Displays and electronic devices

Abstract

This disclosure provides a display and an electronic device, belonging to the field of electronic technology. The display includes a display module, a shielding cover, a circuit board assembly, a base, a first heat-conducting component, and a second heat-conducting component. The opening end of the shielding cover is connected to the display module, forming a shielding space between the shielding cover and the display module. The circuit board assembly is located in the shielding space and is electrically connected to the display module. The base is located on the side of the shielding cover away from the display module. The first heat-conducting component is located in the shielding space and is connected to the inner wall of the circuit board assembly and the shielding cover. The second heat-conducting component is connected to the outer wall of the shielding cover and the base. Using this disclosure, the heat generated on the circuit board assembly is conducted to the shielding cover through the first heat-conducting component. On the one hand, the shielding cover itself can conduct heat to the outside, thereby achieving heat dissipation. On the other hand, the heat on the shielding cover can also be conducted to the base through the second heat-conducting component, further achieving heat dissipation through the base, thereby improving the heat dissipation effect of the display.

Description

Technical Field

[0001] This disclosure relates to the field of electronic technology, and more specifically to a display and an electronic device. Background Technology

[0002] As an indispensable device in daily life, monitors provide users with an audiovisual experience of images, videos, or games. With the increase in monitor refresh rates and the continuous addition of functions, the heat dissipation of the monitor's circuit board components has also increased. It is necessary to conduct heat from the circuit board components to the outside of the machine in a timely and efficient manner to ensure the stable operation of the monitor.

[0003] Typically, a heat-conducting component is placed between the circuit board assembly and the shielding cover of the display to conduct the heat generated on the circuit board assembly to the shielding cover, and then conduct the heat away through the shielding cover.

[0004] However, the above-mentioned structure has poor heat dissipation performance and is gradually unable to meet the high heat dissipation requirements. Utility Model Content

[0005] This disclosure provides a display and an electronic device that can solve the technical problems existing in the related art. The technical solution is as follows:

[0006] On one hand, this disclosure provides a display, which includes a display module, a shielding cover, a circuit board assembly, a base, a first heat-conducting component, and a second heat-conducting component;

[0007] The opening end of the shielding cover is connected to the display module, and a shielding space is formed between the shielding cover and the display module;

[0008] The circuit board assembly is located in the shielded space and is electrically connected to the display module;

[0009] The base is located on the side of the shield away from the display module;

[0010] The first heat-conducting component is located in the shielding space and is connected to the inner wall of the circuit board assembly and the shielding cover;

[0011] The second heat-conducting element is connected to the outer wall of the shield and the base.

[0012] In the technical solution provided in this disclosure, the heat generated on the circuit board assembly is conducted to the shielding cover through the first heat-conducting component. On the one hand, the shielding cover itself can conduct heat to the outside, thereby achieving heat dissipation. On the other hand, the heat on the shielding cover can also be conducted to the base through the second heat-conducting component, and further heat dissipation is achieved through the base, thereby improving the heat dissipation effect of the display.

[0013] In some possible implementations, the circuit board assembly includes a circuit board body and a chip;

[0014] The circuit board body is located in the shielded space and is electrically connected to the display module;

[0015] The chip is located between the inner wall of the circuit board body and the shielding cover. The chip is electrically connected to the circuit board body and connected to the first heat-conducting component.

[0016] In the technical solution provided in this disclosure, the chip is the main heat-generating device in the circuit board assembly. The chip is cooled in a targeted manner through the first heat-conducting component, the shielding cover, the second heat-conducting component, and the base, thereby improving the heat dissipation effect of the display.

[0017] In some possible implementations, the display also includes a rear cover;

[0018] The central portion of the rear shell is located between the shield and the base and is connected to the base. The central portion of the rear shell has a receiving hole, and the edge portion of the rear shell is connected to the display module.

[0019] The second heat-conducting element is located in the receiving hole.

[0020] In the technical solution provided in this disclosure, the second heat-conducting component is placed in the receiving hole of the rear shell. This is sufficient to ensure that the placement of the second heat-conducting component will not affect the connection between other structures in the display, thus ensuring the stability of the display.

[0021] In some possible implementations, the rear housing has a first heat dissipation hole.

[0022] In the technical solution provided in this disclosure, the heat received on the shielding cover can be naturally dissipated into the space formed between the back shell and the display module, and then heat convection is formed through the first heat dissipation hole on the back shell to conduct the heat to the outside air, thereby improving the heat dissipation efficiency of the shielding cover and thus improving the heat dissipation effect of the display.

[0023] In some possible implementations, the base includes a base housing and a metal base body;

[0024] The base housing is located on the side of the rear housing away from the shielding cover, and is connected to the rear housing;

[0025] The metal base body is located inside the base shell and is connected to the base shell and the second heat-conducting component.

[0026] In the technical solution provided in this disclosure, the heat received on the shield can be conducted to the metal base body through the second heat-conducting component. The metal base body has high heat conduction efficiency and good heat dissipation effect, thereby improving the heat dissipation efficiency of the shield and thus improving the heat dissipation effect of the display.

[0027] In some possible implementations, the base housing includes a fixed housing and a support housing, and the metal base body includes a fixed metal cover and a metal support.

[0028] The fixed housing is located on the side of the central portion of the rear shell away from the shield and is connected to the rear shell. An accommodating space is formed between the fixed housing and the central portion of the rear shell. The fixed housing has a central through hole and a second heat dissipation hole.

[0029] The support housing is located on the side of the fixed housing away from the rear housing;

[0030] The fixed metal cover is located in the receiving space and is connected to the second heat-conducting element;

[0031] The metal support is located on the side of the fixed metal cover away from the second heat-conducting element, and one end of the metal support passes through the central through hole and is connected to the fixed metal cover.

[0032] In the technical solution provided in this disclosure, the heat received on the shielding cover can be conducted to the fixed metal cover through the second heat-conducting element. On one hand, the heat on the fixed metal cover can be naturally dissipated into the accommodating space, and then conducted to the outside air through thermal convection formed by the second heat dissipation holes on the fixed housing. On the other hand, the heat on the fixed metal cover can also be conducted to the metal support, and dissipated to the outside through the metal support, which is a large metal component. In this way, the heat dissipation efficiency of the shielding cover is improved, thereby improving the heat dissipation effect of the display.

[0033] In some possible implementations, the first thermally conductive element includes a first thermally conductive buffer layer;

[0034] The two sides of the first thermally conductive buffer layer are respectively connected to the inner wall of the circuit board assembly and the shielding cover.

[0035] In the technical solution provided in this disclosure, the first thermally conductive buffer layer not only conducts the heat generated on the circuit board assembly to the shielding cover, but also achieves a buffer connection between the circuit board assembly and the shielding cover, preventing damage to the circuit board assembly caused by the shaking of the shielding cover, thereby improving the stability of the display.

[0036] In some possible implementations, the first thermally conductive element includes a second thermally conductive buffer layer and a heat-dissipating metal sheet;

[0037] The second thermally conductive buffer layer is located on the side of the circuit board assembly away from the display module and is connected to the circuit board assembly;

[0038] The heat dissipation metal sheet is located on the side of the second thermally conductive buffer layer away from the circuit board assembly. The central portion of the heat dissipation metal sheet is connected to the second thermally conductive buffer layer, and the other portions of the heat dissipation metal sheet are connected to the inner wall of the shield. The connection area between the other portions of the heat dissipation metal sheet and the inner wall of the shield is greater than the connection area between the central portion of the heat dissipation metal sheet and the circuit board assembly.

[0039] In the technical solution provided in this disclosure, the heat generated on the circuit board assembly can be conducted to the central portion of the heat dissipation metal sheet through the second thermally conductive buffer layer, and then conducted to the shielding cover through the other portions of the heat dissipation metal sheet. Since the connection area between the other portions of the heat dissipation metal sheet and the inner wall of the shielding cover is larger than the connection area between the central portion of the heat dissipation metal sheet and the circuit board assembly, the heat exchange area between the circuit board assembly and the shielding cover is increased through the heat dissipation metal sheet, thereby improving the heat dissipation effect of the display.

[0040] Furthermore, the second thermally conductive buffer layer not only conducts the heat generated on the circuit board assembly to the heat sink, but also achieves a buffer connection between the circuit board assembly and the heat sink, preventing damage to the circuit board assembly caused by the shaking of the shield or heat sink, thereby improving the stability of the display.

[0041] In some possible implementations, the first heat-conducting element further includes a third heat-conducting layer;

[0042] The third heat-conducting layer is located between the central portion of the heat-dissipating metal sheet and the inner wall of the shielding cover, and is connected to the central portion of the heat-dissipating metal sheet and the inner wall of the shielding cover.

[0043] In the technical solution provided in this disclosure, while other parts of the metal heat sink exchange heat with the shielding cover, the central part of the heat sink can also conduct heat to the shielding cover through the third heat-conducting layer, thereby improving the heat dissipation effect of the display.

[0044] On the other hand, this disclosure provides an electronic device that includes a display as described in any of the preceding claims.

[0045] The technical solution provided in this disclosure includes at least the following beneficial effects:

[0046] This disclosure provides a display in which heat generated on the circuit board assembly is conducted to a shielding cover through a first heat-conducting element. On the one hand, the shielding cover itself can conduct heat to the outside, thereby achieving heat dissipation. On the other hand, the heat on the shielding cover can also be conducted to the base through a second heat-conducting element, and further heat dissipation is achieved through the base, thereby improving the heat dissipation effect of the display.

[0047] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is a schematic cross-sectional view of a display according to an embodiment of the present disclosure;

[0050] Figure 2 This is a schematic cross-sectional view of a display according to an embodiment of the present disclosure;

[0051] Figure 3 This is a schematic diagram of the structure of a display shown in an embodiment of the present disclosure;

[0052] Figure 4 This is a schematic cross-sectional view of a display according to an embodiment of the present disclosure;

[0053] Figure 5 This is a schematic cross-sectional view of a display according to an embodiment of the present disclosure.

[0054] Legend

[0055] 1. Display module;

[0056] 2. Shielding cover;

[0057] 3. Circuit board assembly; 31. Circuit board body; 32. Chip;

[0058] 4. Base; 41. Base outer shell; 42. Metal base body; 411. Fixed shell; 412. Support shell; 421. Fixed metal cover; 422. Metal support; 4111. Central through hole; 4112. Second heat dissipation hole;

[0059] 5. First heat-conducting component; 51. First heat-conducting buffer layer; 52. Second heat-conducting buffer layer; 53. Heat-dissipating metal sheet; 54. Third heat-conducting layer; 531. Central portion of heat-dissipating metal sheet; 532. Other portions of heat-dissipating metal sheet;

[0060] 6. Second heat-conducting component;

[0061] 7. Rear shell; 71. Central portion of the rear shell; 72. Edge portion of the rear shell; 73. First heat dissipation hole; 711. Receiving hole;

[0062] A. Shielding space; B. Containment space. Detailed Implementation

[0063] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar terms mean that the element or object preceding “comprising” or “including” encompasses the element or object listed following “comprising” or “including” and its equivalents, and do not exclude other elements or objects. The terms “connected” or “linked” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0064] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0065] This disclosure provides a display, see [link to relevant documentation] Figure 1 The display includes a display module 1, a shielding cover 2, a circuit board assembly 3, a base 4, a first heat-conducting component 5, and a second heat-conducting component 6. The opening end of the shielding cover 2 is connected to the display module 1, and a shielding space A is formed between the shielding cover 2 and the display module 1. The circuit board assembly 3 is located in the shielding space A and is electrically connected to the display module 1. The base 4 is located on the side of the shielding cover 2 away from the display module 1. The first heat-conducting component 5 is located in the shielding space A and is connected to the circuit board assembly 3 and the inner wall of the shielding cover 2. The second heat-conducting component 6 is connected to the outer wall of the shielding cover 2 and the base 4.

[0066] In practice, when the display is working, the various components on the circuit board assembly 3 will generate heat, which can be dissipated through two heat dissipation paths.

[0067] The first heat dissipation path is as follows: the heat generated on the circuit board assembly 3 can be conducted to the shielding cover 2 through the first heat-conducting component 5, and the heat is dissipated into the air through the shielding cover 2. Through the thermal convection between the inside of the display and the outside air, the heat on the shielding cover 2 is conducted to the outside air, thereby achieving part of the heat dissipation.

[0068] The second heat dissipation path is as follows: After the heat generated on the circuit board assembly 3 is conducted to the shielding cover 2 through the first heat-conducting component 5, it can also be conducted to the base 4 through the second heat-conducting component 6, and then the heat is conducted to the outside air through the base 4, thus achieving another part of heat dissipation.

[0069] The two heat dissipation paths described above work together to dissipate heat from the circuit board assembly 3, thereby improving the heat dissipation effect of the display.

[0070] See also some possible implementations. Figure 1 The circuit board assembly 3 includes a circuit board body 31 and a chip 32. The circuit board body 31 is located in the shielded space A and is electrically connected to the display module 1. The chip 32 is located between the circuit board body 31 and the inner wall of the shielding cover 2, and is electrically connected to the circuit board body 31 and connected to the first heat-conducting component 5.

[0071] In practice, the chip 32 is electrically connected to the display module 1 through the circuit board body 31, thereby performing corresponding data processing to realize the image display on the screen.

[0072] In the circuit board assembly 3, the chip 32 is the main heat-generating device, and the chip 32 also has a high demand for heat dissipation. Therefore, the first heat-conducting component 5 can be connected to the chip 32 so that the first heat-conducting component 5 can directly and quickly conduct the heat on the chip 32 to the shielding cover 2, thereby improving the heat dissipation effect of the chip 32 and thus improving the heat dissipation effect of the display.

[0073] The connection structure between the first heat-conducting component 5 and the chip 32 can be a direct contact connection or an indirect connection through other heat-conducting components. This embodiment does not specifically limit the connection.

[0074] In this embodiment of the disclosure, the circuit board assembly 3 may include the motherboard of the display and other adapter boards (such as the T-CON board, etc.), and the chip 32 may be the main chip, etc. This embodiment of the disclosure does not specifically limit the chip.

[0075] See also some possible implementations. Figure 1and Figure 2 The display also includes a rear housing 7. The central portion 71 of the rear housing 7 is located between the shielding cover 2 and the base 4 and is connected to the base 4. The central portion 71 of the rear housing 7 has a receiving hole 711, and the edge portion 72 of the rear housing 7 is connected to the display module 1. The second heat-conducting element 6 is located in the receiving hole 711.

[0076] In implementation, the edge portion 72 of the back cover 7 is connected to the edge portion of the display module 1, thereby protecting the various components between the back cover 7 and the display module 1. It is understandable that... Figure 2 Only a portion of the structure of the rear shell 7 is shown for ease of understanding; the entire structure is not shown.

[0077] The second heat-conducting element 6 is placed in the receiving hole 711 of the rear shell 7. This is sufficient to ensure that the placement of the second heat-conducting element 6 will not affect the connection between other structures in the display, thus ensuring the stability of the display.

[0078] See also some possible implementations. Figure 2 The rear shell 7 has a first heat dissipation hole 73.

[0079] In practice, the heat received on the shield 2 can be naturally dissipated into the space between the back cover 7 and the display module 1, and then heat convection is formed through multiple first heat dissipation holes 73 on the back cover 7 to conduct the heat to the outside air, thereby improving the heat dissipation efficiency of the shield 2 and thus improving the heat dissipation effect of the display.

[0080] The first heat dissipation hole 73 can be located at any reasonable position on the rear cover 7, for example, see Figure 2 The first heat dissipation hole 73 is located at the edge portion 72 of the rear shell 7. The specific location of the first heat dissipation hole 73 is not limited in this embodiment.

[0081] Alternatively, the first heat dissipation hole 73 may be located at any position between the center portion 71 and the edge portion 72 of the rear cover 7, and this embodiment of the present disclosure does not limit this.

[0082] See also some possible implementations. Figure 1 The base 4 includes a base housing 41 and a metal base body 42. The base housing 41 is located on the side of the rear housing 7 away from the shield 2 and is connected to the rear housing 7. The metal base body 42 is located inside the base housing 41 and is connected to the base housing 41 and the second heat-conducting element 6.

[0083] In practice, the heat received on the shield 2 can be conducted to the metal base body 42 through the second heat-conducting element 6. The metal base body 42 has high heat conduction efficiency and good heat dissipation effect, thereby improving the heat dissipation efficiency of the shield 2 and thus improving the heat dissipation effect of the display.

[0084] The base shell 41 can protect and decorate the various circuits or components inside.

[0085] See also some possible implementations. Figure 1 The base housing 41 includes a fixed housing 411 and a support housing 412, and the metal base body 42 includes a fixed metal cover 421 and a metal support 422.

[0086] The fixed housing 411 is located on the side of the central portion 71 of the rear housing 7 away from the shield 2 and is connected to the rear housing 7. A receiving space B is formed between the fixed housing 411 and the central portion 71 of the rear housing 7. The fixed housing 411 has a central through hole 4111 and a second heat dissipation hole 4112. The support housing 412 is located on the side of the fixed housing 411 away from the rear housing 7.

[0087] The fixed metal cover 421 is located in the receiving space B and is connected to the second heat-conducting element 6. The metal support 422 is located on the side of the fixed metal cover 421 away from the second heat-conducting element 6, and one end of the metal support 422 passes through the central through hole 4111 and is connected to the fixed metal cover 421.

[0088] In practice, the fixed housing 411 and the fixed metal cover 421 can be used to fix the base 4 onto the rear housing 7, while the support housing 412 and the metal support 422 are used to support the entire display.

[0089] The heat received on the shield 2 can be conducted to the fixed metal cover 421 through the second heat-conducting element 6, and the heat on the fixed metal cover 421 can be dissipated through two heat dissipation paths.

[0090] The first heat dissipation path is as follows: the heat on the fixed metal cover 421 can be naturally dissipated into the accommodating space B, and then the heat is conducted to the outside air through the heat convection formed by the multiple second heat dissipation holes 4112 on the fixed housing 411.

[0091] The number of second heat dissipation holes 4112 can be set as needed, and the position of the second heat dissipation holes 4112 can also be set according to the actual structure and requirements. For example, see Figure 3 Two sets of second heat dissipation holes 4112 can be provided. These two sets of second heat dissipation holes 4112 are distributed on opposite sides of the fixed housing 411. Each set includes six second heat dissipation holes 4112 to form heat convection.

[0092] The second heat dissipation path is as follows: the heat on the fixed metal cover 421 can also be conducted to the metal support 422 connected to it, and the heat is dissipated to the outside through the larger metal support 422.

[0093] In this way, the heat dissipation efficiency of the shielding cover 2 is further improved through the two heat dissipation paths mentioned above, thereby improving the heat dissipation effect of the display.

[0094] See also some possible implementations. Figure 4 The first thermal conductive component 5 includes a first thermally conductive buffer layer 51. The two sides of the first thermally conductive buffer layer 51 are respectively connected to the inner walls of the circuit board assembly 3 and the shielding cover 2.

[0095] In practice, there is usually a certain space between the circuit board assembly 3 and the shield 2. The circuit board assembly 3 is connected to the shield 2 through the first thermally conductive buffer layer 51. The heat generated on the circuit board assembly 3 can be conducted to the shield 2 through the first thermally conductive buffer layer 51, thereby achieving heat dissipation.

[0096] Furthermore, the first thermally conductive buffer layer 51 has both thermal conductivity and buffering properties. While conducting the heat generated on the circuit board assembly 3 to the shielding cover 2, the first thermally conductive buffer layer 51 also achieves a buffer connection between the circuit board assembly 3 and the shielding cover 2, preventing the shaking of the shielding cover 2 from damaging the circuit board assembly 3, thereby improving the stability of the display.

[0097] In this embodiment, the first thermally conductive buffer layer 51 may be thermally conductive grease or thermally conductive silicone, etc. Of course, it may also be other reasonable materials with thermal conductivity and buffering properties. This embodiment does not limit the application of these materials.

[0098] See also some possible implementations. Figure 5 The first heat-conducting component 5 includes a second heat-conducting buffer layer 52 and a heat-dissipating metal sheet 53.

[0099] The second thermally conductive buffer layer 52 is located on the side of the circuit board assembly 3 away from the display module 1 and is connected to the circuit board assembly 3.

[0100] The heat dissipation metal sheet 53 is located on the side of the second thermally conductive buffer layer 52 away from the circuit board assembly 3. The central portion 531 of the heat dissipation metal sheet 53 is connected to the second thermally conductive buffer layer 52, and the other portions 532 of the heat dissipation metal sheet 53 are connected to the inner wall of the shielding cover 2. The connection area between the other portions 532 of the heat dissipation metal sheet 53 and the inner wall of the shielding cover 2 is greater than the connection area between the central portion 531 of the heat dissipation metal sheet 53 and the circuit board assembly 3.

[0101] In implementation, the heat dissipation metal fin 53 can be a metal plate-like structure with the central portion 531 protruding towards the circuit board assembly 3, having... Figure 5 The cross-section shown is shaped like the letter Z.

[0102] The heat generated on the circuit board assembly 3 can be conducted through the second thermally conductive buffer layer 52 to the central part 531 of the heat dissipation metal sheet 53, and then through the other parts 532 of the heat dissipation metal sheet 53 to the shielding cover 2.

[0103] Since the heat sink 53 is made of metal, it has good thermal conductivity, thereby improving the heat dissipation of the monitor.

[0104] Furthermore, since the connection area between the other parts 532 of the heat dissipation metal sheet 53 and the inner wall of the shield 2 is greater than the connection area between the central part 531 of the heat dissipation metal sheet 53 and the circuit board assembly 3, the heat exchange area between the circuit board assembly 3 and the shield 2 is increased through the heat dissipation metal sheet 53, thereby further improving the heat dissipation effect of the display.

[0105] Similar to the first thermally conductive buffer layer 51, the second thermally conductive buffer layer 52 conducts the heat generated on the circuit board assembly 3 to the heat sink 53, while also achieving a buffer connection between the circuit board assembly 3 and the heat sink 53. This prevents the circuit board assembly from being damaged by the shaking of the shielding cover 2 or the heat sink 53, thereby improving the stability of the display.

[0106] The heat dissipation metal sheet 53 can be an aluminum sheet or an aluminum alloy, etc., and the second thermally conductive buffer layer 52 can be thermally conductive grease or thermally conductive silicone, etc. Of course, the heat dissipation metal sheet 53 and the second thermally conductive buffer layer 52 can also be other suitable materials, and this embodiment does not limit them.

[0107] See also some possible implementations. Figure 1 The first heat-conducting component 5 also includes a third heat-conducting layer 54. The third heat-conducting layer 54 is located between the central portion 531 of the heat-dissipating metal sheet 53 and the inner wall of the shielding cover 2, and is connected to the central portion 531 of the heat-dissipating metal sheet 53 and the inner wall of the shielding cover 2.

[0108] In practice, while the other parts 532 of the metal heat sink 53 exchange heat with the shielding cover 2, the central part 531 of the heat sink 53 can also conduct heat to the shielding cover 2 through the third heat-conducting layer 54, thereby further improving the heat dissipation effect of the display.

[0109] The third thermal conductive layer 54 can be thermally conductive grease, thermally conductive silicone, or graphite sheet, etc. Of course, the third thermal conductive layer 54 can also be other reasonable materials, and this embodiment does not limit it.

[0110] See also some possible implementations. Figure 1 The second heat-conducting component 6 may include a fourth heat-conducting layer, which is located between the shielding cover 2 and the base 4 and is connected to the outer wall of the shielding cover 2 and the base 4.

[0111] The fourth thermal conductive layer can be thermal grease, thermal silicone, or graphite sheet, etc. Of course, the fourth thermal conductive layer can also be other reasonable materials, and this disclosure does not limit this.

[0112] This disclosure also provides an electronic device that may include any of the displays described above.

[0113] The technical solution provided in this disclosure includes at least the following beneficial effects:

[0114] This disclosure provides a display in which heat generated on the circuit board assembly 3 is conducted to the shielding cover 2 through the first heat-conducting element 5. On the one hand, the shielding cover 2 itself can conduct heat to the outside, thereby achieving heat dissipation. On the other hand, the heat on the shielding cover 2 can also be conducted to the base 4 through the second heat-conducting element 6, and further heat dissipation is achieved through the base 4, thereby improving the heat dissipation effect of the display.

[0115] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A display, characterized in that, The display includes a display module (1), a shielding cover (2), a circuit board assembly (3), a base (4), a first heat-conducting component (5), and a second heat-conducting component (6); The opening end of the shielding cover (2) is connected to the display module (1), and a shielding space (A) is formed between the shielding cover (2) and the display module (1); The circuit board assembly (3) is located in the shielding space (A) and is electrically connected to the display module (1); The base (4) is located on the side of the shield (2) away from the display module (1); The first heat-conducting component (5) is located in the shielding space (A) and is connected to the inner wall of the circuit board assembly (3) and the shielding cover (2); The second heat-conducting element (6) is connected to the outer wall of the shield (2) and the base (4).

2. The display according to claim 1, characterized in that, The circuit board assembly (3) includes a circuit board body (31) and a chip (32); The circuit board body (31) is located in the shielding space (A) and is electrically connected to the display module (1); The chip (32) is located between the inner wall of the circuit board body (31) and the shield (2). The chip (32) is electrically connected to the circuit board body (31) and connected to the first heat-conducting component (5).

3. The display according to claim 1, characterized in that, The display also includes a rear cover (7); The central portion (71) of the rear shell (7) is located between the shield (2) and the base (4) and is connected to the base (4). The central portion (71) of the rear shell (7) has a receiving hole (711). The edge portion (72) of the rear shell (7) is connected to the display module (1). The second heat-conducting element (6) is located in the receiving hole (711).

4. The display according to claim 3, characterized in that, The rear shell (7) has a first heat dissipation hole (73).

5. The display according to claim 3, characterized in that, The base (4) includes a base shell (41) and a metal base body (42); The base housing (41) is located on the side of the rear housing (7) away from the shield (2), and is connected to the rear housing (7); The metal base body (42) is located in the base shell (41) and is connected to the base shell (41) and the second heat-conducting component (6).

6. The display according to claim 5, characterized in that, The base housing (41) includes a fixed housing (411) and a support housing (412), and the metal base body (42) includes a fixed metal cover (421) and a metal support (422); The fixed housing (411) is located on the side of the central portion (71) of the rear shell (7) away from the shield (2) and is connected to the rear shell (7). A receiving space (B) is formed between the fixed housing (411) and the central portion (71) of the rear shell (7). The fixed housing (411) has a central through hole (4111) and a second heat dissipation hole (4112). The support housing (412) is located on the side of the fixed housing (411) away from the rear housing (7); The fixed metal cover (421) is located in the receiving space (B) and is connected to the second heat-conducting element (6); The metal support (422) is located on the side of the fixed metal cover (421) away from the second heat conductor (6), and one end of the metal support (422) passes through the central through hole (4111) and is connected to the fixed metal cover (421).

7. The display according to claim 1, characterized in that, The first heat-conducting component (5) includes a first heat-conducting buffer layer (51); The two sides of the first thermally conductive buffer layer (51) are respectively connected to the inner walls of the circuit board assembly (3) and the shield (2).

8. The display according to claim 1, characterized in that, The first heat-conducting component (5) includes a second heat-conducting buffer layer (52) and a heat-dissipating metal sheet (53); The second thermally conductive buffer layer (52) is located on the side of the circuit board assembly (3) away from the display module (1) and is connected to the circuit board assembly (3); The heat dissipation metal sheet (53) is located on the side of the second thermally conductive buffer layer (52) away from the circuit board assembly (3). The central portion (531) of the heat dissipation metal sheet (53) is connected to the second thermally conductive buffer layer (52), and the other portions (532) of the heat dissipation metal sheet (53) are connected to the inner wall of the shield (2). The connection area between the other portions (532) of the heat dissipation metal sheet (53) and the inner wall of the shield (2) is greater than the connection area between the central portion (531) of the heat dissipation metal sheet (53) and the circuit board assembly (3).

9. The display according to claim 8, characterized in that, The first heat-conducting element (5) further includes a third heat-conducting layer (54); The third heat-conducting layer (54) is located between the central portion (531) of the heat dissipation metal sheet (53) and the inner wall of the shield (2), and is connected to the central portion (531) of the heat dissipation metal sheet (53) and the inner wall of the shield (2).

10. An electronic device, characterized in that, The electronic device includes a display as described in any one of claims 1-9.

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