall of the serpentine heat dissipation channel is coated with a graphene coating to improve the heat dissipation efficiency of the structure. The top frame includes a hollow frame, a coarse filter layer and a precision filter layer. The outer layer intercepts large particles, and the inner layer of nanofibers captures micro dust. The shielding plate structure consists of a metal mesh shielding layer and a phase change heat conduction layer. The copper meshes of the upper copper mesh layer and the lower copper mesh layer are orthogonal. The orthogonal copper mesh has a shielding effectiveness of ≥70dB in the 1-10GHz frequency band. Attached Figure Description

[0015] Figure 1 This is a perspective view of the present invention.

[0016] The attached diagram is labeled as follows: hollow frame 11, coarse filter layer 10, precision filter layer 12, insert post 13, top frame 14, upper copper mesh layer 15, lower copper mesh layer 16, phase change heat conduction layer 17, circuit board body 19, side plate structure 20, shielding plate structure 18, slot 23, fitting guide groove 21, guide block 22. Detailed Implementation

[0017] To further understand the features, technical means, and specific objectives and functions achieved by this utility model, the following detailed description of this utility model is provided in conjunction with specific embodiments and accompanying drawings.

[0018] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0019] Please refer to Figure 1 As shown, this utility model provides a corrosion-resistant electromagnetic shielding heat dissipation circuit board, including a circuit board body 19, a side plate structure 20, a top frame 14, a corrosion-resistant film, and a shielding plate structure 18. The side plate structure 20 is connected to the circuit board body 19 through a stitching hole hinge structure to form a limiting frame. The top frame 14 covers the limiting frame and is connected through a post 13 and a slot 23 structure. The side plate structure 20 includes side plate bodies respectively surrounding the four sides of the circuit board body 19.

[0020] Each side panel has a serpentine heat dissipation channel inside, and the inner wall of the serpentine heat dissipation channel is coated with a graphene coating.

[0021] The shielding structure 18 consists of a metal mesh shielding layer and a phase change heat conduction layer 17. The phase change heat conduction layer 17 is disposed on the side of the circuit board body 19 and is embedded with a hexagonal densely arranged array of silicon carbide micro pillars. The metal mesh shielding layer includes an upper copper mesh layer 15 and a lower copper mesh layer 16. The copper meshes of the upper copper mesh layer 15 and the lower copper mesh layer 16 are orthogonal.

[0022] The top frame 14 includes a hollow frame 11, a coarse filter layer 10, and a precision filter layer 12. The coarse filter layer 10 covers the upper surface of the hollow frame 11, and the precision filter layer 12 covers the lower surface of the hollow frame 11. An anti-corrosion film covers the upper surface of the coarse filter layer 10. During actual assembly, the coarse filter layer 10 and the precision filter layer 12 can be fixed to the hollow frame 11 with screws or magnetically. For example, neodymium iron boron magnets can be installed in the coarse filter layer 10 and the precision filter layer 12, and magnetically conductive steel sheets can be installed on the inner wall of the hollow frame 11. Magnetic adsorption and fixation are achieved through the cooperation of the neodymium iron boron magnets and the magnetically conductive steel sheets.

[0023] The phase change thermal conductive layer 17 is set as a paraffin / expanded graphite composite material layer.

[0024] The upper copper mesh layer 15 has a mesh size of 0.5mm × 0.5mm; the lower copper mesh layer 16 has a mesh size of 2mm × 2mm. The upper copper mesh layer 15 and the lower copper mesh layer 16 are vertically welded to the phase change heat-conducting layer 17 by copper pillars.

[0025] The top of the silicon carbide micropillar array is provided with a conical groove, the depth of which is 1 / 5 to 1 / 3 of the height of the micropillar. The conical groove is filled with a paraffin / boron nitride composite phase change material.

[0026] The two inner sides of the limiting frame along its length are each formed with a fitting guide groove 21, and the two sides of the shielding plate structure 18 along its length are each formed with a guide block 22 that is corresponding to the fitting guide groove 21.

[0027] The coarse filter layer 10 is set as a meltblown electret fiber filter; the precision filter layer 12 is set as an electrospun nanofiber filter.

[0028] The anti-corrosion film is made of polytetrafluoroethylene or Teflon film with a porosity of ≥85% and a pore size of 0.1-0.3μm.

[0029] In this embodiment, each side plate has a serpentine heat dissipation channel inside. The inner wall of the serpentine heat dissipation channel is coated with a graphene coating to improve the heat dissipation efficiency of the structure. The top frame includes a hollow frame, a coarse filter layer and a precision filter layer. The outer layer intercepts large particles, and the inner layer of nanofibers captures micro dust. The shielding plate structure consists of a metal mesh shielding layer and a phase change thermal conductive layer. The copper meshes of the upper copper mesh layer and the lower copper mesh layer are orthogonal. The orthogonal copper mesh has a shielding effectiveness of ≥70dB in the 1-10GHz frequency band.

[0030] The above-described embodiments are merely one implementation of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A corrosion-resistant electromagnetic shielding heat dissipation circuit board, comprising a circuit board body (19), a side plate structure (20), a top frame (14), an anti-corrosion film, and a shielding plate structure (18), wherein the side plate structure (20) is connected to the circuit board body (19) through a stitching hole hinge structure to form a limiting frame, and the top frame (14) covers the limiting frame and is connected through a post (13) and a slot (23) structure; the side plate structure (20) includes side plate bodies respectively surrounding the four sides of the circuit board body (19); Its features are, Each of the side plates has a serpentine heat dissipation channel inside, and the inner wall of the serpentine heat dissipation channel is coated with a graphene coating. The shielding plate structure (18) comprises a metal mesh shielding layer and a phase change heat conduction layer (17). The phase change heat conduction layer (17) is disposed on the side facing the circuit board body (19) and is embedded with a hexagonal densely arranged array of silicon carbide micropillars. The metal mesh shielding layer comprises an upper copper mesh layer (15) and a lower copper mesh layer (16). The copper meshes of the upper copper mesh layer (15) and the lower copper mesh layer (16) are orthogonal. The top frame (14) includes a hollow frame (11), a coarse filter layer (10), and a precision filter layer (12). The coarse filter layer (10) is correspondingly covered on the upper surface of the hollow frame (11), the precision filter layer (12) is correspondingly covered on the lower surface of the hollow frame (11), and the anti-corrosion film is correspondingly covered on the upper surface of the coarse filter layer (10).

2. The corrosion-resistant electromagnetic shielding heat dissipation circuit board according to claim 1, characterized in that: The phase change thermal conductive layer (17) is configured as a paraffin / expanded graphite composite material layer.

3. The corrosion-resistant electromagnetic shielding heat dissipation circuit board according to claim 1, characterized in that: The upper copper mesh layer (15) has a mesh size of 0.5mm × 0.5mm; the lower copper mesh layer (16) has a mesh size of 2mm × 2mm. The upper copper mesh layer (15) and the lower copper mesh layer (16) are vertically welded to the phase change heat-conducting layer (17) by copper pillars.

4. The corrosion-resistant electromagnetic shielding heat dissipation circuit board according to claim 1, characterized in that: The top of the silicon carbide micropillar array is provided with a conical groove, the depth of which is 1 / 5 to 1 / 3 of the height of the micropillar, and the conical groove is filled with a paraffin / boron nitride composite phase change material.

5. The corrosion-resistant electromagnetic shielding heat dissipation circuit board according to claim 1, characterized in that: The limiting frame has two inner sides with interlocking guide grooves (21) on opposite sides along its length, and the shielding plate structure (18) has guide blocks (22) on opposite sides along its length that are corresponding to the interlocking guide grooves (21).

6. The corrosion-resistant electromagnetic shielding heat dissipation circuit board according to claim 1, characterized in that: The coarse filter layer (10) is configured as a meltblown electret fiber filter; the precision filter layer (12) is configured as an electrospun nanofiber filter.

7. The corrosion-resistant electromagnetic shielding heat dissipation circuit board according to claim 1, characterized in that: The anti-corrosion film is made of polytetrafluoroethylene or Teflon, with a porosity ≥85% and a pore size of 0.1-0.3μm.

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