A vibration-resistant and anti-detachment housing for modular power supplies

Abstract

This application discloses a vibration-resistant and anti-detachment housing for a modular power supply, comprising: a housing, with connecting feet provided on at least two opposite sides of the housing; a cover plate, with connecting foot through holes that mate with the connecting feet; and solder pads provided at the connecting foot through holes. This solution, by adding a connecting foot structure to the housing and providing solder pads at the connecting foot through holes, welds the housing and cover plate together, saving module space, avoiding wear between the housing and cover plate, facilitating disassembly, and controlling the horizontal and vertical displacement of the modular power supply housing and cover plate, thereby improving the reliability of the small modular power supply housing.

Description

Technical Field

[0001] This application relates to the field of structural design technology, and in particular to a vibration-resistant and anti-detachment housing for a modular power supply. Background Technology

[0002] According to the requirements of GJB150.16A-2009 "Laboratory Environmental Testing Methods for Military Equipment - Part 16: Vibration Testing", vibration testing is required for the modular power supply. The modular power supply casing consists of a shell and a cover plate. Currently, commonly used assembly methods include snap-fit ​​connections, bolted connections, or adhesive bonding. However, snap-fit ​​connections are prone to wear, while adhesive bonding has lower reliability. Furthermore, when the modular power supply is small, the use of bolts is limited. Therefore, in the use of modular power supplies, especially in vibration environments, the vibration resistance and anti-detachment function of the casing needs to be strengthened. Utility Model Content

[0003] An embodiment of this application provides a vibration-resistant and anti-detachment housing for a modular power supply.

[0004] To achieve the above objectives, embodiments of this application provide a vibration-resistant and anti-detachment housing for a module power supply, comprising:

[0005] The housing has connecting feet on at least two opposite sides;

[0006] The cover plate has through holes for connecting feet, which are matched with the connecting feet; solder pads are provided at the through holes for connecting feet.

[0007] In one embodiment, the module power supply includes a PCB board with pins connected to it;

[0008] The cover plate has a first pin via hole, which is set to correspond to the pin; a pad is provided at the first pin via hole.

[0009] In one embodiment, the PCB board is soldered to the pins.

[0010] In one embodiment, the housing is made of nickel-plated iron.

[0011] In one embodiment, the cover is made of FR-4 material.

[0012] In one embodiment, the cover plate is welded to the mounting surface, and a second pin via is provided on the mounting surface, with the second pin via corresponding to the pin; a pad is provided at the second pin via.

[0013] Compared with the prior art, this application has the following advantages: This solution adds a connecting foot structure to the nickel-plated iron shell, the cover plate is made of FR-4 material, and pads are set on the connecting foot through holes and the first pin through holes and the second pin through holes to weld the nickel-plated iron shell to the cover plate, as well as to weld the pins to the cover plate. Compared with traditional snap-fit, bolt and glue methods, it saves module space, solves the problem that small shells cannot be bolted with rivet studs, avoids wear between the shell and the cover plate, facilitates disassembly, and controls the displacement of the module power supply shell and the cover plate in the horizontal and vertical directions, improves the reliability of the small module power supply shell, adapts to various usage conditions, and avoids the risk of the module power supply shell detaching in a vibration environment. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the structure of the anti-vibration and anti-detachment housing for the module power supply according to an embodiment of this application;

[0016] Figure 2 This is an exploded view of the structure of the anti-vibration and anti-detachment housing for the module power supply according to an embodiment of this application;

[0017] Figure 3 A schematic diagram showing the module power supply with an anti-vibration and anti-detachment housing provided in the embodiments of this application soldered onto the mounting surface. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0020] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation", "connection" and "joining" should be interpreted broadly, for example, they can refer to fixed connection, detachable connection, or integral connection; for those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0021] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0022] Reference Figure 1 , Figure 2 This application provides an anti-vibration and anti-detachment housing for a modular power supply. The modular power supply comprises three parts: a housing 1, a PCB board 2, and pins 3. The vibration environment of the modular power supply conforms to GJB150.16A-2009, the power spectral density spectrum is set as required, and the vibration directions include up / down, front / back, and left / right.

[0023] like Figure 1 , Figure 2 As shown in the embodiment of this application, an anti-vibration and anti-detachment housing for a module power supply includes:

[0024] The housing 11 has connecting feet 111 on at least two opposite sides;

[0025] The cover plate 12 has a connecting pin through hole 121, which matches the connecting pin 111; a solder pad is provided at the connecting pin through hole 121.

[0026] The housing 11 is used to house the PCB board 2. The housing 11 can be made of nickel-plated iron for easy heat dissipation. The cover plate 12 can be made of FR-4 material.

[0027] The housing 11 is a cuboid with an opening on one side. Connecting feet 111 are provided on at least two opposite sides of the opening side for connection with the cover plate 12. The cover plate 12 has connecting foot through holes 121 that match the connecting feet 111, and solder pads are provided at the connecting foot through holes. The connecting feet 111 can be passed through the connecting foot through holes 121 and soldered to the cover plate 12 to ensure the vertical stability of the module power supply during vibration. Figure 2 The example shown is an example with connecting pins 111 on two opposite sides of the opening side. It is understandable that, in order to make the module power supply more stable, more than two connecting pins 111 and corresponding connecting pin vias 121 can be provided.

[0028] In one embodiment, the module power supply includes a PCB board 2, on which pins 3 are connected;

[0029] The cover plate 12 has a first pin via 122, which is set to correspond to the pin 3; a pad is provided at the first pin via 122.

[0030] The PCB board 2 and the pin 3 can be connected by soldering.

[0031] The first pin via 122 on the cover plate 12 can be made according to the actual number of pins 3. A solder pad is provided at the first pin via 122, so that the pins 3 can be passed through the first pin via 122 and soldered to the cover plate 12 to ensure the horizontal stability of the module power supply during vibration.

[0032] In one embodiment, the cover plate 12 is welded to the mounting surface 4, and the mounting surface 4 has a second pin via hole, which is corresponding to the pin 3; a solder pad is provided at the second pin via hole. The cover plate 12 is welded to the mounting surface 4 to fix the module power supply on the mounting surface 4.

[0033] The anti-vibration and anti-detachment housing 1 of the above-mentioned module power supply is soldered at the solder pads by melting the solder with an electric soldering iron. When disassembling, the solder can be melted off with a soldering iron.

[0034] Other module power supply structures or processes that are unrelated to the structural design of the housing 1 and are required during the module power supply assembly process will not be described in detail here, such as potting process and specific welding process.

[0035] The anti-vibration and anti-detachment housing for modular power supplies provided in this application adds a connecting foot structure to the nickel-plated iron housing. The cover plate is made of FR-4 material, and pads are set on the connecting foot through holes and the first and second pin through holes to weld the nickel-plated iron housing to the cover plate, as well as the pins to the cover plate. Compared with traditional snap-fit, bolt, and glue methods, this saves module space, solves the problem that small housings cannot be bolted with studs, avoids wear between the housing and the cover plate, facilitates disassembly, and controls the horizontal and vertical displacement of the modular power supply housing and the cover plate, improving the reliability of the small modular power supply housing, adapting to various usage conditions, and avoiding the risk of the modular power supply housing detaching in vibration environments.

[0036] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A vibration-resistant and anti-detachment housing for a modular power supply, characterized in that, include: A housing (11) having connecting feet (111) on at least two opposite sides; Cover plate (12), the cover plate (12) is provided with a connecting foot through hole (121), the connecting foot through hole (121) is matched with the connecting foot (111); a solder pad is provided at the connecting foot through hole (121).

2. The anti-vibration and anti-detachment housing for a modular power supply according to claim 1, characterized in that, The module power supply includes a PCB board (2), and pins (3) are connected to the PCB board (2); The cover plate (12) has a first pin via (122), which is corresponding to the pin (3); a pad is provided at the first pin via (122).

3. The anti-vibration and anti-detachment housing for a modular power supply according to claim 2, characterized in that, The PCB board (2) is soldered to the pin (3).

4. The anti-vibration and anti-detachment housing for a modular power supply according to claim 1, characterized in that, The housing (11) is made of nickel-plated iron.

5. The anti-vibration and anti-detachment housing for a modular power supply according to claim 1, characterized in that, The cover plate (12) is made of FR-4 material.

6. The anti-vibration and anti-detachment housing for a modular power supply according to claim 1, characterized in that, The cover plate (12) is welded to the mounting surface (4), and a second pin through hole is provided on the mounting surface (4). The second pin through hole is corresponding to the pin (3). A solder pad is provided at the second pin through hole.

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