Heat dissipation components and switching power supply

Abstract

This application provides a heat dissipation assembly and a switching power supply. The heat dissipation assembly includes a heat sink, multiple switching transistors, and a pressure strip. The multiple switching transistors are all disposed on one side of the heat sink. The pressure strip is detachably connected to the heat sink and has multiple elastic elements, each corresponding to one of the multiple switching transistors. The switching transistors are insulated and connected to the heat sink through their respective elastic elements. Each elastic element includes a horizontal portion that abuts against the switching transistor. The pressure strip in this application facilitates stable contact between the elastic elements and the switching transistors, improving the uniformity of heat dissipation from the switching transistors, preventing excessive localized heat generation in the switching power supply, and enhancing the safety and lifespan of the switching power supply.

Description

Technical Field

[0001] This application relates to electronic component manufacturing technology, and more particularly to a heat dissipation component and a switching power supply. Background Technology

[0002] A switching power supply is a power device that converts electrical energy using high-frequency switching devices. Its working principle is to maintain a stable output voltage by controlling the on and off time ratio of the switching devices.

[0003] As switching power supplies gradually develop towards higher power density, their size is constantly shrinking, reducing the space available for heat dissipation components. While related technologies aim to reduce the size of heat dissipation components, the poor heat dissipation capacity and / or insulation performance of the switching transistors within the power supply can lead to high localized heat levels after prolonged use, potentially affecting the power supply's safety and lifespan. Utility Model Content

[0004] In order to overcome the above-mentioned defects in related technologies, the purpose of this application is to provide a heat dissipation component and a switching power supply. This application is beneficial to improving the uniformity of heat dissipation of the switching transistor, avoiding excessive local heat in the switching power supply, and improving the safety and service life of the switching power supply.

[0005] On one hand, this application provides a heat dissipation component, including:

[0006] heat sink;

[0007] Multiple switching transistors are disposed on one side of the heat sink;

[0008] A pressure strip is detachably connected to the radiator. The pressure strip is provided with multiple elastic elements, and each of the multiple elastic elements corresponds to a multiple of the switching tubes. The switching tubes are insulatedly connected to the radiator through the corresponding elastic elements.

[0009] The elastic element includes a horizontal portion that abuts against the switch tube.

[0010] In one possible implementation, the elastic element includes a spring sheet, the spring sheet including two connecting portions and a protrusion, the two connecting portions being located on opposite sides of the protrusion, and the horizontal portion being disposed on the protrusion.

[0011] In one possible implementation, the protrusion further includes two transition sections, which are located on opposite sides of the horizontal portion, and the horizontal portion is connected to the two connecting portions through the two transition sections.

[0012] In one possible implementation, the connecting portion is welded or riveted to the pressure strip.

[0013] In one possible implementation, the surface of the elastic element is provided with a first insulating layer, which abuts against the switching transistor; the surface of the heat sink is provided with a third insulating layer, which abuts against the switching transistor and external equipment.

[0014] In one possible implementation, the switching transistor has a second insulating layer that abuts against the third insulating layer and the first insulating layer.

[0015] The switching transistor is provided with a second insulating layer, which abuts against the heat sink.

[0016] In one possible implementation, when the elastic element is not in a compressed state, the distance between the elastic element and the heat sink is less than the thickness of the switching transistor.

[0017] In one possible implementation, the pressure bar is further provided with a plurality of welding pins, which are located on the side of the pressure bar away from the elastic element, and the heat dissipation assembly is connected to an external device through the welding pins.

[0018] In one possible implementation, the pressure strip further includes at least two buckles, which are respectively disposed at both ends of the pressure strip along the second direction; the radiator is provided with at least two slots, which are respectively disposed at both ends of the radiator along the second direction; the pressure strip is engaged with the corresponding slots on the radiator by means of the buckles.

[0019] In one possible implementation, the buckle includes an adapter and a latching part, a first end of the adapter is connected to the pressure strip, a second end of the adapter is connected to the latching part, and along the second direction, the length of the latching part is greater than the length of the adapter.

[0020] The slot includes a groove and an opening, the opening communicating with the groove, and the length of the groove along the second direction is greater than the length of the opening;

[0021] The pressure strip is engaged with the groove body via the snap-fit ​​part.

[0022] In one possible implementation, the pressure strip further includes a positioning rib, which is disposed between the two buckles along the second direction.

[0023] In one possible implementation, a fastener is included, the pressure strip has mounting holes for mounting the fastener, and the heat sink has through holes that match the mounting holes, so that the pressure strip is fastened to the heat sink by the fastener.

[0024] In one possible implementation, the switching transistor has a main body structure extending along a first direction, and the pressure strip is disposed on the surface of the switching transistor along the first direction, wherein the maximum extension length of the pressure strip in the first direction is less than the main body length of the switching transistor in the first direction.

[0025] On the other hand, this application provides a switching power supply, including any of the heat dissipation components described above.

[0026] This application provides a heat dissipation assembly and a switching power supply. The heat dissipation assembly includes a heat sink, multiple switching transistors, and a pressure strip. The multiple switching transistors are all disposed on one side of the heat sink. The pressure strip is detachably connected to the heat sink and has multiple elastic elements, each corresponding to one of the multiple switching transistors. The switching transistors are insulated and connected to the heat sink through their respective elastic elements. Each elastic element includes a horizontal portion that abuts against the switching transistor. This application uses elastic elements on the pressure strip to insulate the switching transistors against the heat sink, ensuring insulation while eliminating gaps between the switching transistors and the pressure strip. This ensures uniform heat dissipation from the switching transistors, prevents excessive localized heat, and thus improves the safety and lifespan of the switching power supply. The horizontal portion on the elastic element abuts against the switching transistor, increasing the contact area and improving contact stability. By setting the length of the pressure strip along a first direction to be less than the length of the switching transistors along the first direction, the pressure strip ensures it does not extend beyond the switching transistors in the first direction, thus reducing the product's size. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a simplified structural diagram of a heat dissipation assembly provided in one embodiment of this application;

[0029] Figure 2 This is a simplified diagram of the connection structure between the pressure strip and the elastic element provided in an embodiment of this application;

[0030] Figure 3 for Figure 2 Top view;

[0031] Figure 4 A simplified structural diagram of an elastic element provided in an embodiment of this application;

[0032] Figure 5 for Figure 4 Side view;

[0033] Figure 6 A simplified structural diagram of a pressure strip provided in an embodiment of this application;

[0034] Figure 7 A simplified structural diagram of a heat sink provided in one embodiment of this application;

[0035] Figure 8 A simplified structural diagram of a heat sink provided in another embodiment of this application.

[0036] Figure label:

[0037] 10-Fasteners;

[0038] 100 - Heat sink; 110 - Card slot; 111 - Slot body; 112 - Opening;

[0039] 200 - Switching transistor; 210 - First switching transistor; 220 - Second switching transistor;

[0040] 300 - Pressure strip; 310 - Clip; 311 - Adapter; 312 - Snap-fit ​​part; 320 - Positioning rib;

[0041] 400 - Elastic element; 410 - Connecting part; 420 - Protrusion; 421 - Horizontal part; 422 - Transition section;

[0042] 500 - Solder pins;

[0043] X - First direction; Y - Second direction; Z - Third direction. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.

[0045] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0046] As described in the background section, in related technologies, the heat dissipation capacity and / or insulation performance of the switching transistors in the switching power supply are poor. Prolonged use may lead to high localized heat levels in the switching power supply, thus affecting its safety and lifespan. Specifically, the switching power supply contains a heat sink and multiple switching transistors, all of which are in contact with the heat sink to facilitate heat transfer.

[0047] In view of this, the embodiments of this application aim to provide a heat dissipation component and a switching power supply. By providing an elastic element on the pressure strip to insulate the switching transistor against the heat sink, the gap between the switching transistor and the pressure strip is eliminated while ensuring insulation, ensuring uniform heat dissipation of the switching transistor, preventing excessive local heat, and thus improving the safety and service life of the switching power supply. By providing a horizontal part on the elastic element, which abuts against the switching transistor, the contact area between the elastic element and the switching transistor is increased, improving the stability of the contact.

[0048] The embodiments of this application will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can gain a more detailed understanding of the content of this application. In the description of the embodiments of this application, the first direction X, the second direction Y, and the third direction Z are three different directions in three-dimensional space. For example, the first direction X, the second direction Y, and the third direction Z can be perpendicular to each other.

[0049] Please refer to Figures 1-8 This embodiment provides a heat dissipation component, including:

[0050] The structure of the radiator 100 can be configured as needed, for example, it can be a water-cooled radiator; the shape of the radiator 100 can also be configured as needed, for example, it can be a cuboid shape.

[0051] Multiple switching transistors 200 are disposed on one side of the heat sink 100 along the third direction Z. In this embodiment, the power of the multiple switching transistors 200 can be the same or different. The switching transistors 200 can be, for example, metal-oxide-semiconductor field-effect transistors (MOSFETs), diodes, transistors, or other types of switching transistors. The shape of the switching transistors 200 can also be generally cuboid.

[0052] The pressure strip 300 is detachably connected to the radiator 100, facilitating installation and subsequent maintenance and replacement, and also reducing the size of the pressure strip 300. The pressure strip 300 has multiple elastic elements 400, each corresponding to a different switching tube 200. When the elastic element 400 is not compressed, the distance between it and the radiator 100 is less than the thickness of the switching tube 200. After the switching tube 200 is installed, it presses against the elastic element 400, compressing it. The switching tube 200 is insulated and connected to the radiator 100 through the corresponding elastic element 400. The elastic force of the elastic element 400 firmly holds the switching tube 200 against the radiator 100. Different elastic elements 400 can have different deformations to accommodate switching tubes 200 of varying thicknesses. Understandably, by setting an elastic element 400 on the pressure strip 300 to insulate the switching tube 200 against the heat sink 100, the gap between the switching tube 200 and the pressure strip 300 is eliminated while ensuring insulation. This allows switching tubes 200 of different thicknesses to be in contact with the elastic element 400 and the heat sink 100, ensuring uniform heat dissipation of the switching tube 200, preventing excessive local heat, and thus improving the safety and service life of the switching power supply.

[0053] In this embodiment, the elastic element 400 can be, for example, a sheet spring or a spring-like component. Preferably, the elastic element 400 is a sheet spring, and it includes a horizontal portion 421 that abuts against the switching transistor 200. By providing the horizontal portion 421 on the elastic element 400—that is, the horizontal portion 421 being a planar structure—and utilizing the horizontal portion 421 to abut against the switching transistor 200, this embodiment increases the contact area between the elastic element 400 and the switching transistor 200, thereby improving the stability of the contact.

[0054] In this embodiment, the length of the pressure strip 300 along the first direction X is less than the length of the switching tube 200 along the first direction X. It can be understood that the switching tube 200 has a main body structure extending along the first direction X, and the pressure strip 300 is disposed on the surface of the switching tube 200 along the first direction X, wherein the maximum extension length of the pressure strip 300 in the first direction X is less than the main body length of the switching tube 200 in the first direction X. Alternatively, it can be understood that the pressure strip 300 is rectangular in shape, and the width of the pressure strip 300 is less than the main body length of the switching tube 200 in the first direction X.

[0055] It is understandable that after the pressure strip 300 and the switch tube 200 are assembled, the upper and / or lower end faces of the switch tube 200 along the first direction X protrude from the upper and lower ends of the pressure strip 300 along the first direction X, thereby ensuring that the pressure strip 300 does not exceed the range of the switch tube 200 in the first direction X, which makes it easier to reduce the size of the product after setting the pressure strip 300.

[0056] Please continue to refer to Figure 4 and Figure 5 In this embodiment, the elastic element 400 includes two connecting portions 410 and a protrusion 420. The connecting portions 410 are used for fixed connection with the pressure strip 300, and the protrusion 420 is used for abutting against the switch tube 200. The two connecting portions 410 are located on opposite sides of the protrusion 420, and a horizontal portion 421 is disposed on the protrusion 420. It can be understood that the horizontal portion 421 is parallel to the lower surface of the switch tube 200 (the surface where the switch tube 200 is connected to the elastic element 400), and the area of ​​the horizontal portion 421 can be set as needed.

[0057] Furthermore, the protrusion 420 also includes two transition sections 422, which are located on opposite sides of the horizontal portion 421. The horizontal portion 421 is connected to the two connecting portions 410 through the two transition sections 422. In this embodiment, the connecting portion 410 and the protrusion 420 can be integrally formed, and the protrusion 420 can be formed, for example, by stamping.

[0058] Optionally, the connecting part 410 and the pressure strip 300 in this embodiment can be connected and fixed by welding or riveting.

[0059] In one possible implementation, the surface of the elastic member 400 of this embodiment is provided with a first insulating layer, which abuts against the switching transistor 200. The first insulating layer may be, for example, a thermally conductive epoxy coating. The surface of the heat sink 100 is provided with a third insulating layer, which abuts against the switching transistor 200 and external devices. The third insulating layer may be, for example, an insulating and thermally conductive silicone cloth, and the external devices may be, for example, a PCB board or other electrical equipment. The switching transistor 200 is provided with a second insulating layer, which abuts against the third insulating layer of the heat sink 100 and the first insulating layer of the elastic member 400. The second insulating layer may be, for example, an insulating cap disposed on the surface of the switching transistor 200, and may be, for example, a silicone rubber layer or a ceramic powder layer.

[0060] It is understood that in other possible implementations, the surface of the elastic member 400 in this embodiment is provided with a first insulating layer, the surface of the heat sink 100 is provided with a third insulating layer, and the surface of the switching tube 200 is not provided with a second insulating layer.

[0061] It is understood that in other possible implementations, the surface of the elastic element 400 is provided with a first insulating layer, the surface of the heat sink 100 is not provided with a third insulating layer, and the surface of the switching tube 200 is provided with a second insulating layer.

[0062] Through the above structure, this embodiment can achieve an insulated connection between the elastic element 400, the switching tube 200, the heat sink 100 and the external device. The multiple insulation settings of the first insulation layer, the second insulation layer and the third insulation layer can ensure electrical safety.

[0063] Please refer to Figure 1 In this embodiment, the multiple switching transistors 200 include several first switching transistors 210 and several second switching transistors 220. The thickness (length along the third direction Z) of the second switching transistor 220 can be less than or equal to the thickness (length along the third direction Z) of the first switching transistor 210. The thickness of the second switching transistor 220 can be the same as or different from the thickness of the first switching transistor 210. It is understood that the types of the first switching transistors 210 and second switching transistors 220 in this embodiment can be the same or different. For example, both the first switching transistor 210 and the second switching transistor 220 can be diodes or ternary transistors; or, the first switching transistor 210 can be a ternary transistor, and the second switching transistor 220 can be a diode. The difference in thickness between the first switching transistors 210 and the second switching transistor 220 can be due to differences in the type of switching transistor or differences in manufacturing processes.

[0064] Please continue to refer to Figure 1 , Figure 3 In this embodiment, the pressure strip 300 is also provided with a plurality of welding pins 500. The welding pins 500 are located on the side of the pressure strip 300 away from the elastic member 400. The heat dissipation assembly is connected to an external device through the welding pins 500. The external device may be, for example, a printed circuit board (PCB) or other required surface.

[0065] Please continue to refer to Figure 1 , Figure 2 , Figure 6 and Figure 7 In one embodiment of the heat dissipation assembly, the pressure strip 300 further includes at least two latches 310, which are respectively disposed at both ends of the pressure strip 300 along the second direction Y. The heat sink 100 is provided with at least two slots 110, which are respectively disposed at both ends of the heat sink 100 along the second direction Y. The pressure strip 300 is engaged with the corresponding slots 110 on the heat sink 100 via the latches 310.

[0066] With the above structure, this embodiment can achieve the connection between the pressure strip 300 and the heat sink 100 without the use of fasteners, which is beneficial to improving assembly efficiency. Furthermore, since no fasteners are required, there is no need to reserve installation distance between the pressure strip 300 and the heat sink 100, which helps to reduce the overall height of the heat dissipation assembly and leaves ample space for the installation of other parts. In addition, the above structure also helps to improve the uniformity of heat transfer.

[0067] Specifically, the buckle 310 of this embodiment includes an adapter portion 311 and a snap-fit ​​portion 312. The first end of the adapter portion 311 is connected to the pressure strip 300, and the second end of the adapter portion 311 is connected to the snap-fit ​​portion 312. Along the second direction Y, the length of the snap-fit ​​portion 312 is greater than the length of the adapter portion 311.

[0068] The slot 110 includes a slot 111 and an opening 112. The opening 112 is connected to the slot 111. The length of the slot 111 along the second direction Y is greater than the length of the opening 112.

[0069] The pressure strip 300 can be snapped into the groove 111 along the first direction X via the snap-fit ​​part 312.

[0070] Furthermore, the pressure strip 300 in this embodiment also includes positioning ribs 320. Along the second direction Y, multiple positioning ribs 320 are evenly distributed between the two latches 310. By providing positioning ribs 320 on the pressure strip 300, this embodiment enables multiple switching transistors 200 to be pre-positioned, facilitating the subsequent installation of the switching transistors 200 with printed circuit boards and other devices.

[0071] Please continue to refer to Figure 8 In another embodiment of the heat dissipation assembly, a fastener 10 is further included. A plurality of switching tubes 200 are fixed to a heat sink 100 via a pressure strip 300, and the pressure strip 300 is then secured to the heat sink 100 by the fastener 10. Exemplarily, the pressure strip 300 has mounting holes for installing the fastener 10, and the heat sink 100 has through holes that match the mounting holes. The pressure strip 300 is secured to the heat sink 100 by the fastener 10. The fastener 10 can be a screw or bolt, etc., used to fix the pressure strip 300 and the heat sink 100 together. The pressure strip 300 and the heat sink 100 are pressed together, cooperating with the horizontal portion 421 of the elastic member 400 to complete the fixation of the switching tubes 200.

[0072] This embodiment also provides a switching power supply, including the heat dissipation component described above.

[0073] It is understood that, due to the adoption of the above-mentioned heat dissipation components, the heat dissipation uniformity of the multiple switching transistors in the switching power supply of this embodiment is good, which can avoid the phenomenon of excessive local heat in the switching power supply, thereby improving the safety and service life of the switching power supply.

[0074] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0075] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0076] It should be noted that in the description of this application, the terms "first" and "second" are used only for convenience in describing different components and should not be construed as indicating or implying a sequential relationship, relative importance, or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features.

[0077] The embodiments or implementation methods in this application are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0078] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with an embodiment or example that are included in at least one embodiment or example of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipating assembly, characterized by, include: heat sink; Multiple switching transistors are disposed on one side of the heat sink; A pressure strip is detachably connected to the heat sink. The pressure strip is provided with multiple elastic elements, each of which corresponds to a multiple switching tube. The switching tube is insulatedly connected to the heat sink through the corresponding elastic element. The elastic element includes a horizontal part that abuts against the switching tube.

2. The heat dissipation assembly of claim 1, wherein, The elastic element includes a spring sheet, which includes two connecting portions and a protrusion. The two connecting portions are located on opposite sides of the protrusion, and the horizontal portion is disposed on the protrusion.

3. The heat dissipation assembly of claim 2, wherein, The protrusion further includes two transition sections, which are located on opposite sides of the horizontal portion, and the horizontal portion is connected to the two connecting portions through the two transition sections.

4. The heat dissipation assembly according to claim 2, characterized in that, The connecting part is welded or riveted to the pressure strip.

5. The heat dissipation assembly according to claim 1, characterized in that, The surface of the elastic element is provided with a first insulating layer, which abuts against the switching tube; the surface of the heat sink is provided with a third insulating layer, which abuts against the switching tube and external equipment.

6. The heat dissipation assembly according to claim 5, characterized in that, The switching transistor is provided with a second insulating layer, which abuts against the third insulating layer and the first insulating layer.

7. The heat dissipation assembly according to claim 1, characterized in that, When the elastic element is not in a compressed state, the distance between the elastic element and the heat sink is less than the thickness of the switching transistor.

8. The heat dissipation assembly according to claim 1, characterized in that, The pressure bar is also provided with a plurality of welding pins, which are located on the side of the pressure bar away from the elastic element. The heat dissipation assembly is connected to an external device through the welding pins.

9. The heat dissipation assembly according to claim 1, characterized in that, The pressure strip also includes at least two buckles, which are respectively disposed at both ends of the pressure strip along the second direction; the radiator is provided with at least two slots, which are respectively disposed at both ends of the radiator along the second direction; the pressure strip is engaged with the corresponding slots on the radiator by means of the buckles.

10. The heat dissipation assembly according to claim 9, characterized in that, The buckle includes an adapter and a locking part. The first end of the adapter is connected to the pressure strip, and the second end of the adapter is connected to the locking part. Along the second direction, the length of the locking part is greater than the length of the adapter. The slot includes a groove and an opening, the opening communicating with the groove, and the length of the groove along the second direction is greater than the length of the opening; The pressure strip is engaged with the groove body via the snap-fit ​​part.

11. The heat dissipation assembly according to claim 9, characterized in that, The pressure strip also includes a positioning rib, which is disposed between the two buckles along the second direction.

12. The heat dissipation assembly according to claim 1, characterized in that, The device includes fasteners, and the pressure strip has mounting holes for installing the fasteners. The radiator has through holes that match the mounting holes. The pressure strip is fastened to the radiator by means of the fasteners.

13. The heat dissipation assembly according to claim 1, characterized in that, The switching tube has a main body structure extending along a first direction, and the pressure strip is disposed on the surface of the switching tube along the first direction. The maximum extension length of the pressure strip in the first direction is less than the main body length of the switching tube in the first direction.

14. A switching power supply, characterized in that, Includes the heat dissipation component as described in any one of claims 1-13.

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