Double-layer module power supply with heat conduction structure
By setting a heat-conducting layer between the upper and lower circuit boards of the modular power supply, the problem of heat island effect between the circuit boards is solved, achieving better heat dissipation and ensuring the stability and safety of the power supply system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU BOHUA XINDA TECHNOLOGY CO LTD
- Filing Date
- 2025-04-11
- Publication Date
- 2026-05-26
AI Technical Summary
Existing modular power supplies have poor heat dissipation performance, especially in AI hardware power supply systems. The overlapping structure of upper and lower PCBs prevents heat from being effectively dissipated, creating a heat island effect that may damage the power supply system.
A thermally conductive layer is placed between the upper and lower circuit boards, and the gaps are filled with materials such as thermally conductive films or silicone sheets to achieve uniform heat conduction and increase the heat dissipation area.
This effectively avoids the heat island effect between circuit boards, improves the heat dissipation efficiency of the module power supply, and ensures the stability and safety of the power system.
Smart Images
Figure CN224290377U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power supply technology, and in particular to a double-layer modular power supply with a thermally conductive structure. Background Technology
[0002] In the field of AI hardware power supply systems (AIPower), xPU power supply modules, as core components of computing infrastructure, are facing the dual challenges of exponential growth in power density and miniaturization. Existing technologies typically employ a stacked architecture for module power supplies. The upper module consists of a printed circuit board with double-sided mounting of high-density integrated devices, including core components such as power management chips and energy storage capacitors. The lower module uses single-sided mounting technology, with its bottom surface electrically connected to the server motherboard via surface mount pads. The two layers are vertically interconnected through a matrix of signal and power pins.
[0003] With the upgrading of AI hardware system architecture, traditional natural convection cooling methods are no longer sufficient to meet thermal management requirements. Heat from the upper PCB area is primarily dissipated through the heat spreader above the components, but heat generated by components at the bottom cannot be directly dissipated. Heat generated in the lower PCB area typically needs to be conducted through the component pads to the bottom pads of the entire device and then to the motherboard for dissipation. The overlapping structure of the upper and lower PCBs causes a heat island effect in areas where power devices are concentrated, especially at the power pin connections in the sandwich layer where there is high thermal resistance. This heat cannot be effectively dissipated directly through the heat spreader and accumulates between the upper and lower PCBs, potentially leading to localized overheating and even damage to the entire power supply. Utility Model Content
[0004] To address the issue of poor heat dissipation in AIPower modular power supplies, this invention aims to provide a dual-layer modular power supply with a thermally conductive structure.
[0005] To achieve the above objectives, the present invention provides a dual-layer modular power supply with a thermally conductive structure, comprising a first circuit board; a second circuit board connected to the first circuit board via pins; and a thermally conductive layer disposed between the first circuit board and the second circuit board.
[0006] In one embodiment, the thickness of the thermally conductive layer is less than the spacing between the first circuit board and the second circuit board.
[0007] By setting the heat-conducting layer between the first circuit board and the second circuit board, the heat generated by the components below the first circuit board and the components above the second circuit board can be conducted to the heat-conducting layer, which can effectively avoid the heat island effect formed between the first circuit board and the second circuit board due to the dense components, thereby effectively solving the heat dissipation problem of the module power supply.
[0008] In one embodiment, the thermally conductive layer fills the gap between the first circuit board and the second circuit board.
[0009] By filling the heat-conducting layer between the first circuit board and the second circuit board, the heat generated by the components below the first circuit board and the components above the second circuit board can be uniformly conducted to the heat-conducting layer, which effectively increases the heat dissipation area between the first circuit board and the second circuit board, thereby better solving the heat dissipation problem of the module.
[0010] In one embodiment, the pin passes through the thermally conductive layer.
[0011] In one embodiment, the pin is a signal pin or a power pin.
[0012] In one embodiment, the thermally conductive layer is a thermally conductive film or a silicone sheet.
[0013] In one embodiment, a plurality of input capacitors and a plurality of first output capacitors are respectively disposed at the upper two ends of the first circuit board, and a magnetic core is disposed between the input capacitors and the first output capacitors, with the magnetic core passing through the middle position of the first circuit board.
[0014] In one embodiment, at least one heat spreader is disposed above the first circuit board, and the bottom of the heat spreader is connected to the top of the first circuit board.
[0015] The heat generated by the devices above the first circuit board is dissipated through the heat spreader.
[0016] In one embodiment, a MOS transistor and a second output capacitor are disposed below the first circuit board. The MOS transistor is disposed on the side close to the input capacitor, and the second output capacitor is located on the same side as the first output capacitor.
[0017] This invention adds a heat-conducting layer between two circuit boards, which can conduct the heat generated by the components between the two circuit boards to the heat-conducting layer, effectively avoiding the heat island effect formed by the dense components between the two circuit boards, thus effectively solving the heat dissipation problem of the module power supply. At the same time, the heat-conducting layer can fill the gap between the two circuit boards, uniformly conducting the heat generated by the components between the two circuit boards to the heat-conducting layer, effectively increasing the heat dissipation area of the two circuit boards, thereby better solving the heat dissipation problem of the module.
[0018] To make the above-mentioned features and advantages of the utility model more apparent and understandable, specific embodiments are described below, and detailed descriptions are provided in conjunction with the accompanying drawings. Attached Figure Description
[0019] Figure 1 This is a three-dimensional structural diagram of a double-layer modular power supply with a heat-conducting structure according to Embodiment 1 of this utility model.
[0020] Figure 2 This is a three-dimensional structural diagram of a double-layer modular power supply with a heat-conducting structure according to Embodiment 2 of this utility model.
[0021] Figure label:
[0022] 1, 2 - Module power supply; 11, 21 - First circuit board; 12, 22 - Thermal conductive layer; 13, 23 - Second circuit board; 14 - Power pin; 15 - Signal pin; 111 - Input capacitor; 112 - First output capacitor; 113 - Magnetic core; 114 - Driver; 115 - Heat sink; 116 - MOSFET; 117 - Second output capacitor; 131 - Component. Detailed Implementation
[0023] To make the objectives and technical solutions of the present utility model clearer, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.
[0024] like Figure 1 As shown, Embodiment 1 of this utility model provides a dual-layer modular power supply 1 with a thermally conductive structure, which includes a first circuit board 11, a thermally conductive layer 12 and a second circuit board 13 from top to bottom. The first circuit board 11 and the second circuit board 13 are connected through a power pin 14 and a signal pin 15. The thermally conductive layer 12 is disposed between the first circuit board 11 and the second circuit board 13, and the power pin 14 and the signal pin 15 pass through the thermally conductive layer 12.
[0025] Multiple input capacitors 111 and multiple first output capacitors 112 are respectively disposed at the upper two ends of the first circuit board 11. A magnetic core 113 is disposed between the input capacitors 111 and the first output capacitors 112, and the magnetic core 113 passes through the middle of the first circuit board 11. A driving component 114 is also disposed on the upper side of the circuit board 11 near the input capacitors 111. Of course, other types of components can be disposed on the upper side of the first circuit board 11 according to the actual situation, which will not be listed or limited here.
[0026] Furthermore, at least one heat spreader 115 is disposed above the first circuit board 11. The bottom of the heat spreader 115 is connected to the top of the first circuit board 11. The heat spreader 115 has a hollow plate structure and covers the components on the first circuit board 11, allowing the heat generated by the devices on the first circuit board 11 to be discharged through the heat spreader 115. In this embodiment, two heat spreaders 115 are included, respectively disposed near the input capacitor 111 and near the first output capacitor 112. The magnetic core 113 is located between the two heat spreaders 115, and the top of the magnetic core 113 is flush with the top of the heat spreader 115.
[0027] Components, including a MOSFET 116 and a second output capacitor 117, are also disposed below the first circuit board 11. The MOSFET 116 is disposed on the side close to the input capacitor 111, and the second output capacitor 117 is located on the same side as the first output capacitor 112. Similarly, other types of components can also be disposed below the first circuit board 11.
[0028] The second circuit board 13 has multiple components 131 disposed on its upper surface. These components 131 may be control chips, driver chips, resistors, capacitors, or switching transistors, etc. The second circuit board 13 and the first circuit board 11 are connected via the power pin 14 and the signal pin 15.
[0029] In this embodiment, the thermally conductive layer 12 is located between the components below the first circuit board 11 and the components above the second circuit board 13, and the thickness of the thermally conductive layer 12 is less than the distance between the first circuit board 11 and the second circuit board 13. The thermally conductive layer 12 can be a thermally conductive film or a silicone sheet, or other encapsulation materials.
[0030] By setting the heat-conducting layer 12 between the first circuit board 11 and the second circuit board 13, the heat generated by the components below the first circuit board 11 and the components above the second circuit board 13 can be conducted to the heat-conducting layer 12, which can effectively avoid the heat island effect formed between the first circuit board 11 and the second circuit board 13 due to the dense components, thereby effectively solving the heat dissipation problem of the module power supply 1.
[0031] like Figure 2As shown, Embodiment 2 of this utility model provides a dual-layer modular power supply 2 with a thermally conductive structure, comprising, from top to bottom, a first circuit board 21, a thermally conductive layer 22, and a second circuit board 23. The first circuit board 21 and the second circuit board 23 are connected via power pins and signal pins. The thermally conductive layer 22 is disposed between the first circuit board 21 and the second circuit board 23. The difference between this embodiment and Embodiment 1 is that the thermally conductive layer 22 fills the space between the first circuit board 21 and the second circuit board 23, that is, the thermally conductive layer 22 completely covers the components below the first circuit board 21 and the components above the second circuit board 23.
[0032] By filling the heat-conducting layer 22 between the first circuit board 21 and the second circuit board 23, the heat generated by the components below the first circuit board 21 and the components above the second circuit board 23 can be uniformly conducted to the heat-conducting layer 22, which effectively increases the heat dissipation area between the first circuit board 21 and the second circuit board 23, thereby better solving the heat dissipation problem of the module 2.
[0033] In summary, by adding a heat-conducting layer between the upper and lower circuit boards, this utility model can conduct the heat generated by the components between the two circuit boards to the heat-conducting layer, effectively avoiding the heat island effect formed by the dense components between the two circuit boards, thus effectively solving the heat dissipation problem of the module power supply.
[0034] Unless otherwise defined, the technical or scientific terms used in this invention shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects.
[0035] Although this application has been described in conjunction with several specific embodiments, it is quite obvious that this application is by no means limited thereto, and the present invention includes all technical equivalents of the described apparatus and combinations thereof, all of which fall within the scope of this application.
Claims
1. A dual-layer modular power supply with a thermally conductive structure, characterized in that, include A first circuit board, wherein at least one heat spreader is disposed above the first circuit board, the bottom of the heat spreader is connected to the top of the first circuit board, and the heat generated by the devices above the first circuit board is discharged through the heat spreader. The second circuit board is connected to the first circuit board via pins; A thermally conductive layer is disposed between the first circuit board and the second circuit board.
2. The double-layer module power supply with heat conduction structure according to claim 1, characterized in that, The thickness of the thermally conductive layer is less than the distance between the first circuit board and the second circuit board.
3. A dual-layer modular power supply with a thermally conductive structure according to claim 1, characterized in that, The thermally conductive layer fills the gap between the first circuit board and the second circuit board.
4. A dual-layer modular power supply with a thermally conductive structure according to claim 1, characterized in that, The pin passes through the thermally conductive layer.
5. A dual-layer modular power supply with a thermally conductive structure according to claim 4, characterized in that, The pin can be a signal pin or a power pin.
6. A dual-layer modular power supply with a thermally conductive structure according to claim 1, characterized in that, The thermally conductive layer is a thermally conductive film or a silicone sheet.
7. A dual-layer modular power supply with a thermally conductive structure according to claim 1, characterized in that, Multiple input capacitors and multiple first output capacitors are respectively provided at the upper two ends of the first circuit board. A magnetic core is provided between the input capacitors and the first output capacitors, and the magnetic core is inserted through the middle position of the first circuit board.
8. A dual-layer modular power supply with a thermally conductive structure according to claim 7, characterized in that, A MOSFET and a second output capacitor are disposed below the first circuit board. The MOSFET is disposed on the side close to the input capacitor, and the second output capacitor is located on the same side as the first output capacitor.