A multilayer circuit board with precise drilling

Abstract

This utility model discloses a precision-drilled multilayer circuit board, belonging to the field of multilayer circuit boards. It includes a circuit board and rivets. Each rivet comprises a linkage structure, a clearance groove, a limiting ring, a riveting groove, an outer protective ring, an assembly ring, a riveting plate, a riveting connecting rod, an inner pressure ring, a snap-fit ​​groove, and a through groove. Through the combination of the outer protective ring and the limiting ring, and the inner riveting groove and the riveting plate, stacked rivets can be achieved. Each rivet can independently press the circuit board through the limiting ring, ensuring the stability between circuit board layers and improving interlayer positioning accuracy. Simultaneously, it reduces the pressure difference between layers, thereby reducing deformation caused by uneven interlayer stress, ensuring the accuracy of subsequent drilling, etc. It is not limited by the number or thickness of layers, allows for convenient assembly, and eliminates the need for multiple sets of riveting holes, saving circuit board space. During riveting, a single riveting connecting rod can drive all assembled rivets to be riveted simultaneously, eliminating the need for multiple riveting operations, ensuring stability while improving production efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of multilayer circuit boards, and specifically relates to a multilayer circuit board with precise drilling. Background Technology

[0002] Circuit boards, as electronic devices, enable miniaturization and visualization of circuits, playing a crucial role in the mass production of fixed circuits and the optimization of electrical appliance layout. Multilayer circuit boards, as a type of circuit board, offer advantages such as better electrical performance, increased circuitry per unit area, and improved reliability. However, in current technology, to increase the bonding strength between layers and improve the positioning accuracy between layers, as well as to prevent misalignment during subsequent pressing and drilling processes, multilayer circuit boards are often riveted for positioning. Traditional riveting methods include integral riveting and layer riveting. In integral riveting, a single rivet is used to directly rivet through the board, depending on the number of layers and board thickness. This method has high limitations on the layer thickness and number of layers, poor interlayer alignment accuracy, and the tendency for accumulated deviations during drilling after stacking. Furthermore, uneven stress between layers during pressing can lead to deformation, affecting the accuracy of subsequent drilling. While layer riveting improves accuracy, it requires multiple independent riveting operations and intermediate inspections, resulting in low efficiency. Additionally, each layer requires two or more sets of riveting holes, necessitating more board space and impacting subsequent drilling and circuit layout, making it inconvenient. Utility Model Content

[0003] (a) Technical problems to be solved

[0004] To overcome the shortcomings of existing technologies, a precision-drilled multilayer circuit board is proposed. This addresses the issues that arise in existing technologies when multilayer circuit boards are riveted together to increase interlayer bonding strength, improve interlayer positioning accuracy, and prevent misalignment during subsequent pressing and drilling processes. Traditional riveting methods include integral riveting and layer riveting. In integral riveting, a single rivet is used to directly pierce the board based on the number of layers and board thickness. This method has high limitations on the number of layers and poor interlayer alignment accuracy. After stacking, drilling deviations tend to accumulate, and uneven interlayer stress during pressing can lead to deformation, affecting subsequent drilling accuracy. While layer riveting improves accuracy, it requires multiple independent riveting operations and intermediate inspections, resulting in low efficiency. Furthermore, each layer requires two or more sets of riveting holes, necessitating more board space and impacting subsequent drilling and circuit layout, which is quite inconvenient.

[0005] (II) Technical Solution

[0006] This utility model is achieved through the following technical solution: This utility model proposes a multilayer circuit board with precise drilling, the structure of which includes a circuit board and rivets, the rivets being used for the stable combination of multiple circuit boards;

[0007] The rivet includes a linkage structure, a clearance groove, a limiting ring, a riveting groove, an outer protective ring, an assembly ring, a riveting plate, a riveting connecting rod, an inner pressure ring, a snap-fit ​​groove, and a through groove. The limiting ring has an integrated outer protective ring at its top, which is embedded in one end face of the circuit board. The outer diameter of the limiting ring is larger than that of the outer protective ring, and the inner diameter of the limiting ring is smaller than that of the outer protective ring. The bottom of the limiting ring has a clearance groove of the same size as the outer protective ring. The outer protective ring, on the side away from the limiting ring, penetrates the circuit board and is positioned within the clearance groove of another rivet. An assembly ring is fixed to the inner ring end of the outer protective ring. A riveting groove is formed between the assembly ring and the inner ring end of the outer protective ring on the side adjacent to the limiting ring. The assembly ring is located away from the limiting ring. Multiple riveting plates are uniformly fixed in a ring shape on one side. Each riveting plate, on the side away from the assembly ring, passes through a limiting ring of another rivet and is located in a riveting groove. The inner pressure ring is a convex ring body. The small ring end of the inner pressure ring is assembled facing the limiting ring. The outer diameter of the large ring of the inner pressure ring is larger than the outer diameter of the ring formed by the riveting plates. A snap-fit ​​groove is provided inside the large ring end of the inner pressure ring. A through groove communicating with the snap-fit ​​groove is provided at the connection between the large ring and the small ring of the inner pressure ring. The outer diameter of the small ring of the inner pressure ring fits with the inner diameter of the ring formed by the riveting plates. The through groove is used for the ring formed by the riveting plates to enter the snap-fit ​​groove. The maximum diameter of the snap-fit ​​groove is larger than the maximum diameter of the through groove. The linkage structure is used to drive the inner pressure ring to move by the riveting connecting rod.

[0008] Furthermore, the junction between the slot and the through slot is arc-shaped.

[0009] Furthermore, it also includes an end ring and a rivet joint. The end ring has the same structure as the limiting ring. The end ring is used to replace the rivet located outside the end of the circuit board. The rivet joint is fixed to the end of the riveting rod located on the end ring side. The outer diameter of the rivet joint is larger than the outer diameter of the ring formed by the riveting plates.

[0010] Furthermore, when the end ring and the limiting ring are embedded in the circuit board, the side of the end ring and the limiting ring that is in contact with the outside is flush with the circuit board or is housed inside the circuit board.

[0011] Furthermore, the rivets located outside the end of the circuit board adopt a structure that removes the assembly ring and the riveting plate, and the outer protective ring is flush with the inner pressure ring on the side away from the limit ring.

[0012] Furthermore, the linkage structure is a first threaded structure, and the side end face of the riveting connecting rod is connected to the inner ring end of the inner pressure ring through the first threaded structure.

[0013] Furthermore, the inner pressure ring is a ring structure that cannot rotate within the riveting groove, and the limiting ring or outer protective ring is a ring structure that cannot rotate within the circuit board.

[0014] Furthermore, the linkage structure comprises a second threaded structure, a groove, and a retaining strip. The large ring side face of the inner pressure ring is connected to the riveting groove side face via the second threaded structure. Multiple retaining strips are evenly distributed on the inner ring end of the inner pressure ring. The groove passes through the beginning and end of the riveting connecting rod and is located on the side face of the riveting connecting rod. The groove has the same number as the retaining strips. The groove is used for the retaining strips to engage when the riveting connecting rod passes through the inner pressure ring.

[0015] Furthermore, the inner pressure ring is a convex-shaped annular body, the riveting groove is an annular groove, and the limiting ring or outer protective ring is an annular structure that cannot rotate within the circuit board.

[0016] Furthermore, the linkage structure is a second threaded structure, the large ring side end face of the inner pressure ring is connected to the riveting groove side end face through the second threaded structure, and the riveting connecting rod is a rod that slides on the inner ring end of the inner pressure ring but cannot rotate.

[0017] Furthermore, the inner pressure ring is a convex-shaped annular body, the riveting groove is an annular groove, and the limiting ring or outer protective ring is an annular structure that cannot rotate within the circuit board.

[0018] (III) Beneficial Effects

[0019] One of the above technical solutions has the following advantages or beneficial effects:

[0020] By combining the outer protective ring and limiting ring, and the inner riveting groove and riveting plate, stacked rivets can be achieved. Each rivet can independently press the circuit board through the limiting ring, ensuring the stability between circuit board layers and improving the positioning accuracy between layers. At the same time, it can reduce the pressure difference between layers, thereby reducing the deformation caused by uneven stress between layers, ensuring the accuracy of subsequent drilling, etc. It is not limited by the number of layers or layer thickness, can be easily combined, and does not require the arrangement of multiple sets of riveting holes, saving circuit board space. During riveting, a single riveting rod can drive all the combined rivets to be riveted simultaneously, eliminating the need for multiple riveting, ensuring stability and improving production efficiency.

[0021] An inlaid rivet structure is adopted to prevent unevenness between layers caused by the rivet limiting plate. At the same time, the limiting plate and the outer protective ring that connect the rivet holes of the entire circuit board are connected by a relief groove, so that the rivet holes of the circuit board will not be deformed. Meanwhile, the relief groove ensures the adjustability of the pressing during riveting. Attached Figure Description

[0022] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0023] Figure 1 This is a cross-sectional structural diagram of the limiting ring in one of the following embodiments of the present invention:

[0024] Figure 2 This is an enlarged structural diagram of another inlay configuration of the limiting ring in Embodiment 1 of this utility model;

[0025] Figure 3 These are enlarged structural schematic diagrams of embodiments two and four of this utility model;

[0026] Figure 4 This utility model Figure 3 A schematic diagram of the structure of A in the middle;

[0027] Figure 5 These are schematic diagrams of embodiments two and five of this utility model;

[0028] Figure 6 This utility model Figure 5 Schematic diagram of structure B in the middle;

[0029] Figure 7 This is a structural schematic diagram of Embodiment 3 of the present invention;

[0030] Figure 8 This utility model Figure 7 Schematic diagram of the C-structure;

[0031] In the diagram: Circuit board-1, Rivet-2, End ring-3, Rivet joint-4, Linkage structure-201, Clearance groove-202, Limiting ring-203, Riveting groove-204, Outer protective ring-205, Assembly ring-206, Riveting plate-207, Riveting connecting rod-208, Inner pressure ring-209, Snap-fit ​​groove-210, Through groove-211, First thread structure-20101, Second thread structure-20102, Snap groove-20103, Snap strip-20104. Detailed Implementation

[0032] The present invention will be further described in detail below with reference to the embodiments, but the implementation of the present invention is not limited thereto.

[0033] Example 1:

[0034] This utility model provides a multilayer circuit board with precise drilling: its structure includes a circuit board 1 and rivets 2, wherein the rivets 2 are used for the combination and stability of multiple circuit boards 1;

[0035] The rivet 2 includes a linkage structure 201, a clearance groove 202, a limiting ring 203, a riveting groove 204, an outer protective ring 205, an assembly ring 206, a riveting plate 207, a riveting connecting rod 208, an inner pressure ring 209, a snap-fit ​​groove 210, and a through groove 211. The limiting ring 203 has an integrated outer protective ring 205 at its top. The limiting ring 203 is embedded in one end face of the circuit board 1. The outer diameter of the limiting ring 203 is larger than the outer diameter of the outer protective ring 205. The inner diameter of ring 203 is smaller than the inner diameter of outer protective ring 205. The bottom of the limiting ring 203 has a clearance groove 202 of the same size as the outer protective ring 205. The outer protective ring 205, on the side away from the limiting ring 203, penetrates the circuit board 1 and is located within the clearance groove 202 of another rivet 2. An assembly ring 206 is fixed to the inner ring end of the outer protective ring 205. A riveting groove 204 is formed between the side of the assembly ring 206 adjacent to the limiting ring 203 and the inner ring end of the outer protective ring 205. Multiple riveting plates 207 are uniformly fixed in a ring shape on the side of ring 206 away from the limiting ring 203. The riveting plates 207, on the side away from the assembly ring 206, pass through the limiting ring 203 of another rivet 2 and are located within the riveting groove 204. The inner pressure ring 209 is a convex-shaped ring body. The small ring end of the inner pressure ring 209 is assembled towards the limiting ring 203. The outer diameter of the large ring of the inner pressure ring 209 is larger than the outer diameter of the ring formed by the riveting plates 207. The large ring end of the inner pressure ring 209 has an internal... The inner pressure ring 209 has a snap-fit ​​groove 210. The connection between the large ring and the small ring of the inner pressure ring 209 is provided with a through groove 211 that communicates with the snap-fit ​​groove 210. The outer diameter of the small ring of the inner pressure ring 209 fits with the inner diameter of the annulus formed by the riveting plates 207. The through groove 211 is used for the annulus formed by the riveting plates 207 to enter the snap-fit ​​groove 210. The maximum diameter of the snap-fit ​​groove 210 is larger than the maximum diameter of the through groove 211. The linkage structure 201 is used to drive the inner pressure ring 209 to move by the riveting connecting rod 208.

[0036] Furthermore, the junction between the slot 210 and the through slot 211 is arc-shaped.

[0037] In use, each circuit board 1 is equipped with rivets 2, and the outer protective ring 205 is aligned with the clearance groove 202 of the limiting ring 203 of the adjacent circuit board 1 for insertion assembly. At this time, the riveting plate 207 can be inserted from the inner ring end of the limiting ring 203 into the riveting groove 204. At the same time, the small ring end of the inner pressure ring 209 will enter the ring formed by the riveting plates 207, and the riveting connecting rod 208 is connected to all the rivets 2 through the linkage structure 201 to perform riveting. During riveting, the pressing device (not shown in the figure) pulls the riveting connecting rod 208, so that the riveting connecting rod 208 is connected to the connecting rod 208 through the linkage structure 201. The moving structure 201 drives the inner pressure ring 209 to move towards the adjacent circuit board 1. During this process, the riveting plate 207 will enter the snap-fit ​​groove 210 from the through groove 211 and deform as the pressing proceeds. After the riveting plate 207 reaches the snap-fit ​​groove 210 limit, the riveting plate 207 will deform under pressure. At this time, because the inner ring end formed by the riveting plate 207 is in contact with the small ring of the inner pressure ring 209, the riveting plate 207 will only deform towards the riveting groove 204. As the riveting plate 207 deforms, it will drive the limiting ring 203 to press the adjacent circuit board 1. In this process, the clearance groove 202 of the limiting ring 203 gradually covers the outer protective ring 205, ensuring the adjustability of the pressing during riveting. This allows for the stacking of rivets 2, each of which can independently press against the circuit board 1 via the limiting ring 203, ensuring the stability between layers of the circuit board 1, improving interlayer positioning accuracy, and reducing the pressure difference between layers. This reduces deformation caused by uneven interlayer stress, ensuring the accuracy of subsequent drilling, etc., and is not limited by the number or thickness of layers. It allows for convenient assembly and eliminates the need for multiple sets of riveting holes, saving space on the circuit board. During riveting, a single riveting rod 208 can drive all the assembled rivets 2 to be riveted simultaneously, eliminating the need for multiple riveting operations, ensuring stability and improving production efficiency. After riveting is completed, the riveting rod 208 or any excess parts can be separated by pulling off the linkage structure 201 or breaking the riveting rod 208. An inlaid rivet 2 structure is used to prevent unevenness between layers caused by the rivet 2 limiting plate 203. At the same time, the limiting plate 203 and the outer protective ring 205, which connect the riveting holes of the entire circuit board 1, are connected by the relief groove 202, so that the riveting holes of the circuit board 1 will not be deformed.

[0038] Example 2:

[0039] Compared to the previous embodiment, this embodiment also includes an end ring 3 and a rivet joint 4. The structure of the end ring 3 is the same as that of the limiting ring 203. The end ring 3 is used to replace the rivet 2 located outside the end of the circuit board 1. The rivet joint 4 is fixed to the end of the riveting rod 208 located on the side of the end ring 3. The outer diameter of the rivet joint 4 is larger than the outer diameter of the ring formed by the riveting plates 207.

[0040] Furthermore, when the end ring 3 and the limiting ring 203 are embedded on the circuit board 1, the side of the end ring 3 and the limiting ring 203 that is in contact with the outside is flush with the circuit board 1 or is housed inside the circuit board 1.

[0041] In use, only the end ring 3 and the height of the pressed riveting plate 207 and the riveting head 4 are needed at the end of the circuit board 1, eliminating the need for the entire rivet 2. This reduces the extra height and material after riveting, while the rest of the structure and effect remain unchanged.

[0042] Example 3:

[0043] Compared to the previous embodiments, in this embodiment, the rivet 2 located outside the end of the circuit board 1 adopts a structure that removes the assembly ring 206 and the riveting plate 207, and the side of the outer protective ring 205 away from the limiting ring 203 is flush with the side of the inner pressure ring 209 away from the limiting ring 203, reducing some of the extra height and material after riveting is completed, while the rest of the structure and effect remain unchanged.

[0044] Example 4:

[0045] Compared to the previous embodiments, the linkage structure 201 in this embodiment is a first threaded structure 20101, and the side end face of the riveting connecting rod 208 is connected to the inner ring end of the inner pressure ring 209 through the first threaded structure 20101.

[0046] Furthermore, the inner pressure ring 209 is an annular structure that cannot rotate within the riveting groove 204, and the limiting ring 203 or the outer protective ring 205 is an annular structure that cannot rotate within the circuit board 1.

[0047] In use, the riveting rod 208 can be rotated to combine with multiple inner pressure rings 209, which facilitates the rapid combination of multiple rivets 2. After the combination is completed, the interlayer pressing can be performed by pulling the riveting rod 208, and the rest of the structure and effect remain unchanged.

[0048] Example 5:

[0049] Compared to the previous embodiments, the linkage structure 201 in this embodiment consists of a second thread structure 20102, a slot 20103, and a retaining strip 20104. The large ring side end face of the inner pressure ring 209 is connected to the side end face of the riveting groove 204 through the second thread structure 20102. Multiple retaining strips 20104 are evenly provided at the inner ring end of the inner pressure ring 209. The slot 20103 passes through the riveting connecting rod 208 and is located at both ends on the side end face of the riveting connecting rod 208. The number of slots 20103 is the same as the number of retaining strips 20104. The slots 20103 are used for the engagement of the retaining strips 20104 when the riveting connecting rod 208 passes through the inner pressure ring 209.

[0050] Furthermore, the inner pressure ring 209 is a convex-shaped annular body, the riveting groove 204 is an annular groove, and the limiting ring 203 or the outer protective ring 205 is an annular structure that cannot rotate within the circuit board 1.

[0051] In use, the riveting rod 208 can be quickly combined with multiple rivets 2 by insertion and removal, which is more convenient than the combination of threads and other rotating connections. After the combination is completed, the riveting rod 208 can be rotated to drive the inner pressure ring 209 to rotate through the slot 20103 and the retaining strip 20104. The inner pressure ring 209 moves in the riveting groove 204 with the second thread structure 20102, thereby gradually compressing the riveting plate 207 for pressing. Then, the riveting rod 208 can be pulled to press the riveting joint 4 at the end to press the riveting plate 207 for end riveting. This increases the processing difficulty, but the rotation drives the compression of the inner pressure ring 209 to make the pressure between the layers more uniform and avoid over-pressure deformation. The rest of the structure and effect remain unchanged.

[0052] Example 6:

[0053] Compared to Embodiment 5, the linkage structure 201 in this embodiment is a second threaded structure 20102. The large ring side end face of the inner pressure ring 209 is connected to the side end face of the riveting groove 204 through the second threaded structure 20102. The riveting connecting rod 208 is a rod that slides on the inner ring end of the inner pressure ring 209 but cannot rotate, such as a rod with a square or elliptical cross-section.

[0054] Furthermore, the inner pressure ring 209 is a convex-shaped annular body, the riveting groove 204 is an annular groove, and the limiting ring 203 or the outer protective ring 205 is an annular structure that cannot rotate within the circuit board 1.

[0055] When in use, the riveting rod 208 can be directly inserted into the rivet 2 after being aligned with the shape, eliminating the need for the slot 20103 and the clip 20104, which can save some structural processing and facilitate processing, while the rest of the structure and effect remain unchanged.

[0056] In the description of this utility model, it should be noted that the terms "upper", "lower", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0057] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0058] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A multilayer circuit board with precision drilling, the structure of which includes a circuit board (1) and rivets (2), the rivets (2) being used for stabilizing the combination of multiple circuit boards (1); Its features are: The rivet (2) includes a linkage structure (201), a clearance groove (202), a limiting ring (203), a riveting groove (204), an outer protective ring (205), an assembly ring (206), a riveting plate (207), a riveting connecting rod (208), an inner pressure ring (209), a snap-fit ​​groove (210), and a through groove (211). The limiting ring (203) has an integrated outer protective ring (205) on its top. The limiting ring (203) is embedded in one end face of the circuit board (1). The outer diameter of the limiting ring (203) is larger than the outer diameter of the outer protective ring (205). The inner diameter of the limiting ring (203) is smaller than that of the outer protective ring (205). The bottom of the limiting ring (203) is provided with a relief groove (202) of the same size as the outer protective ring (205). The outer protective ring (205) is located in the relief groove (202) of another rivet (2) on the side of the circuit board (1) away from the limiting ring (203). An assembly ring (206) is fixed to the inner ring end of the outer protective ring (205). A riveting groove (204) is formed between the side of the assembly ring (206) adjacent to the limiting ring (203) and the inner ring end of the outer protective ring (205). The assembly ring (206) has multiple riveting plates (207) uniformly fixed in a ring shape on the side away from the limiting ring (203). The riveting plates (207) on the side away from the assembly ring (206) pass through the limiting ring (203) of another rivet (2) and are located in the riveting groove (204). The inner pressure ring (209) is a convex ring body. The small ring end of the inner pressure ring (209) is assembled facing the limiting ring (203). The outer diameter of the large ring of the inner pressure ring (209) is larger than the outer diameter of the ring formed by the riveting plates (207). The end is provided with a snap-fit ​​groove (210). The connection between the large ring and the small ring of the inner pressure ring (209) is provided with a through groove (211) that communicates with the snap-fit ​​groove (210). The outer diameter of the small ring of the inner pressure ring (209) fits with the inner diameter of the ring formed by the riveting plate (207). The through groove (211) is used for the ring formed by the riveting plate (207) to enter the snap-fit ​​groove (210). The maximum diameter of the snap-fit ​​groove (210) is greater than the maximum diameter of the through groove (211). The linkage structure (201) is used to rivet the connecting rod (208) to drive the inner pressure ring (209) to move.

2. The multilayer circuit board with precise drilling according to claim 1, characterized in that: The junction of the slot (210) and the through slot (211) is arc-shaped.

3. A multilayer circuit board with precise drilling according to claim 1, characterized in that: It also includes an end ring (3) and a rivet joint (4). The structure of the end ring (3) is the same as that of the limiting ring (203). The end ring (3) is used to replace the rivet (2) located outside the end of the circuit board (1). The rivet joint (4) is fixed to the end of the riveting rod (208) located on the side of the end ring (3). The outer diameter of the rivet joint (4) is larger than the outer diameter of the ring formed by the riveting plate (207).

4. A multilayer circuit board with precise drilling according to claim 1, characterized in that: The rivet (2) located outside the end of the circuit board (1) adopts a structure that removes the assembly ring (206) and the rivet plate (207), and the outer protective ring (205) is flush with the side away from the limiting ring (203) and the inner pressure ring (209) is flush with the side away from the limiting ring (203).

5. A multilayer circuit board with precise drilling according to claim 1, 3, or 4, characterized in that: The linkage structure (201) is a first threaded structure (20101), and the side end face of the riveting connecting rod (208) is connected to the inner ring end of the inner pressure ring (209) through the first threaded structure (20101).

6. A multilayer circuit board with precise drilling according to claim 5, characterized in that: The inner pressure ring (209) is an annular structure that cannot rotate within the riveting groove (204), and the limiting ring (203) or outer protective ring (205) is an annular structure that cannot rotate within the circuit board (1).

7. A multilayer circuit board with precise drilling according to claim 1, 3, or 4, characterized in that: The linkage structure (201) consists of a second thread structure (20102), a slot (20103), and a strip (20104). The large ring side end face of the inner pressure ring (209) is connected to the side end face of the riveting groove (204) through the second thread structure (20102). Multiple strips (20104) are evenly provided at the inner ring end of the inner pressure ring (209). The slot (20103) passes through the riveting rod (208) and is located at both ends on the side end face of the riveting rod (208). The slot (20103) has the same number as the strips (20104). The slot (20103) is used for the fitting of the strips (20104) when the riveting rod (208) passes through the inner pressure ring (209).

8. A multilayer circuit board with precise drilling according to claim 7, characterized in that: The inner pressure ring (209) is a convex-shaped annular body, the riveting groove (204) is an annular groove, and the limiting ring (203) or outer protective ring (205) is an annular structure that cannot rotate within the circuit board (1).

9. A multilayer circuit board with precise drilling according to claim 1, 3, or 4, characterized in that: The linkage structure (201) is a second threaded structure (20102). The large ring side end face of the inner pressure ring (209) is connected to the side end face of the riveting groove (204) through the second threaded structure (20102). The riveting connecting rod (208) is a rod that slides on the inner ring end of the inner pressure ring (209) but cannot rotate.

10. A multilayer circuit board with precise drilling according to claim 9, characterized in that: The inner pressure ring (209) is a convex-shaped annular body, the riveting groove (204) is an annular groove, and the limiting ring (203) or outer protective ring (205) is an annular structure that cannot rotate within the circuit board (1).

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