A heat conduction component and electronic device
Patent Information
- Application Number
- CN202520938553.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-13
- Publication Date
- 2026-05-26
- Estimated Expiration
- 2035-05-13
AI Technical Summary
In existing electronic devices, heat-generating components such as the CPU are concentrated at the system end, resulting in limited heat dissipation space and poor heat dissipation performance.
A heat conduction component is designed, including a rotating component, a first component, and a second component. The first body and the second body are connected by rotation. The first component absorbs heat from the heat-generating component and transfers it to the second component, which then transfers it to the heat dissipation component. The heat transfer efficiency is improved by utilizing the target component and the heat-conducting medium.
It enables heat transfer between different bodies, improves heat dissipation, eliminates the need for heating and heat dissipation components to be installed in the same body, and adapts to different angles of rotation or stationary states.
Smart Images

Figure CN224290411U_ABST